Remove fastly glass cover . Benefits: Safe, fast and repetable process. No thermal stress on sample. Necessary to clean sample with a solvent (vaporised glue).
Goal: Remove nearly all molding compound above the die down to 100µm thickness to allow SQUID investigations. Benefits: Safe, fast and repetable process. Very helpfull when some package components are not chemical compatible.
Frederic BEAUQUIS
EUFANET Workshop 2009
Goal: Remove fastly die paddle to obtain backside access. Benefits: Fast and repetable process. No mechanical scratch on die backside. Necessary to remove attach glue with acetone.
Frederic BEAUQUIS
EUFANET Workshop 2009
Goal: Remove fastly glass cover . Benefits: Safe, fast and repetable process. No thermal stress on sample. Necessary to clean sample with a solvent (vaporised glue).
Nov 29, 2011 - 3D integration is a key new trend for microelectronics. At system level, it allows incredible heterogeneous System in Packages with sensors, ...
Nov 29, 2011 - Advanced Packaging Processes suitable for complex electronic micromodule ..... already assessed at the laboratory scale or on specific industrial themes. ... Open 3D is a new platform started by LETI in April 2011. .... operation of th
You are kindly invited to attend the workshop on Optical Localization Techniques (Emission .... Gornik, Institute for Solid State Electronics, Vienna University of.
Increase member competences by technical seminar, workshops and tutorials; ... Form to fill. ⢠Validated by member ... Optical resolution, sensitivity evaluation.
It will be a workshop, not a conference, and a friendly event focused on practical ... Lab tour duration is around 1 hour. .... Round table: what do user need?
Oct 8, 2003 - 18h30 Magnetic field analysis challenges and solutions. ⢠Board : Romain Desplats (CNES), Gerald Haller (ST), Philippe Descamp (Philips),.
Special workshop. â« specifics 2 days workshop on. Optical testing (in conjunction with. CCT, TOLSA â¦) ? â« Mark your Calendar. â January 26-27, 2009.
383. 382. All Flip Flops in this ROI look OK at clock frequency, BUT at data frequency, data is missing starting from FF 383. 1st level of localization: Defect is ...
Packages using Magnetic Microscopy and. Lock-in-IR Thermography. M. Hechtl, G. Steckert, C. Keller, (A. Altes). Infineon Technologies. Failure Analysis.
Position of peaks provides fault location. Shorts or low impedances are shown by EOTPR as negative peaks. Substrate. Interposer. Si Die. B. G. A. Pa c k a g e.
Oct 6, 2010 - Introduction / Eufanet (Philippe Perdu). What is Eufanet and ... 3D (360degree) failure characterization in semiconductor devices using Hitachi's.
1st Case study. Sample #1. ⢠45nm technology. ⢠Specific test structure between for back-end validation (design perform in strong collaboration between test ...
The first presentation was on EUFANET goals (eufanet_goal.pdf). .... on cheap ways (email, web site) to increase information exchanges on failure analysis .... Nevertheless, English is required to have widespread exchanges at European ...
direct pointing of open failures. ... Case study 2 : real case on 32nm Product. ⢠Conclusion/ ... Traditional FA technique used for fail localization : Charge contrast.
Sociétés/Associations/Fondations/Autres. Pays. Administrateur représentant les salariés (mandat depuis le 21 juin ... Société cotée. (b). Sous réserve de son ...
To describe a comprehensive overview of fault site localization technique by imaging with Nanoprobes. Resistive Contrast Imaging (RCI). Voltage DIstribution ...
FIB Micro-pillar sampling of Si devices and its 3D observation. T. Yaguchi, T. ... Introduction. New materials such as electronic and semiconductor devices.
Mar 8, 2009 - stem cells on the French Riviera open to all research staff ... University, Jerusalem; âHuman Embryonic Stem Cells - Towards Future Therapy of.
Front side / Back side. Software enhancement. COMPUTER AIDED TOOLS FOR FA : NAVIGATION / BITMAP ( full integrated ). Behavioral simulation / diagnostic.
... Stimulation / Soft defect localization. ⢠IR Thermography ... Non destructive analysis ... Region Of Interest ? - Can you still test your product after preparation ?
needle stage, the geometry of the original specimen is not a limiting factor for ... Figure 4 shows a schematic flow for the FIB micro-pillar sample preparation ...
