boitiers de circuits integres - Marc JOUBERT

BGA (Ball Grid. Array),LC. PGA (Lead. Ceramic PGA). QFP (Quad Flat. Package), SQFP (Shrink. QFP), TQFP (Thin QFP). SOP (Small Out-Lin e. Package), PSOP.
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SDIP (Shrink DIP)

Chip Carrier)

PDIP (Plastic DIP),

Lead)

SOJ (Small Out-Line J-

QFP), TQFP (Thin QFP)

Package), SQFP (Shrink

QFP (Quad Flat

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Flatpack)

PQF (Plastic Quad

PLCC (Plastic Leaded

DIP (Dual-In-Line),

Array),LCPGA (Lead Ceramic PGA)

Ceramic Chip Carrier)

Ceramic Dual In-Line

BGA (Ball Grid

Package)

LCCC (Leadless

CDIP SB (Side-Braze

BOITIERS DE CIRCUITS INTEGRES

(Shrink SOP)

(Plastic SOP), SSOP

Package), PSOP

SOP (Small Out-Line

PLCC (Plastic Leaded Chip Carrier)

SOJ (Small Out-Line J-Lead)

SSOP

Plastic DIP

Shrink DIP

DIP (Dual-In-Line), PDIP (Plastic DIP), SDIP (Shrink DIP)

PSOP

SOP (Small Out-Line Package), PSOP (Plastic SOP), SSOP (Shrink SOP)

BGA (Ball Grid Array),LCPGA (Lead Ceramic PGA)

PGA (Pin Grid Array),LCPGA (Lead Ceramic PGA)