IFB-DVI-V2 EDID update procedure

Observe all ESD precautions when manipulating the IFB-DVI-V2 card by hands ! • Carefully unsolder the 24C02 SOIC8 chip by heating four pins at the same ...
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IFB-DVI-V2 EDID update

IFB-DVI-V2 EDID update (+EIA/CEA-861) U3 chip replacement procedure

Locate the U3 chip on the IFB-DVI-V2 card •

Observe all ESD precautions when manipulating the IFB-DVI-V2 card by hands !



Carefully unsolder the 24C02 SOIC8 chip by heating four pins at the same time with the 390°C temp. iron (start by the left side, bend the chip upward on its left and unsolder the four remainings pins of its right side).



When older chip removed, clean the 8 PCB pads with iron and solder wick to remove previous solder paste.



Take the new EDID chip from it anti-static bag and take care of ESD when carrying the new chip with your hands back to the PCB. Discharge yourself by touching the earth. Page 1 of 2

IFB-DVI-V2 EDID update



Place the new EDID chip with care to its ORIENTATION (Pin #1 location is on the upper left footprint corner on PCB !). See the picture below :



When the new chip is placed on the U3 footprint with correct orientation, solder its 8 pins one after one.



Check for any solder ponds on the right 4 pins. If any, remove them with solder wick and restart the pin(s) soldering process. Do not heat too much this small device or it’ll burn !



Re-install the card within the projector and test it.

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