Nov 28, 1997 - ±10%. 2222 330 41... on request. Loose in box lt = 3.5 ±0.3 mm. ±20%. 2222 330 47. .... Year and week of manufacture (e.g. 9701). 10.

Ethernet Standards s Direct interface to the ... ing the design of an Ethernet node in a PC system. With ..... Carrier Tracking and End of Message. 1-924 ...... P R E L I M I N A R Y. 1-876. Am79C970. RELATED PRODUCTS. Part No. Description.

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mA. Quiescent Current Change. ΔΙΒ. 7.0V

Mar 21, 2000 - 4.0. X 10– 4. Small–Signal Current Gain. (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz). 2N2219A .... CONTROLLING DIMENSION: INCH. 3.

Impulse3 and FLASH370i are trademarks of Cypress Semiconductor Corporation. ChipLab is a trademark of Data I/O. CY3047. 28-pin TSOP adapter for 256.

Oct 19, 2000 - forth in the “Handling Guide for Semiconductor Devices," or "TOSHIBA ... Power supply. +5V ... considering the application software evaluation.

Rsttng Symbol 2N~9 2N3440. Coll~or-Em.tier Voltage VCEO 350. Colledor+ase Voltage VCBO 450. Colleotor+ase Voltage@ 100,000 Ft. VCB. A~de. ,1.:..:=,.

—Dielectric strength 1,500 VAC between coil and contacts ... *1 Minimum switching loads mentioned above are reference values. Please perform the confirmation test with the actual load .... COIL DATA CHART ... Flow Solder condtion:.

Untitled Document http://www.chinafronter.com/htmlink/3028.html (1 of 2) [1/17/2002 12:34:01 PM]. Page 2. Click here to enlarge the photo. Untitled Document.

LCD option: STN, TN, FSTN. Backlight Option: LED,EL Backlight feature, other Specs not available on catalog is under request. OUTLINE DIMENSION & BLOCK ...

a single 5V power supply. It has a 512-byte data register inside. A program .... 1/00-7. Power. Data Out. Active. Hi - Z. Standby. 5V. Read. Read Output Deselect.

Gate Threshold Voltage. Gate-Body Leakage. VGS(th). IGSS. +500. nA. 250. Zero Gate Voltage Drain Current. Ipss ... Gate-Source Charge. | Gate-Drain Charge.

The system clock frequency must be at least 4.5 times the data rate. UNA ... can be programmed so that the clock rate is 1, 16, 32, ..... Recovery time between.

Power modules enable power devices to be easily mounted at high densities, and are ideal ... Features of MP Series of Power ... MP Series Features. 1. 2. 3. 4. 1.

RENESAS. PDZ9.1B. 45. IDT74FST163211. IDT. CBT16211. 118. IDT74FST163212. IDT. CBT16212. 118. IDT74FST3125. IDT. CBT3125. 118. IDT74FST3126.

1. MW4IC2020MBR1 MW4IC2020GMBR1. MOTOROLA RF DEVICE DATA. The Wideband IC Line. RF LDMOS Wideband Integrated. Power Amplifiers.

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Page 1.

Jan 1, 2000 - Short switching time (typ. 20 ns). • DIL plastic package with high packing density. • BP 104 FS: suitable for vapor-phase and. IR-reflow soldering.

The effective value of θJA can be reduced by using a heatsink (see Application Hints for specific information on heatsinking). The value of θJA for the LLP ...

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THERMAL RESISTANCE. Package ... θJT: Thermal Resistance - Junction to Tab. .... For multi-layered PCB, these layers can also be used as a heat sink.

mA/oC. 5. 5. 5. 5. 5. V. 11/14/2000. ○ Industuy Standard Size. ○ Wide Viewing angle. Solder Temperature 1/16 inch Below Seating Plane for 3 Seconds at ...