SDLS032G − DECEMBER 1983 − REVISED MAY 2004
D Convert TTL Voltage Levels to MOS Levels D High Sink-Current Capability D Input Clamping Diodes Simplify System D D
SN5407, SN5417 . . . J OR W PACKAGE SN7407, SN7417 . . . D, N, OR NS PACKAGE (TOP VIEW)
1A 1Y 2A 2Y 3A 3Y GND
Design Open-Collector Driver for Indicator Lamps and Relays Inputs Fully Compatible With Most TTL Circuits
description/ordering information These TTL hex buffers/drivers feature high-voltage open-collector outputs for interfacing with high-level circuits (such as MOS) or for driving high-current loads (such as lamps or relays) and also are characterized for use as buffers for driving TTL inputs. The SN5407 and SN7407 have minimum breakdown voltages of 30 V, and the SN5417 and SN7417 have minimum breakdown voltages of 15 V. The maximum sink current is 30 mA for the SN5407 and SN5417 and 40 mA for the SN7407 and SN7417.
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC 6A 6Y 5A 5Y 4A 4Y
1Y 1A NC VCC 6A
SN5407 . . . FK PACKAGE (TOP VIEW)
4
3 2 1 20 19 18
5
17
6
16
7
15
8
14 9 10 11 12 13
6Y NC 5A NC 5Y
3Y GND NC 4Y 4A
2A NC 2Y NC 3A
These devices perform the Boolean function Y = A in positive logic.
NC − No internal connection
ORDERING INFORMATION TA
ORDERABLE PART NUMBER
PACKAGE†
SOIC − D
Tube
SN7407D
Tape and reel
SN7407DR
Tube
SN7417D
Tape and reel
SN7417DR
0°C to 70°C PDIP − N
−55°C to 125°C
Tube
TOP-SIDE MARKING 7407 7417
SN7407N
SN7407N
SN7417N
SN7417N
SN7407NSR
SN7407
SN7417NSR
SN7417
SNJ5407J
SNJ5407J
SNJ5417J
SNJ5417J
SOP − NS
Tape and reel
CDIP − J
Tube
CFP − W
Tube
SNJ5407W
SNJ5407W
LCCC − FK
Tube
SNJ5407FK
SNJ5407FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated
!"#$% ! & '("") % $& ! *(+, '$% ! -$%). "!-('%& '! !"# %! &*)' '$% ! & *)" %/) %)"#& ! )0$& &%"(#) %& &%$ -$"- 1$""$ %2. "!-('% ! *"!')&& 3 -!)& !% )')&&$" ,2 ',(-) %)&% 3 ! $,, *$"$#)%)"&.
*"!-('%& '!#*, $ % %! 4565 $,, *$"$#)%)"& $") %)&%)( ,)&& !%/)"1 &) !%)-. $,, !%/)" *"!-('%& *"!-('% ! *"!')&& 3 -!)& !% )')&&$" ,2 ',(-) %)&% 3 ! $,, *$"$#)%)"&.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SDLS032G − DECEMBER 1983 − REVISED MAY 2004
description/ordering information (continued) These circuits are completely compatible with most TTL families. Inputs are diode clamped to minimize transmission-line effects, which simplifies design. Typical power dissipation is 145 mW, and average propagation delay time is 14 ns.
logic diagram, each buffer/driver (positive logic) A
Y
schematic VCC 6 kΩ
3.4 kΩ
1.6 kΩ
Input A Output Y 100 Ω
1 kΩ GND
Resistor values shown are nominal.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V Output voltage, VO (see Notes 1 and 2): SN5407, SN7407 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V SN5417, SN7417 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values are with respect to GND. 2. This is the maximum voltage that should be applied to any output when it is in the off state. 3. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SDLS032G − DECEMBER 1983 − REVISED MAY 2004
recommended operating conditions (see Note 4)
VCC
Supply voltage
VIH VIL
High-level input voltage
MIN
NOM
MAX
SN5407, SN5417
4.5
5
5.5
SN7407, SN7417
4.75
5
5.25
2 0.8
High-level output voltage
IOL
Low-level output current
TA
Operating free-air temperature
V V
Low-level input voltage
VOH
UNIT
SN5407, SN7407
30
SN5417, SN7417
15
SN5407, SN5417
30
SN7407, SN7417
40
SN5407, SN5417
−55
125
SN7407, SN7417
0
70
V V mA °C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) TEST CONDITIONS†
PARAMETER VIK
VCC = MIN,
MIN
TYP‡
II = −12 mA
IOH
VCC = MIN,
VIH = 2 V
VOL
VCC = MIN,
VIL = 0.8 V
II IIH
VCC = MAX, VCC = MAX,
VI = 5.5 V VIH = 2.4 V
IIL ICCH
VCC = MAX, VCC = MAX
VIL = 0.4 V
MAX
UNIT
−1.5
V
VOH = 30 V (SN5407, SN7407) VOH = 15 V (SN5417, SN7417)
0.25
IOL = 16 mA IOL = 30 mA (SN5407, SN5417)
0.4
IOL = 40 mA (SN7407, SN7417)
0.7
0.25 0.7
mA
V
1
mA
40
µA
−1.6
mA
29
41
mA
ICCL VCC = MAX 21 † For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. ‡ All typical values are at VCC = 5 V, TA = 25°C.
30
mA
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1) PARAMETER
FROM (INPUT)
TO (OUTPUT)
tPLH tPHL
A
Y
RL = 110 Ω,
CL = 15 pF
tPLH tPHL
A
Y
RL = 150 Ω,
CL = 50 pF
POST OFFICE BOX 655303
TEST CONDITIONS
MIN
TYP
MAX
6
10
20
30
UNIT ns
15
• DALLAS, TEXAS 75265
26
ns
3
SDLS032G − DECEMBER 1983 − REVISED MAY 2004
PARAMETER MEASUREMENT INFORMATION VCC
RL From Output Under Test
Test Point CL (see Note A)
LOAD CIRCUIT 3V 1.5 V
Input
1.5 V 0V
tPLH High-Level Pulse
1.5 V
1.5 V
1.5 V
1.5 V
tPLH VOH
Out-of-Phase Output
1.5 V
1.5 V VOL
VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES
CL includes probe and jig capacitance. In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 7 ns, tf ≤ 7 ns. The outputs are measured one at a time, with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
4
1.5 V VOL
tPHL
VOLTAGE WAVEFORMS PULSE WIDTHS NOTES: A. B. C. D.
VOH
In-Phase Output
1.5 V tw
Low-Level Pulse
tPHL
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA MCFP002A – JANUARY 1995 – REVISED FEBRUARY 2002
W (R-GDFP-F14)
CERAMIC DUAL FLATPACK Base and Seating Plane
0.260 (6,60) 0.235 (5,97)
0.045 (1,14) 0.026 (0,66)
0.008 (0,20) 0.004 (0,10)
0.080 (2,03) 0.045 (1,14)
0.280 (7,11) MAX 1
0.019 (0,48) 0.015 (0,38)
14
0.050 (1,27)
0.390 (9,91) 0.335 (8,51) 0.005 (0,13) MIN 4 Places
7
8 0.360 (9,14) 0.250 (6,35)
0.360 (9,14) 0.250 (6,35)
4040180-2 / C 02/02 NOTES: A. B. C. D. E.
All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification only. Falls within MIL STD 1835 GDFP1-F14 and JEDEC MO-092AB
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF TERMINALS **
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342 (8,69)
0.358 (9,09)
0.307 (7,80)
0.358 (9,09)
28
0.442 (11,23)
0.458 (11,63)
0.406 (10,31)
0.458 (11,63)
21
9
22
8
44
0.640 (16,26)
0.660 (16,76)
0.495 (12,58)
0.560 (14,22)
23
7
52
0.739 (18,78)
0.761 (19,32)
0.495 (12,58)
0.560 (14,22)
24
6 68
0.938 (23,83)
0.962 (24,43)
0.850 (21,6)
0.858 (21,8)
84
1.141 (28,99)
1.165 (29,59)
1.047 (26,6)
1.063 (27,0)
B SQ A SQ
25
5
26
27
28
1
2
3
4 0.080 (2,03) 0.064 (1,63)
0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25)
0.055 (1,40) 0.045 (1,14)
0.045 (1,14) 0.035 (0,89)
0.045 (1,14) 0.035 (0,89)
0.028 (0,71) 0.022 (0,54) 0.050 (1,27)
4040140 / D 10/96 NOTES: A. B. C. D. E.
All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA MSOI002B – JANUARY 1995 – REVISED SEPTEMBER 2001
D (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
8 PINS SHOWN 0.020 (0,51) 0.014 (0,35)
0.050 (1,27) 8
0.010 (0,25)
5
0.008 (0,20) NOM
0.244 (6,20) 0.228 (5,80) 0.157 (4,00) 0.150 (3,81)
Gage Plane 1
4
0.010 (0,25) 0°– 8°
A
0.044 (1,12) 0.016 (0,40)
Seating Plane 0.010 (0,25) 0.004 (0,10)
0.069 (1,75) MAX
PINS **
0.004 (0,10)
8
14
16
A MAX
0.197 (5,00)
0.344 (8,75)
0.394 (10,00)
A MIN
0.189 (4,80)
0.337 (8,55)
0.386 (9,80)
DIM
4040047/E 09/01 NOTES: A. B. C. D.
All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15). Falls within JEDEC MS-012
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2004, Texas Instruments Incorporated
