Cession 6 - Multiple FA techniques on advanced technologies Sylvain DUDIT
EUFANET Workshop 2009
Summary
• Typical EFA flow • Application on case of analysis • Focus to put in place for a complex case of analysis – Optical techniques for fault research and localization – The FIB and AFM-P during the analysis – Knowledge for a failure analyst
EUFANET Workshop 2009
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Summary
• Typical EFA flow • Application on case of analysis • Focus to put in place for a complex case of analysis – Optical techniques for fault research and localization – The FIB and AFM-P during the analysis – Knowledge for a failure analyst
EUFANET Workshop 2009
3
Typical EFA flow Best case: 1.5 Days Worst case: 18 Days Interaction with designer /Techno / Test needed
Day time 0.2 to 0.5
0.2 to 3
0.2 to 2
0.1 to 0.5
0.2 to 6
0.2 to 2
0.2 to 3
0.2 to 1
Physical analysis
FA_report
EMMI SLS / DLS TRE Frontside preparation FA request
• Typical EFA flow • Application on case of analysis • Focus to put in place for a complex case of analysis – Optical techniques for fault research and localization – The FIB and AFM-P during the analysis – Knowledge for a failure analyst
EUFANET Workshop 2009
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Case of analysis (1/5) •
Analysis – Test chip analog and digital on 65nm technology – Fail on specific structure to track the problem @ metallization level – Output stuck @ - no evident over consumption observed
IN
OUT
•
For a failure analysis point of view – Case with no over consumption : Open, bridge, serial defects – Case with over consumption : short to GND, short to VDD,
EUFANET Workshop 2009
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Case of analysis (2/5) EMMI results IN
•
Dynamic EMMI : – – – –
•
OU T
Transistor commutations High EMMI spot (drawbacks for the low emitter) No functionality after high EMMI spot 3 IV impacted by the failure ?
Next : – Laser stimulation – Goal : best fail understanding
EUFANET Workshop 2009
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Case of analysis (3/5) LS results
EMMI results IN
•
OU T
IN
OU T
Laser Stimulation – SIL220X benefits versus a 100X lenses • Sensitivity, spatial resolution • Best fail understanding • 2 IV impacted by the failure ? (1 in accordance with EMMI result)
EUFANET Workshop 2009
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Case of analysis (4/5) LS results IN
EMMI results OU T
IN
OU T
•
TRE results – Not in total accordance with LS and EMMI – 5 IV impacted by the failure ?
EUFANET Workshop 2009
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Case of analysis (5/5) •
Conclusion about fail hypothesis : – Short @ VDD or GND on a very long path – 3 FA techniques of localization with results but without fine localization – DLS technique : Fail (pseudo static fail)
!!! Charge contrast technique use to have the good localization !!!
IN
OUT
EUFANET Workshop 2009
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• Typical EFA flow • Application on case of analysis • Focus to put in place for a complex case of analysis – Optical techniques for fault research and localization – The FIB and AFM-P during the analysis – Knowledge for a failure analyst
EUFANET Workshop 2009
11
Fault research & Localization EMMI + SLS Top side
Top & Back side
EMMI static
EBT-Ebeam Tester Top & Back side
PLS – Obic (Liva)
TLS – Obirch (Tiva)
- ESD - Hot carriers - Latch-up Measurement : - Delay - Rise/fall time @ebeam probe point
Back side
- Floating node - Non bias junction - Resistive path
Timing analysis Tester
EMMI + Laser tester
TRE Back side
Measurement : - Delay @transistor level
EMMI Dynamic
EUFANET Workshop 2009
SDL
Dynamic fault tracking: - cross talk - Latch-up
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Fault research & Localization FIB AFM Probing
Electrical characterization by “in situ” contact 60µA
Front side modification
Current leakage mapping
Id/Vd REF
15µA
Id/Vd FAIL Backside modification
Cross-Ebeam Probe Pad section Generation EUFANET Workshop 2009
Charge contrast
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Knowledge for a failure analysis
Knowledge needed :
Knowledge needed :
- Sample Preparation ( // polishing, chemical, micro drill …) - Electrical setup ( Power supplies , DC) - CAD navigation setup – Layout view - Optic Tester ( EMMI+SLS) (collaboration with the designers) - Mechanical deprocessing - Chemical deprocessing - SEM Imaging - Fib editing (F / B) and X-sectioning
Sample Preparation ( // polishing, chemical, micro drill …) - Electrical setup ( Power supplies , DC) - Electrical setup AC : °Pattern conversion & Optimization - CAD navigation setup ° Layout view °Netlist view °Schematic view - Optic Tester 5 ( EMMI+ SLS + TRE + DLS) - E-beam - Comparison with simulation results (close collaboration with the designers) - AFM probing - Mechanical deprocessing - Chemical deprocessing - SEM Imaging - Fib editing ( F / B) and X-sectioning -
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imaged to date that have masses less than 13 times that of Jupiter. ... Keywords: Exoplanets, coronagraphs, adaptive optics, instrumentation, theory ..... caused by random phase aberrations and log-amplitude perturbations in various optical ..... per
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common question I get is about various forms of anal sex (analingus, actual anal ... Anal activities in sex are less talked about, and make many people feel more ...
incorporation of multiple specifications into the design problem such as Hзжй .... vt ) T nЧu X uw i h g fUd ll d wYT ng T nfinÐTWipg -eqT m#g n§RhTd nÐP l ...... motor and a concentrated mass at the tip of the second beam which is the payload
Jun 19, 2013 - Standard (SRAM) transistor characterization (case study) ... Samples with high topography (different layers) can easily be measured. â« Shorts ...
coordinates but these points are an effect, not a root cause, especially for ... Introduction. ⢠Fail scan electrical analysis ... Product : Integrated Circuit for ASIC BU.
To describe a comprehensive overview of fault site localization technique by imaging with Nanoprobes. Resistive Contrast Imaging (RCI). Voltage DIstribution ...
FIB Micro-pillar sampling of Si devices and its 3D observation. T. Yaguchi, T. ... Introduction. New materials such as electronic and semiconductor devices.
Nov 28, 2011 - Membrane deflection increased=>cavity internal pressure increased. â Test vehicle is not hermetic. Surface topography after bombing stage.
Front side / Back side. Software enhancement. COMPUTER AIDED TOOLS FOR FA : NAVIGATION / BITMAP ( full integrated ). Behavioral simulation / diagnostic.
... Stimulation / Soft defect localization. ⢠IR Thermography ... Non destructive analysis ... Region Of Interest ? - Can you still test your product after preparation ?
needle stage, the geometry of the original specimen is not a limiting factor for ... Figure 4 shows a schematic flow for the FIB micro-pillar sample preparation ...
