15th EUropean Failure Analysis NETwork workshop

Copper sample prep challenges and solutions ESREF 2014, Berlin, Germany Wednesday, October 1st

EUFANET • EUROPEAN FA NETWORK – – – –

260 members (free membership) MoU with EDFAS (free E-membership) Web site www.eufanet.org Annual short meeting on hot topic • In conjunction with ESREF • Fully integrated in ESREF program (2014)

• Move to EUROPEAN CHAPTER OF EDFAS (www.edfas.org) • We need you, it is your network

Agenda • Overview of copper challenges, an intro “Copper in state-of-the-art Microelectronic Products and Systems: new Challenges for FA”, Siegfried Goerlich (Infineon Germany) • Chip access “Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices”, Michael Obein (Digit Concept France) • Cu as part of the defect “Copper dendrites growth in LLT (Lead Lock Tape) embedded in QFP package: physical identification and characterization”, Giuseppe GIUGA (STM Italy) • Preparation techniques for preservation of grain structure “A comparison of preparation techniques for Cu filled TSV characterization”, Frank Altmann (IWMH, Halle, Germany)

Agenda • Overview of copper challenges, an intro “Copper in state-of-the-art Microelectronic Products and Systems: new Challenges for FA”, Siegfried Goerlich (Infineon Germany) • Chip access “Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices”, Michael Obein (Digit Concept France) • Cu as part of the defect “Copper dendrites growth in LLT (Lead Lock Tape) embedded in QFP package: physical identification and characterization”, Giuseppe GIUGA (STM Italy) • Preparation techniques for preservation of grain structure “A comparison of preparation techniques for Cu filled TSV characterization”, Frank Altmann (IWMH, Halle, Germany)

Questions

Agenda • Overview of copper challenges, an intro “Copper in state-of-the-art Microelectronic Products and Systems: new Challenges for FA”, Siegfried Goerlich (Infineon Germany) • Chip access “Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices”, Michael Obein (Digit Concept France) • Cu as part of the defect “Copper dendrites growth in LLT (Lead Lock Tape) embedded in QFP package: physical identification and characterization”, Giuseppe GIUGA (STM Italy) • Preparation techniques for preservation of grain structure “A comparison of preparation techniques for Cu filled TSV characterization”, Frank Altmann (IWMH, Halle, Germany)

Questions • Which are the main topics one should pay attention for, when changing the technology to copper or silver with respect to – – – –

dendrite growth between pads at different potentials pad surface structures underneath the pad artifacting failures due to dendrite growth after preparation – rebuilding the chip after its extraction into an engineering ceramics-DIL (especially the rebondingstep: is it compatible with gold wire rebonding?

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Agenda • Overview of copper challenges, an intro “Copper in state-of-the-art Microelectronic Products and Systems: new Challenges for FA”, Siegfried Goerlich (Infineon Germany) • Chip access “Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices”, Michael Obein (Digit Concept France) • Cu as part of the defect “Copper dendrites growth in LLT (Lead Lock Tape) embedded in QFP package: physical identification and characterization”, Giuseppe GIUGA (STM Italy) • Preparation techniques for preservation of grain structure “A comparison of preparation techniques for Cu filled TSV characterization”, Frank Altmann (IWMH, Halle, Germany)

Questions • Which would be the consequences for moulding or other packaging in order to avoid dendrite growth within the package? • Can copper dendrite growth be made visible by X-ray, Micro XCT, or ultrasonic analysis before decapsulation ? • Other indirect F/A technologies available to directly or indirectly proof dendrite growth? • What about silver wires?-problem even worse?

More questions

Agenda • Overview of copper challenges, an intro “Copper in state-of-the-art Microelectronic Products and Systems: new Challenges for FA”, Siegfried Goerlich (Infineon Germany) • Chip access “Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices”, Michael Obein (Digit Concept France) • Cu as part of the defect “Copper dendrites growth in LLT (Lead Lock Tape) embedded in QFP package: physical identification and characterization”, Giuseppe GIUGA (STM Italy) • Preparation techniques for preservation of grain structure “A comparison of preparation techniques for Cu filled TSV characterization”, Frank Altmann (IWMH, Halle, Germany)

Questions • Plasma FIB seems to be the more powerfull techniques. What are the feedbacks on cheaper techniques – Ultra microtome – Vibromat

• Useful for grain visualization of thin layers as for instance barrier layers? • FIB ion beam imaging vs. EBSD: Experiences?

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