Your Hot Ideas … Our Cool Solutions!

May 31, 2007 - 2006 Electron d'Or Award (France) .... ▫MUST Consider Temperature effects when ..... programmable 4K bit embedded memory blocks:.
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Your Hot Ideas … Our Cool Solutions! IUT GEII May 31 2007 Patrizio Piasentin – Actel France Country Manager Cyril Carsalade - FAE

Actel Company Overview  Established FPGA Supplier First product shipped - 1988 $191M in sales in 2006 63 consecutive quarters of Pro Forma profitability Strong balance sheet >$170 M cash, no debt More than 550 employees Fabless company #1 non volatile FPGA supplier 100% green and RoHS compliant

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2007 Roadshow

2

The Challenges Facing Today’s System Designer Time to market and design costs driving Programmable System Chip (PSC) market cin >>X >>Y; for (;;) {cout X>>Y; }

MCU Suppliers

Analog Suppliers

LUT

Malleable (HW & SW) Mixed Signal PSC

FPGA Suppliers

ASIC Suppliers Your Hot Ideas … Our Cool Devices

2007 Roadshow

3

Fusion PCS with ARM7  Changes the competitive landscape Integrates analog, Flash, SRAM and FPGA with soft ARM7 IP core in a single chip Fusion and ARM7 unlock possibilities by increasing design flexibility and configurability while reduced power, footprint, board complexity and risk

Fusion ARM7 System Off-chip Memory SRAM or Flash

Cache Memory SRAM

NV Storage FLASH

CoreMP7 FPGA MPUOptimized / MCU

Flash FPGA

ARM7

Analog Interface

Power Mgmt

Clock Mgmt

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Discrete Analog

2007 Roadshow

4

Actel’s Key Market Segments ƒValue-based FPGA ƒSub-$10 market System Cost effective

ƒProgrammable System Chip ƒSystem developers need integrated functionality on a single chip Analog / Processing / User Flash

ƒSystem Critical ƒWhere failure and tampering are not options SEU immune technologies

Nonvolatile technologies applied to three target market segments Your Hot Ideas … Our Cool Devices

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5

Actel Solutions Includes Enablers Software & Hardware Tools •Libero Integrated Design Environment •EDA Partners •Programming Solutions •Verification and Debug Solutions •Evaluation Boards

Intellectual Property •DirectCores •CompanionCores •Solution Partners •Free Evaluations

Support •Technical Support •Technical Training •Customer Portal •Knowledge Base

Services •Design Services •DO 254 Services •Prototyping Services •Programming Services

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6

Award Winning Products

2007 EE Times ACE Awards Finalist 2006 EDN “Hot 100 Products of Year” 2006 EE Times “Ultimate Products – Q3 2006” 2007 EE Times China ACE Awards Finalist 2006 ECN Technology Awards 2006 EE Times ACE Awards Finalist–Design Team 2006 Electronics Weekly Elektra Awards Finalist 2006 EDN China Leading Product Award 2006 EEPW Editor’s Choice Award “Best Embedded System Product” (China)

2006 Electron d’Or Award (France) 2006 IEC DesignVision Award 2005 EDN “Innovation of the Year” Award 2005 EDN “Hot 100 Products of Year”

2005 EDN “Hot 100 Products of Year” 2005 Electronic Products “Product of the Year”

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7

Actel Differentiators

FPGA Technologies Compared

Actel SRAM

Flash

Antifuse

1T 6T

Reprogrammable

Best of Both Worlds Reprogrammable & Nonvolatile

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2007 Roadshow

Nonvolatile

9

Actel Technology Advantages  Single-chip offerings provide total cost advantage over competition

 Inherently more secure than any other solution

 All Actel devices function as soon as power is applied to the board

 Power advantages over competition

 Actel delivers a significant reliability advantage over SRAM-based devices Your Hot Ideas … Our Cool Devices

2007 Roadshow

10

Typical System Board Before Fusion Clock Clockchip chiprequire require because becauseFPGA FPGAhas has no nosource source

OSC. Clock Chip

RTC RTCto totrack trackreal real time timeand andtime timestamp stamp events events RTC Digital FPGA

Processor

PWM

EE22PROM PROM for fordata data logging logging

External Externalflash flash for forcode code

EEPROM

NV Storage

Memory

Memory

For Formotor motor control control ADC

Temp Monitor and Fan Cntrl

ADC ADCto tointerface interfaceto to “real “realworld” world” Your Hot Ideas … Our Cool Devices

CPLD

Power Seq. Current Monitor and Brown-out detect

Sequences Sequences and andmonitors monitors multiple multiplepower power supplies supplies CPLD CPLDfor for SRAM SRAM configuration configuration /supervisory /supervisory

Thermal Thermalmgt mgtIC IC for forfan fancontrol control 2007 Roadshow

11

Typical System Board After Fusion

Processor FUS1ON PSC

Memory

Memory

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12

Total System Cost ProASIC3 Leadership SP3 & CYC 2

ProASIC3

Comparable

Comparable

Always

Not required

Clock Management

Often

Not required

Live at Power-Up CPLD

Often

Not required

Reset Controller

Sometimes

Not required

Configuration LDO

Very Often

Not required

Brownout detector

Very Often

Not required

Heat Sink / Cooling

Sometimes

Not required

FPGA Core LDO adder

Always

Not required

PCB AREA Penalty

Always

Not required

FPGA Unit Cost Configuration Memory Class 2 LAPU Penalty

Volatile SRAM Penalty

Total Bill of Materials Adder Up to 100% adder

No adder

 There is also a support cost overhead Development and debug time Your Hot Ideas … Our Cool Devices

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13

Actel IGLOO Low Power Leadership  Actel IGLOO is the lowest power solution

Low Power Mode 60KSG (nW/uLE) 500

 CPLDs short of logic and features for same power budget

400 300

 IGLOO wins on power AND features

200 100 0 Series2

XC2C512

LCMXO640C

QL1P100

AGL060

451

77

47

15

 Other FPGAs not competitive

Device

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14

Temperature Effect MUST Consider Temperature effects when choosing your target FPGA Static Power at Temp (25C vs 85C) 1000 900

Spartan3 - 85C

800

Static Power (mW)

700 600 500 400 300

PA3/E - 85C

Spartan3 - 25C

200 100

PA3/E - 25C

0 0

5000

10000

15000

20000

25000

30000

35000

40000

45000

50000

LE (equiv.) Your Hot Ideas … Our Cool Devices

2007 Roadshow

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Programmable Logic Technologies SRAM

SRAM

SRAM FPGA with boot (PROM or MCU)

Hybrid FPGAs/CPLDs – SRAM fabric loaded from NVM on chip PROM

SRAM FPGA

or MCU

NVM Hybrid FPGA/CPLD

NVM

EEPROM

Flash/Antifuse

SPLD/CPLDs – EEPROM

NVM FPGAs

EEPROM SPLD/CPLD

NVM FPGA

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16

Live at Power Up SRAM FPGA Example System using SRAM FPGA loaded from external Flash Power Up Sequence

Time

1.

Power On (applied)

0 ns

2.

Regulate power, clock

3.

Apply Reset and provide clocks to devices

4.

SPLD Address Memory for MCU

5.

Power Up (stable)

6.

Components initialized

7.

MCU wakes up and starts initializing

Reset Controller (CPLD)

ASSP

Clock Generation PLL/Dividers

MCU

100 µs

Config.

MCU operational

9.

FPGA configuration loaded from MCU

10.

FPGA operational

SRAM FPGA

Address/Data

Address/data Decode SPLD

Address/Data

Address/Data

8.

Xtal Osc.

Flash Memory >200 ms Your Hot Ideas … Our Cool Devices

2007 Roadshow

Live At power up (Level 0) Live After power up (Level 1) Live After system initialized (Level 2) 17

Live at Power Up Actel NVM FPGA Case Circuit showing design implementation using Actel Flash FPGA Clock Reset

Power Up Sequence

Time

1.

Power On (applied)

0 ns

2.

Regulate power, clock

3.

Actel FPGA is Live, I/Os active FPGA applies Reset and provides Clocks to devices

4.

FPGA initializes memory

5.

Power Up (stable)

6.

Components initialized

7.

MCU wakes up and starts initializing

Live After power up (Level 1)

8.

MCU is operational

Live After system initialized (Level 2)

50 µs

MCU

ASSP

Actel FPGA

Clock Source

Memory 100 µs

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Live At power up (Level 0)

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PLD Live At Power Up timing Family

Power-Up Time

LAPU

(est./test)

Classification

SPLD (EEPROM)

22V10

100us

0

CPLD (EEPROM)

MAX7000

100us

0

Hybrid CPLD

MAX II1

>2ms

1

>2ms

1

CoolRunner II Lattice FPGA

ispXPGA2

Xilinx FPGA

Spartan31 XC3S200

>200ms

2

Altera FPGA

Cyclone1

>200ms

2

Actel FPGA

ProASICPLUS

100us

0

Actel FPGA

ProASIC3

100us

0

Actel FPGA

Ax, Sx, Sx-A, Mx, eX

100us

0

Notes 1. Best Case conditions taken from datasheet 2. Based on the company statement on web site 3. Ramp up 1ms

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19

What is Over Building, Cloning and Reverse Engineering

Over Building „ Unscrupulous manufacturer buys standard parts (FPGAs) on the open market and over builds. Selling the extra inventory for profit with non of the support and design overhead.

Cloning „ A competitor makes a copy of the boot prom or intercepts the bit stream from the on-board processor and copies the code. If you have a bit stream in your design, your IP is very vulnerable to cloning.

Reverse Engineering „ A competitor copies a design by reconstructing a “schematic” or netlist level representation in the process, he understands how the design works and to improve it. Your Hot Ideas … Our Cool Devices

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20

ProASIC3/E Security Features Device Security Layers

Muti-layered approach to Security

Physical

 Physical Flash under 7 Metal Layers. Virtually impossible to detect charge on Floating Gates There is NO readback mechanism on PA3 devices

Security Header

Password

 Password FlashLock – 128 bit FlashLock password. Correct password is needed to modify security settings

Decryption

 Decryption Bitstream can be encrypted in Libero and then decrypted using a built-in AES decryption core

Application

 Application IP cores that provide AES or DES encryption or decryption of data can be programmed into the FPGA fabric. The on-chip FROM is very useful (and secure) to store keys for these user applications

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21

ProASIC3 Secure ISP Leadership  Several security options exist

Libero Plain Text

AES Encryption

Option 1: FlashLock Security in effect ‹ Device programmed with plain text

(bypass) Source Cipher Text

Opt. 3

Opt. 2

Opt. 1

TCP/IP Internet

AES Decrypt

FROM

Option 2: Overbuilding Protection ‹ Device programmed in-house with an

AES key only, then shipped to a 3rd party manufacturer ‹ Final programming at untrusted site (contract manufacturer) using AESencrypted bit-stream

Option 3: Secure ISP ‹ Device can be reprogrammed remotely

using AES encrypted programming file for easy and secure field upgrades

 Secure FROM programming FPGA Core

Same options as above Can be updated independently Your Hot Ideas … Our Cool Devices

2007 Roadshow

22

ASIC Alternatives Reliability & Liability  FPGA users want ASIC reliability and not product liability

Oxide Insulation

Gate

Drain

 SRAM FPGAs are unreliable?

Source

N+

N+

- - + -+ + - - + + -+ +

P Substrate Depletion Region

Dominant failure mechanism for SRAM FPGAs is Firm Errors at ALL altitudes

SRAM FPGAs Incoming neutron causes firm error in routing

SRAM FPGA FIT (Failure in Time) rate is 2 orders of magnitude higher than Industry norms ProASIC3 Flash FPGAs are Firm Error immune

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High Energy Neutron

Firm error leads to . . .

misrouted signal

2007 Roadshow

or missing signal

23

Neutron Effects on FPGA Configuration SRAM FPGAs are vulnerable to neutron upsets SRAM

Flash

Antifuse

1 1 0 1 1 0 0 1

A B

10

10

10

1 0

10

1 0

C

A B C

Q

A B C

Q

1 0

Q SRAM cells control function of logic cell. SRAM cells are active devices with low capacitance and are vulnerable to neutron upset

Flash cells connect to tieoffs and signal tracks. Flash cells store charge on a thin floating gate and are immune to neutron upset Your Hot Ideas … Our Cool Devices

2007 Roadshow

Antifuses control connections to tie-offs and signal tracks. Antifuses are passive devices and are immune to neutron upset 24

Firm Errors Have Serious Impact on SRAM FPGA Logic SRAM Look-Up Table configures logic cell to implement OR-3 logic 1 1 1 1 1 1 1

A B

10

10

10

1 0

Single bit error causes complete PERMANENT change in function

SRAM Look-Up Table configures logic cell to implement constant logic 1

0

1 1 1 1 1 1 1

A B

10

1 0

Neutron

C

10

10

1 0

10

1 0

C

1 0

1 0

Configuration SRAM

Q A B C

10

1

Q

1111111

A B C

Q

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2007 Roadshow

x x x

Vdd

Q

25

Automotive Examples  Scenario An occupant sensing airbag system uses one FPGA One million systems are in service The table indicates system FIT rates and MTBF using a variety of FPGAs FPGA Logic Error Failure Rates in Autom otive System Xilinx Rosetta Xilinx XC2V6000 Xilinx XC2V3000 Xilinx XC2V1000

Sea Level 416,666,667 FITs MTBF (Hours) 2.40 200,236,672 FITs MTBF (Hours) 4.99 77,852,516 FITs MTBF (Hours) 12.84

5,000 Ft 2,281,746,032 MTBF (Hours) 1,096,534,154 MTBF (Hours) 426,335,208 MTBF (Hours)

iRoC Phase 2 FITs 0.44 FITs 0.91 FITs 2.35

Xilinx XC3S1000 Altera EP1C20 Actel APA1000 Actel AX1000

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Sea Level 2,393,001,555 FITs MTBF (Hours) 0.42 1,150,000,000 FITs MTBF (Hours) 0.87 447,122,862 FITs MTBF (Hours) 2.24 320,000,000 FITs MTBF (Hours) 3.13 460,000,000 FITs MTBF (Hours) 2.17 0 FITs MTBF (Hours) 0 FITs MTBF (Hours) -

2007 Roadshow

5,000 Ft 8,115,396,579 MTBF (Hours) 3,900,000,000 MTBF (Hours) 1,516,329,705 MTBF (Hours) 1,100,000,000 MTBF (Hours) 1,600,000,000 MTBF (Hours) 0 MTBF (Hours) 0 MTBF (Hours)

FITs 0.12 FITs 0.26 FITs 0.66 FITs 0.91 FITs 0.63 FITs FITs -

26

Neutron Test Results Summary – Configuration Failures Equivalent Functional Failure FIT Rates per Device FPGA

Technology

Ground-Level Applications

Commercial Aviation

Military Aviation

Sea Level

5,000 Ft

30,000 Ft

60,000 Ft

Actel AX1000 1M-Gate

0.15µm Antifuse

No Failures Detected

No Failures Detected

No Failures Detected

No Failures Detected

Actel APA1000 1M-Gate

0.22µm Flash

No Failures Detected

No Failures Detected

No Failures Detected

No Failures Detected

Actel A3P1000 1M-Gate

0.13µm Flash

No Failures Detected

No Failures Detected

No Failures Detected

No Failures Detected

Xilinx XC2V3000 3M-Gate

0.15µm SRAM

1,150 FITs

3,900 FITs

170,000 FITs

540,000 FITs

Xilinx XC3S1000 1M-Gate

90nm SRAM

320 FITs

1,100 FITs

47,000 FITs

150,000 FITs

Altera EP1C20 1M-Gate

0.13µm SRAM

460 FITs

1,600 FITs

67,000 FITs

220,000 FITs

Altera EP2C20 1M-Gate

90nm SRAM

700 FITs

2,400 FITs

103,000 FITs

330,000 FITs

Altera EP2S30 2M-Gate

90nm SRAM

1,500 FITs

5,200 FITs

225,000 FITs

710,000 FITs

FITs = number of errors in 109 hours ‹ ‹

Acceptable FIT rates for commercial applications are < 100 Acceptable FIT rates for high-reliability applications are < 20 Your Hot Ideas … Our Cool Devices

2007 Roadshow

27

Motor control challenge Time to Market and Cost Regulation pressure (pollution) Customer pressure (oil consumption )

Sensors & Actuators Algorithm complexity # of process

uController performance required uController cost Time to design software

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28

Sensor N

$ uController

Actuator 1 Actuator 2

Parallel

Sensor 1 Sensor 2

Parallel

uController Real Time Issues

Sequential

Actuator M

Memory

Process 1 Process 2 Process P

Real Time issue Your Hot Ideas … Our Cool Devices

2007 Roadshow

Time

29

Vision: FPGA is uC companionchip Sensor 1 Sensor 2 Sensor N

uC

$

Actuator 1 Actuator 2 Actuator M

FPGA FPGA

$

Process 1 Process 2 Process P

NO Real Time issue Your Hot Ideas … Our Cool Devices

2007 Roadshow

Time

30

Reliable and low cost

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31

ProASIC3 The Production FPGA Technology Changes Flash Advantages

ProASIC3/E Typical Floorplan RAM/FIFO

PLL/CCC

VersaNets

VersaTile

Pro I/O

Charge Pumps FROM ISP AES NVM Decryption Your Hot Ideas … Our Cool Devices

2007 Roadshow

JTAG ISP 33

ProASIC3/E Key Features Industry’s Lowest Cost FPGA solution 130nm 7LM Flash-Based CMOS FPGA

Only FPGA with on-chip user Non-Volatile Flash Memory 1024 bits (128 x 8 pages) of On-Chip user NVM Flash

Only FPGA supporting ARM7 soft core with CoreMP7 Industry’s best FPGA ISP solution Fast single voltage - Flash ISP Secure FlashLock enabled read-back protection AES based secure In System Programming

Only FPGA with ASIC like features Fast, Single Chip, Live at Power Up, Firm Error Immune

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34

ProASIC3 Fine Grained Architecture Up to 75,264 tiles any of which can be any 3 input combinatorial gate, a latch or a D-FF with Enable

 a

Data X3 pin 4

Clk X2 pin 3

All input signals can be inverted Easier technology mapping and netlist optimizations

Clr XC pin 5





 a 

  a a   a a

0 1

0 1  a



Y pin 1 F2 YL

0 1   a  a

 a

  a a

  a

Set/Reset/Enable X1 pin 2

Register intensive applications are handled easily

 a

 a   0   1  a a     a a   a a    a  a

  a



  a

 a  a

Your Hot Ideas … Our Cool Devices

  a

  a

Combinatorial : Any function of 3 inputs. 3 LUT equivalent A B C

 a

Q

 a

 a

Sequential: D FLIP-FLOP With Enable and Set or Reset D Enable CLK Set or Reset

2007 Roadshow

Q

35

Clock Conditioning Circuitry

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36

ProASIC3/E PLL Specifications Each CCC contains a PLL PLL Specification • Input Frequency Range (fIN) = 1.5 to 350 MHz • Feedback Frequency Range (fVCO) = 1.5 to 350 MHz • Output Frequency Range (fOUT) = 24 to 350 MHz • Output Phase Shift = 0 °, 90 °, 180 °, and 270 ° • Output Duty Cycle = 50% ±2% or better • Low Output Jitter (max at 25° C) >Y; for (;;) {cout X>>Y; }

MCU Suppliers

Analog Suppliers

LUT

Programmable System Chip

FPGA Suppliers

ASIC Suppliers Your Hot Ideas … Our Cool Devices

2007 Roadshow

50

Fusion starts with ProASIC3… SRAM / FIFO FPGA Core

PA3

Digital I/O

PLL/CCC User FROM

Security

Charge Pumps

Clocking RTC, Xtal Osc.

Analog – to – Digital Converter Analog I/O

Embedded Flash Your Hot Ideas … Our Cool Devices

2007 Roadshow

51

Fusion – Programmable System Chip  Changes the competitive landscape The world’s first mixed-signal FPGA Fusion unlocks creativity: New architecture provides configurability and new tools provide simplified design flow

Embedded Flash Memory

LUT Flash FPGA Fabric

Configurable Analog

Programmable System Chip Your Hot Ideas … Our Cool Devices

Integrated clock resources 2007 Roadshow

52

Fusion – Unprecedented Integration  Integrates across functional boundaries  Based on ProASIC 3 130nm FPGA  Same Security features as ProASIC 3 Typical System System Memory DRAM

Cache Memory SRAM

MPU / MCU

Analog Interface

Power Mgmt

NV Storage FLASH

FPGA / ASIC

Thermal Mgmt

Clock Mgmt

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Discrete Analog

2007 Roadshow

53

Embedded-flash Process Supports Integration Actel is in a unique position to integrate Analog, Flash, FPGA, Logic, SRAM and Soft MCU For analog integration ‹ High-voltage transistors ‹ Triple-well process

For nonvolatile storage integration ‹ Embedded flash memory

For SRAM integration ‹ High-performance CMOS

For programmable logic integration ‹ Flash-based FPGA fabric

For soft MCU integration ‹ AES-based security

 Embedded flash process is the best technology for realworld programmable system-chip applications Your Hot Ideas … Our Cool Devices

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54

Fusion: Only FPGA with Analog!  Successive Approximation Register (SAR) ADC Up to 12 bit or 600 Ksps ±6 Total Unadjusted Error (TUE) Internal reference

GPIO

 Built in sample and hold

Analog Inputs

Ana Mux

MOSFET Outputs A/D

FLASH Memory

A3P FPGA Fabric (incl. SRAM, CCC/PLL, IO)

Increases accuracy of dynamic signals

 Analog I/O

Xtal OSC, RC OSC, RTC, Vreg

± 12 V Tolerant Up to 30 channels input Current monitor block ‹ 2 mV resolution

Temperature monitor block ‹ 2 C calibrated ‹ 5 C w/o calibration

MOSFET Gate driver output JTAG Port

‹ Programmable drive strength ‹ P and N channel devices

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55

Elements of Analog Block  Analog Quad

Vcc (1.5V)

5 to 10 Quads/Device Voltage monitor block Current Monitor block Temperature monitor block Gate control/driver block

 ADC

Pads AV0 AC0 AG0 AT0

Analog Quad0

ATRTN0 AV1 AC1 AG1 AT1 AV2 AC2 AG2 AT2

Analog Quad1 Analog Quad2

ATRTN1 AV3 AC3 AG3 AT3 AV4 AC4 AG4 AT4

Analog Quad3 Analog Quad4

16 Analog Mux (32 to 1)

ATRTN2

Selectable 8/10/12 bits Up to 32 input channels Up to 600K samples/sec Selectable reference voltage

AV5 AC5 AG5 AT5 AV6 AC6 AG6 AT6

Analog Quad5

ADC Digital out to FPGA

Analog Quad6

ATRTN4 AV7 AC7 AG7 AT7 AV8 AC8 AG8 AT8

Analog Quad7 Analog Quad8

ATRTN5 AV9 AC9 AG9 AT9

Analog Quad9 Temperature Monitor Internal Diode

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56

Fusion: Analog Quad – I/O Structure

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57

Fusion: Flash Features Flash array 2 Mbit (1 – 4 /device) Each 2 Mbit Array operates independently (controller) Independent JTAG access

GPIO

Very Flexible operation Analog Inputs

Ana Mux

MOSFET Outputs A/D

FLASH Memory

JTAG Port

x8, x16, and/or x32 FPGA interface Each supports multiple partitions Small page size Can be accessed by either on-chip or off chip resources

A3P FPGA Fabric (incl. SRAM, CCC/PLL, IO)

Xtal OSC, RC OSC, RTC, Vreg

Supports High performance 60 ns random access Pipelined 10 ns access of sequential memory addresses

Uses: EEPROM emulation, state saving, boot code, data storage

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58

Applications for flash  Embedded Processor Code Storage 2 Mbit to 8 Mbit arranged in 1 to 4 independent blocks Suitable for embedded processor cores (i.e. Core8051)

 ADC Calibration/Error Correction Characterize your analog datapath, compute correction factors, and store them in flash as a look-up table Provide several look-up tables for various temperature ranges

 System Initialization Initialize ADC configuration, internal memory contents, and machine states at power-up

 Data/Event Logging (Black Box) and State Saving Store system parameters for later analysis Save internal logic states before entering deep sleep mode Restore logic states during the wake-up process Record events and alarms Your Hot Ideas … Our Cool Devices

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59

Fusion: Comprehensive Clocking resources Fusion builds up clocking resources: On chip clock sources:

GPIO

Analog Inputs

Ana Mux

MOSFET Outputs A/D

A3P FPGA Fabric (incl. SRAM, CCC/PLL, IO)

‹ CCCs (6) / PLLs (1 or 2) ‹ RC oscillator ‹ Crystal Oscillator

Real Time Counter (RTC)

Use Models Internal 100MHz RC oscillator ‹ ±1% over I-temp range

Crystal OSC circuit FLASH Memory

Xtal OSC, RC OSC, RTC, Vreg

‹ 32 KHz – 20 MHz

CCC/PLLs can multiply, divide, and phase shifts clock signals for user applications ‹ Sources include: crystal Osc,

JTAG Port

RC Osc, or external clock

RTC enables low power standby mode

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2007 Roadshow

60

RC & Crystal OSC System Block Diagram

GND_OSC

100 MHz RC clock generator

VCC_OSC

Clock out to FPGA core

C

GLINT

R C

Crystal Oscillator

C External Or External Crystal RC

Xtal Clock Clock IOs

PLL/ CCC

GLA GLC

NoGlitch Mux

To core CLKOUT

From FPGA Core

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61

Voltage Regular (V-Reg)  Runs from a single 3.3V supply  Generates 1.5 V supply up to 500 mA

External pin on Fusion package

VDD33 VDD33

Uses external pass transistor

 1.5V supply is external to the device and can be routed to Power FPGA Embedded Flash

PTBASE

1.5V Regulator

PTEM 1.5V out

PDVR

 Single supply for both core and Embedded Flash Cannot be powered down independently

VDD33 1uA PUB

Power Up to 1

 Configurable control includes: FPGA power down signal External wake up signal – push button, wake up signal… Internal wake up – RTC Your Hot Ideas … Our Cool Devices

Power Up/Down Toggle Control Switch

Low Power Triple Inverter

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62

RTC + Voltage Regul. => Low Power  Voltage Regulator can be used to control 1.5V system power Sleep mode = RTC on with 1.5 V (FPGA off) ‹ Device will draw ~ 200 µA (OSC) ‹ Can wake with either internal signal (RTC) or external signal

Standby mode = RTC off + with 1.5 V (FPGA off) ‹ Device will draw ~10µA ‹ Needs external signal to wake up

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63

RTC + V-Reg = Low Power  40-bit Real-Time Counter and Match register Use for sleep/wake interval timer Use for real-time, watch-dog, service hours timer

 V-Reg provides 1.5V power from 3.3V supply for FPGA and Flash blocks Standby mode = 3.3V on + RTC on + V-Reg (1.5 V for FPGA off) ‹ ‹

Device will draw ~ 200 µA (OSC) Can wake with either internal signal (RTC) or external signal

Sleep mode = 3.3V on + RTC off + V-Reg (1.5 V for FPGA off) ‹ ‹

JTAG TAP

Device will draw ~10µA Needs external signal to wake up

JTAG B.S.

Control/Status Reg

Match Reg

Start Up Voltage Regulator

Counter

Crystal Clock

Prescaler

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64

AFS I/Os Similar to A3P Bank selectable 3 Registers per I/O (Input, Output, and Enable) Multiple I/O Standard Support Bank 6

‹ High-Speed 700Mb/s LVDS with External

Bank 1

Resistors ‹ LVPECL

Bank 2

‹ HSTL1, SSTL2/3, GTL+, LVTTL, LVCMOS

Bank 0

Bank 3

Hot Swappable 1.5v - 3.3v Configurable DDR Send/Receive Mode

Bank 4

AFS

Analog IOs

Analog IOs Analog Slow Digital IOs

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65

Fusion Family

I/O: Single ended / Double ended (analog)

I/O

Analog

Memory

General

Part #

AFS090

90K System Gates 2,304 Tiles (D-FF) Yes Secure (AES) ISP 1 PLLs Globals 18 6 RAM blocks (512x9) 27 Kbits Total RAM 1Kbits FlashROM bits 1 Flash Memory Blocks Total Flash Memory 2 Mbits 5 Analog Quads 15 Analog Inputs 5 Output Gate Drivers I/O Types Analog / LVDS / Std+ 4 I/O Banks (+ JTAG) 75 Max Digital I/O Analog I/O 20 37/9 (16) QN108 60/16 (20) QN180 PQ208 75/22 (20) FG256 FG484 FG676

AFS250

AFS600

AFS1500

250K 6,144 Yes 1 18 8 36 Kbits 1Kbits 1 2 Mbits 6 18 6

600K 13,824 Yes 2 18 24 108 Kbits 1Kbits 2 4 Mbits 10 30 10

1,500K 38,400 Yes 2 18 60 270 Kbits 1Kbits 4 8 Mbits 10 30 10

Analog / LVDS / Std+

Analog / LVDS / Pro

Analog / LVDS / Pro

4 114 24

5 172 40

5 278 40

65/15 (24) 93/26 (24) 114/37 (24)

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2007 Roadshow

95/46 (40) 119/58 (40) 172/86 (40)

119/58 (40) 228/86 (40) 278/139 (40)

66

The Fusion Tools Vision Design Creation (HDL or C++) Import / Export applets (2006)

Synthesis / Compile

Instantiation & Interconnect

System Creation & Management

(SmartGen, Launch)

(SmartConnect 2006)

HW/SW Simulation

Models for All Chip Resources (Launch)

Silicon Debug Platform

HW/SW Debug in Silicon (Launch)

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67

Fusion Starter Kit – Current View

Your Hot Ideas … Our Cool Devices

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68

Fusion PSC: Target Applications  Power and temperature management Power sequencing with tracking control Smart battery charging Voltage, current, temperature monitors and alarms Fan and heat-element control and monitoring Intelligent Platform Management Interface (IPMI)

 Motor and motion control Motor control – stepper, 3-phase and solenoid control Anti-lock brakes

 System initialization and configuration Context save and restore Context switching System boot codes

 Storage Program code storage EEPROM emulation Data acquisition and logging

 Low power and clocking Control for sleep mode and wake-up Live at power-up clock generation, conditioning, and distribution Your Hot Ideas … Our Cool Devices

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69

Fusion Flexibility: Power Management Applet Everything today’s system sequencers can do plus…  FPGA gates – your design here…  Event and alarm logging using on-chip flash for remote diagnostics  Sequence system along with power management activities Enable devices, system buses, interfaces, memories etc. during power-up/down

 Additional system management activities: Thermal monitoring and fan control  Easy field changes of sequences or alarm levels use Fusion flash  Upgradeable using spare I/Os and gates  Support for ANY voltage from ±12V  High precision through infinite supply ramp control  No compromises

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70

Fusion Stack: Simplifies Design  Level 0 - Fusion smart peripherals FPGA Fabric

Peripherals are treated equally, whether hard-wired or soft IP

User Application

 Level 1 - Fusion Smart Backbone Built-in control (soft IP) configures peripherals from flash memory Backbone is scalable to any number of peripherals or applets

Optional MCU (ARM or 8051) Fusion Applet 1

Fusion Applet 2

(i.e. power sequence)

(i.e. Thermal Mgmt)

 Level 2 - Fusion applets

Fusion Applet 3

Control Fusion Smart Backbone

OSCs, RTC Flash Memory

ADC Analog I/O

Flash Memory

Application building blocks implementing specific functions Rapid deployment Applets can be rapidly combined to create large applications

 Level 3 - User application Optional ARM7 or 8051 Verified and integrated (CoreConsole) Well-defined interface for external IP and tool integration

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71

New Tools: SmartGen Peripheral Configurator  New graphical productivity tools ADC sampling Digital low-pass filtering Threshold comparisons State filtering Analog input High current output Flash memory access (FlashPoint™)

 Automatically connects FPGA, flash and analog to Smart Backbone

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72

Actel Fusion is… The World’s First Mixed Signal FPGA The ultimate Programmable System Chip Introduces analog and flash to programmable logic

An excellent soft MCU platform The only single chip programmable soft 8051/ARM platform

An excellent alternative to mixed-signal ASIC Time to market, risk reduction, no NRE

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73

Fusion PSC: Changing the Competitive Landscape

ASSP or Mixed-Signal ASIC

FPGA

Highly Integrated Application Optimized Secure Low Power Live at Power-up On-chip Flash Low Unit Cost Monolithic Nonvolatile Analog No NRE Configurable Rapid Prototyping Short Lead-time ISP Extendable/Flexible Your Hot Ideas … Our Cool Devices

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74

Actel IGLOO Low Power Flash FPGAs

Expectations and Reality Collide in the Portable Market -Apple: “… up to 20 hours of battery life - five more than before…” -Motorola: “…for most consumers, form factor is the crucial hook…” -Fuji: “…quick response times … 1.4 second startup…”

Your Hot Ideas … Our Cool Devices

-Xilinx: “…the industry has crossed a critical inflection point at 90nm, where performance competes with power and thermal budgets…” -Philips: “…ultra-thin leadless package allows designers flexibility to add more functionality into smaller spaces…”

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76

Actel IGLOO Low Power Flash Family The low-power, high-density, reprogrammable ASIC alternative for portable apps  Devices from 30K to 3 million system gates  Lowest power 4x lower static power (5µW) than nearest competitor (19.8µW) More than 5x longer battery life in portable applications compared to leading devices Flexible low-power implementation options

 The only low-power FPGA solution to support 1.2V  Features meet application requirements  Single chip  Lowest total system cost  Small footprint packages Your Hot Ideas … Our Cool Devices

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77

Portable Friendly Actel IGLOO FPGAs True Single Chip Single voltage Elimination of additional components and reduced board size

Small footprint packages CS196 ‹ 8x8mm, 133 I/O, 0.5mm ball pitch array

QFN 132 ‹ 8x8mm, 87 I/O, Three 0.5mm pad array

Reprogrammable – easy prototyping and updates no socket required

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2007 Roadshow

78

Igloo FPGAs Flexible System Implementation  Flash*Freeze mode Power consumption as low as 5µW ‹ Enter/exit within 1µs via

Flash*Freeze pin

During Flash*Freeze ‹ No need to power off voltage ‹ Freezes incoming clocks and inputs ‹ Core registers and SRAM maintain

state ‹ ‘No’ power consumed by I/Os, JTAG pins, PLL

 Low-power active mode Allows IGLOO to directly control system power Power consumption as low as 25µW (Static) Slow (e.g. 32KHz) or stop the clocks Part remains active in system

 Sleep mode Your Hot Ideas … Our Cool Devices

2007 Roadshow

79

Actel’s IGLOO Power Modes Overview Mode

Vcci

Vcc Core Clocks To resume operation

Trigger

Active

On

On

On

On

None

-

Static Flash* Freeze Idle

On

On

On

On

External

On

On

On

Off

Deassert Flash*Freeze pin Initiate clock

Sleep

On

Off

Off

Off

Vcc Supply

External

Shutdown

Off

Off

Off

Off

Vcc and Vcci supplies

External

External

 ULSICC macro can be used to reduce static/active power

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2007 Roadshow

80

Battery Life Experiment

 IGLOO best in all power categories Sleep (low power) mode, static, dynamic

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81

Cooling Considerations

Volatile SRAM Penalty

SRAM FPGA

IGLOO

Configuration LDO

Very Often

Not required

Brownout detector

Very Often

Not required

Heat Sink / Cooling

Sometimes

Not required

Always

Not required

Significant

No adder

FPGA Core LDO adder Total Power Adder

 More support devices, more total power  Heat dissipation  Dynamic power savings, 1.2V for IGLOO  Added Cost $1 per Watt of additional system cost (estimates)

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2007 Roadshow

82

Actel Libero IDE SmartPower

Advanced Power Analysis  Analyze Block Power by Type, Instance or by Rail

 Benefits Design-level power summary View detailed hierarchical reports of dynamic power consumption Average switching activity Ambient and junction temperature readings

 I/O Enable Rate Estimation  Models Percent of time-enabled outputs actively drive loads

 Provides better power estimation

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2007 Roadshow

83

Reference Design - Low-power Storage Solution  Functionality Bridge from processor bus to various storage interface Include WinCE device drivers

 Processor Support ARM-based solutions

 Storage Standards ATA6 and CE-ATA HDD Secure Digital SD 1.1/2.0 and MMC CompactFlash 3.0 CardBus 2.1/PCMCIA

 Target Application Smart Phone, GPS and PDA Handheld & mobile storage

 Software drivers, schematics, BOM and HDL code provided  Turnkey important

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2007 Roadshow

84

Actel IGLOO Family  Based on Actel’s 3rd generation Flash technology Support 1.2V to 1.5V (nominal) core operation

AGL030

Actel Igloo

AGL060

AGL125

AGL250

AGL600

AGL1000

AGLE600

AGLE3000

M7AGL250 *

M7AGL600 *

M7AGL1000 *

M7AGLE600 *

M7AGLE3000 *

Family Members

Tiles (D-FF)

768

1536

3072

6144

13824

24576

13824

75264

Ram K Bits

-

18

36

36

108

144

108

504

4608 bit blocks

-

4

8

8

24

32

24

112

PLLs

-

1

1

1

1

1

6

6

I/O

Std,HS

Std+

Std+

Std+/LVDS

Std+/LVDS

Std+/LVDS

Pro

Pro

I/O Banks (+ JTAG)

2

2

2

4

4

4

8

8

1.2V Typ. FlashFreeze (uW)

5

9

17

33

72

122

72

294

Static (uW)

25

30

38

60

99

149

111

333

Typ. Sleep (uW), Vcci=1.5V

7.5

7.5

7.5

13.5

13.5

13.5

27

27

QN132

81

80

84

87/19

VQ100

79

71

71

68/13

FG144

96

97

97/24

97/24

97/25

CS196

96

133

143/30

FG256

178/45

177/44

165/79

FG484

227/56

300/74

270/135

FG896

280/136 616/300

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2007 Roadshow

85

Pricing and Availability Actel IGLOO devices Immediate prototyping available with flash-based ProASIC3 family Evaluate using low-power Actel IGLOO in Q1 2007 Small footprint packages available (CS196 - 8x8mm) Pricing from $1.50 (250KU)

Software tools available September Reference designs Low-power storage solution application ‹ Available from PalmChip in September 2006

Additional reference designs in Q4 2006

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86

Prototyping with ProASIC3 to IGLOO A3P030 A3P060 A3P125 A3P250 A3P600 Package AGL030 AGL060 AGL125 AGL250 AGL600 QN132 VQ100 FG144 TQ144 CS196 PQ208 FG256 FG484 FG896

√ √ N/A N/A N/A N/A N/A N/A N/A

A3P1000 A3PE600 A3PE3000 AGL1000 AGLE600 AGLE3000

N/A N/A N/A √ √ √ √ √ √ N/A N/A N/A N/A √ √ √ √ √ N/A N/A N/A N/A ProASIC3 only N/A N/A N/A Supported in IGLOO only N/A Supported in ProASIC3/E only N/A N/A PA3 only √ √ √ N/A N/A N/A √ √ √ N/A N/A N/A N/A N/A N/A

N/A N/A N/A N/A N/A N/A √ √

J Compatible J Package available for IGLOO only J Package available for ProASIC3 only Use ProASIC3 devices and starter kits to prototype for IGLOO Your Hot Ideas … Our Cool Devices

2007 Roadshow

87

Summary  Low-power flash-based FPGAs are well positioned to capture share in the portable market  At 5µW, Actel’s new IGLOO family is THE low-power, high-density reprogrammable ASIC alternative  The fully featured Actel IGLOO family is the best solution for portable electronics Lowest power at 5µW; delivers up to 5x longer battery life Single chip Only low-power FPGA solution to support 1.2V Quick and easy power control Small footprint Reprogrammability Lowest total system cost

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2007 Roadshow

88

IGLOO The Lowest Power FPGA

ASIC

SRAM FPGA

Single Chip Live at Power-Up Nonvolatile Lowest Power Secure Firm-Error Immune On-Chip NVM Low Unit Cost Low Total System Cost Flash*Freeze Technology No NRE Rapid Prototyping Low Production Lead Time In-System Programmable Your Hot Ideas … Our Cool Devices

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89

ARM7 in Fusion

Enabling Programmable Real-World Designs

Why Partner with ARM? ARM7 is the 32-bit embedded standard More than 1.2 Billion units shipped in 2004 ~75% market share The largest IP provider in the world

Huge hardware and software ecosystem Extensive third-party tool support for ARM Broad industry knowledge and experience with ARM New tools are developed first for the ARM architecture

ARM7 is the 8051 of the 32-bit embedded space

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91

Actel and Partnership Actel and ARM partner to deliver a free license, soft ARM7TDMI core to the masses Collaborate to develop FPGA-optimized version of the ARM7 embedded processor Actel FPGAs with ARM7 are ideal for high-volume or cost-sensitive applications Low-cost alternative to ASICs Better SOC implementation solution

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92

Why Fusion ARM? The real world is analog Growing requirement to move information from the analog domain to the digital to process it Increasing level of performance in electronics moving embedded processors from 8-bit to 32-bit Integration of analog, logic and memory functions into fewer devices for “real-world” system-level designs Comprehensive and intuitive design infrastructure support is critical to designer’s ability to get products to market on schedule Your Hot Ideas … Our Cool Devices

2007 Roadshow

93

Fusion PCS with ARM7  Changes the competitive landscape Integrates analog, Flash, SRAM and FPGA with soft ARM7 IP core in a single chip Fusion and ARM7 unlock possibilities by increasing design flexibility and configurability while reduced power, footprint, board complexity and risk

Fusion ARM7 System Off-chip Memory SRAM or Flash

Cache Memory SRAM

NV Storage FLASH

CoreMP7 FPGA MPUOptimized / MCU

Flash FPGA

ARM7

Analog Interface

Power Mgmt

Clock Mgmt

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Discrete Analog

2007 Roadshow

94

Only From Actel Actel is in a unique position to integrate Analog, Soft ARM7, Flash, SRAM, and FPGA Logic For analog integration ‹ High-voltage transistors ‹ Triple-well process

For soft ARM7 integration ‹ AES-based security with maximum usability

For nonvolatile storage integration ‹ Embedded flash memory

For SRAM integration ‹ High-performance CMOS

For programmable logic integration ‹ Flash-based FPGA fabric

 Embedded flash process is the best technology for realworld ARM7 programmable system-chip solutions Your Hot Ideas … Our Cool Devices

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95

Fusion CoreMP7 Benefits Single chip solution Analog, ARM7, Flash, SRAM, FPGA all in one device Reduced power, footprint, board complexity Increased reliability

ARM7 industry-standard architecture Large volume of existing software programs and legacy code Speeds application and program development and reduces design risk No ARM7 license or royalty fees

Analog configurability

On-the-fly analog dynamic range selection Multiple configurable clocks sources and PLL

FPGA flexibility and fast time to market More flexible than 32-bit microcontrollers Designers can include the functionality they want and need Programmability makes bug fixes and field upgrades easy Your Hot Ideas … Our Cool Devices

2007 Roadshow

96

CoreAI - Analog Interface CoreAI brings CoreMP7 and Fusion together Configurable IP block (150-460 tiles) Simplifies Fusion analog interface to CoreMP7

Advantages for designers Parameterizable control of Fusion Analog Block (AB) and I/O Controlled by CoreMP7 via APB bus Flash Memory

CoreMP7 CoreMP7

Static Memory Static Memory Controller Controller

Interrupt Interrupt Controller Controller

Fusion Hardware

AHB

AHB2APB AHB2APB bridge bridge APB

UART UART

Watchdog Watchdog

Timers Timers

Your Hot Ideas … Our Cool Devices

GPIO GPIO

2007 Roadshow

CoreAI

AB

Analog I/O

RTL IP Components

AB is logically but not physically implemented inside of CoreAI

97

SmartGen with CoreAI Analog System Builder Configure the Fusion Analog Block Set ADC system clock and resolution for each peripheral Outputs as acm.mem file

CoreConsole Imports acm.mem CoreAI uses the acm.mem file to write ACM at initialization Can also configure AB without using SmartGen Your Hot Ideas … Our Cool Devices

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98

New Tools: CoreConsole IP Deployment Platform A complete design in three clicks  Click - Add parts Add IP to design from list of available IP

 Click - Design Configure and stitch IP Can be done in design or schematic window

 Click - Generate Generates IP (design) RTL and other output items (test benches, etc.)

 SPIRIT supported Structure for Packaging, Integrating and Re-using IP within Tool flows (SPIRIT) Your Hot Ideas … Our Cool Devices

2007 Roadshow

99

Fusion ARM Hardware Solution Implementation with Fusion IP and CoreMP7 Available using existing elements Interconnected through CoreGPIO

SmartGen used to configure Fusion IP Flash Memory

CoreMP7 CoreMP7

Static Memory Static Memory Controller Controller

Interrupt Interrupt Controller Controller AHB

Fusion Hardware

Flash Memory

AHB2APB AHB2APB bridge bridge

Fusion AB IP

APB

RTL IP Components

UART UART

Watchdog Watchdog

Timers Timers

GPIO GPIO

I/O

RAM

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100

M7 Fusion Development Flow RealView or GNU Determine HW & SW Requirements

Develop/Edit SW Program

SW Design Fail

C Compile

SW Simulation & Debug

Dev Kit

Develop or Acquire User IP

Design Start

CoreConsole

Pass

Program SW to FPGA Device

Actel IP Vault

Development Board

Libero Configure IP Cores

Stitch System Together

Behavioral Simulation

Back-Annotate

Edit Edit Edit Sub-Block Sub-Block IP Sub-Block IP IP & Testbench

Layout

Fail

SW Debug & Coverification

Pass

Design Complete

Program FPGA Device HW

HW Design

Fail Fail

Timing Driven Simulation Pass

Circuit Synthesis

Compile

Your Hot Ideas … Our Cool Devices

Encrypted Bitstream/STAPL

2007 Roadshow

101

M7 ProASIC3 Flash Devices

Broad selection of ARM-ready M7 devices M7 ProASIC3: 250k – 1M gates, up to 144kb SRAM & 288 I/O M7 ProASIC3E: 600k – 3M gates, up to 504kb SRAM & 616 I/O

Devices deliver innovative ProASIC3 features FlashLockTM security and secure in-system programming Single-chip, live at power-up, firm-error immune Device Æ Package

M7A3P 250

M7A3P 400

M7A3P6 00

M7A3P10 00

M7A3PE 600

M7A3PE1 500

M7A3PE3 000

147/65

147/65

280/136

280/136

VQ100

68/19

FG144

97/37

97/24

97/24

97/25

PQ208

151/34

151/33

154/35

154/35

147/65

FG256

178/38

179/45

179/45

165/79

FG484

194/38

227/56

300/74

270/135

FG676

439/209

FG896

616/300

Note: The data in the table is the I/O / differential pairs available on the device in the package

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102

CoreMP7 in M7 Fusion No changes to CoreMP7 for ARM Fusion Optimized for size and speed in M7 Fusion FPGAs Two variants (with and without debug)

Maximum Usability CoreMP7 is user programmed to FPGA All CoreMP7 I/O accessible in the fabric Easy routing of user added IP

Easy User Implementation Firm macro implementation Preserves speed and size optimization Includes timing shell and BFM

Fully compatible with ARM7TDMI-S Implements full functionality CoreMP7 passes the ARM7 Instruction Validation Suite Your Hot Ideas … Our Cool Devices

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103

Single-Chip M7 Fusion Power Interface to the Real World Analog inputs ±12V Temp, current, voltage sensing ADC – up to 600KSPS, up to 12 bits On-the-fly analog dynamic range select High current outputs (PWM / FET)

M7AFS600-FG484

Single chip solution On chip FLASH and SRAM Secure flash FPGA fabric In System Programmable

On chip resources 13.5K-33.7K SRAM 512K-1M Flash 600K-1.5M system gates 32kHz to 20MHz Xtal OSC

M7 Fusion Devices Package

M7AFS600

M7AFS1500

PQ208

95/40

FG256

119/40

119/40

FG484

172/40

228/40 278/40

FG676

Note: The data in the table shows the digital I/Os / Analog I/Os available for the device in the package.

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104

Programme Universitaire CNFM/ACTEL Mise en place dès maintenant Distribution gratuite de la partie CAO Prix spécifiques pour des plateformes universitaires Contact CNFM Thierry Gil, [email protected]

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2007 Roadshow

105

Low Cost University Kit

ProASIC3 Board (Fusion kit will be similar) Parallel Port Programmer Programming header for FlashPro3

2-Line LCD Display

Key Pad

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106

ProASIC3 and Fusion kits Features and contents Contents of the University kit

 ProASIC3 and Fusion University Kit features  16 × 2 alphanumeric LCD  Programming Through parallel port cable Also through FlashPro3

 Starter kit board  FPGA parts ProASIC3 kit has A3P250-PQ208 Fusion Kit has AFS600-PQ208

 6-key keyboard as 2 × 3 matrix

 Parallel port cable

 32 bidirectional I/Os (LEDs and DIP switches)

 Power supply

 Power-on reset circuit with reset key  1 on-board 40 MHz oscillator and 1 optional oscillator  Socket for user expansion

 Software CD including Libero IDE Gold with FlashPro software  Training CD  Documentation created by Reanu

 ** Fusion kit has Temperature sensor on board

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107

ProASIC3 and Fusion Education kits

Development Boards: Starter Kits Pricing for Universities

Unit price (HT) of

Qrder

Unit price (HT) of Additional discounts for Volume purchase

Quantity

A3PE-EVAL-KIT

AFS-EVAL-KIT

University Kits

University Kits

1-9

114 €

148 €

-

10-24

108 €

142 €

2 Copies of Libero Platinum Free

25-49

103 €

137 €

5 Copies of Libero Platinum Free

50-100

98 €

132 €

10 Copies of Libero Platinum Free

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2007 Roadshow

108

A3PE-PROTO-KIT Prix unitaire : 515 € HT (1 cartes achetée, une carte gratuite) Descriptif : Starter kit ProAsic3, contient un A3PE600 sur socket, un programmateur FlashPro3, une licence Libero IDE Gold. Plus: Le Fpga monté sur socket est connecté à :

•2 connecteurs RJ45, LCD, au quartz, aux Leds, aux Bouton Poussoirs, au JTAG •Toutes les broches sont accessibles via des broches •Espace disponible pour « wrapper ».

COREMP7-1000-DEV-KIT-FP3 Prix : 690 € HT (1 cartes achetée, une carte gratuite) Descriptif : Starter kit ARM ProAsic3, contient un M7A3P1000 soudé, un programmateur FlashPro3, une licence Libero IDE Gold. Plus: Le Fpga est connecté à : •2 RJ45, 2 UART, 1 CAN, 1 USB •aux quartzs, aux Led, aux boutons poussoir, au JTAG •Mémoire 2MB de SRAM et 2MB de Flash •3 connecteurs 40 broches Le jeu « Riversi » fourni en design de démonstration

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2007 Roadshow

109

AFS-EVAL-KIT Prix : 460 € HT (1 carte achetée, une carte gratuite) Descriptif : Starter kit Fusion, contient un AFS600 soudé, un programmateur FlashPro3, une licence Libero IDE Gold. Plus: Le Fpga est connecté à : 1.Partie numérique : a.LCD, au quartz, aux Led, aux BP et au JTAG b.1 connecteur 40 broches

2.Partie analogique : a.potentiomètre, capteur de température, à la Led tricolore b.connecteur pour ventilateur, I/O analogique

3.Toutes les broches sont accessibles via des broches + espace pour « wrapper ». est disponible

SYSMGMT-DEV-KIT-FP3 Prix : 1265 € HT (1 carte achetée, une carte gratuite) Descriptif : Starter kit ARM Fusion, contient un M7AFS600 soudé, un A3P250 soudé, un programmateur FlashPro3, une licence Libero IDE Gold. Plus: Les FPGA sont connectés à : 1)M7AFS600 : a.Mémoire 4Mo de SRAM et 2Mo de Flash b.2 I2C/SMBus, RS232, RS485, RJ45, JTAG c.Ventilateur, Resistance 7.5Ω, Batterie Nimh, alimentation (9v) d.2 PCI, connecteur I/O + espace pour « wrapper » e.Gestion Alim ATX (connecteur I/O) + potentiomètre + capteur T° 2)A3P250: l’interface humaine (LCD, keypad, switch, LED)

L’A3P250 communique via RS232 avec le M7AFS.

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