GSM TELEPHONE SGH-C210
CONTENTS
GSM TELEPHONE 1.
Specification
2.
Circuit Description
3.
Exploded Views and Parts List
4.
Electrical Parts List
5.
Block Diagrams
6.
PCB Diagrams
7.
Flow Chart of Troubleshooting
1. Specification 1-1. GSM General Specification EG SM 9 0 0 Pha s e 2
D CS 1 8 0 0 Pha s e 1
PC S 1 9 0 0 Ph a s e 1
F r eq . B a n d [M Hz ] Up l in k / Do w n li n k
8 8 0 ~9 1 5 9 2 5 ~9 6 0
1 7 1 0 ~1 7 8 5 1 8 0 5 ~1 8 8 0
1850~1910 1930~1960
A RF C N r a n g e
0 ~1 2 4 & 9 7 5 ~ 1 0 2 3
5 1 2 ~8 8 5
512~810
T x /R x s p ac in g
4 5 MH z
9 5 MH z
8 0 M Hz
Mo d . B i t r at e/ Bi t Pe r i o d
2 7 0 .8 3 3 k b p s 3 .6 9 2 u s
2 7 0 .8 3 3 k b p s 3 .6 9 2 u s
2 7 0 .8 3 3 k b p s 3 .6 9 2 u s
Ti me Sl o t P er io d / F r am e P er i o d
5 7 6 .9 u s 4 . 6 1 5 ms
5 7 6 .9 u s 4 . 6 1 5 ms
5 7 6 .9 u s 4 .6 1 5 m s
Mo d u l a ti o n
0 . 3 GMS K
0 . 3 GMS K
0 .3 GM SK
M S P o we r
3 3 d B m~5 d B m
3 0 d B m~0 d B m
3 0 d B m~ 0 d B m
Po w er C l as s
5 p cl ~ 1 9 p c l
0pcl ~ 15pcl
0pcl ~ 15pcl
Se n si t iv i t y
- 1 0 2 d Bm
- 1 0 0 d Bm
-100dBm
TDM A M u x
8
8
8
C el l Ra d iu s
35Km
2Km
2 Km
O p er a ti n g T em p er a tu r e
- 2 0 °C ~ +5 0 °C
1-1
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2. Circuit Description 2-1. SGH-C210 RF Circuit Description 2-1-1. RX PART — ASM(F101) → Switching Tx, Rx path for GSM900, DCS1800 and PCS1900 by logic controlling. — ASM Control Logic Truth Table VC1
VC2
VC3
EGSM TX
H
L
L
DCS/PCS TX
L
H
L
PCS_RX
L
L
H
— Saw FILTER To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band. - GSM FILTER (F100) → For filtering the frequency band between 925 and 960 MHz. - DCS FILTER (F100) → For filtering the frequency band between 1805 and 1880 MHz - PCS FILTER (F102) → For filtering the frequency band between 1930 and 1990 MHz. — Crystal (X101) To generate the 26MHz reference clock to drive the logic and RF. After additional process, the reference clock applies to the U801 Rx IQ demodulator and Tx IQ modulator. The oscillator for RX IQ demodulator and Tx modulator are controlled by serial data to select channel and use fast lock mode for GPRS high class operation. — Si4210 (U102) The receive section integrates four differential-input low noise amplifiers LNAs supporting the GSM850, EGSM900, DCS1800 and PCS1900 bands. The LNA inputs are matched to the 150 ohm balanced-output SAW filters through externa LC matching network. A quadrature Image-reject mixer downconverts the RF signal to a 200 KHz intermediate frequency(IF). The mixer output is amplified with an analog programmable gain amplifier(PGA) that is controlled with the AGAIN. The quadrature IF ? ? is digitized with high resolution analog-to-digital converts (ADC). The ADC output is downconverted to baseband with a digital quadrature LO signal. Digital decimation and FIR filters perform digital filtering and remove ADC quantization noise, blockers and reference interferers. After filtering, the digital output is scaled with a digital PGA, which is controlled with the DGAIN. DACs drive a differential I and Q analog signal onto the BIP, BIN, BQP and BQN pins to interface to standard analog-input baseband ICs.
2-1
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Circuit Description
2-1-2. TX PART Baseband IQ signal fed into offset PLL, this function is included inside of U801 chip. The transmit section of U801 consist of an I/Q baseband upconverter, an offset phase-locked loop (OPLL) and two 50 ohm output buffers that can drive an external Power Amplifier(PA). Si4210 chip generates modulator signal which power level is about 1.5dBm and fed into Power Amplifier(U900). The PA output power and power ramping are well controlled by Auto Power Control circuit. We use offset PLL below.
200kHz offset 30 kHz bandwidth
400kHz offset 30 kHz bandwidth
Modulation Spectrum
600kHz ~ 1.8MHz offset 30 kHz bandwidth
GSM
-35dBc
DCS
-35dBc
PCS
-35dBc
GSM
-66dBc
DCS
-65dBc
PCS
-66dBc
GSM
-75dBc
DCS
-68dBc
PCS
-75dBc
2-2. Baseband Circuit description of SGH-C210 2-2-1. CSP2200B1 — Power Management Seven low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal system performance and long battery life. A programmable LDO provides support for 1.8V, 3.0V SIMs, while a selfresetting, electronically fused switch supplies power to external accessories. Ancillary support functions, such as two LED drivers and two call-alert drivers, aid in reducing both board area and system complexity. A four-wire serial interface unit(SIU) provides access to control and configuration registers. This interface gives a microprocessor full control of the CSP2200B1 and enables system designers to maximize both standby and talk times. Error reporting is provided via an interrupt signal and status register. Supervisory functions. including a reset generator, an input voltage monitor, and a thermal monitor, support reliable system design. These functions work together to ensure proper system behavior during start-up or in the event of a fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature). — Battery Charge Management A battery charge management block, incorporating an internal PMOS switch, and an 8-bit ADC, provides fast, efficient charging of single-cell Li-Ion battery. Used in conjunction with a current-limited voltage source, this block safely conditions near-dead cells and provides the option of having fast-charge and top-off controlled internally or by the system's microprocessor.
2-2
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Circuit Description
— Backlight LED Driver The backlight LED driver is a low-side, programmable current source designed to control the brightness of the keyboard illumination.
LED1_DRV is controlled via LED1_[0:2] and can be programmed to sink from 15mA to 60mA in 7.5mA
steps. LED2_DRV is controlled via LED2_[0:2] and can be programmed to sink from 5mA to 40mA in 5mA steps. Both LED drivers are capable of sinking their maximum output current at a worst-case maximum output voltage of 0.6V. For efficient use, the LEDs is connected between the battery and the LED_DRV output. — Vibrator Motor Driver The vibrator motor driver is a independent voltage regulator to drive a small dc motor that silently alerts the user of an incoming call. The driver is a 3.3V constant source while sinking up to 140mA and controlled by enable signal of main chip. For efficient use and safety, the vibrator motor should be connected between the regulator output and the ground.
2-2-2. Connector — JTAG Connector Trident has two JTAG ports which are for ARM core and DSP core(DSP16000). So this system has two port connector for these ports. Pins' initials for ARM core are 'CP_' and pins' initials for DSP core are 'DSP_'. CP_TDI and DSP_TDI signal are used for input of data. CP_TDO and DSP_TDO signals are used for the output of the data. CP_TCK and DSP_TCK signals are used for clock because JTAG communication is a synchronous. CP_TMS and DSP_TMS signals are test mode signals. The difference between these is the RESET_INT signal which is for ARM core RESET.
— Keypad connector This is consisted of key interface pins in the trident, KEY_ROW[0~4] and KEY_COL[0~4]. These signals compose the matrix. Result of matrix informs the key status to key interface in the trident. Some pins are connected to varistor for ESD protection. And power on/off key is seperated from the matrix. So power on/off signal is connected with CSP2200 to enable CSP2200. Nine key LED use the +VBATT supply voltage. These are connected to BACKLIGHT signal in the CSP2200. This signal enables LEDs with current control.
— EMI Filtering This system uses the EMI Filter to reduce noise from LCD part. Some control signals are connected to LCD without EMI filtering.
2-3
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Circuit Description
2-2-3. IF connetor It is 24-pin connector, and separated into two parts. One is a power supply part for main system. And the other is designed to use SDS, DEBUG, DLC-DETECT, JIG_ON, VEXT, VTEST, VF, and GND. They connected to power supply IC, microprocessor and signal processor IC.
2-2-4. Audio AOUTAP, AOUTAN from CSP2200 is connected to the speaker via analog switch. AOUTBP and AOUTBN are connected to the ear-mic speaker via ear-jack. MICIN and MICOUT are connected to the main MIC. And AUXIN and AUXOUT are connected to the Ear-mic. YMU762MA3 is a LSI for portable telephone that is capable of playing high quality music by utilizing FM synthesizer and ADPCM decorder that are included in this device. As a synthesis, YMU762MA3 is equipped 16 voices with different tones. Since the device is capable of simultaneously generating up to synchronous with the play of the FM synthesizer, various sampled voices can be used as sound effects. Since the play data of YMU762MA3 are interpreted at anytime through FIFO, the length of the data(playing period) is not limited, so the device can flexibly support application such as incoming call melody music distribution service. The hardware sequencer built in this device allows playing of the complex music without giving excessive load to the CPU of the portable telephones. Moreover, the registers of the FM synthesizer can be operated directly for real time sound generation, allowing, for example, utilization of various sound effects when using the game software installed in the portable telephone. YMU762 includes a speaker amplifier with high ripple removal rate whose maximum output is 550mW (SPVDD=3.6V). The device is also equipped with conventional function including a vibartor and a circuit for controlling LEDs synchornous with music. For the headphone, it is provided with a stereophonic output terminal. For the purpose of enabling YMU762MA3 to demonstrate its full capabilities, Yamaha purpose to use "SMAF:Synthetic music Mobile Application Format" as a data distribution format that is compatible with multimedia. Since the SMAF takes a structure that sets importance on the synchronization between sound and images, various contents can be written into it including incoming call melody with words that can be used for training karaoke, and commercial channel that combines texts, images and sounds, and others. The hardware sequencer of YMU762MA3 directly interprets and plays blocks relevant to synthesis (playing music and reproducing ADPCM with FM synthesizer) that are included in data distributed in SMAF.
2-4
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Circuit Description
2-2-5. Memory This system uses SHARP's memory, LRS18B0. It is consisted of 256M bits flash memory and 64M bits SCRAM. It has 16 bit data line, D[0~15] which is connected to trident, LCD or CSP2200. It has 23 bit address lines, A[1~23]. They are also connected. CP_CSROMEN signal, chip select signal in the trident, enable flash memories. They use supply voltages, VCCD and VCC_1.8A. During wrting process, CP_WEN is low and it enables writing process to flash memory and SCRAM. During reading process, CP_OEN is low and it output information which is located at the address from the trident in the flash memory or SCRAM to data lines. Each chip select signals in the trident select flash memory or SCRAM. Reading or writing procedure is processed after CP_WEN or CP_OEN is enabled. Memories use FLASH_RESET, which is buffered signal of RESET from CSP2200, for ESD protection. A[0] signal enables lower byte of SCRAM and UPPER_BYTE signal enables higher byte of SCRAM.
2-2-6. Trident Trident is consisted of ARM core and DSP core. It has 20K*16bits RAM 144K*16bits ROM in the DSP. It has 4K*32bits ROM and 2K*32bits RAM in the ARM core. DSP is consisted of timer, one bit input/output unit(BIO), JTAG, EMI and HDS(Hardware Development System). ARM core is consisted of EMI, PIC(Programmable Interrupt Controller), reset/power/clock unit, DMA controller, TIC(Test Interface Controller), peripheral bridge, PPI, SSI(Synchronous Serial Interface), ACCs(Asynchronous communications controllers), timer, ADC, RTC(Real-Time Clock) and keyboard interface. DSP_AB[0~8], address lines of DSP core and DSP_DB[0~15], data lines of DSP core are connected to CSP2200. A[0~20], address lines of ARM core and D[0~15], data lines of ARM core are connected to memory, LCD and YMU762. ICP(Interprocessor Communication Port) controls the communication between ARM core and DSP core. CSROMEN, CSRAMEN and CS1N to CS4N in the ARM core are connected to each memory. WEN and OEN control the process of memory. External IRQ(Interrupt ReQuest) signals from each units, such as, YMU, Ear-jack, Ear-mic and CSP1093, need the compatible process. Some PPI pins has many special functions. CP_KB[0~9] receive the status from key FPCB and are used for the communications using data link cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR). And UP_CS/SCLK/SDI, control signals for CSP2200 are outputted through PPI pins. It has signal port for charging(CHG_DET), SIM_RESET and FLIP_SNS with which we knows open.closed status of folder. It has JTAG control pins(TDI/TDO/TCK) for ARM core and DSP core. It recieves 13MHz clock in CKI pin from external TCXO and receives 32.768KHz clock from X1RTC. ADC(Analog to Digital Convertor) part receives the status of temperature, battery type and battery voltage. And control signals(DSP_INT, DSP_IO and DSP_RWN) for DSP core are used. It enables main LCD with DSP IP pins.
2-5
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Circuit Description
2-2-7. CSP2200 CSP2200 is integrated the timing and control functions for GSM 2+ mobile application with the ADC and DAC functions, and power management block. The CSP2200 interfaces to the trident, via a 16-bit parallel interface. It serves as the interface that connects a DSP to the RF circuitry in a GSM 2+ mobile telephone. DSP can load 148 bits of burst data into CSP2200’ s internal register, and program CSP2200’ s event timing and control register with the exact time to send the burst. When the timing portion of the event timing and control register matches the internal quarter-bit counter and internal frame counter, the 148 bits in the internal register are GMSK modulated according to GSM 2+ standards. The resulting phase information is translated into I and Q differential output voltages that can be connected directly to an RF modulator at the TXOP and TXON pins. The DSP is notified when the transmission is completed. For receiving baseband data, a DSP can program CSP2200’ s event timing and control register with the exact time to start receiving I and Q samples through TXIP and TXIN pins. When that time is reached, the control portion of the event timing and control register will start the baseband receive section converting I and Q sample pairs. The samples are stored in a double-buffered register until the register contains 32 sample pairs. CSP2200 then notifies the DSP which has sample time to read the information out before the next 32 sample pairs are stored. The voice band ADC converter issues an interrupt to the DSP whenever it finishes converting a 16-bit PCM word. The DSP then reads the new input sample and simultaneously loads the voice band output DAC converter with a new PCM output word. The voice band output can be connected directly to a speaker via AOUTAN and AOUTAP pins and be connected to a Ear-mic speaker via AOUTBN and AOUTBP pins. There are 7 LDOs which are power sources of microprocessor, LCD, etc. These 7 LDOs output are programmable.
2-6
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3. Exploded View and Parts List 3-1. Exploded View
QFR01
QKP01
QSP01 QMO01
QLC01
QMP01
QME01 QMI01
QAN01
QRE01 QRF01 QCR31
QBA01
3-1
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Exploded view and Part List
3-2. Parts List Location
Description
NO.
SEC CODE
QFR01
FRONT COVER
GH75-06802A
QKP01
KEYPAD
GH75-06998A
QSP01
SPEAKER
3001-001760
QMO01
MOTOR DC
GH31-00163A
QMP01
PBA MAIN
GH92-02142A
QLC01
LCD
GH07-00701A
QME01
UNIT METAL DOME
GH59-02090A
QMI01
MICROPHONE ASSY
GH30-00186A
QAN01
INTENNA
GH42-00552A
QRE01
REAR COVER
GH75-06804A
QRF01
TAPE PC RF
GH74-14175A
QCR31
SCREW
6001-001795
QBA01
BATTERY
GH43-01817A
3-2
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Remark
Exploded view and Part List
Description
SEC CODE
BAG PE;LDPE,T0.05,W80,L180,TRP,-,-
6902-000634
ADAPTOR-TAD;TAD137ESE,SGH-P100,-,110
GH44-00482A
LABEL(P)-WATER SOAK;SCH-X110,NORGE,1
GH68-02026A
MANUAL-SFC;SGH-S200,SAMSUNG,RUSSIAN,
GH68-04336A
LABEL(R)-MAIN( SER);SGH-C210,SER,POL
GH68-06983B
MANUAL-USE;SGH-C210,SER,RUSSIAN,ROMA
GH68-07137A
CUSHION-CASE(1-2);SGH-C210,PULP,T0.8
GH69-02937A
MPR-ESD TAPE;SGH-C200,3M 851,7X5,-,-
GH74-08853A
MPR-BOHO VINYL M/WIN;SGH-C200,STA EL
GH74-09824B
MPR-MAIN WINDOW BOHO;SGH-C200,ST 555
GH74-11636A
3-3
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Exploded view and Part List
3-3. Test Jig (GH80-00865A)
3-3-1. RF Test Cable (GH39-00283A)
3-3-2. Test Cable (GH39-00127A)
3-3-3. Serial Cable
3-3-4. Power Supply Cable
3-3-5. DATA CABLE (GH39-00143B)
3-3-6. TA (GH44-00184A)
3-4
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4. Electrical Parts List SEC Code
Design LOC
Description
0403-001387
ZD700
DIODE-ZENER
0403-001427
ZD703
DIODE-ZENER
0406-001083
ZD701,ZD702
DIODE-TVS
0406-001190
ZD401
DIODE-TVS
0406-001194
ZD601
DIODE-TVS
0406-001201
ZD501,ZD502
DIODE-TVS
0407-001002
D501
DIODE-ARRAY
0501-000225
Q400
TR-SMALL SIGNAL
0504-000168
Q300
TR-DIGITAL
0601-002020
LED601,LED602,LED603
LED
0601-002020
LED604,LED605,LED606
LED
0601-002020
LED607,LED608,LED609
LED
0601-002020
LED610
LED
0801-000796
U701
IC
1001-001294
U502
IC
1108-000010
U601
IC
1201-002260
U101
IC
1203-002782
U505
IC
1203-003109
U301
IC
1203-003304
U300
IC
1203-003674
U705
IC
1204-002161
U501
IC
1205-002683
U102
IC
1404-001221
TH200
THERMISTOR
1405-001082
V405,V410,V411,V601
VARISTOR
1405-001082
V602,V603,V604,V605
VARISTOR
1405-001082
V606,V607,V608,V609
VARISTOR
1405-001082
V610,V611,V613,V702
VARISTOR
1405-001082
V703,V704,V705,V706
VARISTOR
1405-001093
V701
VARISTOR
1405-001108
V501,V502,V503,V504
VARISTOR
1405-001108
V612
VARISTOR
2007-000140
R207,R417,R420,R704
R-CHIP
2007-000140
R712,R713,R714,R715
R-CHIP
2007-000140
R716,R717,R718,R719
R-CHIP
2007-000140
R720,R721,R724,R726
R-CHIP
2007-000140
R727
R-CHIP
2007-000142
R406
R-CHIP
2007-000145
R422
R-CHIP 4-1
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Electrical Parts List
SEC Code
Design LOC
Description
2007-000146
R502
R-CHIP
2007-000148
R112,R402
R-CHIP
2007-000153
R722
R-CHIP
2007-000157
R201,R204,R223,R309
R-CHIP
2007-000162
R208,R211,R501,R725
R-CHIP
2007-000167
R306
R-CHIP
2007-000171
C131,R101,R104,R105
R-CHIP
2007-000171
R107,R213,R214,R216
R-CHIP
2007-000171
R217,R219,R220,R301
R-CHIP
2007-000171
R305,R408,R409,R414
R-CHIP
2007-000171
R418,R419,R500,R612
R-CHIP
2007-000171
R700,R701,R702,R703
R-CHIP
2007-000171
R723
R-CHIP
2007-000172
R222,R304,R611
R-CHIP
2007-000173
R412,R415
R-CHIP
2007-000174
R601,R602,R603,R604
R-CHIP
2007-000174
R605,R606,R607,R608
R-CHIP
2007-000174
R609,R610
R-CHIP
2007-000566
R707,R708,R709,R710
R-CHIP
2007-000566
R711
R-CHIP
2007-001298
R103
R-CHIP
2007-001308
R113
R-CHIP
2007-001313
R102
R-CHIP
2007-001317
R407
R-CHIP
2007-001319
R303,R504
R-CHIP
2007-001320
R405,R411
R-CHIP
2007-001325
R506
R-CHIP
2007-001333
R421
R-CHIP
2007-002797
R108
R-CHIP
2007-003001
R705
R-CHIP
2007-003112
R503,R505
R-CHIP
2007-007134
R410,R416
R-CHIP
2007-007142
R206,R310,R401,R403
R-CHIP
2007-007142
R413
R-CHIP
2007-007308
R210,R212
R-CHIP
2007-007480
R205
R-CHIP
2007-007489
R400,R404
R-CHIP
2007-007538
R218
R-CHIP
2007-008263
R311
R-CHIP 4-2
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Electrical Parts List
SEC Code
Design LOC
Description
2203-000233
C118,C310,C325,C411
C-CERAMIC,CHIP
2203-000233
C601,C603,C701
C-CERAMIC,CHIP
2203-000254
C134,C201,C202,C203
C-CERAMIC,CHIP
2203-000254
C204,C208,C210,C211
C-CERAMIC,CHIP
2203-000254
C212,C213,C215,C301
C-CERAMIC,CHIP
2203-000254
C319,C605
C-CERAMIC,CHIP
2203-000278
C119,C120
C-CERAMIC,CHIP
2203-000330
C220,C221
C-CERAMIC,CHIP
2203-000386
C127
C-CERAMIC,CHIP
2203-000425
C406
C-CERAMIC,CHIP
2203-000438
C104,C115,C132,C514
C-CERAMIC,CHIP
2203-000438
C700
C-CERAMIC,CHIP
2203-000530
C113
C-CERAMIC,CHIP
2203-000585
C510
C-CERAMIC,CHIP
2203-000628
C405
C-CERAMIC,CHIP
2203-000679
C207,C419
C-CERAMIC,CHIP
2203-000696
C124,C142
C-CERAMIC,CHIP
2203-000812
C305,C306,C307,C401
C-CERAMIC,CHIP
2203-000812
C402,C409,C416
C-CERAMIC,CHIP
2203-000854
C117,C706
C-CERAMIC,CHIP
2203-000995
C105,C116,C404
C-CERAMIC,CHIP
2203-001017
C141
C-CERAMIC,CHIP
2203-001072
C302,C417,C418
C-CERAMIC,CHIP
2203-001405
C209
C-CERAMIC,CHIP
2203-001412
C129
C-CERAMIC,CHIP
2203-001432
C114
C-CERAMIC,CHIP
2203-001598
C309,C318
C-CERAMIC,CHIP
2203-002668
C107,C111
C-CERAMIC,CHIP
2203-002677
C138,C140
C-CERAMIC,CHIP
2203-002687
C504
C-CERAMIC,CHIP
2203-005061
C206,C308,C320,C501
C-CERAMIC,CHIP
2203-005061
C506,C509,C511,C515
C-CERAMIC,CHIP
2203-005061
C602,C604
C-CERAMIC,CHIP
2203-005065
C321,C500
C-CERAMIC,CHIP
2203-005234
C121,C122
C-CERAMIC,CHIP
2203-005393
C103
C-CERAMIC,CHIP
2203-005450
C139
C-CERAMIC,CHIP
2203-005482
C137,C143,C144,C303
C-CERAMIC,CHIP
2203-005496
C205,C214,C403,C407
C-CERAMIC,CHIP 4-3
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Electrical Parts List
SEC Code
Design LOC
Description
2203-005496
C413,C507
C-CERAMIC,CHIP
2203-006053
C312,C313,C314,C315
C-CERAMIC,CHIP
2203-006053
C316
C-CERAMIC,CHIP
2203-006090
C110
C-CERAMIC,CHIP
2203-006093
C304,C503
C-CERAMIC,CHIP
2203-006190
C513
C-CERAMIC,CHIP
2203-006208
C512
C-CERAMIC,CHIP
2203-006257
C327
C-CERAMIC,CHIP
2203-006348
C703
C-CERAMIC,CHIP
2203-006438
C218
C-CERAMIC,CHIP
2203-006562
C704
C-CERAMIC,CHIP
2404-001105
C412,C414,C502
C-TA,CHIP
2404-001134
C109
C-TA,CHIP
2404-001240
C311
C-TA,CHIP
2404-001268
C324,C326,C505,C705
C-TA,CHIP
2404-001305
C410
C-TA,CHIP
2503-001041
C708,C709
C-NETWORK
2503-001053
C710,C711,C712,C713
C-NETWORK
2503-001053
C714
C-NETWORK
2703-002170
L108
INDUCTOR-SMD
2703-002198
L102
INDUCTOR-SMD
2703-002199
L106
INDUCTOR-SMD
2703-002202
L401,L402
INDUCTOR-SMD
2703-002203
L109
INDUCTOR-SMD
2703-002205
L103,L112
INDUCTOR-SMD
2703-002269
L113
INDUCTOR-SMD
2703-002339
L701
INDUCTOR-SMD
2703-002367
L101
INDUCTOR-SMD
2703-002544
L105,L111
INDUCTOR-SMD
2703-002558
L107
INDUCTOR-SMD
2801-003856
X201
CRYSTAL-UNIT
2801-004426
X101
CRYSTAL-UNIT
2904-001480
F102
FILTER-SAW
2904-001523
F100
FILTER-SAW
3301-001659
L702
CORE-FERRITE BEAD
3705-001347
CN100
CONNECTOR-COAXIAL
3709-001336
CN300
CONNECTOR-CARD EDGE
3710-001611
CN701
CONNECTOR-SOCKET
3711-005829
CN702
CONNECTOR-HEADER 4-4
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Electrical Parts List
SEC Code
Design LOC
Description
3722-002067
CN401
JACK-PHONE
4302-001130
U303
BATTERY
NEW-IC001
F101
COMP-SMD
4-5
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5. Block Diagrams 5-1. RF Solution Block Diagram
5-1
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Block Diagrams
5-2. Base Band Solution Block Diagram
5-2
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6. PCB Diagrams 6-1. Main PCB Top Diagram
6-1
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PCB Diagrams
6-2. Main PCB Bottom Diagram
6-2
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7. Flow Chart of Troubleshooting 7-1. Power On The set is not ' Power On '
Check the current consumption
No
Current consumption >=100mA
Download again
Yes Check the +VBATT Voltage
No Voltage >= 3.3V
Charge the Battery
Yes Check the pin of U300
No
Check U300 and C315
pin#J12 of U300 >= 2.8V Yes
pin#A13 of U300 = 2.8V No No
Yes
pin#G11 = 1.8V
Check U300 and C316
Yes
Check the clock signal at pin#3 of X101 Freq = 26MHz , Vrms ≥ 300mV
No
Check the clock generation circuit (related to X101)
Yes Check the initial operation
END
7-1
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Flow Chart of Troubleshooting
7-2
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Flow Chart of Troubleshooting
7-2. Initial Initialization Failure Yes
No
The pin#G11 of U300 = 1.8V and the pin#J12 of U300 ≒ 2.825V ?
Check the U300 (If it has some problem, adjust it.)
Yes
No
Is the pin#K9 of U300 "Low -> High"?
Check the U300 (If it has some problem, adjust it.)
Yes
No
32.768kHz wave forms at the C220 and C221
Check the U200
Yes
No The Voltage is "High" at the C114
Check the U300
Yes No Check the LCD Part
LCD display is O.K
Yes No Sound is O.K
Check the Audio Part
Yes END
7-3
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Flow Chart of Troubleshooting
7-4
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Flow Chart of Troubleshooting
7-3. SIM Part "Insert SIM" is displayed on the LCD
Yes
No Are there any Signals at pin#N9, #R10, #P10 of U300?
Check the U200
Yes
No Are there any Signals at pin#K12, #K11, #K14, #J11 of CN300?
Check the U300
Yes
Check the SIM Card
END
7-5
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Flow Chart of Troubleshooting
7-4. Charging Part Abnormal charging operation
No
The pin#17, #18 of CN701 is TA_VEXT ≒ 5V ?
Replace TA or Check CN701
Yes
No Check the U301
The pin#8 of U101 is 3.2~4.2V ?
Yes
The ICHRG = 1.4V(during
No
charging) and ≒ 180mV(full
Solder again or change R310
charging) ?
Yes
END
7-6
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VCCA
VRF
VCCD
R301
VBAT
C301 C303 C302
C304
DSP_IO DSP_RWN FLASH_RESET
DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 AB8 AB7 AB6 AB5 AB4 AB3 AB2 AB1 AB0 I|O RWN RESETN_CSP
E6 C5 F5 E5 A4 G6 B3 A3
OCTL0 OCTL1 OCTL2 OCTL3 OCTL4 OCTL5 OCTL6 OCTL7
B1 A2 C1 C2
SERLE1 SERLE2 SERDA SERCK
VDD5 VDD67 GNDQ GND_PSC1 GND_PSC2 GND_HCUR VDD1 VDD2 VDD3 VDD_IO1 VDD_IO2 VSS1 VSS2 VSS3 VSS4 VDDD GNDD VDDB GNDB VDDV GNDV VDD_OCTL GND_OCTL
DSP_AB(0:8)
D2 D3 E3 E2 F3 F2 F1 F4 G4 G3 H5 J6 J5 K3 K2 K1 K5 K7 M1 M2 N2 N1 L5 P1 K6 L3 L2 R3
C10 B13 E8 B15 K15 F11 J3 M3 N6 N5 J4 G5 K4 R2 P6 N11 M10 A6 F6 L11 P13 C4 B4
DSP_DB(15) DSP_DB(14) DSP_DB(13) DSP_DB(12) DSP_DB(11) DSP_DB(10) DSP_DB(9) DSP_DB(8) DSP_DB(7) DSP_DB(6) DSP_DB(5) DSP_DB(4) DSP_DB(3) DSP_DB(2) DSP_DB(1) DSP_DB(0) DSP_AB(8) DSP_AB(7) DSP_AB(6) DSP_AB(5) DSP_AB(4) DSP_AB(3) DSP_AB(2) DSP_AB(1) DSP_AB(0)
AUX_ADC3 D13 GNDS1 F7 GNDS2 F8 GNDS3 F9 GNDS4 F10 GNDS5 G7 GNDS6 G8 GNDS7 G9 GNDS8 G10 GNDS9 H6 GNDS10 H7 GNDS11 H8 GNDS12 H9 GNDS13 J7 GNDS14 J8 GNDS15 J9 GNDS16 J10 GNDS17 K10 NC5 1 NC6 2
DSP_DB(0:15)
7-7
U300
R304
PCS_RX_EN XOENA TX_BAND_SEL RF_EN TX_EN
SERLE SERDAT SERCLK
VDD34 C11 VDD12 J13 C305 UP_CLK UP_RST UP_IO SIM_IO SIM_RST SIM_CLK
N9 R10 P10 J11 K11 K14
VSIM VRTC LED2_DRV LED1_DRV RING_DRV VIB_DRV VLDO_7 VLDO_6 VL5S_B VL5S_A VLDO_5 VL4S_B VL4S_A VLDO_4 VLDO_3 VLDO_2 VLDO_1 VACC
K12 H11 G12 G13 F13 F15 C12 A14 C9 D10 B10 B11 A12 B12 A13 J12 G11 F14
CSN_PSC SCLK_PSC SDO_PSC SDI_PSC
K8 L8 N7 M7
VEXT VBAT CH_BDRV CH_ISEN CH_RES
E14 E13 E11 F12 D14
ADC_AUX2 ADC_AUX1 VREF CREF RTC_ALMN
D15 E10 A10 E9 H10
C306
C307
C308
C309
SIMCLK SIMRST SIMDATA VRTC
VBAT
VCCB
VCCA
VRF
VCCD
VCC_1.8A
KEY_BL1
C310
R303
TP301
POS DCS_TX_EN GSM_TX_EN
U303
NEG
TP305
UP_CS UP_SCLK UP_SDO UP_SDI
C311 C318
C312
C313
C314
C315
C316
VRTC R305 R306 VREF RTCALARM VCCD
VIB_RNG_EN L9 INTRQL10 PWR_KEEP M9 MODE N10 RESET_O K9 PSW1_BUF L7 PWR_SW1N C15 PWR_SW2 C14
DINTR P3 NC7 P5 MC R6 XOENAQ D1 RTC_CLK N4
DAIDO M6 DAIDIL6 DAIRN P4 DAICK R4 VREGNR14 VREGPM13 VXVCMR13 AUXOUTN L13 AUXOUTP K13 AUXINN L14 AUXINP M15 MICOUTN P15 MICOUTP N15 MICINNM14 MICINPN14 AOUTBN P12 AOUTBP R12 AOUTAN N12 AOUTAP P11
AFC TXPOWER
RXTXQN C6 RXTXQP C7 RXTXIN D6 RXTXIP D7 RAREF1 B6 RAREF2 B5
TXP E7 AFC D9
R308
R309
U301
KEY_COL(2) 1 VL 2
Q300
2 IN
C324
ICHRG
R310
_ACOK 6
4 ISET
_EN 5
PWR_ON JIG_ON
RST
CLK13M_MC
DSP_INT
CLK32K
AUXOUTN AUXOUTP AUXINN AUXINP MICOUTN MICOUTP MICINN MICINP AOUTBN AOUTBP AOUTAN AOUTAP
G GG G 910 11 12
PWR_KEEP R307
BATT 7
3 GND
TP304 CHG_DET
C325
R311
C327
CHG_ON C326
Flow Chart of Troubleshooting
INTRQ
_CHG 8 TP303
KEY_ROW(0) TA_VEXT
C321
VBAT
3
1
RTX_IP RTX_IN RTX_QP RTX_QN
VCCD
C319
C320
TP302
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CN300 6 6 1 1 5 5 22 4 4 3 3 G GG G 78 91 0
Flow Chart of Troubleshooting
7-5. Microphone Part Microphone does not work
Yes No Is the assembled status of microphone O.K?
Reassemble the microphone
Yes
Check the reference voltage on Mic path
No Solder the microphone again or C401 > 2.5V
Replace around Mic Circuit (C403, C407, R407, R411.....)
Yes
No Is microphone ok ?
Check U300
Yes END
7-8
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Flow Chart of Troubleshooting
7-6. Speaker Part There is no sound from Speaker
No Is the terminal of Speaker O.K.?
Replace the Speaker
Yes
The type of sound from the Speaker is Melody
Yes
Are there any signals at the pin#5 and pin#7 of U502? Yes
The pin#4 of U502 is "Low"
No
No
No
Are there any signals at the pin#2 and pin#10 of U502? Yes
Yes
Yes Check U502
No
The pin#4 of U502 is "High"
No
Check U300
Check U502
END
7-9
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VIBRATOR
SPEAKER MOT+
VBAT U505 D501 1 2 3
YMU_VIB_EN
VIN
VOUT
SPEAKER VIB1
5
BYPASS
4
C502
C500 2
C501
2 2 1 1
SPK1N SPK1P
3
GND VEN
VIB2
ZD501
ZD502
1
C503
D(2)
D(3)
D(4)
23
D(5)
24
22
D(6)
25
21
D(7)
20
19
18
17
G
G D2
D3
D4
D5
D6
D7
26 27 28 29 30 31 32
D1
MTR
AOUTAN
34
YMU_VIB_EN
A(0) CP_OEN
R505
D0 /WR
36 16
SPVDD EQ3
U501
/CS
EQ2
A0
EQ1
/RD
HPOUT-R
VBAT
15 14
R500 C504
13 12
R502 C505
C507
C506
R504 11
HPOUT-L/MONO 10
IOVDD
35
CLKI
LED
/IRQ
/RST
4
NC
3
5
PLLC
2
6
VDD
1
7
VSS
GG
SPK_SEL
8
VREF
C508
SPOUT2
V502
YMU_EN
1 2 3
SPK1N
4 5
SPOUT1
VCC NO1 COM1 IN1 NC1
SPVSS
NO2 COM2 IN2 NC2 GND
YMU_SPK1N
33
VCCD D(1)
10
8
6
YMU_SPK1P
VBAT
D(0) V501 CP_WEN R501 U502 R503
AOUTAP
9
SPK1P
7
YMU_SPK1P
9
YMU_SPK1N
GND 11
V503
7-10
CLK13M_YMU
V504
C510
R506
C509 VCCD
C511
T500 YMU_IRQ RST
Flow Chart of Troubleshooting
C513
C514
C512
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C515
Flow Chart of Troubleshooting
7-7. EGSM Reciever CONTINUOUS RX ON RF INPUT : 62CH AMP : -50dBm
YES NORMAL CONDITION catch the channel?
Check soldered status of C103 C133, L109
NO NO
CN100 resolder or change
F101 CHECK pin#9 ≥ -65dBm ?
YES NO F101 CHECK pin#11 ≥ -65dBm ?
F101, C120, L106 resolder or change
YES NO U102 CHECK pin#21,22 ≥ -65dBm ?
C124,C142,L107 resolder or change
YES
NO U102 CHECK pin#31 : 26MHz ? Vp-p : 860mV?
UX101 CHECK 26MHz ? Vp-p : 950mV?
NO UX101 CHECK clean 3V?
YES YES
CHECK U300 UX101 Resolder or Change?
7-11
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Flow Chart of Troubleshooting
7-8. EGSM transmitter
F101pin#7 : about 2~3 dBm?
NO
CONTINUS TX ON CONDITION
NO F101 pin#4 : 3 V?
U300 check & change
YES
TX POWER DAC:500 CODE APPLIED CH:62 RBW : 100KHz VBW : 100KHz SPAN : 10MHz REF LEV. : 10dBm ATT. : 20dB
YES NO CON100, C105 check&change
C107 ≒ 4~5dBm?
YES
U101 check & change
NO BATTERY, U102 check & change
C103 : 3.7 V? YES
NO
NO R102 check & change
Between R102 & U101 : 1.2V?
YES
YES
NO R102 : ≒ -5dBm ?
YES
U101 change
U102 change or resolder
7-12
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U300 check &
Flow Chart of Troubleshooting
7-9. DCS Receiver CONTINUOUS RX ON RF INPUT : 698CH AMP : -50dBm
YES NORMAL CONDITION catch the channel?
Check soldered status of C103 C133, L109
NO NO CN100 resolder or change
F101 CHECK pin#9 ≥ -65dBm ?
YES NO F101 CHECK pin#3 ≥ -65dBm ?
F101, C139, L112 resolder or change
YES NO U102 CHECK pin#17,18 ≥ -65dBm ?
C138, C140, L111 resolder or change
YES
NO F102 CHECK pin#31 : 26MHz ? Vp-p : 860mV?
NO X101 CHECK 26MHz ? Vp-p : 950mV?
X101 CHECK clean 3V?
YES YES
X101 Resolder or Change? CHECK U300
7-13
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Flow Chart of Troubleshooting
7-10. DCS transmitter
CONTINUOUS TX ON CONDITION
NO
NO
F101 pin#5 : about 2~3 dBm?
U300 check & change
F101 pin#10 : 3 V? YES
YES
CN100, C105 check&change
NO
CH : 698CH(DCS),660CH(PCS) TX POWER CODE: 350 CODE APPLIED RBW : 100KHz VBW : 100KHz SPAN : 10MHz REF LEV. : 10dBm ATT. : 20dB
L101: ≒ 4~5dBm?
YES
U101 check & change
NO BATTERY, U102 check & change
C103 : 3.7 V?
YES
Between R102 & U102 : 1.2V?
NO
R102 check & change
NO
YES
YES
NO R101: ≒ -5dBm ?
YES
U101 change or resolder U102 change or resolder
7-14
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U300 check
Flow Chart of Troubleshooting
7-11. PCS Receiver CONTINUOUS RX ON RF INPUT : 698CH AMP : -50dBm
YES Check soldered status of C103 C133, L109
NORMAL CONDITION catch the channel?
NO NO CN100 resolder or change
F101 CHECK pin#9 ≥ -65dBm ?
YES NO F101 CHECK pin#1 ≥ -65dBm ?
F101, C141, L108 resolder or change
YES NO U102 CHECK pin#19,20 ≥ -65dBm ?
C122, C121, L105 resolder or change
YES
NO U102 CHECK pin#31 : 26MHz ? Vp-p : 860mV?
NO X101 CHECK 26MHz ? Vp-p : 950mV?
X101 CHECK clean 3V?
YES YES
X101 Resolder or Change? CHECK U300
7-15
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Flow Chart of Troubleshooting
7-12. PCS transmitter
CONTINUOUS TX ON CONDITION
NO
NO
F101 pin#5 : about 2~3 dBm?
F101 pin#10 : 3 V?
U300 check & change
YES YES
CN100, C105 check&change
CH : 698CH(DCS), 660CH(PCS) TX POWER CODE: 350 CODE APPLIED RBW : 100KHz VBW : 100KHz SPAN : 10MHz REF LEV. : 10dBm ATT. : 20dB
L101: ≒ 4~5dBm?
NO
YES
U101 check & change
NO BATTERY, U102 check & change
C109 : 3.7 V?
YES
Between R102 & U101 : 1.2V?
NO
R102 check & change
NO U300 check
YES
YES
NO R101: ≒ -5dBm ?
YES
U101 change or resolder U102 change or resolder
7-16
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Flow Chart of Troubleshooting
7-17
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TP101
TP102
C102 G
G 6
G 5
C 4
A 3
G 2
1
TX_BAND_SEL
C104 C132 VBAT
18
17
G VCC2 G 1 DCS/PCS_IN 16 DCS/PCS_OUT 2 15 BS G 3 TX_EN 4 5
C110
C109
6
G
VBATT
VCC_OUT
CEXT
G
VRAMP
G
71 GSM_IN 8
C106
L102
13
9 ANT
12 11 C100
0
PCSRX
3
PCS_RX
DCSRX
1
DCS_RX
5
G 9
C111
R102
C112
DCS|PCSTX
C115
R103 GSM_PAM_IN
C136
C116
C134
GSM_TX_EN
VC2 4
DCS_TX_EN
VC3 2
PCS_RX_EN
7
EGSM_RX
11
14 1312 86
C114
VC1 10
EGSM_TX
G G G G G C113
Flow Chart of Troubleshooting
C107
TP103
L109
C105
F101
TXPOWER
C135
L113
14
GSM_OUT
VCC2
C103
L101
EGSMRX
7-18
19
TX_EN
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CN100 U101 C101
SAMSUNG Proprietary-Contents may change without notice
R101 DCS_PAM_IN
L110 C137 R104
C117
RF_EN
GSM_PAM_IN
C119
DCS_PAM_IN
C138
C118 9
10
11
12
14
13
15
5
16
(MURATA) 17
RFOH
RFOL
GND
BIN
VDD
6 RTX_IN
_RESET
BIP
_PDN
RTX_IP
VDD
XOUT
7
19
C121 C120
20
(MURATA)
RFIDN
L105
21
U102
3
C122
RFIEP SDIO
22
2
RFIEN _SEN
RFIAP
1 SERCLK
SCLK
23
C124
RFIAN 24
(MURATA)
L107 C142
26
EGSMRX
L106 10 5 3 2 G G G G 4 9 IN 8 OUT 7 OUT 1 IN 6 OUT OUT
GSM C141
DCSRX
DCS L108
F100
XMODE
27
XDIV
28
29
AFC
30
VDD
XTAL2
31
VDD
32
R111
XTAL1
R110
XEN
GND NC NC
35 34 33
R109
L112
RFIDP
BQN
SERLE
PCSRX
1
RFIPN
4
SERDAT
C139 IN
OUT F102
18
BQP
RTX_QN
3
RFIPP
5 RTX_QP
G
C140 VIO
13MHZ_BB
2
G 4 OUT
L111 8
7-19
25 VRF
C143
R105
R107
XOENA
C127
2
CLK13M_TR
R113 AFC
3
R108
13MHZ_BB
R112 X101
C129 C131
4
CLK13M_MC CLK13M_YMU
1 C145
C144
Flow Chart of Troubleshooting
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VRF
VCCD
