Contributor: Fulvio Infante President of Intraspec Technologies Thursday, 12th May 2011
Contactless High Resolution Characterization of 3D current paths in Advanced SIP Packages
Challenges for three-dimensional (3D) ICs and systems
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Outline
Introduction Purpose Magnetic Microscopy: State of the Art The Simulation Approach Case study Conclusions
Challenges for three-dimensional (3D) ICs and systems
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Introduction Magnetic Current Imaging (MCI) has proven a very reliable FA technique Mostly suitable for assembly level defects Sufficient resolution for standard devices For new devices, a new dimension has been added (z depth) There are new challenges due to the long working distance and to the shrinking of devices New ways of Failure Localization are needed by the failure analyst Challenges for three-dimensional (3D) ICs and systems
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Purpose
Show the State of the Art for Magnetic Microscopy Identify a technique able to solve the 3D problem for defect localization Increase the standard resolution of the MCI technique Work with both very large and very small sample geometries
Challenges for three-dimensional (3D) ICs and systems
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Magnetic Microscopy A current line generates a magnetic field according to the Biot-Savart law:
0 I dl r dB 3 4 r
Hypotheses: Jz=0, x=y=constant From the measurement of Bz it is possible to obtain Jx, Jy Gives meaningful results only for small working distances Challenges for three-dimensional (3D) ICs and systems
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Magnetic Current Imaging
5.2mm
Challenges for three-dimensional (3D) ICs and systems
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MCI example: SQUID analysis Current Overlaid on Optical
Processed X-Ray
X-Ray
Optical
SEM
Courtesy of David Vallett, IBM Challenges for three-dimensional (3D) ICs and systems
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MCI example: GMR analysis
Courtesy of Ingrid De Wolf, IMEC Challenges for three-dimensional (3D) ICs and systems
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The Simulation Approach
Works with raw data Avoids data filtering Avoids Fourier analysis Increases the resolution of the technique Works with currents flowing on different xy planes Able to map currents up to 2 centimetres away from the sensor 3D currents reconstruction
Challenges for three-dimensional (3D) ICs and systems
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Obtaining 3D information
Sample tilt:
Z distance evaluated through a fitting algorithm Challenges for three-dimensional (3D) ICs and systems
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Applications: FA of a 3D cube
y x
z y x Challenges for three-dimensional (3D) ICs and systems
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Electrical Signature
Challenges for three-dimensional (3D) ICs and systems
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MCI and simulation results
Maximum of the correlation
Challenges for three-dimensional (3D) ICs and systems
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Z Plane evaluation
0 I ( x x0 ) B( x) o 2 2 4 2 ( x x0 ) z Fitting parameters
The resulting curves (magnetic acquisition and fitted curve) are very similar to each other
Z=834
Challenges for three-dimensional (3D) ICs and systems
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Fitting Results With the z distance known, we were able to superpose the MCI result with the XRay acquisition of the real plane The resulting current map corresponds perfectly with the results obtained with the simulation approach
Challenges for three-dimensional (3D) ICs and systems
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Results We noticed that the track we isolated should not have been connected to any of the layers An X-Ray inspection of different isolated layers showed that two of the tracks had been cut to avoid contact However, on the 5th layer, the cut is not visible on one of the tracks Challenges for three-dimensional (3D) ICs and systems
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Conclusions
Magnetic Microscopy is a powerful tool for current mapping It does not require any sample deprocessing in order to obtain the desired results The new challenges are due to its application to 3D current paths: the standard technique does not provide a good solution To work on three-dimensional packages, we developed the simulation approach Challenges for three-dimensional (3D) ICs and systems
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Conclusions
With this approach it is possible to obtain 3D information about the currents, which was not possible with standard MCI We have demonstrated that with this approach we can work with both high and small working distances
Challenges for three-dimensional (3D) ICs and systems
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Acknowledgments
3D-Plus, for providing the 3D cube and allowing the data to be presented F. Battistella and S. Annerau, Thales, for the analysis on the cube Neocera, for their continuous support in the 3D project IBM and IMEC
Challenges for three-dimensional (3D) ICs and systems
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