GSM TELEPHONE SGH-D807
GSM TELEPHONE
CONTENTS 1. Safety Precautions 2. General Introduction 3. Specification 4. Product Function 5. Circuit Description 6. Test Command & Test Procedure 7. Array course control 8. Exploded View and Parts List 9. Disassembly and Assembly instructions 10. MAIN Electrical Parts List 11. Flow Chart of Troubleshooting 12. PCB Diagrams 13. Block Diagrams 14. Reference data
This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law.
ⓒ Samsung Electronics Co.,Ltd. Code No.: GH68-10831A 2006. 05. Rev.1.0
Contents 1. Safety Precautions 1-1. Repair Precaution ...........................................................................1-1 1-2. ESD(Electrostatically Sensitive Devices) Precaution ...........................1-2 2. General Introduction 3. Specification 3-1. GSM General Specification ..............................................................3-1 3-2. GSM TX power class ......................................................................3-2 3-3. EDGE TX Power Level ....................................................................3-3 4. Product Function 5. Circuit Description 6. Test Command & Test Procedure 6-1. Calibration Equipment ....................................................................6-1 6-2. Calibration Program .......................................................................6-1 6-3. Tx Power Tune up Procedure ..........................................................6-2 7. Array course control 7-1. Downloading Binary Files ................................................................7-1 7-2. Pre-requisition for Downloading .......................................................7-1 7-3. S/W Downloader Program ...............................................................7-2 7-4. How to Download ..........................................................................7-2 8. Exploded View and Parts List 8-1. Cellular phone Exploded View .........................................................8-1 8-2. Cellular phone Parts list .................................................................8-2 9. Disassembly and Assembly instructions 9-1. Disassembly ..................................................................................9-1 9-2. Assembly ......................................................................................9-7 9-3. KIT Assembly ..............................................................................9-10 9-4. Window Disassembly ....................................................................9-13
Contents 10. MAIN Electrical Parts List 11. Flow Chart of Troubleshooting 11-1. Baseband 11-1-1. Power ON ..............................................................................11-1 11-1-2. Initial ....................................................................................11-6 11-1-3. Sim Part ...............................................................................11-9 11-1-4. Microphone Part ...................................................................11-10 11-1-5. Speaker Part_1(MP3, SPEAKER PHONE) .................................11-12 11-1-6. Speaker Part_2(RECEIVER) ...................................................11-16 11-1-7. Charging Part ......................................................................11-18 11-2. RF 11-2-1. GSM850/EGSM RX ................................................................11-21 11-2-2. DCS RX ...............................................................................11-23 11-2-3. PCS RX ...............................................................................11-25 11-2-4. GSM850/EGSM TX ................................................................11-26 11-2-5. DCS/PCS TX ........................................................................11-28 12. PCB Diagrams 13. Block Diagrams 14. Reference data
1. Safety Precautions 1-1. Repair Precaution ● Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because specipicty of cellular phone is sensitive for surrounding interference(RF noise). ● Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by the influence of manetic force. ● Surely use a standard screwdriver when you disassemble this product, otherwise screw will be worn away. ● Use a thicken twisted wire when you measure level. A thicken twisted wire has low resistance, therefore error of measurement is few. ● Repair after separate Test Pack and Set because for short danger (for example an overcurrent and furious flames of parts etc) when you repair board in condition of connecting Test Pack and tuning on. ● Take specially care of soldering, because Land of PCB is small and weak in heat. ● Surely tune on/off while using AC power plug, because a repair of battery charger is dangerous when tuning ON/OFF PBA and Connector after disassembing charger. ● Don't use as you pleases after change other material than replacement registered on SEC System. Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
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Safety Precautions
1-2. ESD(Electrostatically Sensitive Devices) Precaution Several semiconductor may be damaged easilly by static electricity. Such parts are called by ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below. You can prevent from ESD damage by static electricity. ● Remove static electricity remained your body before you touch semiconductor or parts with semiconductor. There are ways that you touch an earthed place or wear static electricity prevention string on wrist. ● Use earthed soldering steel when you connect or disconnect ESD. ● Use soldering removing tool to break static electricity. , otherwise ESD will be damaged by static electricity. ● Don't unpack until you set up ESD on product. Because most of ESD are packed by box and aluminum plate to have conductive power,they are prevented from static electricity. ● You must maintain electric contact between ESD and place due to be set up until ESD is connected completely to the proper place or a circuit board.
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2. General Introduction The SGH-D807 Quad Band phone functions as digital phone working in GSM (Global System for Mobile communications)850,EGSM900, DCS1800 and PCS(PersonalCommunication System)1900 modes.
● ● ● ● ● ● ●
Dimension LCD R/F band Vocoder Antenna SIM BLUETOOTH
: 99.9x52.0x15.4 mm (with Standard Battery) : QCIF(176×220) TFT, 2.12" : GSM850 / EGSM 900 / DCS1800 / PCS1900 : EFR + FR + HR + AMR : Intenna type : 3 Voltage operation : VER 1.2
● ● ● ● ● ●
MS Class GPRS Phase Multi-slot SMG Coding scheme Power class
: : : : : :
Class B GSM Phase II+ GPRS/EGPRS Class 10 (2 Up-link, 4 Down-link, 5 Sum) SMG #31 CS1 - CS4(GPRS), MCS5 - MCS9(EGPRS) support GSM850 - Class 4 (2W) EGSM900 - Class 4 (2W) DCS1800 - Class 1 (1W) PCS1900 - Class 1 (1W)
●
WAP 2.0 Browser
●
SIM AT(Application Toolkit)
●
40 Polyphonic Ringtone
< Basic Package > ●
Handset + Standard Battery + TA + User Guide
< Option Item > ● Battery : Li-Ion, 880mA ● Travel Adapter ● Ear Microphone ● Bluetooth Headset ● Bluetooth Hands Free Kit ● Car Charger/Adapter
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3. Specification 3-1. GSM General Specification GSM850
EGSM900
DCS1800
PCS1900
F r e q . Ba n d [ M Hz ] Uplink/ Downlink
824~849 869~894
880~915 925~960
1710~1785 1805~1880
1850~1910 1930~1990
A RFCN rang e
128~251
0~124& 975~1023
512~885
512~810
T x /Rx s pacing
45 MHz
45 MHz
95 MHz
80 M Hz
GP RS
270.833 Kb ps 3. 692 us
270.833 Kb ps 3. 692 us
270.833 Kb ps 3. 692 us
270.833 Kbp s 3.692 us
EDGE
812.5 K b ps 3. 692 us
812.5 K b ps 3. 692 us
812.5 K b ps 3. 692 us
812.5 K bp s 3.692 us
576. 9 u s 4.615 ms
576. 9 u s 4.615 ms
576. 9 u s 4.615 ms
576.9 u s 4.615 ms
GP RS
0.3 G M SK
0.3 G M SK
0.3 G M SK
0.3 G MS K
EDGE
8 PSK
8 PSK
8 PSK
8 PSK
GP RS
33 d Bm~5 d Bm
33 d Bm~5 d Bm
30 d Bm~0 d Bm
30 dBm~0 d Bm
ED G E
27~5 dBm
27~5 dBm
26~0 dBm
26~0 dBm
GP RS
5~19(class4)
5~19(class4)
0~15(class1)
0~15(class1)
ED G E
8~19( class E 2)
8~19( class E 2)
2~15(class E2)
2~15(class E2)
Sens itivity
- 102 dBm
- 102 dBm
- 100 dBm
-102 d Bm
T D MA Mux
8
8
8
8
Cell Radius
35 Km
35 Km
2 Km
2 Km
Mod. Bit r ate/ Bit P eriod
Time Slot Period/ Fr ame Period
Modu lation
M S P o wer
P ower L evel
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Specification
3-2. GSM TX power class
DCS1800
TX Power control level
PCS1900
0
30±3 dBm
0
30±3 dBm
31±2 dBm
1
28±3 dBm
1
28±3 dBm
7
29±2 dBm
2
26±3 dBm
2
26±3 dBm
27±2 dBm
8
27±2 dBm
3
24±3 dBm
3
24±3 dBm
9
25±2 dBm
9
25±2 dBm
4
22±3 dBm
4
22±3 dBm
10
23±2 dBm
10
23±2 dBm
5
20±3 dBm
5
20±3 dBm
11
21±2 dBm
11
21±2 dBm
6
18±3 dBm
6
18±3 dBm
12
19±2 dBm
12
19±2 dBm
7
16±3 dBm
7
16±3 dBm
13
17±2 dBm
13
17±2 dBm
8
14±3 dBm
8
14±3 dBm
14
15±2 dBm
14
15±2 dBm
9
12±4 dBm
9
12±4 dBm
15
13±2 dBm
15
13±2 dBm
10
10±4 dBm
10
10±4 dBm
16
11±2 dBm
16
11±2 dBm
11
8±4 dBm
11
8±4 dBm
17
9±2 dBm
17
9±2 dBm
12
6±4 dBm
12
6±4 dBm
18
7±2 dBm
18
7±2 dBm
13
4±4 dBm
13
4±4 dBm
19
5±2 dBm
19
5±2 dBm
14
2±5 dBm
14
2±5 dBm
15
0±5 dBm
15
0±5 dBm
TX Power control level
GSM850
TX Power control level
EGSM900
TX Power control level
5
33±2 dBm
5
33±2 dBm
6
31±2 dBm
6
7
29±2 dBm
8
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Specification
3-3. EDGE TX Power Level
TX Power control level
GSM850
TX Power contro l level
TX Power control level
EGSM900
PCS1900
8
27±3 dBm
8
27±3 dBm
2
26±3 dBm
9
25±3 dBm
9
25±3 dBm
3
24±3 dBm
10
23±3 dBm
10
24±3dBm
4
22±3 dBm
11
21±3 dBm
4
22±3dBm
5
20±3 dBm
12
19±3 dBm
5
20±3dBm
6
18±3 dBm
13
17±3 dBm
6
18±3dBm
7
16±3 dBm
15±3 dBm
14
15±3 dBm
7
16±3dBm
8
14±3 dBm
15
13±3 dBm
15
13±3 dBm
8
14±3dBm
9
12±4 dBm
16
11±5 dBm
16
11±5 dBm
9
12±4dBm
10
10±4 dBm
17
9±5 dBm
17
9±5 dBm
10
10±4dBm
11
8±4 dBm
18
7±5 dBm
18
7±5 dBm
11
8±4dBm
12
6±4 dBm
19
5±5 dBm
19
5±5 dBm
12
6±4dBm
13
4±4 dBm
13
4±4dBm
14
2±5 dBm
14
2±5dBm
15
0±5 dBm
15
0±5dBm
TX Power control level
DCS1800
2
26±3 dBm
23±3 dBm
3
11
21±3 dBm
19±3 dBm
12
13
17±3 dBm
14
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4. Product Function Main Function - 1.3 Mega Pixel Camera - Instant Messaging Capability - Multimedia Capability - Bluetooth Wireless Technology - Voice Command Feature - Speakerphone Capability - Personal Assistant feature provides alarms, calendar, calculator, timer, stopwatch, record audio, world time, and converter.
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5. Circuit Description < RF Circuit Description of SGH-D807 > 1. FEM (DUF400) ==> Switching Tx, Rx path for GSM850, EGSM900, DCS1800 and PCS1900 controlled by logic. Integration of GSM850, EGSM900, DCS1800 and PCS1900 RX SAW Filters. To convert Electromagnetic Field Wave to Acoustic Wave and the pass the specific frequency band. - for filtering the frequency band 824 ~ 849 / 869 ~ 894 MHz - for filtering the frequency band 880 ~ 915 / 925 ~ 960 MHz - for filtering the frequency band 1710 ~ 1785 / 1805 ~ 1880 MHz - for filtering the frequency band 1850 ~ 1910 / 1930 ~ 1990 MHz 2. FEM Control Logic ==> Truth Table VC1
VC2
VC3
GSM850 Rx Mode
L
L
H
EGSM900 Rx Mode
L
L
L
GSM850/EGSM900 Tx Mode
L
H
L
DCS/PCS Rx Mode
L
L
L
DCS/PCS Tx Mode
H
L
L
3. VC-TCXO(TCX400) ==> To generate the 26 MHz reference clock to drive the logic and RF. After additional process, the reference clock applies to the U401 VCXOB pin to modulate TXIQ and demodulate RXIQ. 4. HD155154NP (U405) ==> The HD155154NP is a RF tranceiver IC for GS850, EGSM900 DCS1800 and PCS1900 QUAD band cellular systems, and incorporates EDGE tranceiver capabillity, and integrates most of the low power silicon functions of a tranceiver. The HD155154NP incorporates triple RF LNAs, direct conversion mixers which are IQ demodulator, an auto offset calibrated programmable gain amplifier with baseband filter for both IQ chains, RF architecture for the transmitter. Moreover the HD155154NP includes power mode controller to optimize the power consumption. These functions can operate down to 2.7V and are housed in a 48-pin DPE QFN SMD package.
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Circuit Description
- RX Function ● Differential Low Noise Amplifiers ● Direct Conversion mixer and IQ demodulator with 90 degree phase splitter. ● Auto offset calibrated programmable gain amplifier with baseband filter(PGA) - TX Function ● I/Q modulator with 90 degree phase splitter ● Offset PLL - Phase comparator included fast lock system (Digital phase detector)
● Polar loop - Lineariser - Voltage gain amplifier - Inverse voltage gain amplifier - Down converter - AM detector ● PLL Synthesiser - RF Synthesiser for RX/TX RF local included fast lock system - 400kHz comparison frequency to achieve faster lock-up time 5. POWER AMP (PAM406) ==> The PF09025B is a high-power, high-efficiency power amplifier module with integrated power control ● Quad band Polar Loop Amplifier for GSM850 (824 to 849 MHz), GSM900(880 to 915 MHz), DCS1800(1710 to 1785 MHz) and PCS1900 (1850 to 1910 MHz). ● For 3.5 V normal operation ● Built in LDO ● Superb output linearity ● High gain 3-stage amplifier : +5dBm input typical ● GPRS / EGPRS Operation Compatible ● Small package : 8.0 X 8.0 mm
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Circuit Description
< Baseband
Circuit description of SGH-D807 >
1. CSP2750 (UCD101) ==> The CSP2750 has two major logical components power management and conversion signal processing. The PSC component is responsible for all power-related functionality, including the following; ● Power management for RF, BB and ancillary devices within the GSM/GPRS ● Battery-charge management ● Reset control ● SIM card voltage-level shifting The CSP component is responsible for the following ; ● Intraframe event scheduling ● Voice band processing, including voice band ADC and DAC ● Analog baseband processing, including baseband ADC and DAC ● Providing RF interface for Trident digital baseband device ● Transmitter Power control ● Automatic frequency control ● A5 ciphering ● Low-power sleep mode and wake-up control The CSP2750 has the following major physical components; ● Timing and control unit ● RF serial interface ● Low-power sleep mode controller ● Baseband Transmitter / Receiver ● Voice input and output
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Circuit Description
2. WM8955L(UCD503) ==> The WM8955L is a low power, high quality stereo DAC with intergrated headphone and loudspwaker amplifiers, designed to reduce external component requirements in portable digital audio application. The on-chip headsphone amplifiers can deliver 40mW into a 16Ω load. Advanced on-chip digital signal processing performs bass and treble tone comtrol. The WM8955L can operate as a master or a slave, and include an on-chip PLL. It can use most master clock frequencies commonly found in portable systems, including USB,GSM, CDMA or PDC clocks, or standard 256fs, clock rates. Different audio sample rates such as 48khz, 44.1khz, 8khz and many other are supported. The WM8955L operates on supply voltages from 1.8V up to 3.6V, although the digital core can operates on a separate supply down to 1.42V, saving power. Different section of the chip can also be powered down under software control.
3. HPE(UCP201) ==> The Trident-HPE digital baseband processor is a complete system IC designed for wireless terminals that includes two digital signal processor(DSP) cores optimized for low-power communications applications and a powerful, highperformance, industry-standard microcontroller core along with a rich set of peripherals. The Trident-HPE digital baseband processor achieves best-in-class signal processing performance while maintaining the efficient software code density, low power consumption, and small physical size required for GSM/GPRS terminals ARM946E-S microcontroller core; ● 101 MHz system bus, 16 kbyte instruction and 16kbyte data caches. ● 8 kbyte tightly coupled zero wait-state instruction and 4kbyte tightly coupled zero waitstate data memory ● direct memory access controller for transparent transfer between memory and peripherals. ● External Memory interface with asynchronous burst mode support ● Synchronous serial port supporting ● Programmable 48-bit general-purpose IO unit, keyboard interface, programmable interval timer and real-time clock. 5-4
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Circuit Description
● SD/MMC controller that supports interfacing to secure digital/multimedia memory card. Two DSP16000 dual-MAC DSP cores; ● Up to 404 million MACs per second at 101 MHz. ● Memory complement; - DSP0 : 144K X 16-bit ROM, 40k X 16-bit RAM. - DSP1 : 96K X 16-bit ROM, 16k X 16-bit RAM. JTAG boundary scan and integrated H/W developement system Low power; ● Ultralow leakage process technology for best-in-class standby power ● Flexible power management modes to allow for maximum active power management Interprocessor communication hardware support between ARM, DSP0 and DSP1. Supported by Trident-HPE digital baseband processor software and hardware developement tools as well as industry standard ARM software and hardware developement tools Two on-chip, programmable, PLL clock synthesizers; - one for ARM and DSP, the other one for USB.
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6. Test Command & Test Procedure 6-1. Calibration Equipment -
HP 8960 DC Power Supply Test Jig Configuration HP8960
RF
DC POWER SUPPLY GPIB +
+
--
PC
TEST JIG
GPIB Serial
Serial
6-2. Calibration Program - Samsung internal software
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Test Command & Test Procedure
6-3. Tx Power Tune up Procedure - GMSK 1) Procedure: a. Calibraion equipment HP8960 and the cell phone are connected through RF cable. b. Target power ( required power level according to the specification which should be set by calibration program) is set to equipment as power level (ex: GSM 5 level is 32.5 dBm). c. Activate phone in Tx_Mode_Only. d. HP8960 equipment measures transmitted power through rf test cable from the phone and reports measured level to calibration program. e. The program compares measured power with the target power. f. The calibration program decides power code which is defined in advance in the program and writes the codes to the flash memory in the phone. 2) Target value is defined according to the value of GSM specification. See the TX power level definition table below. 3) Target values of the peak level of the phone are set normally in conducted mode - GSM850 5 level : 32.5 dBm - EGSM900 5 level : 32.5 dBm - DCS 0 level : 29.5 dBm - PCS 0 level : 30.2 dBm (Tolerance : -2 dB ~ +1 dB ) 4) Accuracy All the TX level from the phone after tuned-up satisfy the GSM specification 5) TX ramp mask specification applied to the calibration program :
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Test Command & Test Procedure
- 8PSK
1) Procedure: a. Calibraion equipment HP8960 and the cell phone are connected through RF cable. b. Target power ( required power level according to the specification which should be set by calibration program) is set to equipment as power level (ex: GSM 8 level is 27 dBm). c. Activate phone in Cont_8psk_Tx_Mode_Only. d. HP8960 equipment measures transmitted power through rf test cable from the phone and reports measured level to calibration program. e. The program compares measured power with the target power. f. The calibration program decides power code which is defined in advance in the program and writes the codes to the flash memory in the phone.
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Test Command & Test Procedure
2) Target value is defined according to the value of EGPRS specification. See the TX power level definition table below. 3) Target values of the peak level of the phone are set normally in conducted mode - GSM850 8 level : 27 dBm - EGSM900 8 level : 27 dBm - DCS 2 level : 26 dBm - PCS 2 level : 26 dBm (Tolerance : -2 dB ~ +1 dB ) 4) Accuracy All the TX level from the phone after tuned-up satisfy the EGPRS specification 5) TX ramp mask specification applied to the calibration program :
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7. Array course control • D807 DATA Cable and JTAG
Software Downloading 7-1. Downloading Binary Files • A binary file for downloading D807. - gsmstack.s3
7-2. Pre-requisition for Downloading • Downloader Program(Optiflash.exe) - Optiflash version 4.16 T1 S01 • D807 Mobile Phone • Data Cable • Binary file
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Array course control
7-3. S/W Downloader Program • Optiflash application • Path: version(D807ucfb6)\utils\SIBLEY_OPTIFLASH\optiflash.exe
7-4. How to Download ① Connect the data cable and press '*(star)' key on the keypad simultaneously. ② Run Optiflash application (Optiflash.exe)
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Array course control
③ File open
• Select an existing load file ( usually, gsmstack.s3 )
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Array course control
③ Option
• Click 'Settings' , Display as below.
* Generic • Specify Hardware Platform: Select a model and platform (USB) • Misc.Settings : Check the 'Debug Mode' and 'Erase All Unused Regions'
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Array course control
* COM Port
• Select com port - if you don't know the usb port, please see the control pannel. (Device Manager –
Hardware – Port)
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Array course control
* Flash and Verify
• Click 'Browse' button - file to load and verify • Check the reserved memory regions ④ All procedures are done, Click 'Flash' Button.
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Array course control
⑤ Pop up the window as below. Type the "yes" and Click 'OK'
⑥ Start Download.
• Display status of downloading progress.
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Array course control
⑦ Display "All is well" and the D807 will reboot automatically.
⑧ After download.. • You do "Full service reset" by pressing key button "*2767*3855#". • You can see S/W version by pressing key button "*#9998*1234#".
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8. Exploded View and Parts List 8-1. Cellular phone Exploded View
QFR06 QFU01 QKP01
QME06
QME01
QKP02
QMI03 QFR01 QLC01 QPC01 QCR32
QME02
QCA01 QCR32
QMP01
QFL01 QCA05
QCR17
QCR05 QSC01
QAN05
QAN02 QCH05 QRE01
QRF03 QVO01 QBA01 QRF01 QBA00
QCR06
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Exploded View and Parts List
8-2. Cellular phone Parts list QAN02
INTENNA-SGHD807
GH42-00749A
QAN05
ASSY MEC-RUBBER INTENNA CONTAC
GH75-09496A
QBA00
PMO-BATT COVER V1
GH72-28679A
QBA01
INNER BATTERY PACK-800MAH,BLK,
GH43-02389A
QCA01
UNIT-CAMERA
GH59-02729A
QCA05
ASSY MEC-CAMERA DECO
GH75-07777A
QCH05
PMO-MICRO SD COVER
GH72-27731A
QCR04
SCREW-MACHINE
6001-001479
QCR05
SCREW-MACHINE
6001-001478
QCR17
SCREW-MACHINE
6001-001460
QCR32
SCREW-MACHINE
6001-001700
QCR32
SCREW-MACHINE
6001-001700
QFL01
ASSY MEC-SLIDE LOWER HINGE
GH75-08808A
QFR01
ASSY MEC-CASE FRONT
GH75-08730A
QFR06
PMO-CASE FRONT U BUSH
GH72-27384A
QFU01
ASSY CASE-SLIDE UPPER
GH98-01668A
QKP01
ASSY MEC-KEYPAD(CIN/ZK)
GH75-08727A
QKP02
ASSY MEC-KEYPAD SUB
GH75-07758A
QLC01
MEA-LCD MODULE KIT
GH97-05871A
QME01
UNIT-3X4 KEY FPCB ASSY
GH59-02878A
QME02
UNIT-NAVY KEY FPCB
GH59-02866A
QME06
UNIT-MODULE SPEAKER
GH59-03051A
QMI03
ASSY MEC-MIC HOLDER
GH75-09497A
QMP01
PBA MAIN-SGHD807
GH92-02519A
QPC01
MEA-SLIDE FPCB KIT
GH97-05904A
QRE01
ASSY MEC-CASE REAR
GH75-08731A
QRF01
PMO-RF COVER 2
GH72-25716A
QRF03
PMO-EARJACK COVER
GH72-24043A
QSC01
RMO-LOWER SCREW CAP
GH73-05237A
QVO01
PMO-VOLUM KEY
GH72-24041A
8-2
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Exploded View and Parts List
CBF INTERFACE-SGHE900,DLC,B_TY
GH39-00654A
ADAPTOR-SGHE900,BLK,PHIL,B_TYP
GH44-01343A
S/W CD-SGH-D807 PC STUDIO 3.0
GH46-00274A
UNIT-EARPHONE,SGHE900,BLK,D-TY
GH59-03537A
LABEL(P)-INTENNA WARNING LABEL
GH68-09868A
MPR-BOHO VINYL MAIN WIN
GH74-15426A
MPR-TAPE MAIN CONN COVER
GH74-19552A
MPR-TAPE MAIN FPCB SHIELD
GH74-22333A
MPR-TAPE LCD CONN BASE
GH74-19553A
MPR-TAPE INS COVER MAIN
GH74-20753A
MPR-TAPE TEST POINT
GH74-20754A
LABEL(R)-WATER SOAK
GH68-09361A
AS-WINDOWS SVC
GH81-03625A
AS-SPK GASKET(T.0.5)
GH81-03355A
LABEL(R)-WATER SOAK T_MOBILE
GH68-05914A
MPR-BOHO VINYL FUNCTION
GH74-18027A
MPR-TAPE LCD CONN COVER
GH74-19561A
MPR-TAPE KEY FPCB CONN
GH74-19564A
MPR-TAPE FRONT SCREW
GH74-20758A
MPR-VINYL BOHO UPPER B
GH74-20768A
MPR-VINYL BOHO FRONT BUS
GH74-21091A
MPR-TAPE CONN COVER
GH74-21709A
MPR-TAPE SPRING ANCHOR
GH74-21711A
MPR-TAPE MAIN FPCB SHIELD
GH74-22333A
MPR-GASK TAPE
GH74-22658A
ASSY MEC-RUBBER KEY FPCB
GH75-09498A
MPR-TAPE UPPER LCD
GH74-27527A
MANUAL USERS-ROGERS ENGLISH
GH68-11340A
MANUAL USERS-ROGERS FRENCH
GH68-11341A
MANUAL USERS-ROGERS QRC
GH68-11342A
BAG PE
6902-000634
LABEL(R)-MAIN(RWC)
GH68-09538B
CUSHION-CASE(CIN)
GH69-03758A
BOX(P)-UNIT MAIN(CKD-CHINA)
GH69-03760A
8-3
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
9. Disassembly and Assembly instructions 9-1. Disassembly
1
2
Unscrew 4 places of the Rear
Open the Ear Cover.
3
4
Open the lower part of Rear's right side using stick for disassembly.
Pull stick for disassembly and opens Rear's right side Hook
5
6
Open the Rear's left side Hook.
Push the Rear and unlock top portion Hook 2 places, disassemble the Rear. 9-1
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Disassembly and Assembly instructions
7
Unscrew
8
2 places of PBA.
Down Slide.
9
10
Remove the PBA carafully.
Remove the Key Connector.
11
12
Control the Slide and makes the FPCB longest.
Remove a electric conduction Tape and a insulation Tape on the FPCB Connector using tweezers. 9-2
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Disassembly and Assembly instructions
13
14
Open the cover of the Connector
Pull out the Slide FPCB carefully in
using wide surface of a tweezers.
the Connector.
15
16
Remove a insulation Tape and a electric conduction Tape that is covering Screw.
Unscrew 6 places of Front.
17
18
disassemble the Front.
Remove the Screw Cap that is covering the Slide Lower. 9-3
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Disassembly and Assembly instructions
19
20
Unscrew on the Slide Lower
Push stick for disassembly with the picture in the Slide's corner.
21
22
Pull out the Hook of the Lower's top portion and disassemble Slide Lower.
Remove the FPCB's fixing Tape.
23
24
Remove the Connector's fixing Tape.
Open the Connector cover.
9-4
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Disassembly and Assembly instructions
25
26
Pull out the Slide FPCB.
Remove the Connector insulation Tape.
27
28
Remove the ESD electric conduction Tape.
disassemble the SPK Module.
29
30
disassemble the Camera Module.
disassemble the Sub Key PBA.
9-5
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Disassembly and Assembly instructions
31
disassemble the LCD Module.
9-6
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Disassembly and Assembly instructions
9-2. Assembly
1
2
3
Assemble the LCD and Sub Assemble the Sub Key PBA, After the ESD electric Camera, SPK gradually. conduction Tape sticking, Keypad to Front. attach a insulation tape on Connector.
4
6
5
Attach a insulation Tape according to Main FPCB's
Attach as do not pass over the FPCB's gilding part.
white surface. Attach a Assemble the LCD's FPCB.
electric conduction Tape according to gilding end line.
9-7
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Disassembly and Assembly instructions
7
Inserts
8
two places of
9
Attach Screw Cap in 2
screw on the Front's
Hook's lower part and
places of the top portion
places .
assembles Slide Lower.
after screw on the Slide
6
Lower's 6 places.
10
11
12
Attach a insulation Tape
Combine the FPCB with the Sets in white surface of
and a electric conduction
PBA.
FPCB on Connector, and
Tape on a screw.
set a insulation Tape in gilding surface. Then, a insulation Tape attaches electric conduction Tape .
9-8
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Disassembly and Assembly instructions
13
14
Connect the 3*4 Key Connector.
Combine
15
fix Screw 2 places of the PBA.
16
Assemble the Rear Hook's top portion.
Assemble the Set's right side Hook.
17
18
Assemble the Set's left side Hook.
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Disassembly and Assembly instructions
9-3. KIT Assembly
Attach LCD on Upper's inside.
State that LCD sticks on inside
Take care so that ESD electric conduction Tape may not reach with surrounding Chip.
Connect Sub Key PBA, Camera, Spk to
After attach ESD electric conduction
sequential connector.
Tapes, attach insulation tapes according to base line that is written to LCD. (All connectors should be covered.)
9-10
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Disassembly and Assembly instructions
13
14
Attach a insulation Tape according to the Main FPCB's white surface.Then, attach a Assemble the SLIDE FPCB with the
electric conduction Tape depending on
Connector.
end line which do gilding.
15
16
Must not pass over the FPCB's gilding part.
The Lower assembly and the Screw combine. Combine a Screw after assemble the Front.
17
18
Attach a insulation Tape and a electric
Combine the FPCB with the PBA.
conduction Tape on the base line . 9-11
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Disassembly and Assembly instructions
19
Place a insulation Tape according to the FPCB's white surface on the Connector correctly. Attach electric conduction Tape on gilding surface.
9-12
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Disassembly and Assembly instructions
9-4. Window Disassembly
1
2
Infix tweezers in middle groove of the
Put end of tweezers at groove until the
LCD top portion.
WINDOW goes up little bit.
3
4
Lift the window, at the same time put tweezers into the window's right side
Lift the window, at the same time puts tweezers into the window's left side.
5
6
Lift the WINDOW between the gab using a finger.
Lift WINDOW with two hands slightly.
9-13
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Disassembly and Assembly instructions
7
Check that the WINDOW's end segment has
the step.
There is no step at the opposite, and assembles the Window with the step locating in the LCD top portion.
8
The Wide surface among steps sticks directly with the LCD, and assembles the WINDOW to under portion direction after set end of the LCD top portion with the WINDOW.
9
After assemble finally the LCD's under portion, confirm whether the GAB does not happen between the WINDOW and the LCD 9-14
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
10. MAIN Electrical Parts List SEC CODE 0403-001411 0403-001427 0403-001511 0403-001547 0406-001150 0406-001150 0406-001150 0406-001150 0406-001190 0406-001190 0406-001190 0406-001210 0406-001210 0406-001210 0406-001210 0504-000168 0801-002958 0801-002975 0801-002993 0801-002995 0801-003022 1001-001306 1001-001400 1002-001441 1003-001716 1009-001018 1108-000046 1201-002240 1201-002267 1203-003340 1203-003432 1203-003432 1203-003523 1203-003523 1203-003754 1203-003789 1203-004119 1203-004151 1203-004253 1205-002272 1205-002568 1205-002652
Design LOC AN400 ANT401 ANT402 BAT100 BTC502 C100 C101 C102 C103 C104 C105 C106 C107 C108 C109 C110 C111 C112 C113 C114 C115 C116 C117 C118 C119 C120 C121 C122 C123 C124 C125 C126 C127 C128 C129 C130 C133 C135 C136 C137 C138 C139
Discription DIODE-ZENER DIODE-ZENER DIODE-ZENER DIODE-ZENER DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS TR-DIGITAL IC-CMOS LOGIC IC-CMOS LOGIC IC-CMOS LOGIC IC-CMOS LOGIC IC-CMOS LOGIC IC-ANALOG MULTIPLEX IC-ANALOG SWITCH IC-D/A CONVERTER IC-EL DRIVER IC-HALL EFFECT S/W IC-MCP IC-AUDIO AMP IC-POWER AMP IC-POSI.FIXED REG. IC-POSI.FIXED REG. IC-POSI.FIXED REG. IC-POSI.FIXED REG. IC-POSI.FIXED REG. IC-POSI.FIXED REG. IC-POWER SUPERVISOR IC-POWER SUPERVISOR IC-BATTERY IC-DC/DC CONVERTER IC-TRANSCEIVER IC-SWITCH IC-TRANSCEIVER
10-1
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Main Electrical Parts List
SEC CODE 1404-001165 1405-001082 1405-001082 1405-001082 1405-001082 1405-001082 1405-001082 2007-000137 2007-000138 2007-000138 2007-000138 2007-000138 2007-000139 2007-000139 2007-000143 2007-000148 2007-000148 2007-000161 2007-000170 2007-000170 2007-000170 2007-000171 2007-000171 2007-000171 2007-000171 2007-000171 2007-000171 2007-000171 2007-000173 2007-000173 2007-000242 2007-000690 2007-000775 2007-000982 2007-001217 2007-001292 2007-001292 2007-002797 2007-002965 2007-002965 2007-007107 2007-007107
Design LOC C200 C201 C202 C203 C204 C205 C206 C207 C208 C209 C210 C211 C212 C213 C214 C215 C216 C217 C218 C219 C220 C221 C222 C223 C224 C225 C226 C227 C228 C229 C230 C300 C301 C302 C303 C304 C305 C306 C307 C308 C309 C310
Discription THERMISTOR-NTC VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP
10-2
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Main Electrical Parts List
SEC CODE 2007-007107 2007-007107 2007-007134 2007-007134 2007-007142 2007-007142 2007-007142 2007-007142 2007-007316 2007-007318 2007-007528 2007-007528 2007-007528 2007-007528 2007-007586 2007-007588 2007-008051 2007-008055 2007-008055 2007-008055 2007-008055 2007-008055 2007-008055 2007-008055 2007-008055 2007-008055 2007-008055 2007-008057 2007-008117 2007-008210 2007-008210 2007-008419 2007-008419 2007-008419 2007-008419 2007-008419 2007-008420 2007-008478 2007-008478 2007-008483 2007-008483 2007-008483
Design LOC C311 C312 C313 C315 C318 C319 C320 C321 C322 C323 C324 C325 C329 C330 C331 C333 C334 C335 C336 C337 C338 C339 C340 C341 C342 C344 C345 C346 C347 C348 C400 C401 C404 C405 C406 C407 C408 C409 C410 C411 C412 C414
Discription R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP
10-3
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Main Electrical Parts List
SEC CODE 2007-008483 2007-008483 2007-008483 2007-008483 2007-008483 2007-008483 2007-008483 2007-008483 2007-008483 2007-008486 2007-008516 2007-008516 2007-008516 2007-008516 2007-008516 2007-008516 2007-008516 2007-008531 2007-008531 2007-008531 2007-008531 2007-008531 2007-008531 2007-008542 2007-008542 2007-008542 2007-008542 2007-008542 2007-008582 2007-008582 2007-008582 2007-008582 2007-008587 2007-008587 2007-008588 2007-008806 2007-008806 2007-008816 2007-008816 2007-009158 2007-009208 2007-009208
Design LOC C415 C416 C417 C418 C419 C420 C421 C422 C423 C424 C425 C426 C427 C428 C429 C430 C431 C432 C433 C434 C435 C436 C438 C439 C440 C441 C442 C443 C444 C445 C446 C447 C448 C449 C450 C451 C452 C453 C454 C455 C456 C457
Discription R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP
10-4
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Main Electrical Parts List
SEC CODE 2007-009208 2007-009223 2203-000233 2203-000254 2203-000254 2203-000254 2203-000254 2203-000254 2203-000254 2203-000254 2203-000254 2203-000254 2203-000278 2203-000359 2203-000438 2203-000438 2203-000438 2203-000438 2203-000489 2203-000550 2203-000550 2203-000627 2203-000627 2203-000627 2203-000654 2203-000654 2203-000812 2203-000812 2203-000812 2203-000812 2203-000812 2203-000836 2203-000995 2203-000995 2203-001153 2203-001412 2203-001412 2203-001412 2203-002982 2203-005056 2203-005056 2203-005138
Design LOC C458 C459 C500 C501 C502 C504 C505 C506 C508 C509 C510 C512 C513 C514 C515 C517 C518 C519 C520 C522 C523 C524 C525 C527 C529 C530 C531 C532 C533 C534 C535 C536 C537 C538 C539 C540 C541 C542 C545 C547 C548 C549
Discription R-CHIP R-CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP
10-5
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SNA SNA SNA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SNA SA SA SA
Main Electrical Parts List
SEC CODE 2203-005138 2203-005344 2203-005344 2203-005344 2203-005395 2203-005395 2203-005446 2203-005446 2203-005514 2203-005514 2203-005514 2203-005514 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682
Design LOC C550 C551 CD200 CN300 D504 DUF400 F301 F302 F303 F304 HDC301 IFC501 L100 L101 L102 L200 L401 L403 L404 L405 L406 L407 L408 L409 L410 L412 L500 L501 L502 L503 L504 OSC200 OSC301 PAM406 Q100 Q101 R100 R101 R102 R103 R104 R105
Discription C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP
10-6
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Main Electrical Parts List
SEC CODE 2203-005682 2203-005683 2203-005725 2203-005725 2203-005736 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006121 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006257 2203-006257 2203-006257 2203-006257 2203-006260 2203-006260
Design LOC R106 R107 R108 R109 R110 R111 R112 R113 R116 R117 R118 R120 R122 R123 R200 R201 R202 R203 R204 R205 R206 R207 R209 R210 R211 R212 R213 R214 R215 R216 R218 R219 R220 R301 R302 R303 R304 R305 R306 R307 R308 R309
Discription C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP
10-7
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Main Electrical Parts List
SEC CODE 2203-006324 2203-006348 2203-006348 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006556 2203-006556 2203-006556 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562
Design LOC R310 R400 R401 R402 R403 R404 R405 R406 R407 R408 R409 R410 R411 R412 R413 R417 R418 R419 R420 R421 R422 R423 R424 R425 R426 R427 R428 R429 R430 R431 R432 R433 R434 R437 R500 R501 R502 R503 R504 R505 R508 R511
Discription C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP
10-8
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Main Electrical Parts List
SEC CODE 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006585 2203-006638 2203-006648 2203-006712 2203-006824 2203-006824 2203-006824 2203-006824 2203-006824 2203-006824 2203-006824 2203-006824 2203-006825 2203-006825 2404-001225 2404-001225 2404-001336 2404-001336 2404-001339 2404-001352 2404-001352 2404-001381 2404-001381 2404-001381 2404-001381 2404-001381 2404-001381 2404-001396 2404-001406 2404-001406 2703-001178
Design LOC R512 R513 R514 R515 R516 R517 R518 R519 R520 R521 R522 R523 R524 R525 R527 R529 R530 R531 R532 R533 R536 R537 R538 R539 R540 R541 R542 R543 R544 R546 R547 RFS400 SIM100 SW301 SW302 TCX400 U100 U102 U103 U107 U108 U202
Discription C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP INDUCTOR-SMD
10-9
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Main Electrical Parts List
SEC CODE 2703-001178 2703-001180 2703-001737 2703-002203 2703-002205 2703-002206 2703-002268 2703-002368 2703-002734 2703-002734 2703-002966 2801-004285 2801-004373 2809-001293 2901-001389 2901-001389 2901-001389 2901-001389 2911-000017 3301-001158 3301-001158 3301-001729 3301-001729 3301-001729 3301-001729 3301-001729 3404-001152 3404-001152 3705-001358 3708-002194 3709-001344 3709-001421 3710-002306 3711-005976 3711-006220 4202-001116 4302-001158 4709-001372 GH09-00044A GH13-00032A GH71-05646A GH71-05646A
Design LOC U203 U204 U205 U206 U300 U301 U303 U304 U400 U401 U402 U403 U404 U405 U500 U501 U502 U504 UCD101 UCD503 UCP201 UME200 V500 V501 V502 V503 V504 V505 ZD101 ZD201 ZD202 ZD203 ZD204 ZD301 ZD302 ZD303 ZD304 ZD305 ZD500 ZD501 ZD502 ZD504
Discription INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD CRYSTAL-SMD CRYSTAL-SMD OSCILLATOR-VCTCXO FILTER-EMI/ESD FILTER-EMI/ESD FILTER-EMI/ESD FILTER-EMI/ESD DUPLEXER-FEM BEAD-SMD BEAD-SMD BEAD-SMD BEAD-SMD BEAD-SMD BEAD-SMD BEAD-SMD SWITCH-TACT SWITCH-TACT CONNECTOR-COAXIAL CONNECTOR-FPC/FFC/PIC CONNECTOR-CARD EDGE CONNECTOR-CARD EDGE SOCKET-INTERFACE HEADER-BOARD TO BOARD HEADER-BATTERY ANTENNA-CHIP BATTERY-LI(2ND) BLUETOOTH MODULE IC MICOM IC ASIC NPR-ANTENNA CONTACT NPR-ANTENNA CONTACT
10-10
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
11. Flow Chart of Troubleshooting 11-1.Baseband 11-1-1. Power ON 'Power On' does not work
Check the current consumption Yes Current consumption >= 100mA
No
Download again
Yes Check the Vbat Voltage
Voltage >=3.3V
No
Charge the Battery
Yes Check the pin of U101
① Pin#J12 >= 2.8V
No
Check U101 and C115
Yes
② Pin#A13 and pin#A14>=2.8V
No
pin#C12 = 1.8V
No
Yes
Yes
③ Check the clock signal at C414
④ Freq = 26MHz Vrms >=300mV Vpp≒ 900mV
No
Check the clock generation circuit (related to 3pin of TCX400, C407, R404)
Yes Check the initial operation
END
11-1
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Check U101, U103
SERLE SERDAT SERCLK
XOENA TX_BAND_SEL RX_SEL ANT_BAND_SEL
TRXIP TRXIN TRXQP TRXQN
OCTL0 OCTL1 OCTL2 OCTL3 OCTL4 OCTL5 OCTL6 OCTL7 SERLE1 SERLE2 SERDA SERCK
E6 C5 F5 E5 A4 G6 B3 A3
B1 A2 C1 C2
R108
A FC VA PC
D9 A FC E7 TXP
DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 AB8 AB7 AB6 AB5 AB4 AB3 AB2 AB1 AB0 I|O RWN RESETN_CSP
C121
D2 D3 E3 E2 F3 F2 F1 F4 G4 G3 H5 J6 J5 K3 K2 K1 K5 K7 M1 M2 N2 N1 L5 P1 K6 L3 L2 R3
U101
11-2
This Document can not be used without Samsung's authorization
SAMSUNG Proprietary-Contents may change without notice C125
A OUTA P A OUTA N A OUTB P A OUTB N MICINP MICINN MICOUTP MICOUTN A UXINP A UXINN A UXOUTP A UXOUTN
B5 B6 D7 D6 C7 C6
A OUTA P A OUTA N A OUTB P A OUTB N MICINP MICINN MICOUTP MICOUTN A UXINP A UXINN A UXOUTP A UXOUTN VXVCM VREGP VREGN DA ICK DA IRN DA IDI DA IDO P11 N12 R12 P12 N14 M14 N15 P15 M15 L 14 K 13 L 13 R13 M13 R14 R4 P4 L6 M6
DSP_IO DSP_RWN FLASH_RESET
R100
C100
VCCD_1_8
DSP_INT
DSP_AB(0:8)
DSP_DB(15) DSP_DB(14) DSP_DB(13) DSP_DB(12) DSP_DB(11) DSP_DB(10) DSP_DB(9) DSP_DB(8) DSP_DB(7) DSP_DB(6) DSP_DB(5) DSP_DB(4) DSP_DB(3) DSP_DB(2) DSP_DB(1) DSP_DB(0) DSP_AB(8) DSP_AB(7) DSP_AB(6) DSP_AB(5) DSP_AB(4) DSP_AB(3) DSP_AB(2) DSP_AB(1) DSP_AB(0)
C102
C101
VCCA_2_8
N4 D1 R6 P5 P3
CL K 32K XOENA Q CL K 13M_MC
RA REF2 RA REF1 RXTXIP RXTXIN RXTXQP RXTXQN
VCCD_2_9
K8 L8 N7 M7
K12 H11 G12 G13 F13 F15 C12 A14 C9 D10 B10 B11 A12 B12 A13 J12 G11 F14
R112
VBAT
ADC_AUX2 ADC_AUX1 VREF CREF RTC_ALMN
D15 E10 A10 E9 H10
VEXT E14 VBAT E13 CH_BDRV E11 CH_ISEN F12 CH_RES D14
CSN_PSC SCLK_PSC SDO_PSC SDI_PSC
VSIM VRTC LED2_DRV LED1_DRV RING_DRV VIB_DRV VLDO_7 VLDO_6 VL5S_B VL5S_A VLDO_5 VL4S_B VL4S_A VLDO_4 VLDO_3 VLDO_2 VLDO_1 VACC
N9 R10 P10 J11 K11 K14
VDD34 C11 VDD12 J13
UP_CLK UP_RST UP_IO SIM_IO SIM_RST SIM_CLK
2 1 K 10 J 10 J9 J8 J7 H9 H8 H7 H6 G10 G9 G8 G7 F10 F9 F8 F7 D13 NC6 NC5 GNDS17 GNDS16 GNDS15 GNDS14 GNDS13 GNDS12 GNDS11 GNDS10 GNDS9 GNDS8 GNDS7 GNDS6 GNDS5 GNDS4 GNDS3 GNDS2 GNDS1 A UX_A DC3
J IG_ON PWR_ON PSW1_B UF
RTC_CL K XOENA Q MC A DC_A UX4 DINTR
B4 C4 P13 L 11 F6 A6 M10 N11 P6 R2 K4 G5 J4 N5 N6 M3 J3 F11 K 15 B 15 E8 B 13 C10 GND_OCTL VDD_OCTL GNDV VDDV GNDB VDDB GNDD VDDD VSS4 VSS3 VSS2 VSS1 VDD_IO2 VDD_IO1 VDD3 VDD2 VDD1 GND_HCUR GND_PSC2 GND_PSC1 GNDQ VDD67 VDD5 PWR_SW2 PWR_SW1N PSW1_B UF RESET_O MODE PWR_K EEP INTRQ VIB _RNG_EN C14 C15 L7 K9 N10 M9 L 10 L9
DSP_DB(0:15)
TTY_DETECT
VCCD_2_9
C120
VBAT
UP_CS UP_SCLK UP_SDO UP_SDI
R111
R107
C117
C118
C108
V1_8_EN
C107
DCS_TX_EN GSM_TX_EN
RTCALARM
ICHRG
VBAT
C105 C106
INTRQ PWR_KEEP RST
SIMCLK SIMRST SIMDATA
KEYBL2
C103
C110
R106
C112
U102
R105
C111
C114
C119
VCLOCK
C113
C115
VCCD_2_9
VRF_2_9
VCCA_2_8 VSYN_2_9 VPAC_2_9
C104
3 2 1
SIM100
10 9 8 7 G G G G 4 4 5 5 6 6
C116
C109
VRTC_1_5
3 2 1
NEG
POS
2
1 M100
R101
Flow Chart of Troubleshooting
Flow Chart of Troubleshooting
VRF_2_9
R401
13MHZ_BB
R400
C400
R402
C401
R434
4
R404
C407
CLK26M_RF
3
OUT VCC
1 2 GND VCON
CLK13M_MC CLK13M_WM
TCX400
AFC
CLK13M_TR
C408
C409
VCCD_1_6
V1_8_EN
VBAT
VCCD_1_8
U103
1 L101
2 3
C136
C138
C139
FB2
SW2
EN2
PGND2
EN1
16 15
R120
14
4 VDD NPOR2 13 5 12 SGND NPOR1 11 6 SCL PGND1 7 10 SW1 SDA 8 9 VIN1 FB1
L100
C133
VIN2
R122 R123
C135
11-3
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
VCLOCK
L401 C412 U403
C414
26M_REF_CLK
1 NC
VCC
2A
NC 5 Y4
3 GND
C415
6
R407 C416
8 U404 VCC 1 7 _PR CK 2 6 _CLR D 3 5 Q _Q GND 4
13MHZ_BB
11-4
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
① ② ① ③
④
④
②
11-5
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
11-1-2. Initial Initial Failure Yes
The pin #C12 of U101 = 1.8V and
① No
Check the U101 (if it has some problem, it is to be replaced.)
the pin #J12 of U101 = 2.8V ?
Yes
① Is the pin #K9 of U101
No
Check the U101 (if it has some problem, it is to be replaced.)
"Low → High" ? Yes
There is 32.768kHz wave
No
②
forms at the C216 and
Check the UCP201
C217
Yes
③ Is the pin #14 & #15 of
No Check the U103, R120
U103 "High"? Yes
④ The voltage is "High" at
No Check the U101
the C110,C115,C116
Yes No LCD display is O.K?
Check the LCD part
Yes No Sound is O.K?
Check the Audio part
Yes END
11-6
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
VCCD_1_6
VCCD_1_8
VRTC_1_5
C200
CLK13M_TR TR_RST
A(0:25)
D(0) D(1) D(2) D(3) D(4) D(5) D(6) D(7) D(8) D(9) D(10) D(11) D(12) D(13) D(14) D(15)
B7 C8 D8 A6 C6 C5 D7 E7 C4 C2 A3 B3 B1 D6 D5 D3 E8 F8 E6 D2 E4 E3 F5 F4 F3 F2 A8 E9 F9 G10 G11 F11 E11 G12 D11 E12 C12 A12 F12 D12 E13 D13 D14 B14 E14 H14 A14 C15 G14 J14 D15 C16 F15 B17 H16 A17
CP_WEN CP_OEN CHG_DET FLASH_RESET ROM1_CS ROM2_CS RAM1_CS RAM2_CS MV_CS
F18 F17 R11 T11 M12 M11 M10 M9 M8 L8 L7 K8 J 12 H12 H11 H10 H9 H8 G9 G8 A 18 A2 V13 V7 N18 M2 H18 G2 B 13 B8 W18 W8 U12 U5 U1 T18 P1 L 16 L4 F1 D18 D9 C14 C1 B 16 B 12 B6 B4 G18 W12 G15 W14 R12
UCP201
TDO TDI TCK CKO_IACK IOBIT1_PIO06 IOBIT0_PIO05 SPFS1_PIO15 SPTXD1_I2SD_PIO16 SPRXD1_PIO17 SPCLK1_PIO18 INT0 IO RWN D_D15 D_D14 D_D13 D_D12 D_D11 D_D10 D_D9 D_D8 D_D7 D_D6 D_D5 D_D4 D_D3 D_D2 D_D1 D_D0 D_A8 D_A7 D_A6 D_A5 D_A4 D_A3 D_A2 D_A1 D_A0 TEST3 TEST2 TEST1 CPTSTSTOP_CKO ATDO_PWM2 ATDI_RTS1 ATCK_CTS1 ATMS_PIO45 PIO31_IRQ6 PIO00_IRQ5 IRQ4 IRQ3 IRQ2 IRQ1 PIO47 PIO34 PIO33
T12 V14 U14 N12 N11 V12 R220 N15 N16 M17 M18 T15 W6 V6 P11 N10 N9 N8 P9 P8 R9 T9 T8 U8 V8 R8 T7 R7 T6 U6 R6 N6 V4 T5 U4 V3 W3 W2 V1 V16 T14 U15 T17 T13 L5 M4 K12 P12 P16 P18 P17 M19 M16 J16 R14 U18
DSP_TMS DSP_TDO DSP_TDI DSP_TCK
PCM_SYNC PCM_TXD PCM_RXD PCM_CLK DSP_INT DSP_IO DSP_RWN
DSP_DB(0:15) DSP_DB(15) DSP_DB(14) DSP_DB(13) DSP_DB(12) DSP_DB(11) DSP_DB(10) DSP_DB(9) DSP_DB(8) DSP_DB(7) DSP_DB(6) DSP_DB(5) DSP_DB(4) DSP_DB(3) DSP_DB(2) DSP_DB(1) DSP_DB(0) DSP_AB(8) DSP_AB(7) DSP_AB(6) DSP_AB(5) DSP_AB(4) DSP_AB(3) DSP_AB(2) DSP_AB(1) DSP_AB(0)
DSP_AB(0:8)
CP_TDO CP_TDI CP_TCK CP_TMS WM_SDIN WM_CS MV_INT FLIP_SNS JACK_INT INTRQ WM_SCLK USB_CON CF
P4 T2 P5 B 19 C19 C18 D17 E16 F16 E17 R3 R4 U2 T3 P3 P2 N4 N2 M3 M1 M6 N5 R16 R17 K7 L6 J7 J6 J5 J4 J8 H6 H4 H1 H3 G6 G4 H2 J 15 J 13 K 13 L 12 L 13 L 15 L 14 M14 N14 H19 F19 H17 G16 P15 P19 G5 V17 V19 U16 U19 W17 R13
LOWER_BYTE UPPER_BYTE
A_A0 A_A1 A_A2 A_A3 A_A4 A_A5 A_A6 A_A7 A_A8 A_A9 A_A10 A_A11 A_A12 A_A13 A_A14 A_A15 A_A16 A_A17 A_A18 A_A19 A_A20 A_A21 A_A22 A_A23 A_A24 PIO35_A_A25_BOOTSEL A_D0 A_D1 A_D2 A_D3 A_D4 A_D5 A_D6 A_D7 A_D8 A_D9 A_D10 A_D11 A_D12 A_D13 A_D14 A_D15 A_WEN A_OEN PIO30_WAITN FLASHRSTN A_CS0N A_CS1N A_CS2N A_CS3N A_CS4N A_CS5N A_CS6N A_CS7N A_BE0N A_BE1N
SIMCL K SIMIO PIO14_SIMRST PIO07_USB _SUSP PIO09_USB _VPI PIO11_USB _VMI PIO12_USB _VPO PIO13_USB _VMO PIO36_USB _OEN PIO37_USB _DA TA SPCL K 0 SPRXD0 SPTXD0_I2SD SPFS0 RIO_PIO01 DSR0_PIO02 DTR0_PIO03 RTS0_PIO04 TX0 RX0_IRQ28 CTS0_PIO29 DCD0_PIO44 PIO41_IRDA TX PIO42_IRDA RX TX1 RX1_IRQ28 K EYBRD0 K EYBRD1 K EYBRD2 K EYBRD3 K EYBRD4 K EYBRD5 K EYBRD6 K EYBRD7 K EYBRD8 K EYBRD9 K EYBRD10 K EYBRD11_PSW1_B UF PIO38_MCI_CLK PIO08_MCI_CMD PIO21_MCI_DAT0 PIO22_MCI_DAT1 PIO23_MCI_DAT2 PIO24_MCI_DAT3 PIO39_MCI_CMD_EN PIO40_MCI_DAT_EN PIO43_MCI_DAT0_EN X1RTC X2RTC RTCAL A RMN OSC32OUT PIO19_PWRK EEP PIO20_SYSCLK REQ PWM1_PIO46 PIO10 PIO25 PIO26 PIO27 PIO28 PIO32
D(0:15)
A(0) A(1) A(2) A(3) A(4) A(5) A(6) A(7) A(8) A(9) A(10) A(11) A(12) A(13) A(14) A(15) A(16) A(17) A(18) A(19) A(20) A(21) A(22) A(23) A(24) A(25)
VSSA _U VDDA _U VSSA _D VDDA _D VSS18 VSS17 VSS16 VSS15 VSS14 VSS13 VSS12 VSS11 VSS10 VSS9 VSS8 VSS7 VSS6 VSS5 VSS4 VSS3 VSS2 VSS1 VDD_CORE8 VDD_CORE7 VDD_CORE6 VDD_CORE5 VDD_CORE4 VDD_CORE3 VDD_CORE2 VDD_CORE1 VDD_IO_1P8_18 VDD_IO_1P8_17 VDD_IO_1P8_16 VDD_IO_1P8_15 VDD_IO_1P8_14 VDD_IO_1P8_13 VDD_IO_1P8_12 VDD_IO_1P8_11 VDD_IO_1P8_10 VDD_IO_1P8_9 VDD_IO_1P8_8 VDD_IO_1P8_7 VDD_IO_1P8_6 VDD_IO_1P8_5 VDD_IO_1P8_4 VDD_IO_1P8_3 VDD_IO_1P8_2 VDD_IO_1P8_1 VRTC CK I RESTN TMS TRSTN
NC2 2 NC1 1
R203
SIMCLK SIMDATA SIMRST AS4 EAR_SWITCH AS2 CODEC_PDN
USB_SUSP USB_DET CAM_IC_RESET USB_VPO USB_VMO USB_OEN USB_DATA
CARD_DETECT AMP_EN BL_CONT XOENAQ PWR_KEEP CLK32K RTCALARM
UP_SCLK UP_SDO UP_SDI UP_CS CHG_EN BT_EN T_FLASH_ON DEBUG_RTS DEBUG_TXD DEBUG_RXD DEBUG_CTS
OSC200
1
MAIN_EL_EN MOT_EN EL_IC_EN SDS_TXD SDS_RXD KEY_COL(0:4)
PSW1_BUF KEY_ROW(0:5)
C219 MCI_DAT0_EN MCI_DAT_EN MCI_CMD_EN
KEY_COL(0) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4)
MCI_DAT0 MCI_CMD MCI_CLK
KEY_ROW(0) KEY_ROW(1) KEY_ROW(2) KEY_ROW(3) KEY_ROW(4) KEY_ROW(5)
11-7
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
2 C220
Flow Chart of Troubleshooting
① ④
③
②
11-8
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
11-1-3. Sim Part "Insert SIM is displayed on the LCD Yes
No
Check the SIM connector's (SIM100) connection to SIM card
① Resolder or change SIM100
Yes
② Check the voltage at pin#1 of SIM100 >= 2.8V ?
No
Check the U101
Yes
③ No
Is there any signals pin#2,#3,#4 of ?
Check the UCP201
Yes
Check the SIM Card
END
①
11-9
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
11-1-4. Microphone Part Microphone does not work Yes Is the assembled status of microphone O.K?
No Reassembled the microphone
Yes Check the reference voltage on mic path
①
Yes
C111 ≒ 2.8V ?
No
Resolder or change R500,R501,R502,R505,R514,R517, C502,C505
Yes
② No Check U101
Is microphone ok? Yes END
11-10
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
R500
MICOUTP
R501
C502
MICINP C503
MAIN_MIC_P MAIN_MIC_N
MICINN R502
MICOUTN
C505 R504
R505
C508
C509
VCCA_2_8
R514
AUXOUTP
R516
R518
R517
C514
R519
AUXINP C515
C516
R520
R521 AUXINN R524
R523
C519
AUXOUTN
EAR_MIC_P EAR_MIC_N
①
11-11
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
C518
Flow Chart of Troubleshooting
11-1-5. Speaker Part_1(MP3, SPEAKER PHONE) There is no sound from the Speaker
No
Is the terminal of Speaker O.K ?
Replace the Speaker
Yes
① No
Are there any signals at the L500, L501
Check U501
Yes
MP3
No
What is the type of sound from the Speaker
Is there any signals at the pin#12 and pin#13 of UCD503 ?
Is there any signals at C506, C512 ?
Yes
② Check UCD503
SPEAKER PHONE
No
Yes
③ The pin #5, #7 of U500 is "High"
No
No
Yes
The pin #5, #7 of U500 is "High"
Yes
④ Check UCP201
END
11-12
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Check U101
Flow Chart of Troubleshooting
VBAT
C500
L500
3 4
VDD
VDD
VDD
GND
VIM
U501
C510
VSS 10
L501
VIP
VOP 9
EN 5
AMP_EN
12
6
7
AMP_OUT_P
VDD
2
R512
VDD
R503
C512
C504
VSS 11
VSS
C506
AMP_OUT_N
13
14
VOM
VSS
AMP_IN_P AMP_IN_N
15 VDD
16
17 18 NC 19 NC 1 VREF
8
R515 R546
R547
C513
R513
VBAT
C517
VBAT
L504
C501
U500
1 AOUTAP
NO2 10
VCC
2 NO1
R511
COM2 9
4 NC1
AMP_OUT_N
C551
AMP_OUT_P
IN2 7
5 IN1
GND 6 GND 11
AOUTAN SPK_N
NC2 8
3 COM1
SPK_P
R508
C550
AS2
R522
11-13
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
VCCD_1_8 R525 C520 R527
AOUTAN
C522
AOUTAP
WM_CS WM_SDIN WM_SCLK
1 MCLK
25 MONOIN-
R543
NC3
R544
NC2
UCD503
3 DBVDD
VMID
4 DGND C534
VREF
5 BCLK
AGND
6 DACDAT
PCM_SYNC
R532
R531
C537
9
20
C529
C532
C530
19 18
10
11
12
14
ROUT2
L OU T 1
13
H P GN D
R OU T 1
OU T 3
8 CLKOUT
22 21
AVDD P L L GN D
7 DACLRC
PCM_CLK PCM_TXD
23
15
HPVDD
17
L OU T 2
C533
VDAC_3_1
24
HPDETECT
2 DCVDD
MONOOUT
CLK13M_WM
MONOIN+
NC4
26
27
L INEINL
28
L INEINR
CSB
29 MODE
30 SDIN
GND
NC5
31
SCL K
38
GND
37
32
34 33
GND
GND
35 36
16
C536
R533
AMP_IN_N AMP_IN_P MP3_L MP3_R
11-14
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C531
Flow Chart of Troubleshooting
①
②
③
④
11-15
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
11-1-6. Speaker Part_2(RECEIVER) There is no sound from the Speaker
Is the terminal of Speaker O.K ?
No Replace the Speaker
Yes
① Are there any signals at the PIN#3, #9 of U500
No Check U500
Yes
② The pin #5, #7 of U500 is "Low"
No Check UCP201
Yes
③ Are there any signals at the PIN#2, #10 of U500
④
No Check U101
Yes Check UCP201
END
11-16
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Flow Chart of Troubleshooting
①
11-17
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Flow Chart of Troubleshooting
11-1-7. Charging Part Abnormal charging part
The pin #1 of U108 is VEXT 뵃 5V?
No
Check IF501
①
Yes
The pin #6 of U108 is "LOW"?
No
Check
②
UCP201
Yes
Charging Current is 350mA~650mA?
No
Check U108
③
Yes
Check The Battery
END
11-18
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Flow Chart of Troubleshooting
①
③
11-19
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Flow Chart of Troubleshooting
VBAT
USB_5V
VEXT_5V
VCCD_1_8
R536
EAR_MIC_P EAR_MIC_N EAR_R EAR_GND EAR_L EAR_SWITCH JACK_INT TTY_DETECT SDS_TXD SDS_RXD
R537
IFC501 1 2 3 4 5 6 7 8 9 10 11 12
R538 R539
4
V505 C542 ZD502
C547
8 3
2
1
7
3
8
C541
V500
C540
ZD501
ZD504
4
ZD500 2
1
7
V501 V502 V503 V504
5
6
5
6
R541
JIG_ON_IF USB_DPLS USB_DMNS
VBAT
VEXT_5V
U108
BATT 8
2 VL
ACOK 7
3 GND
EN 6
4 ISET
CHG 5
GND
ICHRG
1 IN
CHG_EN
9 C122 C124 C137
C123
R109
R110
11-20
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13 14 15 16 17 18 19 20 21 22 23 24
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 NC NC NC NC
NC NC NC NC
25 26 27 28
Flow Chart of Troubleshooting
11-2. RF 11-2-1. GSM850/EGSM RX
① NORMAL CONDITION catch the channel?
No
CHECK ANT401, R405 contact?
Yes
DUF400 Check Pin1 ≥ -65dBm ?
No
② C421, RFS400 resolder or change
Yes
DUF400 Check Pin10, 11 ≥ -65dBm ?
No
③ DUF400 resolder or change
Yes
U405 Check Pin6, 7 ≥ -65dBm ?
No
④ C431, C436, L406 resolder or change
Yes
U405 Check Pin1, 31, 48 : 2.9V ?
No
⑤ U101 pin A13, B10, C112, C114 resolder or change
Yes
⑥ U405 Check Pin35 : 26Mhz? Vp-p : 950mV?
No
TCX400 resolder or change
Yes U405 Check Pin25, 26, 27, 28 Vp-p : 120mV?
⑧
No
⑦ U405 resolder or change
Yes U101 CHECK!!
11-21
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Flow Chart of Troubleshooting
①
① ③
②
②
⑦ ⑤
⑧ ④
⑥
11-22
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Flow Chart of Troubleshooting
11-2-2. DCS RX
NORMAL CONDITION catch the channel?
No
① CHECK ANT401, R405contact?
Yes
DUF400 Check Pin1 ≥ -65dBm ?
No
② C421, RFS400 resolder or change
Yes
DUF400 Check Pin12, 13 ≥ -65dBm ?
No
③ DUF400 resolder or change
Yes
U405 Check Pin4, 5 ≥ -65dBm ?
No
④ C429, C430, L405 resolder or change
Yes
U405 Pin1, 31, 48 : 2.9V ?
No
⑤ U101 pin A13, B10, C113, C115 resolder or change
Yes
⑥ U405 Check Pin35 : 26Mhz? Vp-p : 950mV?
No
TCX400 resolder or change
Yes U405 Check Pin25, 26, 27, 28 Vp-p : 120mV?
⑧
No
⑦ U405 resolder or change
Yes U101 CHECK!!
11-23
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Flow Chart of Troubleshooting
⑦ ⑧
⑤
④ ⑥
11-24
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Flow Chart of Troubleshooting
11-2-3. PCS RX
NORMAL CONDITION catch the channel?
No
① CHECK ANT401, R405contact?
Yes
DUF400 Check Pin1 ≥ -65dBm ?
No
② C421, RFS400 resolder or change
Yes
DUF400 Check Pin14, 15 ≥ -65dBm ?
No
③ DUF400 resolder or change
Yes
U405 Check Pin2, 3 ≥ -65dBm ?
No
④ C427, C428, L404 resolder or change
Yes
U405 Pin1, 31, 48 : 2.9V ?
No
⑤ U101 pin A13, B10, C113, C115 resolder or change
Yes
⑥ U405 Check Pin35 : 26Mhz? Vp-p : 950mV?
No
TCX400 resolder or change
Yes U405 Check Pin25, 26, 27, 28 Vp-p : 120mV?
⑧
No
⑦ U405 resolder or change
Yes U101 CHECK!!
11-25
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Flow Chart of Troubleshooting
11-2-4. GSM850/EGSM TX No
PAM406 pin 13 : about 32dBm?
DUF400 pin 8 : 2.6V ?
① U101 check & change
Yes
Yes
②
No
C421,RFS400 R405,ANT401 check & change
No
PAM406 pin13: about 32dBm? Yes
③
DUF400 check & change No
PAM406 pin16, 17: 3.7V?
BATTERY check & change
Yes
④ No
PAM406 pin 6 : 2.9V ?
U405 pin21 check
Yes No
PAM406 pin7 about 5dBm ? Yes No
PAM406 pin 2,3 : 3V ? Yes
⑤
PAM406 check & change
No
① U101 check
U405 pin16,41,31,29 : 2.9V ? Yes
⑦ U101 pin A13, B10, C112, C114 check or resolder
U405 pin35 : 26MHz ? Vp-p : 950mV ?
No
⑥ TCX400 check or resolder
Yes No
① U101 check or resolder
U405 pin25,26,27,28 Vp-p=1V ?
⑧
Yes
U405 check or resolder
11-26
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
⑤ ④ ⑧
⑥
11-27
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
11-2-5. DCS/PCS TX No
U404 pin 13 : about 30dBm?
DUF400 pin 3 : 2.6V ?
① U101 check & change
Yes
Yes
②
No
C421,RFS400 R405,ANT401 check & change
No
PAM406 pin19: about 30dBm? Yes
③
DUF400 check & change No
PAM406 pin16, 17: 3.7V?
BATTERY check & change
Yes
④ No
PAM406 pin 6 : 2.9V ?
U405 pin21 check
Yes No
PAM406 pin1 about 5dBm ? Yes No
PAM406 pin 2 : 0V? pin 3 : 3V? Yes
⑤
PAM406 check & change
No
① U101 check
U405 pin16,41,31,29 : 2.9V ? Yes
⑦ U101 pin A13, B10, C112, C114 check or resolder
⑥ U405 pin35 : 26MHz ? Vp-p : 950mV ?
No
TCX400 check or resolder
Yes No
① U101 check or resolder
U405 pin25,26,27,28 Vp-p=1V ?
⑧
Yes
U405 check or resolder
11-28
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
This Document can not be used without Samsung's authorization
SAMSUNG Proprietary-Contents may change without notice
C440
R413
C441
CLK26M_RF
SERCLK
SERDAT
26M_REF_CLK
DEBUG_RTS DEBUG_CTS DEBUG_TXD DEBUG_RXD
R435 R436
14
24
23
19
12
5
11
18
21
2
17
VSYN_2_9
SERLE
8
26
C443
VSYN_2_9
PCM_IN
PIO_7_UART_RX2
9
13
C426
15
10
6
7
4
3
25
1
20
TXON_B5
GSM_PAM_IN
DCS_PAM_IN
TRXQN
TRXQP
TRXIN
TRXIP
22
16
C448
PIO_4_UART_TX2
PIO_5_UART_RTS2
PIO_6_UART_CTS2
GND
GND
GND
GND
PIO_3
PIO_2
GND
VDD_UART
PIO_0
PIO_1
PCM_OUT
PCM_SYNC
UART_TX
VDD_1.8V
VDD_REG
UART_RX
UART_RTS
ANT
PCM_CLK
U401
UART_CTS
RESETB
R418
C449
R432
R428
VRF_2_9
C418
R431
R427
R417
R410
R409
R408
C417
PCM_CLK PCM_TXD PCM_RXD PCM_SYNC
32 VCCBB
CLK
R433
C453
C459
C457
VPAC_2_9
22
23
24
QOUTB/QINB
QOUT/QIN
IOUTB/IINB
IOUT/IIN
VCCIFSYN
CPIFSYN
R429
25
26
27
28
29
30
31
SDATA
34 VCXOOUT1 33
21 18
19
44
C423
20
U405
43
42
41
40
39
C420
C419
38
VCCVCXO
35 VCXOB
36
37
VSYN_2_9
VCXOOUT2
R403
LE PMDETO
C406
FL OCK VCCTX2
PMB W
16
46
C450
C422
14
LDO_CONT
BIASDAC
C458
DMIXINB
DMIXIN
VCCTX1
GSMLNAIB
GSMLNAI
DCSLNAIB
DCSLNAI
13
12
11
10
9
8
7
6
5
4
PCSLNAIB 3
PCSLNAI 2
52 G 53 NC 54 NC 1 VCCLNA
48 49 50 51
R430
R423
C452
C451
VRF_2_9
C410
U402
NC 5
VAPC
6
TXON_B5
R421
C455
C442
VRF_2_9
C436
C431
AFC
L406
L405
1 7 3 5 6 16 17
PIN_XCS PIN_GSM VREG VRAMP TX_ON VBAT VBAT
13 19 12 20 2 15
PAM406 POUT_GSM POUT_XCS COUPLEROUT_GSM COUPLEROUT_XCS BAND VLDO
C456
VBAT
8 U404 VCC 7 1 _PR CK 2 6 _CLR D 5 3 _Q Q GND 4
R407
Y4
NC 5
3 GND
2 A
6
VCC
U403
1 NC
C447
L401
VCLOCK
TCX400
C446
C408
C414
L404
C415
PA_COU_OUT
C454
VPAC_2_9
C430
C429
C428
C427
26M_REF_CLK
VBT_1_8
C411
C405
VCLOCK
DCS_PAM_IN GSM_PAM_IN
R412
2 GND 3 VINVOUT 4
1 STBY NC 5
R411
C425
VBAT
GND
6
1 STBY
VOUT 4
U400
2 GND OUT VCC
3 VIN
4 3
VBA T
C404
R406
47
15
VRF_2_9
17
45
C424
VRF_2_9
BT_EN
XOENA
CA PIB
GND
VBT_1_8
CPRFSYN
TXVCOG
L 408
CA PQB TXOUTG
3
VCCRFSYN
TXVCOGB
L 409
C435
VCCRFVCO
TXON
VCCRFL O TXOUTD
C A PI
RA MPDA C
C A PQ VCCTXVCO
G G G
VCCMIX
A MDETO
2
C444 470PF
1
C445
R437 0
G G G G G G G G NC NC NC NC
11-29 8 10 11 21 22 23 24 25 4 9 14 18
A M_CONT
1 2 GND VCON
AN400
C416
C412
L412
L411
13MHZ_BB
C407
13MHZ_BB
TX_BAND_SEL
C409
R401
VRF_2_9
L410
R404
C439
C401
R426
R424
L407
DUF400 GSM850/EGSM-TX
R425
C438
1
R422
R419
22 21 20 19 18 16 9 6 4 2
47PF
C421
CLK26M_RF
CLK13M_WM
CLK13M_MC
CLK13M_TR
12 13 3 VC1 VC2 8 VC3 17 DCS_RX1 DCS_RX2
ANT
G G G G G G G G G G
10 GSM850/EGSM-RX1 11 GSM850/EGSM-RX2 14 PCS_RX1 15 PCS_RX2 5 DCS/PCSTX
7
C400
R402 R434
R400
R420
47PF
47PF
PA_COU_OUT
L403
L402
R405
DCS_TX_EN GSM_TX_EN RX_SEL
C413
ANT
4
3
2
1
G
C
A
G
RFS400
ANT402 1 1 2 2 3 3 4 4
ANT401 1 1 2 2 3 3 4 4
Flow Chart of Troubleshooting
12. PCB Diagrams
ANT_J
Q1 0 0
ZD502
ANT401
ANT402
IFC501
U502
ZD302
U402
TP201 TP301
U501
SW301
RFS400
U202
DUF400
U400
U102
M100
G1
V503 V504ZD504
V502 V501
AN400
TP302
U504
TP303
SW302
U500
CD200
BTC502
U107
G2 WENRSTTDITCKTDOTMS
TP_GND
12-1
ZD305
SIM100
D504
G3
U401
UCD503
OSC200 F302 F303 F301 F304
CN300
HDC301
12-2 U204 U206
U203
ZD201
U300
UME200
U304
UCP201
U205
U301
ZD303
U405
U403
U100
ZD500
V505 ZD501
V500
Q101
ZD304
U108
ZD 3 0 1
ZD306 GND_J
SDS_TXD _J
USB_ DPLS_J
SDS_ RXD_J
USB_ DMNS_J
JIG_ ON_J
US B_5V_J
VBAT_J
PCB Diagrams
SOC302
U404
PAM406
U101 TCX400
ZD203 ZD202 ZD204
OSC301 U103
U303
13. Block Diagrams 13-1. RF Solution Block Diagram
13-1
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Block Diagrams
13-2. Base Band Solution Block Diagram
13-2
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
14. Reference data 14-1. Reference Abbreviate AAC: Advanced Audio Coding. AVC : Advanced Video Coding. BER : Bit Error Rate BPSK: Binary Phase Shift Keying CA : Conditional Access CDM : Code Division Multiplexing C/I : Carrier to Interference DMB : Digital Multimedia Broadcasting EN : European Standard ES : Elementary Stream ETSI: European Telecommunications Standards Institute MPEG: Moving Picture Experts Group PN : Pseudo-random Noise PS : Pilot Symbol QPSK: Quadrature Phase Shift Keying RS : Reed-Solomon SI : Service Information TDM : Time Division Multiplexing TS : Transport Stream
14-1
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
