TSH11 120MHz BANDWIDTH MOS INPUT SINGLE OPERATIONAL AMPLIFIER

.. .. .

VERY LOW INPUT CURRENT : 2pA typ GAIN BANDWIDTH PRODUCT : 120MHz UNITY GAIN STABLE SLEW RATE : 150V/µs STANDARD PIN OUT

N DIP8 (Plastic Package)

D SO8 (Plastic Micropackage)

DESCRIPTION The TSH11 is a low cost wide bandwidth single operational amplifier featuring extremely low input current of 2pA typ. Other features as unity gain stability, fast settling time and high linearity make it suitable for many applications requiring speed and very high input impedance as photo cell amplifier, high input impedance buffer, Fet probe, high speed precision integrator, sample and hold circuit...

ORDER CODES Part Number

Temperature Range o

TSH11I

o

-40 C, 105 C

Package N

D

•

•

PIN CONNECTIONS (top view)

Offse t Null 1

1

8

Offse t Null 2

Inve rting Input

2

7

VCC+

Non-inverting Input

3

6

Output

4

5

N.C.

VCC

November 1994

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TSH11 SCHEMATIC DIAGRAM 7 VCC +

Interna l Vref

non inverting input 3

6 output

2 inverting input

Cc

1 Offs e t N1

8 Offs e t N2

4 VCC-

INPUT OFFSET VOLTAGE NULL CIRCUIT TS H11

N2

N1

100k Ω

VCC

ABSOLUTE MAXIMUM RATINGS Symbol

Value

Unit

VCC

Supply Voltage

±7

V

Vid

Differential Input Voltage

±5

V

Vi

Input Voltage Range

±5

V

Iin

Current On Offset Null Pins

±20

mA

Toper

Parameter

Operating Free-Air Temperature Range

TSH11C TSH11I TSH11M

0oC +70 -40oC +105 o -55 C +125

o

C

OPERATING CONDITIONS Symbol

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Parameter

VCC

Supply Voltage

Vic

Common Mode Input Voltage Range

Value

Unit

±3 to ±6

V

VCC- to VCC+ -3

V

TSH11 ELECTRICAL CHARACTERISTICS VCC = ± 5V, Tamb = 25oC (unless otherwise specified) Symbol Vio DV io Iib Iio ICC Avd Vicm CMR SVR Vo Io GBP SR en ∅m

Parameter Input Offset Voltage Input Offset Voltage Drift Tmin ≤ Tamb ≤ Tmax Input Bias Current Input Offset Current Supply Current, no load VCC = ± 5V Large Signal Voltage Gain RL= 100Ω Vo = ±2.5V Input Common Mode Voltage Range Common Mode Rejection Ratio Vic = Vicm min. Supply Voltage Rejection Ratio VCC = ± 5V to ± 3V Output Voltage RL = 100Ω

Min.

Typ. 3

Max. 15

20 2 2 20

Unit mV o µV/ C

300 200 40

pA pA mA V/V

200 -5 to +2 55

800 -5.5 to +2.5 95

45 ± 2.5

65 +3.5 -3.7

Output Short Circuit Current Vid = ±1V, Vo = 0V Gain Bandwidth Product AVCL = 100, R L = 100Ω, f = 7.5MHz Slew Rate Vin = ± 2V, AVCL = 1, RL = 100Ω

120

Equivalent Input Voltage Noise

20

Phase Margin AVM = 1, RL = 100Ω, CL = 15pF

f = 1MHz

±70

V dB dB V mA MHz V/µs

150 nV √  Hz Degrees

40

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TSH11 EVALUATION CIRCUIT +5V 10µF 50Ω 10nF Input

50Ω Output

1kΩ 10nF

-5V

10µF 1kΩ

C

F

PRINTED CIRCUIT LAYOUT As for any high frequency device, a few rules must be observed when designing the PCB to get the best performances from your this speed op amp. From the most to the least important points : • Each power supply lead has to be bypassed to ground with a 10nF ceramic capacitor very close to the device and a 10µF tantalum capacitor. • To provide low inductance and low resistance common return, use a ground plane or common point return for power and signal. • All leads must be wide and as short as possible especially for op amp inputs. This is in order to decrease parasitic capacitance and

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• • •

•

inductance. Use small resistor values to decrease time constant with parasitic capacitance. Choose component sizes as small as possible (SMD). On output, decrease capacitor load so as to avoid circuit stability being degraded which may cause oscillation. One can also add a serial resistor in order to minimise its influence. One can add in parallel with feedback resistor a few pF ceramic capacitor CF adjusted to optimize the settling time.

TSH11 PACKAGE MECHANICAL DATA 8 PINS - PLASTIC DIP

Dimensions A a1 B b b1 D E e e3 e4 F i L Z

Min.

Millimeters Typ. 3.32

0.51 1.15 0.356 0.204

Max.

1.65 0.55 0.304 10.92 9.75

7.95

Min. 0.020 0.045 0.014 0.008

Max.

0.065 0.022 0.012 0.430 0.384

0.313

2.54 7.62 7.62

3.18

Inches Typ. 0.131

0.100 0.300 0.300 6.6 5.08 3.81 1.52

0.125

0260 0.200 0.150 0.060

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TSH11 PACKAGE MECHANICAL DATA 8 PINS - PLASTIC MICROPACKAGE (SO)

Dimensions A a1 a2 a3 b b1 C c1 D E e e3 F L M S

Min.

Millimeters Typ.

0.1 0.65 0.35 0.19 0.25

Max. 1.75 0.25 1.65 0.85 0.48 0.25 0.5

Min.

Inches Typ.

0.026 0.014 0.007 0.010

Max. 0.069 0.010 0.065 0.033 0.019 0.010 0.020

0.189 0.228

0.197 0.244

0.004

o

45 (typ.) 4.8 5.8

5.0 6.2 1.27 3.81

3.8 0.4

0.050 0.150 4.0 1.27 0.6

0.150 0.016

0.157 0.050 0.024

o

8 (max.)

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publ ication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.  1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.

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