Gatan-Emispec SW and Gatan tomography holder: Price € 45.000.-
Tests on two specimens performed at TVIPS Co.
F. Siegelin, T. Schweinböck CL CTS FA 2004-10-06 page 3
Use small device features (gate, contact trench) for test at vendor site
Find out how straightforward the method can be applied and how easily
beneficial conclusions can be drawn from the images. smallest poly-gate on SOI, missing reference structures for XCF
small interconnects, deformation of sample due to too high electron dose
1st Sample: Poly-Gate on SOI poly gate
Conventional TEM
1 µm 20 nm
Tilt series
reconstructed
F. Siegelin, T. Schweinböck CL CTS FA 2004-10-06 page 4
Surface reconstructed
Problem: for higher magnifications a reference area with a tilt independent contrast is necessary. The poly-Si grain changes the contrast due to dynamical contrast and the surrounding amorphous materials with their homogeneous contrast are not suited for cross-correlations.
2nd Sample: interconnect (liner only) Conventional TEM
Problem: In order to avoid deformation, tomography experiments should be carried out under low electron dose conditions
100 nm
Tilt series
Deformation due to high electron dose
reconstructed
F. Siegelin, T. Schweinböck CL CTS FA 2004-10-06 page 5
Surface reconstructed
2nd Sample: interconnect (liner only) Conventional TEM
Movie of surface reconstruction
100 nm
Tilt series
reconstructed
F. Siegelin, T. Schweinböck CL CTS FA 2004-10-06 page 6
Most important results Tomographic images of two samples (gate structure and interconnect trench) were recorded at Tietz VIPS Co. For high magnifications a reference area with a tilt independent contrast is necessary. Structures with strong dynamic TEM contrast cause the image reconstruction algorithm to fail. Experiments have to be carried out at low dose since several adjustments and several tilt series have to be recorded.
F. Siegelin, T. Schweinböck CL CTS FA 2004-10-06 page 7
We need to think big while keeping an eye for details! More Moore: ... BGA package solder bump, MEMS device. Confidential ... Si mill speed (top down milling,.
The main forward problem of the tomography is the Radon transform. .... only the values of the estimates at previous iterations are used without accounting for.
back-projection operators paralleled on many core processors like GPU [2]. ... 1 China Scholarship Council ... For β = 2 a Gauss-Markov model is obtained.
A lot of potential test moments: pre-, mid-, and post-bond testing ... 'Testing 3D Chips Containing Through-Silicon Vias', IEEE International Test Conference ... Paul Mooney3, Eric Pradel2, Dan Rishavy1, Don Robinson1, Yoichi Shimizu4.
Implementation: We have used the synthetic volume âShepp and Loganâ. (256Ã256Ã256 voxels), and we compare the image reconstructed after. 200 iterations.
Oct 6, 2010 - Introduction / Eufanet (Philippe Perdu). What is Eufanet and ... 3D (360degree) failure characterization in semiconductor devices using Hitachi's.
There are times when you want to extend your view. Because more is not ... And when we say the XPan ..... English, German, Spanish, and Swedish. For more ...
http://www.lss.supelec.fr. NIMI, Gent, Belgium, Mai 2010. A. Mohammad-Djafari,. NIMI Workshop on medical imaging, Gent, Belgium, May 29, 2010. 1/41 ...
To describe a comprehensive overview of fault site localization technique by imaging with Nanoprobes. Resistive Contrast Imaging (RCI). Voltage DIstribution ...
FIB Micro-pillar sampling of Si devices and its 3D observation. T. Yaguchi, T. ... Introduction. New materials such as electronic and semiconductor devices.
Front side / Back side. Software enhancement. COMPUTER AIDED TOOLS FOR FA : NAVIGATION / BITMAP ( full integrated ). Behavioral simulation / diagnostic.
... Stimulation / Soft defect localization. ⢠IR Thermography ... Non destructive analysis ... Region Of Interest ? - Can you still test your product after preparation ?
needle stage, the geometry of the original specimen is not a limiting factor for ... Figure 4 shows a schematic flow for the FIB micro-pillar sample preparation ...
Hugo Bender(IMEC),Ronny Camp (Alcatel), Dick Verkleij (Philips), Ernst Demm(Infineon). ⢠ESREF 1998 in Copenhagen (EFUG meeting organised by Dick ...
Scanning Acoustic Microscopy usually used for detection of delamination extended for new applications: ⢠Detection of delaminated balls. ⢠Detection of cracks.
Gerald Beyer. â Ingrid De Wolf. â Ivan Ciofi. â Joke De Messemaeker. â Kris Vanstreels. â Michele Stucchi. â Myriam Van De Peer. â Olalla Varela Pedreira.