Power MOSFET Databook

Absolute Maximum Ratings (Ta = 25°C). Item. Symbol. Ratings. Unit. Drain to source voltage. 2SK1056. VDSX. 120. V. 2SK1057. 140. 2SK1058. 160.
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2SK1056, 2SK1057, 2SK1058 Silicon N-Channel MOS FET

Application Low frequency power amplifier Complementary pair with 2SJ160, 2SJ161 and 2SJ162

Features • • • • • • •

Good frequency characteristic High speed switching Wide area of safe operation Enhancement-mode Good complementary characteristics Equipped with gate protection diodes Suitable for audio power amplifier

2SK1056, 2SK1057, 2SK1058 Outline

TO-3P

D 1

G

2

3 1. Gate 2. Source (Flange) 3. Drain

S

Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage

2SK1056

Symbol

Ratings

Unit

VDSX

120

V

2SK1057

140

2SK1058

160

Gate to source voltage

VGSS

±15

V

Drain current

ID

7

A

Body to drain diode reverse drain current

I DR

7

A

1

Channel dissipation

Pch*

100

W

Channel temperature

Tch

150

°C

Storage temperature

Tstg

–55 to +150

°C

Note:

2

1. Value at TC = 25°C

2SK1056, 2SK1057, 2SK1058 Electrical Characteristics (Ta = 25°C) Item

Symbol Min

Drain to source

2SK1056 V(BR)DSX

120

breakdown voltage

2SK1057

140

2SK1058

160

Typ

Max

Unit

Test conditions





V

I D = 10 mA, VGS = –10 V

Gate to source breakdown voltage

V(BR)GSS

±15





V

I G = ±100 µA, VDS = 0

Gate to source cutoff voltage

VGS(off)

0.15



1.45

V

I D = 100 mA, VDS = 10 V

Drain to source saturation voltage

VDS(sat)





12

V

I D = 7 A, VGD = 0 *1

Forward transfer admittance

|yfs|

0.7

1.0

1.4

S

I D = 3 A, VDS = 10 V *1

Input capacitance

Ciss



600



pF

VGS = –5 V, VDS = 10 V,

Output capacitance

Coss



350



pF

f = 1 MHz

Reverse transfer capacitance

Crss



10



pF

Turn-on time

t on



180



ns

Turn-off time

t off



60



ns

Note:

VDD = 20 V, ID = 4 A,

1. Pulse test

3

2SK1056, 2SK1057, 2SK1058 Maximum Safe Operation Area

Power vs. Temperature Derating 20

Ta = 25°C

100

n

tio

ra

pe

(T C

=

) °C

25

50

ID max (Continuous) P PW 5 PW W = = 1 10 0 m = 0 s 1 m 1 s s sh 1 2 1 ot sh sh ot ot 1.0 O

Drain Current ID (A)

10

C D

0.5 2SK1056 0

50 100 Case Temperature TC (°C)

0.2 5

150

Typical Output Characteristics 1.0 TC = 25°C

7 6

4

5 4

2

Pch =

3

100 W

VDS = 10 V

C=

0.8

T

VGS = 10 V 9 8

Drain Current ID (A)

Drain Current ID (A)

6

500 10 20 50 100 200 Drain to Source Voltage VDS (V)

Typical Transfer Characteristics

10

8

2SK1057 2SK1058

–2 5°C 25 75

Channel Dissipation Pch (W)

150

0.6

0.4

0.2 2 1 0

0

4

10 20 40 50 30 Drain to Source Voltage VDS (V)

0

0.4 0.8 1.6 2.0 1.2 Gate to Source Voltage VGS (V)

2SK1056, 2SK1057, 2SK1058 Drain to Source Voltage vs. Gate to Source Voltage

Drain to Source Saturation Voltage vs. Drain Current

5

VGD = 0

25

°C

75

10

°C

TC

25

=–

Drain to Source Voltage VDS (V)

Drain to Source Saturation Voltage VDS (on) (V)

10

°C

2 1.0 0.5

0.2 0.1 0.1

0.2

0.5 1.0 2 Drain Current ID (A)

5

6 5A 4

2

0

10

Input Capacitance vs. Gate Source Voltage

500

200 VDS = 10 V f = 1 MHz 100 0

–2 –4 –6 –8 –10 Gate to Source Voltage VGS (V)

2A ID = 1 A 6 2 4 8 10 Gate to Source Voltage VGS (V)

Forward Transfer Admittance vs. Frequency Forward Transfer Admittance  yfs  (S)

Input Capacitance Ciss (pF)

1000

TC = 25°C

8

3.0 1.0 0.3 0.1 0.03 0.01 0.003 10 k

TC = 25°C VDS = 10 V ID = 2 A

30 k 100 k 300 k 1 M 3 M Frequency f (Hz)

10 M

5

2SK1056, 2SK1057, 2SK1058 Switching Time vs. Drain Current

Switching Time ton,toff (ns)

500 t on

200 100 50

t off 20 10 5 0.1

0.2

0.5 1.0 2 Drain Current ID (A)

5

10

Switching Time Test Circuit Output RL= 2 Ω Input

PW = 50µs duty ratio =1%

20 V

50 Ω

Waveforms 90 % Input 10 % t on

t off 10 %

Output

90 %

6

2SK1056, 2SK1057, 2SK1058

When using this document, keep the following in mind: 1. This document may, wholly or partially, be subject to change without notice. 2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without Hitachi’s permission. 3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any other reasons during operation of the user’s unit according to this document. 4. Circuitry and other examples described herein are meant merely to indicate the characteristics and performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual property claims or other problems that may result from applications based on the examples described herein. 5. No license is granted by implication or otherwise under any patents or other rights of any third party or Hitachi, Ltd. 6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company. Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL APPLICATIONS.

Hitachi, Ltd. Semiconductor & IC Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 For further information write to: Hitachi America, Ltd. Semiconductor & IC Div. 2000 Sierra Point Parkway Brisbane, CA. 94005-1835 USA Tel: 415-589-8300 Fax: 415-583-4207

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