ITG Sub-Group 8.5 ITG : „Informationstechnische Gesellschaft“ Sub-group of the VDE (“Verband Deutscher Elektrotechniker e.V.”), support and encourages research and using of IT as well as its application in data and communication techniques and systems, protection of the environment, medicine, traffic.
Main missions :
VDE (*)
- exchange of know how and informations - organization of discussion panels and workshop - writing of rules and recommendation - publication of technical / scientifical papers - participation to R&D projects
8.5.3 Quality Maintenance for VLSI - TQM tools - DoE - SPC - 8D-Process
FhG Micronas Hitachi Hannover Univ.
8.5.4 Wafer Level Rel. and reliability simul. - WLR - Yield and reliability - test structures - Simulation
Mostimportant importantevent eventofofthe the8.5 8.5Group Group: :yearly yearlyworkshop workshop“Failure “FailureMechanism Mechanismand and Most Analysis for small geometries” in Bad Baiersoiern (Germany / Bavaria) Analysis for small geometries” in Bad Baiersoiern (Germany / Bavaria) informaldiscussion discussionforum forum(without (withoutproceedings) proceedings)with withpresentation presentationabout about: : →→informal new analysis techniques IC´s - new analysis techniques - IC´s state-of-the-art teststructures structures - -state-of-the-art - -test -.simulationresults results for packages -.simulation for - -packages case histories (incl. unsolved problems) tool methods - case histories (incl. unsolved problems) - tool / /methods reliabilityissues issues FE/ /BE BEaspects aspects - -reliability - -FE Further activities planned : - website for the 8.5 group, linked to the worldwide FA community (EDFAS, Anadef, etc.) - new workgroups (e.g. Si @200 C, FA for SMD, ...) (*) : for more details please consult http://www.vde.com (**) : website of the 8.5.2 group : http://members.tripod.de/GertVogel/itg.htm
To describe a comprehensive overview of fault site localization technique by imaging with Nanoprobes. Resistive Contrast Imaging (RCI). Voltage DIstribution ...
FIB Micro-pillar sampling of Si devices and its 3D observation. T. Yaguchi, T. ... Introduction. New materials such as electronic and semiconductor devices.
Front side / Back side. Software enhancement. COMPUTER AIDED TOOLS FOR FA : NAVIGATION / BITMAP ( full integrated ). Behavioral simulation / diagnostic.
... Stimulation / Soft defect localization. ⢠IR Thermography ... Non destructive analysis ... Region Of Interest ? - Can you still test your product after preparation ?
needle stage, the geometry of the original specimen is not a limiting factor for ... Figure 4 shows a schematic flow for the FIB micro-pillar sample preparation ...
Hugo Bender(IMEC),Ronny Camp (Alcatel), Dick Verkleij (Philips), Ernst Demm(Infineon). ⢠ESREF 1998 in Copenhagen (EFUG meeting organised by Dick ...
Scanning Acoustic Microscopy usually used for detection of delamination extended for new applications: ⢠Detection of delaminated balls. ⢠Detection of cracks.
Gerald Beyer. â Ingrid De Wolf. â Ivan Ciofi. â Joke De Messemaeker. â Kris Vanstreels. â Michele Stucchi. â Myriam Van De Peer. â Olalla Varela Pedreira.
stress in Si which changes device performance. Transistor performance in TSV- proximity μ-raman. XRD (Synchrotron). Bowing. Thermal stability of. TSV.
Goal: Reach both dies without separating them, without damage on Cu wires and without acid leak. Methodology: 1. LASER cavity. 2. Wet chemical opening at ...
To achieve these objectives, the Association plans, for example, to set up: - a Web site,. - a library of data on information available in the societies, the official ...
4 x 4 Ni insert contact matrix. (â 6 µm) ... 100°C . This phenomenon is reversible and can be attributed to the temperature dependence resistivity of the materials.
Page 1 ... eng.com), a company he founded in 2006, and now President of Presto ... Michel has been Vice President Marketing at FEI, and General Manager of ...
Oct 3, 2006 - system board, in the same package to realise a fully functional system or sub-system. ... Multi Chip Module, stack dies, single or double flip, WLP. â Package .... Simpler analysis of complex geometries of multi layer stacks and ...
Nov 29, 2011 - 3D integration is a key new trend for microelectronics. At system level, it allows incredible heterogeneous System in Packages with sensors, ...
scientific co-worker at the Fraunhofer Institute of Mechanics of Materials Halle, where he worked in the field of microelectronics and materials analysis. In 1996 ...
ANADEF workgroup report. Philippe Perdu CNES ... reproduction. ⢠To find the root cause ... the only way to proof the origin is to reproduce the defect. ⢠EMI can ...
