Decapsulation of Silver-Alloy-Wire-Bonded Devices ESREF Arcachon, France September 30th-October 4th, 2013 François KERISIT (DC, CRISMAT-LaMIPS)
Silver wire-bonding • Ag and Au show less impact on the bond pad than Cu • Ag has slightly higher electrical and thermal conductivies • Ag is cheaper than Au (60x) Units
Ag
Au
Cu
W/mK
430
320
400
10-8 Ωm
1.63
2.2
1.72
Young’s Modulus
GPa
83
78
130
Vickers hardness
MPa
251
216
369
Thermal Conductivity Electrical Resistivity
[1] Pagba A. et al., Cu wire and beyond - Ag wire an alternative to Cu?, 2010, 12th EPTC [2] Kai L.J. et al., Silver Alloy Wire Bonding, 2012, ECTC 1
Case study #1 4 Ag alloy wire-bonded samples Wire
1. 2. 3. 4.
Diameter
18 µm
Ag
95%
Au
0.5%
Pd
4.5%
Laser only Laser + acids Laser + plasma 100 W Laser + plasma 50 W
Acid N:S
2:1
Temperature
10°C
Etch time
120 s
Plasma CF4
40%
O2
60%
Power
Variable
Temperature
80°C
Pressure
4000 mTorr
Cycle time
10 min
Filler blast
CO2 2
1. Laser only
3. Laser + plasma 100 W
2. Laser + acids
4. Laser + plasma 50 W 3
Wet chemistry • Same issue as copper wires, silver is attacked by both nitric and sulfuric acids
Case study #2 Wire Diameter
15 µm
Ag
90%
Au
10%
Laser + plasma 50W
• • • •
Lower percentage of Ag All wires oxidized, but none broken Cracks on the ball Passivation damaged
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