SEMICONDUCTOR MPC555 MPC555 Microcontroller

Four-Bank Memory Controller. • Works with SRAM, EPROM, flash EEPROM, and other peripherals. • Byte write enables. • 32-bit address decodes with bit masks.
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MOTOROLA

MPC555PB/D Rev. 2, December 2001

SEMICONDUCTOR PRODUCT BRIEF

MPC555 Product Brief

MPC555 Microcontroller Features • MPC555 core with floating-point unit • 26 Kbytes fast RAM and 6 Kbytes TPU microcode RAM • 448 Kbytes flash EEPROM with 5-V programming • 5-V I/O system • Serial system: queued serial multi-channel module (QSMCM), dual CAN 2.0B controller modules (TouCANTM) • 50-channel timer system: dual time processor units (TPU3), modular I/O system (MIOS1) • 32 analog inputs: dual queued analog-to-digital converters (QADC64) • Submicron HCMOS (CDR1) technology • 272-pin plastic ball grid array (PBGA) packaging • 40-MHz operation, -40 °C to 125 °C with dual supply (3.3 V, 5 V) • 32-bit architecture (compliant with the PowerPC architecture, Book 1) • Core performance measured at 52.7-Kbyte Dhrystones (v2.1) @ 40 MHz • Fully static, low power operation • Integrated double-precision floating-point unit • Precise exception model • Extensive system development support — On-chip watchpoints and breakpoints — Program flow tracking — BDM on-chip emulation development interface

This document contains information on a new product. Specifications and information herein are subject to change without notice. © MOTOROLA 2001, All Rights Reserved

256 Kbytes Flash

192 Kbytes Flash

Burst Interface

U-bus E-bus USIU

RCPU

10 Kbytes SRAM

16 Kbytes SRAM

L2U

L-bus

QADC

QADC

QSMCM

UIMB TouCAN

IMB3

TPU3

TPU3

DPTRAM

TouCAN

MIOS1

Figure 1 RISC MCU Central Processing Unit (RCPU) Four-Bank Memory Controller • Works with SRAM, EPROM, flash EEPROM, and other peripherals • Byte write enables • 32-bit address decodes with bit masks U-Bus System Interface Unit (USIU) • Clock synthesizer • Power management • Reset controller • MPC555 decrementer and time base • Real-time clock register • Periodic interrupt timer • Hardware bus monitor and software watchdog timer • Interrupt controller that supports up to eight external and eight internal interrupts • IEEE 1149.1 JTAG test access port • External bus interface — 24 address pins, 32 data pins — Supports multiple master designs — Four-beat transfer bursts, two-clock minimum bus transactions — Supports 5V inputs, provides 3.3-V outputs

MPC555

PRODUCT BRIEF Rev. 2, September 2001

MOTOROLA 2

Flexible Memory Protection Unit • Four instruction regions and four data regions • 4-Kbyte to 16-Mbyte region size support • Default attributes available in one global entry • Attribute support for speculative accesses 448-Kbyte Flash EEPROM Memory • One 256-Kbyte and one 192-Kbyte module • Page read mode • Block (32-Kbyte) erasable • External 4.75-V to 5.25-V program and erase power supply 26-Kbytes of Static RAM • One 16-Kbyte and one 10-Kbyte module • Fast (one-clock) access • Keep-alive power • Soft defect detection (SDD) General-Purpose I/O Support • Address (24) and data (32) pins can be used for general-purpose I/O in single-chip mode • Nine general-purpose I/O pins in MIOS1 unit • Many peripheral pins can be used for general-purpose I/O when not used for primary function • 5-V tolerant inputs/outputs Two Time Processor Units (TPU3) • Each TPU3 module provides these features: — A dedicated micro-engine operates independently of the RCPU — 16 independent programmable channels and pins — Each channel has an event register consisting of a 16-bit capture register, a 16-bit compare register and a 16-bit comparator — Nine pre-programmed timer functions are available — Any channel can perform any time function — Each timer function can be assigned to more than one channel — Two timer count registers with programmable prescalers — Each channel can be synchronized to one or both counters — Selectable channel priority levels — 5-V tolerant inputs/outputs • 6-Kbyte dual port TPU RAM (DPTRAM) is shared by the two TPU3 modules for TPU microcode 18-Channel Modular I/O System (MIOS1) • Ten double action submodules (DASM) • Eight dedicated PWM sub-modules (PWMSM) • Two 16-bit modulus counter submodules (MCSM) • Two parallel port I/O submodules (PIOSM) • 5-V tolerant inputs/outputs Two Queued Analog-to-Digital Converter 2 Modules (QADC64) Each QADC provides: • Up to 16 analog input channels, using internal multiplexing • Up to 41 total input channels, using internal and external multiplexing • 10-bit A/D converter with internal sample/hold • Typical conversion time of 10 µs (100,000 samples per second) • Two conversion command queues of variable length • Automated queue modes initiated by:

MPC555

PRODUCT BRIEF Rev. 2, September 2001

MOTOROLA 3

— External edge trigger/level gate — Software command • 64 result registers • Output data that is right- or left-justified, signed or unsigned • 5-V reference and range Two CAN 2.0B Controller Modules (TouCANTM) Each TouCANTM provides these features: • Full implementation of CAN protocol specification, version 2.0A and 2.0B • Each module has 16 receive/transmit message buffers of 0 to 8 bytes data length • Global mask register for message buffers 0 to 13 • Independent mask registers for message buffers 14 and 15 • Programmable transmit-first scheme: lowest ID or lowest buffer number • 16-bit free-running timer for message time-stamping • Low power sleep mode with programmable wake-up on bus activity • Programmable I/O modes • Maskable interrupts • Independent of the transmission medium (external transceiver is assumed) • Open network architecture • Multimaster concept • High immunity to EMI • Short latency time for high-priority messages • Low power sleep mode with programmable wakeup on bus activity Queued Serial Multi-Channel Module (QSMCM) • Queued serial peripheral interface (QSPI) — Provides full-duplex communication port for peripheral expansion or interprocessor communication — Up to 32 preprogrammed transfers, reducing overhead — 160-byte queue buffer — Programmable transfer length: from 8 to 16 bits, inclusive — Synchronous interface with baud rate of up to system clock divided by 4 — Four programmable peripheral-select pins support up to 16 devices — Wrap-around mode allows continuous sampling for efficient interfacing to serial peripherals (e.g., – serial A/D converters, I/O latches, etc.) • Two serial communications interfaces (SCI). Each SCI offers these features: — UART mode provides NRZ format and half-or full-duplex interface — 16 register receive buffer and 16 register transmit buffer (SCI1 only) — Advanced error detection and optional parity generation and detection — Word length programmable as 8 or 9 bits — Separate transmitter and receiver enable bits and double buffering of data — Wakeup functions allow the CPU to run uninterrupted until either a true idle line is detected or a new address byte is received — External source clock for baud generation — Multiplexing of transmit data pins with discrete outputs and receive data pins with discrete inputs, allowing realization of a low-speed serial protocol

MPC555

PRODUCT BRIEF Rev. 2, September 2001

MOTOROLA 4

0x00 0000 CMF Flash A 256 Kbytes 0x04 0000 0x06 FFFF

CMF Flash B 192 Kbytes

0x07 0000

0x2F C000 USIU Control Registers 1 Kbyte FLASH Module A (64 bytes) 0x2F C800 FLASH Module B (64 b ytes)

Reserved for Flash (2.6 Mbytes -–16 Kbytes)

0x2F C840 0x2F C880

Reserved for USIU 0x2F BFFF 0x 2F C000 0x 2F FFFF 0x30 0000

U SI U & F l ash Control 16 Kbytes IMB3 Address Space UIMB Interface & IMB3 Modules (32 Kbytes)

DPTRAM (6 Kbytes)

Reserved for IMB3 (480 Kbytes)

Reserved (2 Kbytes) 0x30 4000

TPU3_B (1 Kbyte)

0x30 4400

SR A M C on t r ol A ( 8 bytes)

QADC_A (1 Kbyte)

0x30 4800

QADC_B (1 Kbyte)

0x30 4C00

SR A M C on t r ol B ( 8 bytes)

QSMCM (4 Kbytes)

0x30 5000

0x30 6000

0x 38 0010

MIOS1 (4 Kbytes)

Reserved (485.98 Kbytes)

0x 3F C000 0x 3F FFFF

0x30 2000

TPU3_A (1 Kbyte)

0x 37 FFFF 0x 38 0000

0x 3F 9800

0x30 0000

Reserved (8180 bytes)

0x 30 7 FFF 0x 30 8000

0x 38 0008

DPTRAM Control (12 bytes)

TouCAN_A (1 Kbyte)

0x30 7080

TouCAN_B (1 Kbyte)

0x30 7480

SRAM A (10 Kbytes)

Reserved (1920 bytes)

0x30 7884

SRAM B (16 Kbytes)

UIMB Registers (128 bytes)

0x30 7F80 0x30 7FFF

Figure 2 MPC555 Internal Memory Map

MPC555

PRODUCT BRIEF Rev. 2, September 2001

MOTOROLA 5

Figure 3 MPC555 Pinout Data

MPC555

PRODUCT BRIEF Rev. 2, September 2001

MOTOROLA 6 y Dees

2

3

4

B_TPUCH2

G

TMS

WEB_ AT[1]

RD_WRB

OEB

TSIZ0

BURSTB

P

R

T

U

V

Y

BDIPB

VDDL

CS1B

CS0B

VDDI

A_TPUCH5

A_TPUCH9

VSSA

VDDA

VRH

8

9

10

11

12

13

14

15

VDDL

Data_ SGP29 Data_ SGP27 Data_ SGP25 Data_ SGP23

VDDL

Data_ SGP20 RCFB_TXP

VDDI

VDDL

VPP

Addr_ SGP14 Addr_ SGP16 Addr_ SGP18 Addr_ SGP20 Addr_ SGP23 Addr_ SGP26 Data_ SGP1 Data_ SGP3 Data_ SGP5 Data_ SGP7 Data_ SGP9 Data_ SGP11 Data_ SGP13 Data_ SGP15 Data_ SGP17 IRQ5B _SGP

CLKOUT

EXTCLK

KAPWR

VDDF

EPEE

TXD1_ QGPO

PCS0 _QGP

PCS1 _QGP

RXD1_ QGPI

VFLS1 _MPIO4

VFLS0 _MPIO3

VDDL

VF2 _MPIO2

MPIO15

MPIO8

MPWM18

MPWM17

MPWM1

MDA29

MDA15

Note: The pinout is a top down view of the package.

VSS

VSS

VSS

MPIO10

MPIO5

MPWM16

MPWM0

VDDL

MDA27

MDA14

18 MDA12

PCS2 _QGP VSS

VSS

VSS

VSS

VDDI

ETRIG1

ETRIG2

17 MDA11

PCS3 _QGP

VSS

VSS

VSS

VSS

16 VDDH

VSS

VSS

VSS

VSS

VSS

AAN1_PQB1 AAN50_PQB6 AAN55_PQA3 AAN58_PQA6 BAN50_PQB6 BAN55_PQA3 BAN58_PQA6 BAN59_PQA7

AAN2_PQB2 AAN51_PQB7 AAN56_PQA4 AAN59_PQA7 BAN49_PQB5 BAN53_PQA1 BAN56_PQA4 BAN57_PQA5

AAN3_PQB3 AAN49_PQB5 AAN53_PQA1 AAN57_PQA5 BAN1_PQB1 BAN48_PQB4 BAN52_PQA0 BAN54_PQA2

AAN0_PQB0 AAN48_PQB4 AAN52_PQA0 AAN54_PQA2 BAN0_PQB0 BAN2_PQB2 BAN3_PQB3 BAN51_PQB7

Addr_ SGP31 Addr_ SGP30 Addr_ SGP28 Addr_ SGP29

VDDI

A_TPUCH13

7 VRL

Addr_ SGP11 Addr_ SGP10 Addr_ SGP9 Addr_ SGP8 Addr_ SGP22 Addr_ SGP27 Data_ SGP31 Data_ SGP30 Data_ SGP28 Data_ SGP26 Data_ SGP24 Data_ SGP22 Data_ SGP21 Data_ SGP19 Data_ SGP18

TSB

TSIZ1

CS2B

WEB_ AT[3]

BBB _IWP3

SGP_ IRQOUTB

IRQ2B _SGP

BGB_LWP1

6

Ball Map 19

=3 volt power (I/O)

VDDi

=3 volt power (internal)

=ground 21 November 1997

VSS

VDDH

=5 volt power

20

MPIO13

MPIO12

MPIO9

MPIO6

MPWM3

MDA31

MDA28

VDDH

A_CNRX0

VDDH

PORESETB

ECK_ BUCK

VSSSYN

XFC

VSSF

RXD2_ QGPI

ECK

Version 10.2

=Misc power

VDDH

HRESETB

SRESETB

XTAL

EXTAL

VDDSYN

VDDH

TXD2_ QGPO

SCK_ QGP6

MISO _QGP4 MOSI _QGP5

A_CNTX0

VF0 _MPIO0 VF1 _MPIO1

MPIO14

MPIO11

MPIO7

MPWM19

MPWM2

MDA30

VDDH

MDA13

Addr_ SGP13 Addr_ SGP15 Addr_ SGP17 Addr_ SGP19 Addr_ SGP21 Addr_ SGP24 Addr_ SGP25 Data_ SGP0 Data_ SGP2 Data_ SGP4 Data_ SGP6 Data_ SGP8 Data_ SGP10 Data_ SGP12 Data_ SGP14 Data_ SGP16 IRQ6B _mck2 IRQ7B _mck3

VDDH

BIB_STSB

TAB

TEAB

CS3B

WEB_ AT[2]

BRB_IWP2

IRQ1B _SGP

Substrate 9/30/97a

VDDH

VDDH

W Addr_ SGP12

WEB_ AT[0]

N

M IRQ0B _SGP

IRQ4B _SGP

VDDL

VDD SRAM

B_CNTX0

B_TPUCH9

B_TPUCH12

VDDL

IRQ3B _SGP

SGP_FRZ

TRST_B

TDO_ DSDO

TDI_DSDI

B_CNRX0

B_TPUCH4

B_TPUCH8

B_TPUCH0

B_TPUCH3

B_TPUCH6

B_TPUCH10 B_TPUCH14

L IWP1 _VFLS IWP0 _VFLS

K

J TCK_ DSCK

B_TPUCH1

B_TPUCH5

F

H

B_TPUCH7

A_TPUCH2

E

5 A_TPUCH12 A_TPUCH15

A_TPUCH10 A_TPUCH11 A_TPUCH14

A_TPUCH8

D B_TPUCH11 B_TPUCH13 A_TPUCH0

A_TPUCH6

A_TPUCH4

A_TPUCH7

A_T2CLK

VDDH

A_TPUCH1

A_TPUCH3

C B_TPUCH15

B_T2CLK

B

1 VDDH

A

MPC555

Ordering Information Table 1 MPC555 Package Information Device Name

Order Part Number

Package Info

Temp. Range

MPC555

MPC555LFMZP40

272 PBGA

-40 to +125 °C

MPC555

MPC555LFCZP40

272 PBGA

-40 to +85 °C

MPC555

MPC555LFMZP40R2

272 PBGA Shipped in tape and reel media

-40 to +125 °C

MPC555

MPC555LFCZP40R2

272 PBGA Shipped in tape and reel media

-40 to +85 °C

Table 2 lists the documents that provide a complete description of the MPC555 and are required to design properly with the part. Documentation is available from a local Motorola distributor, a Motorola semiconductor sales office, a Motorola Literature Distribution Center, or through the Motorola Semiconductor documentation page on the Internet (the source for the latest information). Table 2 Available Documentation Document Number MPC555UM/AD

MPC555

Title MPC555/556 User’s Manual

AN1282/D

Board Strategies for Ensuring Optimum Frequency Synthesizer Performance.

AN1778/D

Using the MIOS on the MPC555 Evaluation Board

AN1821/D

Exception Table Relocation and Multi-Processor Address Mapping in the Embedded MPC5XX Family

AN1837/D

Non-Volatile Memory Technology Overview

AN2001/D

Designing Expansion Boards for the Motorola EVB555/ETAS ES200.

AN2109/D

MPC555 Interrupts.

AN2127/D

EMC Guidelines for MPC500-Based Automotive Powertrain Systems

PRODUCT BRIEF Rev. 2, September 2001

MOTOROLA 7