2 TTL-LOAD OUTPUT DRIVE CAPABILITY 3-STATE OUTPUTS COMMON OUTPUT-DISABLE CONTROL INHIBIT CONTROL QUIESCENT CURRENT SPECIFIED TO 20V FOR HCC DEVICE 5V, 10V, AND 15V PARAMETRIC RATINGS INPUT CURRENT OF 100nA AT 18V AND 25°C FOR HCC DEVICE 100% TESTED FOR QUIESCENT CURRENT MEETS ALL REQUIREMENTS OF JEDEC TENTATIVE STANDARD N°. 13A, ”STANDARD SPECIFICATIONS FOR DESCRIPTION OF ”B” SERIES CMOS DEVICES”
EY (Plastic Package)
M1 Micro Package
F (Ceramic Frit Seal Package)
C1 (Plastic Chip Carrier)
ORDER CODES : HCC4502BF HCF4502BM1 HCF4502BEY HCF4502BC1
PIN CONNECTIONS
DESCRIPTION The HCC4502B (extended temperature range) and HCF4502B (intermediate temperature range) are monolithic integrated circuit, available in 16-lead dual in-line plastic or ceramic package and plastic micro package. The HCC/HCF 4502B consists of six inverter-buffers with 3-state outputs. A logic ”1” on the OUTPUT DISABLE input produces a highimpedance state in all six outputs. This feature permits common busing of the outputs, thus simplifying system design. A logic ”1” on the INHIBIT input switches all six outputs to logic ”0” if the OUTPUT DISABLE input is a logic ”0”. This device is capable of driving two standard TTL loads, which is equivalent to six times the JEDEC ”B” series IOL standard.
June 1989
1/11
HCC/HCF4502B ABSOLUTE MAXIMUM RATINGS Symbol V DD*
Parameter Supply Voltage : HC C Types H C F Types
Value
Unit
– 0.5 to + 20 – 0.5 to + 18
V V
– 0.5 to V DD + 0.5
V
Vi
Input Voltage
II
DC Input Current (any one input)
± 10
mA
Total Power Dissipation (per package) Dissipation per Output Transistor for T o p = Full Package-temperature Range
200
mW
100
mW
Pt ot
Top
Operating Temperature : HCC Types H CF Types
– 55 to + 125 – 40 to + 85
°C °C
Tstg
Storage Temperature
– 65 to + 150
°C
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to VSS pin voltage.
RECOMMENDED OPERATING CONDITIONS Symbol
Parameter Supply Voltage : HC C Types H CF Types
V DD VI
Input Voltage Operating Temperature : HCC Types H CF Types
Top
TRUTH TABLE Disable
Inhibit
Dn
Qn
0
0
0
1
0
0
I
0
0
I
X
0
I
X
X
Z
X = don’t care Z = high impedance Logic 1 = high Logic 0 = low
2/11
Value
Unit
3 to + 18 3 to + 15
V V
0 to V DD
V
– 55 to + 125 – 40 to + 85
°C °C
HCC/HCF4502B STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Symbol IL
* TLo w= – 55°C for HCC device : – 40°C for HCF device. * THigh= + 125°C for HCC device : + 85°C for HCF device. The Noise Margin for both ”1” and ”0” level is : 1V min. with VDD = 5V, 2V min. with VDD = 10V, 2.5 V min. with VDD = 15V.
3/11
HCC/HCF4502B DYNAMIC ELECTRICAL CHARACTERISTICS (T amb = 25 °C, C L = 50 pF, R L = 200 kΩ typical temperature coefficient for all V DD values is 0.3 %/°C, all input rise and fall times = 20 ns) Symbol t P HL
tP LH
t P HZ
t P ZH
t PL Z
t PZ L
tTLH
t T HL
Parameter Data or Inhibit Delay Time
Data or Inhibit Delay Time
Disable Delay Time (output high to high impedance)
Disable Delay Time (high impedance to output high)
Disable Delay Time (output low to high impedance)
Disable Delay Time (high impedance to output low)
Tansition Time
Transition Time
Minimum Output High (source) Current Characteristics.
4/11
Test Conditions
Value V D D (V) Min.
Typ.
Max.
5
135
270
10
60
120
15
40
80
5
190
380
10
90
180
15
65
30
5
60
120
10
40
80
15
30
60
5
110
220
10
50
100
15
40
80
5
125
250
10
65
130
15
55
110
5
125
250
10
55
110
15
40
80
5
100
200
10
50
100
15
40
80
5
60
120
10
30
60
15
20
40
Typical Output Low (sink) Current.
Unit
ns
ns
ns
ns
ns
ns
ns
ns
HCC/HCF4502B Minimum Output Low (sink) Current Characteristics.
Typical Output High (source) Current Characteristics.
Typical Transition Time vs. Load Capacitance.
Typical Propagation Delay Time vs. Load Capacitance.
TEST CIRCUIT Quiescent Device Current.
Input Voltage.
5/11
HCC/HCF4502B TEST CIRCUIT (continued) Input Leakage Current.
TEST CIRCUIT AND WAVEFORMS Disable Delay Time.
Test Conditions Test Pin 1 5
Point A
t P HZ
VSS
VSS
t PL Z
V DD
VDD
t PZL
V DD
VDD
t P ZH
VSS
VSS
6/11
HCC/HCF4502B
Plastic DIP16 (0.25) MECHANICAL DATA mm
DIM. MIN. a1
0.51
B
0.77
TYP.
inch MAX.
MIN.
TYP.
MAX.
0.020 1.65
0.030
0.065
b
0.5
0.020
b1
0.25
0.010
D
20
0.787
E
8.5
0.335
e
2.54
0.100
e3
17.78
0.700
F
7.1
0.280
I
5.1
0.201
L Z
3.3
0.130 1.27
0.050
P001C
7/11
HCC/HCF4502B
Ceramic DIP16/1 MECHANICAL DATA mm
DIM. MIN.
TYP.
inch MAX.
MIN.
TYP.
MAX.
A
20
0.787
B
7
0.276
D E
3.3
0.130
0.38
e3
0.015 17.78
0.700
F
2.29
2.79
0.090
0.110
G
0.4
0.55
0.016
0.022
H
1.17
1.52
0.046
0.060
L
0.22
0.31
0.009
0.012
M
0.51
1.27
0.020
0.050
N P Q
10.3 7.8
8.05 5.08
0.406 0.307
0.317 0.200
P053D
8/11
HCC/HCF4502B
SO16 (Narrow) MECHANICAL DATA mm
DIM. MIN.
TYP.
A a1
inch MAX.
MIN.
TYP.
1.75 0.1
0.068
0.2
a2
MAX.
0.004
0.007
1.65
0.064
b
0.35
0.46
0.013
0.018
b1
0.19
0.25
0.007
0.010
C
0.5
0.019
c1
45° (typ.)
D
9.8
E
5.8
10
0.385
6.2
0.228
0.393 0.244
e
1.27
0.050
e3
8.89
0.350
F
3.8
4.0
0.149
0.157
G
4.6
5.3
0.181
0.208
L
0.5
1.27
0.019
0.050
M S
0.62
0.024 8° (max.)
P013H
9/11
HCC/HCF4502B
PLCC20 MECHANICAL DATA mm
DIM. MIN.
TYP.
inch MAX.
MIN.
TYP.
MAX.
A
9.78
10.03
0.385
0.395
B
8.89
9.04
0.350
0.356
D
4.2
4.57
0.165
0.180
d1
2.54
0.100
d2
0.56
0.022
E
7.37
8.38
0.290
0.330
e
1.27
0.050
e3
5.08
0.200
F
0.38
0.015
G
0.101
0.004
M
1.27
0.050
M1
1.14
0.045
P027A
10/11
HCC/HCF4502B
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A
typical temperature coefficient for all VDD values is 0.3 %/°C, all input rise and fall ... 2.54. 0.100 e3. 17.78. 0.700. F. 7.1. 0.280. I. 5.1. 0.201. L. 3.3. 0.130. Z. 1.27.
Tool repair and maintenance should only be carried out by an authorized Service Center. Refer all communications to the nearest Ingersoll Rand Office or ...
Mar 28, 2000 - auxiliary solvents into an octanol-buffer partitioning system, and the effects of buffer ... poses unique challenges to implementation of an automated ... where a = -0.347 ± 0.023, b = 0.877 ± 0.020, N is the number of .... ANALIZA i
Why logic-on-logic 3D stacking ? ... + Second transistor layer is fabricated sequentially on top of the first one. + High alignment ... Min drive logic cell in top tier.
for a process includes the text, data, and stack segments, and. Figure 1 illustrates this ... foo(), the local variable foo_p is pushed onto the stack after the return ...
The CD4503BC is a hex non-inverting 3-STATE buffer with high output current sink and source capability. 3-STATE outputs make it useful in bus-oriented ...
Buffer avec système Pick to light. Avantage du nouveau système «Pick to light» : > Gain de temps. > Sécurisation des process. > Meilleure gestion des stocks.
through simulation that the trade-off between throughput and delay is .... Fair queuing has the additional advantage of ensuring low packet latency for relatively low rate streaming flows. .... position within the link determined by the starting time
a new polygon is to be processed, a z-value and intensity value are calculated for each pixel ... The z-buffer algorithm works in device space and it can be easily ...
We present an improved z-buffer based CSG rendering algorithm, based on ... CSG arranges boolean operations and primitive objects ... in solid modelling applications. ..... ance and contributions to this research: Dr. Mike Simakov and the.
Oct 15, 2010 - adjustment of the VaR estimates â based on a back-testing ... illustrate an economic evaluation of the impact of model uncertainty on Value-at-.
AND such that if either G1 and G2 are high, all eight output are in the high impedance state. In order to enhance PC board layout the M74HC541 offer a pinout ...
Simulations are conducted and preliminary ... architectures are based on either simulation or analytical mod- els [7], [13] ... be used to model systems that are governed by a law of ... moving in a Bose gas and migrating between various energy.