BYT86 Super Fast Recovery Silicon Power Rectifier - Exvacuo

Sep 27, 2000 - BYT86. Vishay Telefunken www.vishay.de • FaxBack +1-408-970-5600 ... m. Batt. tIRM. 110 ns. Reverse recovery time IF=8A, diF/dt =–100A/ms ...
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BYT86 Vishay Telefunken

Super Fast Recovery Silicon Power Rectifier Features D D D D D

Multiple diffusion High voltage High current Ultra fast forward recovery time Ultra fast reverse recovery time

14282

Applications Fast rectifiers in S.M.P.S, freewheeling and snubber diode in motor control circuits

Absolute Maximum Ratings Tj = 25_C Parameter Reverse voltage g =Repetitive peak reverse voltage Peak forward surge current

Test Conditions

tp= 10ms half sinewave

Repetitive peak forward current Average forward current Junction and storage temperature range

Type Symbol BYT86–600 VR=VRRM BYT86–800 VR=VRRM BYT86–1000 VR=VRRM IFSM IFRM IFAV Tj=Tstg

Value 600 800 1000 90

Unit V V V A

25 8 –55...+150

A A °C

Maximum Thermal Resistance Tj = 25_C Parameter Junction case

Document Number 86036 Rev. 3, 27-Sep-00

Test Conditions

Symbol RthJC

Value 2.4

Unit K/W

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BYT86 Vishay Telefunken Electrical Characteristics Tj = 25_C Parameter Forward voltage g

Test Conditions IF=8A IF=8A, Tj=100°C VR=VRRM VR=VRRM, Tj=100°C IF=8A, diF/dt 50A/ms

Reverse current

Type Symbol Min Typ Max Unit VF 1.8 V VF 1.8 V IR 10 mA IR 0.2 mA tfr 350 ns VFP 7 V

x

Forward recovery time Turn on transient peak voltage Reverse recovery y characteristics

IF=8A, diF/dt =–100A/ms, VBatt=200V

IRM tIRM trr trr

IF=8A, diF/dt =–100A/ms, VBatt=200V IF=0.5A, IR=1A, iR=0.25A

Reverse recovery y time

12 110 150 80

A ns ns ns

Characteristics (Tj = 25_C unless otherwise specified) 100 VR = VR RM 100

10

1

0.1 40

80

120

160

1

0.1

200

Tj – Junction Temperature ( °C )

94 9483

8 RthJC=2.4K/W

RthJA=5K/W

4 RthJA=10K/W 2 RthJA=85K/W 0 0

40

80

120

160

Tamb – Ambient Temperature ( °C )

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1.2

1.8

2.4

3.0

VF – Forward Voltage ( V )

150

120

90

60 IF = 8A TC=25°C VBatt=200V

30 0

200

Figure 2. Max. Average Forward Current vs. Ambient Temperature

0.6

Figure 3. Typ. Forward Current vs. Forward Voltage t IRM – Reverse Recovery Time for IRM ( ns )

10

6

0 94 9482

Figure 1. Typ. Reverse Current vs. Junction Temperature

I FAV– Average Forward Current ( A )

10

0.01 0

94 9481

TCase= 25°C

IF – Forward Current ( A )

I R – Reverse Current ( mA )

1000

0 94 9484

50

100

150

200

–dIF/dt – Forward Current Rate of Change ( A/ms )

Figure 4. Reverse Recovery Time for IRM vs. Forward Current Rate of Change

Document Number 86036 Rev. 3, 27-Sep-00

BYT86 Vishay Telefunken 250 t rr – Reverse Recovery Time ( ns )

IRM – Reverse Recovery Current ( A )

15

12

9

6 IF = 8A TC=25°C VBatt=200V

3

200

150

100

0

0 0

94 9485

IF = 8A TC=25°C VBatt=200V

50

50

100

150

200

–dIF/dt – Forward Current Rate of Change ( A/ms )

Figure 5. Reverse Recovery Current vs. Forward Current Rate of Change

0 94 9486

50

100

150

200

–dIF/dt – Forward Current Rate of Change ( A/ms )

Figure 6. Reverse Recovery Time vs. Forward Current Rate of Change

Dimensions in mm

14276

Document Number 86036 Rev. 3, 27-Sep-00

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BYT86 Vishay Telefunken Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs ). The Montreal Protocol ( 1987 ) and its London Amendments ( 1990 ) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA ) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.

We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423

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Document Number 86036 Rev. 3, 27-Sep-00