Surgeon grade rework and repair, by the book and guaranteed.

Circuit Technology Center . 135 Ward Hill Ave . Haverhill, MA 01835 . www.circuitrework.com

DDR2 BGA Probe Attachment Process Introduction ƒ Thi This presentation t ti is i designed d i d to t provide id customers t off Agilent A il t with ith an overview of the process for installing the DDR2 DRAM BGA Probes onto circuit board assemblies. ƒ Circuit Technology Center is the industry’s most experienced company providing rework and repair services for over 25 years. ƒ Circuit Technology Center has completed this process directly to Agilent and is uniquely qualified to provide this service to you.

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DDR2 BGA Probe Attachment Process Presentation Overview

Topic For Review: ƒ ƒ ƒ ƒ

Operator Skill Set Equipment Requirements Process Review Inspection Criteria

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DDR2 BGA Probe Attachment Process Operator Skill Set ƒ The DDR2 BGA Probe installation is a challenging process to complete. ƒ The Engineer or Operator must have BGA rework experience. ƒ Reballing of the DDR2 BGA Probe i required is i d ffor placement l t onto t th the circuit board. This process also requires experience and skill.

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DDR2 BGA Probe Attachment Process Equipment Requirements ƒ Beyond the skilled Operator that possesses BGA rework expertise, the process for placement of the DDR2 BGA Probe requires equipment for preparation, placement and inspection. p p ƒ The following is a list of the tools and equipment requirements.

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DDR2 BGA Probe Attachment Process Equipment Requirements ƒ BGA reballing kit or system for component and probe solder ball attachment. ƒ Solder S ld paste t stencil t il ffor circuit i it b board d site it preparation. ƒ Hot gas rework station designed for p rework. BGA component ƒ Microscope with oblique view for perimeter inspection. ƒ X-ray inspection system for post placement inspection. inspection

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DDR2 BGA Probe Attachment Process Process Review The process for installing DDR2 BGA Probe requires the following steps: 1. BGA Component removal from site. 2 Site 2. Sit cleaning l i and d preparation ti for f placement l t off Probe. P b 3. Ball placement on Probe and re-balling of BGA component. 4. Probe placement on circuit board. 5. BGA placement on the Probe. 6. Inspection to confirm soldering placement process.

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DDR2 BGA Probe Attachment Process Step 1: BGA removal from circuit board. ƒ The process for safe removal of the BGA component is completed with a Hot Gas Rework Station. ƒ The circuit board may require additional preparation such as baking and masking the area off adjacent to the rework site. ƒ To prevent damage the temperature of the circuit board and component must be closely monitored with thermocouples during the removal cycle.

Hot Gas Rework Station

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DDR2 BGA Probe Attachment Process Step 2: Circuit board site cleaning ƒ After the component has been safely removed from the circuit board the component and site must be prepared for placement of the probe and placement of the BGA onto the Probe. p site ƒ Circuit board and component cleaning is completed with vacuum de-soldering nozzle that removes all residual solder from the sites.

Before Site Cleaning

After Site Cleaning

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DDR2 BGA Probe Attachment Process Step 3: Solder ball application to Probe and component ƒ The placement of solder balls on the probe, and re-balling the BGA component must be completed prior to placement on the circuit board. ƒ For this process a specially designed tool for re-balling is used along with specific stencils and solder balls to match the layout of the probe and BGA component.

Solder Balls S ld Stencil Solder St il

Re-balling Fixture

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DDR2 BGA Probe Attachment Process Step 3: Solder ball application to Probe and component BGA Before Re-balling

P b Before Probe B f Ball B ll Attachment Att h t

Probe After Ball Attachment

BGA After Re-balling

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DDR2 BGA Probe Attachment Process Step 4: Placement of Probe onto circuit board ƒ ƒ

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Installation of the Probe onto the circuit board is completed with Hot Gas Rework System. Solder paste must be applied to the site prior to placement of the Probe. This process is completed with a solder stencil. Th application The li ti off h heatt iis controlled t ll d by using a repeatable temperature profile that is unique for each circuit board.

Hot Gas Rework System

FlexTac Stencil for application of solder paste.

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DDR2 BGA Probe Attachment Process Step 5: Placement of BGA onto the Probe ƒ

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Installation of the BGA onto the Probe is also completed with Hot Gas Rework System and is very similar to the Probe placement. The application of heat is controlled by using a repeatable temperature profile. S ld paste Solder t mustt be b applied li d tto th the site prior to placement of the Probe. This process is completed with a solder stencil. Completed BGA Placement on Probe

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DDR2 BGA Probe Attachment Process Step 6: Inspection to confirm soldering process ƒ

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Like any BGA application the process to inspect the solder joints requires x-ray. X-ray of the Probe i t f interface to t the th circuit i it board b d and d th the BGA component to the Probe is required to inspect for solder g , voids and misalignment. g bridges, Perimeter inspection can be completed with a microscope or inspection camera.

Solder Shorts

Dage 7600 X-ray System

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Recommendations Baking g duration and temperature. ƒ Bake out boards and or components to eliminate moisture entrapment in the boards and components. Normally bake for 24 hours at 125C or to the component p or customers specification. ƒ Maximum reflow temperature: 260 Degrees (One time BGA probe reuse in reflow) ƒ Soldering profile recommendation is similar to the profile for the assembly process of the board. It is specific to each board construction, construction (layer count, count thickness and number of ground planes, etc..).

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If you decide to have Circuit Technology C t d Center do th the work.. k Ballpark charges are as follows: ƒ Set-up S t charge: h $150.00 $150 00 - $250.00. $250 00 This Thi is i a onetime ti charge h for f each board type for a customer to allow setup of a thermal profile. ƒ Rework charge will vary depending on what is needed. The charge h should h ld be b between b t $200.00 $200 00 - $350.00 $350 00 per b board. d ƒ Standard delivery is 2-3 weeks with quick turn at additional charges. Standard Procedure: ƒ Circuit Rework might request to evaluate the board before proceeding with the rework. ƒ A quote will be generated for the customer with description on each procedure required for the board. ƒ Purchased order may then be generated by the customer for Circuit Rework to proceed with the rework.

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