Samsung SCH-811 service manual - provinspc2

Hands-Free Kit is designed to be operated in full-duplex mode taking ...... Battery. Check C40. Check Voltage of. C22. (about 4.5V). Check Voltage of. C22.
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CDMA CELLULAR TELEPHONE SCH-811

SERVICE CDMA CELLULAR TELEPHONE

Manual

CONTENTS 1. General Introduction 2. Specification 3. Installation 4. NAM Programming 5. Product Support Tools 6. Troubleshooting 7. Exploded view and its Part List 8. Electrical Parts List 9. PCB diagrams 10. Block & circuit diagrams

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ELECTRONICS

Samsung Electronics Co.,Ltd. GH68-00398A 1999. 3. REV. 1.0

1. General Description The SCH-811 cellular phone functions as both analog cellular phone working in AMPS (Advanced Mobile Phone Service) mode and digital cellular phone working in CDMA (Code Division Multiple Access) mode. CDMA type digital mode applies DSSS (Direct Sequential Spread spectrum) mode which first came to be used in the military. The DSSS reduces channel cross talk and allow to use one frequency channel by multiple users in the same specific area, resulting in increase of channel capacity to about ten times compared to that of analog mode currently used. Soft/Softer Handoff, Hard Handoff, and Dynamic RF Power Control technologies are combined into this phone to reduce the call drop while usage. CDMA digital cellular network consists of MSO (Mobile Switching Office), BSC (Base Station Controller), BTS(Base Station Transmission System), and MS (Mobile Station). MS meets the specifications of the below: E IS-95A : Mobile Station-Base Station Compatibility Standard for Dual-Mode Wideband Spread Spectrum Cellular System E IS-96A : Speech Service Option 1 Standard for Dual-Mode Wideband Spread Spectrum Cellular Systems E IS-98A : Standards for Dual-Mode Wideband Spread Spectrum Cellular Mobile Station E IS-126 : Mobile Station Loopback Service Options Standard SCH-811 is composed of main handset, rapid charger, three batteries (1600 mAh, 1000 mAh, 550mAh), handsfree kit, car adaptor, and travel charger. Hands-Free Kit is designed to be operated in full-duplex mode taking turn-around delay between the phone and the system into account.

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1-1

2. Specification 2-1 General Frequency Range Transmitter Receiver

Digital Mode : 824 ~ 849 MHz : 869 ~ 894 MHz

Analog Mode 824 ~ 849 MHz 869 ~ 894 MHz

Channel Spacing : 1.23 MHz 30kHz Number of Channels : 20 FA 832CHs Duplex Spacing : 45 MHz 45MHz Frequency Stability : ±2.5 ppm (-20ûC ~ +60ûC, -4ûF ~ +140ûF) Operating Temperature : -30ûC~+60ûC (-4ûF ~ +140ûF) Operating Voltage HHP : 3.6V DC (±10%) Hands-free : 13.7V DC (±10%) Size and Weight : 88.0 x 56.5 x 26.7/27.6/31.3 mm including slim battery : 117.3 g including standard battery : 145.2 g including extended battery : 160.5 g Operating Time Digital Mode Standby Time

Talk Time

2-1

: up to 36 hours (with slim battery) : up to 65 hours (with standard battery) : up to 100 hours (with extended battery) : up to 75 min (with slim battery) : up to 150min (with standard battery) : up to 240min (with extended battery)

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2-2 Digital Mode Waveform Quality Time Reference Rx Sensitivity and Dynamic Range Tx Output Power Tx Frequency Deviation Occupied Band Width Tx Conducted Spurious Emission Minimum Tx Power Control Open Loop Power Control Standby Output Power

Colsed Loop Tx Power Control Range

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0.944 or more ±1uS or less -104dBm, FER=0.5% or less -25dBm, FER=0.5% or less 320mW (25dBm) ±300Hz or less 1.32MHz 900KHz : -42dBc / 30KHz below 1.98MHz: -54dBc / 30KHz below below -50dBm -25dBm: -57.0dBm ~ -38.5dBm -65dBm: -17.5dBm ~ + 1.5dBm -104dBm: +18.0dBm ~ +30.0dBm below -61dBm Test1: ±24dB or less Test2: 0mS ~ 2.5mS Test3: ±24dB or more Test4: ±24dB or more Test5: ±24dB or more

2-2

2-3 ANALOG MODE TRANSMITTER RF output power Carrier ON/OFF conditions ÒONÓ Condition ÒOFFÓ Condition Compressor Compression Rate Attack Time Recovery Time Reference Input Preamphasis Maximum Freqency Deviation F3 of G3 Supervisory Audio Tone Signaling Tone Wideband Data Post Deviation Limiter Filter 3.0 ~ 5.9KHz 5.9 ~ 6.1KHz 6.1 ~ 15KHz Over 15KHz

0.6W (+2/-4dB) within ±3dB of specification output (in 2mS) below-60dBm (in 2mS) 2:1 3mS 13.5mS Input level for producing a nominal ±2.9KHz peak freqency deviation of transmitted carrier 6dB/OCT within 0.3 ~ 3KHz ±12KHz ±2KHz (±10%) ±8KHz (±10%) ±8KHz (±10%) above 40 LOG (F/3000) dB above 35 dB above 40 LOG (F/3000) dB above 28 dB

Spectrum Noise Suppression

For all modulation f0+20KHz ~ f0+45KHz

For modulation by voice and SAT f0 +45KHz

For modulation by WBD(without SAT) and ST (with SAT) f0+45KHz ~ f0+60KHz f0+60KHz ~ f0+90KHz f0+90KHz ~ 2f0 Harmonic and conducted Spurious Emissions

2-3

above 26 dB

above 63 +10 LOG (PY) dB

above 45 dB above 65 dB above 63 +10 LOG (PY) dB (where f0=carrier frequency PY=mean output power in watts) below 43 + 10 LOG (PY) dB

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RECEIVER De-Emphasis Expander Expander Rate Attack Time Recovery Time Reference Input Sensitivity

-6dB / OCT within 0.3 ~3KHz 1:2 within 3mS within 13.5mS output level to a 1000Hz tone from a carrier within ±2.9KHz peak frequency deviation 12dB SINAD / -116dBm

Intermodulation Spurious Response Attenuation

avove 65dB

RSSI Range

above 60dB

Protection Against Spurious Response Interference

above 60dB

In Band Conducted Spurious Emission Transmit Band Receive Band Other Band

below -60dBm below -80dBm below -47dBm

Radiated Spurious Emission Frequency Range 25 ~ 70 MHz 70 ~ 130MHz 130 ~ 174 MHz 174 ~ 260 MHz 260 ~ 470 MHz 470 ~ 1GHz

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Maximum Allowable EIRP -45dBm -41dBm -41 ~ -32dBm -32dBm -32 ~ -26dBm -21dBm

2-4

2-4 CDMA Debug Display Information (menu 8) IN IDLE MODE 1

2

3

Sxxxx 4

SIx

T-xx

x Dxxx

Pxxx

-xx

6

CHxxx 8

7 5

IN CONVERSATION MODE

9

10

TEx T-xx Pxxx

REx

11

xx Dxxx

x -xx

3

CHxxxx

1 : Sxxxxx : SID (System ldentification) toggle Nxxxxx : NID (Network Identification) toggle 2 : SIx : Slot cycle index (lowest between the system and the phone will be used) 3 : Handset Status : 0 - Acquisition 1 - Synchronization 2 - Paging (Idle) 3 - Traffic Initialization 4 - Traffic Mode 5 - Exit 4 : T-xx : Tx adjust, Value ranges from +63 ~ -63dB 5 : Dxxx : sector power in dBm 6 : -xx : Ec/Io 7 : Pxxx : PN offset 8 : CHxxxx : channel number 9 : TEx : Tx vocoder rate (8 is full rate, 1 is 1/8th rate) E : EVRC V : 13k or 8k 10 : REx : Rx vocoder rate (8 is full rate, 1 is 1/8th rate) 11 : xx : Walsh code used in traffic channel

2-5

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2-5 FM Debug Display Information (menu 8) 1

4

SIDxxxxx 2

PWRx SATx

3

x RSSIxxx

5

CHxxxx 6

1 : SIDxxxxx : FM Home System ID 2 : PWRx : Power Level 0~7 3 : SATx : Supervisory Audio Tone code (0~3) 4 : x (Using Frequency Band) : A Band or B Band 5 : RSSIxxx : RSSI value 6 : CHxxx : Using Channel

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2-6

3. Installation 3-1 Installing a Battery Pack 1. To attach the battery pack after charging, align it with the phone about 1cm (1/2 inch away from its place so that the two arrows on the phone are seen, the battery charge contacts pointing downward. 2. Slide the battery pack upwards until it clicks firmly into position. The phone is now ready to be turned on. 3. To remove the battery pack, release it by pressing the button on the rear of the phone. 4. Slide the battery pack downward about 1cm (1/2inch and lift it away from the phone.

Press this button to release the battery pack

3-1

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3-2 For Desk Top Use 1. Choose a proper location to install the charger for Desk Top use. 2. Plug the power cord of the charger into an appropriate wall socket. When the power is connected correctly, the lamps turn on briefly. 3. To charge the battery pack, insert the battery pack into the rear slot of the charger. The lamp marked BAT on the front panel of the charger ights up red. 4. If you do not wish to use the phone while charging the battery, insert the phone with the battery pack attached into the front slot of the charger. The lamp marked PHONE on the front panel of the charger lights up red.

SLIM BATTERY PACK

STANDARD BATTERY PACK

EXTENDED BATTERY PACK

Figure 3-1 Charging the Phone and Battery

item

Model Name

Desk Top Rapid Charger

Service Part#

DTC81

Slim Battery Pack

BTI81AB

Standard Battery Pack

BTS81AB

Extended Battery Pack

BTE81AB

GH43-00060A

SPECIFICATIONS USING ÒDTC 81Ó Product

Charging time (hours)

Stand by time (hours) Talking time(min)

Front

Rear

Digital

Digital

2

2

36

75

Standard Battery Pack (Li-ion: 1000mAh)

2.5

4

65

150

Extended Battery Pack (Li-ion: 1600mAh)

3

5

100

240

Slim Battery Pack (Li-ion: 550mAh

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3-2

3-3 For Mobile Mount 3-3-1 Cradle 1. Choose a location where it is easy to reach and does not interfere with the driverÕs safe operation of the car. 2. Separate the two halves of the clamshell by removing the two large slotted screws. See the figure 3-2. 3. Drill holes and mount the lower half of the clamshell by using the screws. 4. Place the cradle onto the remaining half of the clamshell and assemble them by using the screws. 5. Reassemble the two halves of the clamshell together. Adjust the mounting angle and tighten the two slotted screws.

CRADLE

CLAM SHEEL MOUNT UPPER

CELLULAR PHONE

FIXED SCREW HANDS FREE BOX

CLAM SHEEL MOUNT LOWER

CAR

32

32

Figure 3-2 Cradle Installation

3-3-2 Hands-Free Box 1. Drill holes in a proper location for the hands-free box, attach the mounting bracket by using the screws. See the figure 3-3. 2. Install the hands-free box into the bracket.

3-3

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3-3-3 Hands-Free Microphone 1. It is recommended to install the microphone where it is 30-45 cm (12-18inch away from the driver. Choose the location where is least susceptible to interference caused by external noise sources, ie, adjacent windows, radio speakers, etc. Normal place is the sun visor. 2. Once the microphone has been correctly positioned, connect the microphone wire to the MIC jack on the hands-free box.

MOUNTING BRACKET

Figure 3-3 Hands-Free Box 1 Installation

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3-4

3-3-4 Cables 1. Connect the cradle and the hands-free box with the data cable. See the figure 3-4. 2. Connect the antenna cable to the RF jack of the cradle. 3. Connect the power cable as follows: Connect the red wire to the battery (+) terminal, black wire to the vehicle chassis. Then connect the battery (-) terminal to the vehicle chassis. Connect the yellow wire to the switched side of the ignition switch, and then connect the white to the stereo mute wire from your vehicle stereo. 4. Connect the other end of the power cable to the PWR jack of the hands-free box. Notes: It is recommended to connect the power cable directly to the battery to avoid power noise. Make sure the connection, in the vehicle, between the battery (-) terminal and vehicle chassis is made correctly. Make sure the fuse having a proper capacity is used on the power cable. Make sure the cables do not pass over any sharp metal edge that may damage it.

Micro Phone

Yellow(Ignition) White(Stereo Mute) Red(Vehicle Battery) Black(GND)

3-5

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4. NAM Programming NAM features can be programmed as follows: Notes: -If you enter the NAM program mode, each item shows the currently stored data. Go to the next item by pressing OK. -You can modify the data by entering a new data. -If you enter a wrong digit, press CLR to delete the last digit. Press and hold CLR to delete all digits. -To scroll items backwards or forwards, press the VOLUME button on the left side of the phone.

4-1 General Setup LCD Display

Key in

Function

47*869#08#9 1

-selects NAM programming -choose ÔGENERALÕ

ESN E9031F77

Volume ▼

-Electronic Serial Number of the phone is displayed

CAI version 3

Volumet

-Common Air Interface version is displayed

Volume ▼

-Vocoder Rate

Volume ▼

-Station Class Mark displays the power class, transmission, slotted class, dual mode.

NAM program 1:General 2:Setup NAM1 3:Setup NAM2

VOC13K/8K SO_VOICE_08K SCM 01101010 Lock Code 0000

Slot Mode Yes

Slot Index 2 OK -store it. Pref NAM(1~4)... Digital pref

4-digit code OK

Lock code, current ststus is displayed -to change, enter new code. -store it

F or E OK

Slot mode. ÔYesÕ indicates the slot mode. -changes the status. -store it.

0-7

Slot mode index. The higher, the longer sleeping time -to change, enter new one.

F or E OK

Preferred system selection for NAM(1~4). Up to four NAMs are allowed for the phone. This lists one of the four NAMs and allows you to program both the FM and CDMA settings.

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4-1

4-2 Setting Up NAM1 LCD Display

Key in

NAM Program 1:General 2:Setup NAM1 3:Setup NAM2

2

-Choose ÔSetup NAM1.Õ

Setup NAM1 1:Phone # 2:FM 3:CDMA

1

-Choose ÔPhone #Õ

Phone number OK

-directory number -to change, enter new one. -store it.

Phone number OK

-Phone number currently used. -to change, enter new one. -store it.

2

-Choose ÔPhone #Õ

ID number OK

System ID for home, current ststus is displayed. -to change, enter new one. -store it.

Channel number OK

Current 1st paging channel. -to change, enter new one. -store it.

ID number OK

Acquisition system ID 1, current status is displayed. -to change, enter new one. -store it.

ID number OK

Acquisition system ID2, current status is displayed. -to change, enter new one. -store it.

Phone # 1234567890

Mobile ID # 1234567890

Setup NAM1 1:Phone # 2:FM 3:CDMA FM HOME SID 4369

FM 1st Chn 333

FM Acq SID1 4

FM Acq SID2 0

FM LockSID 1 0 Auto Reg

4-2

ID number OK

Function

Lock system ID 1, current status is displayed. -to change, enter new one. -store it. FM Registration, current status is displayed. -changes the status.

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LCD Display Yes

Key in F or E OK

ÔYESÕ to enable, ÔNOÕ to disable. -store it.

F or E OK

Preferred system selection, current status is displayed. -changes the system. ÔYESÕ to enable, ÔNOÕ to disable. -store it.

F or E OK

Current Access Overload Class. -changes the system. -store it.

3

-choose ÔCDMAÕ

number OK

IMSI Moble Country Code, current code is displayed. -to change, enter new one. -store it.

number OK

IMSI Mobile Network Code, current code is displayed. -to change, enter new one. -store it.

F or E OK

Preferred system selection, current system is displayed. -changes the system. -store it.

class number OK

CDMA Access Overload Class, current status is displayed. -to change, enter new one. -store it.

channel number OK

Preferred channel currently used under system A -to change, enter new one. -store it.

channel number OK

Preferred channel currently used under system B -to change, enter new one. -store it.

channel number OK

Second channel currently used under system A -to change, enter new one. -store it.

FM preq... A only

FM ACCOLC 0

Setup NAM1 1:Phone # 2:FM 3:CDMA IMSI_MCC 000

IMSI_MNC 00

CDMA pref.. A only

CDMA ACCOLC 0

Pchn Sys A 779

Pchn Sys B 779

Schn Sys A 738

Function

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4-3

LCD Display Schn Sys B 738

CD Acq SID 1 0

CD lockSID 1 0

CDMA Home SID Yes

CDMA fSID Yes

CDMA fNID Yes

Key in channel number OK

Second channel currently used under system B -to change, enter new one. -store it.

ID number OK

1st Acquisition system ID, current status is displayed. -to change, enter new one. -store it.

ID number OK

1st lock system ID,current status is displayed. -to change, enter new one. -store it.

F or E OK

CDMA Home system ID, current status is displayed -changes the status. -store it.

F or E OK

CDMA foreign SID, current status is displayed. -changes the system. -store it.

F or E OK

CDMA foreign NID, current status is displayed. -changes the system. -store it.

number OK

first SID written in the list, current status is displayed. -to change, enter new one. -store it.

number OK

first NID written in the list, current status is displayed. -to change, enter new one. -store it.

number OK

2nd SID written in the list, current status is displayed. -to change, enter new one. -store it.

number OK

2nd NID written in the list, current status is displayed. -to change, enter new one. -store it.

number OK

3rd SID written in the list, current status is displayed. -to change, enter new one. -store it.

number OK

3rd SID written in the list, current status is displayed. -to change, enter new one. -store it.

SID #1 2222

NID #1 1

SID #2 2222

NID #2 2

SID #3 2222

NID #3 3

4-4

Function

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LCD Display SID #4 2222 NID #4 15

Key in number OK number OK

Setup NAM1 1:Phone # 2:FM 3:CDMA

Function 4th SID written in the list, current status is displayed. -to change, enter new one. -store it. 4th NID written in the list, current status is displayed. -to change, enter new one. -store it. LCD returns to the NAM1 setup mode.

4-3 Setting Up NAM2,3,4 The NAM2,3,4 setup program is the same as Ô4-2 Setting Up NAM1Õ.

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4-5

5. Product Support Tools 5-1 General IMPORTANT INFORMATION Purpose The Product Support Tool (PST) offers you the ability to interface with the SAMSUNG CDMA telephone using a PC. With this tool you can program the phones network system requirements and functionality, swap phone data, and download software upgrades. This document supports UniPST version 1.xx. NOTE: This software must be executed in the Windows95/98 mode.

EQUIPMENT REQUIRED Make sure you have the following equipment setup: 1. Minimum PC configuration: 586 CPU, 16MB RAM, Windows95/98, 5MB of disk space free for software upgrade. 2. PST Software with appropriate cable (DM Cable for SAMSUNG CDMA phone). 3. Serial Port (16550 Serial Interface Card). 4. POWER SUPPLY (3.8V) OR BATTERY

INSTALLATION Software 1.Insert the PST floppy disk into drive (A:\). 2.Create an appropriate directory on the C:\ drive for PST software, Execute Setup.exe file, The installation program creates folder and task bar on the windows95/98 start bar. SAMSUNG CDMA Phone The serial port should be configured to COM1 or COM2. Use the following procedure to connect the phone, cable, and PC . Plug the female end of the DM Cable into the 16550 card. Pull the black rubber connector away from the socket at the base of the phone. Plug the special connector on the cable into the socket at the base of the phone.

5-1

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5-2. PST (Product Support Tool) 5-2-1 Getting Started MAIN MENU SCREEN 1. At the Windows95/98, Double Click ÒUniPst.exeÓ. 2. The Main Menu Screen will be displayed. The Main Menu Screen shows the basic tasks that are available. CAUTION: DO NOT attempt to program phone with a low battery.

PST SETUP UniPst supports SAMSUNG CDMA portable telephone. You can select serial port COM1 or COM2.

5-2-2 Operation Procedure Service Programming The Service Programming screens enable you to set and change the service activation parameters of the phones. These items can be changed individually or as a group via the ÒEdit ItemsÓ Property Sheet of the PST. There are several pages on the Service Programming Property Sheet (See below Figure). Read Data from File Click ÒopenÓ icon to select the name of a file whose extension is ÒmmcÓ. The values will be read from the named file, and will initialize the parameter values seen on the Service programming screen Read Data from Phone Click Read from the Phone icon to upload the current programmable parameters of the phone. The values are read from the phone, so the phone must have the power ON and be properly connected to the PST. NOTE: To actually view the data you need to go to the Edit Items screens. Edit Items Click this icon to edit Number Assignment Module (NAM) items or UI items. There are two types of screens: 1. Parameters associated with a particular Number Assignment Module (NAM) 2. UI items settings Phone Book Click this icon to edit Phone Book. While you edit cell, you can use and < UP , DOWN,LEFT,LIGHT Arrow> and key. If you want to edit phone number or name , you must move rectangle box to cell where you want to edit , Write it down . if key is pressed, the cursor moves to next cell or previous cell.

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5-2

Save Data to File Click this icon to save the current parameters to a file. Once you enter a filename, Click button to write all current parameters to that file. This way the same information can be downloaded into multiple phones. Write to Phone Click this icon to write the selected parameter values to the phone. Writing the selected values to the phone may take up to a minute. If there are dependencies in a field you can make all the changes in the proper fields and download the information all together. If you intend to use this ÒWrite to PhoneÓ feature, it is recommended that you do a ÒRead Data from PhoneÓ first, and then make the changes, so that nothing gets inadvertently overwritten.

NOTE: DO NOT TOUCH THE PHONE WHILE WRITING IS IN PROGRESS. Software Download and Upgrade Screen To begin a software upgrade or download, perform the following steps: 1. From the main menu screen choose DOWNLOAD MODE? Click open icon to choose a BIN file of the new software to be loaded. Choose the appropriate BIN file, then Click (see below figure). 2. Click Download? to begin downloading the file. You will notice various messages and a progress bar that informs the user what percentage of the downloading has already occurred. 3.Click Mode Select box, then Select SERVICE MODE?to return to the Service Mode Screen. NOTE: DO NOT POWER OFF WHILE THE PHONE IS BEING DOWNLOADED!

5-3

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5-3 TEST PROCEDURE 5-3-1 Configuration of Test

Spectrum Analyzer

RF In

HP8924C

RF In/Out

Audio Audio Out In

Directional Coupler

To A-Out Test Jig To A-In

DC Power Supply (+3.93V)

❈ CAUTION : Because there is the loss (0.33V at FM Max Power) of the test jig and Data cable, youÕd better input 3.93V to the DC Power Supply to use 3.6V (Battery normal voltage) at Cellular phone

Items needed to purchase from SAMSUNG ITEMS RF test Cable Test cable DM Cable Test JIG (RF Interface Pack AssÕy)

PARTS # GH39-0002A GH39-30516A GH39-30525A GH80-10502A

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REMARK

Including 1. Power Cable(Black,Red) 2. 9-pin RS232 data Cable

5-4

5-3-2 List of Equipment - DC Power Supply - Test Jig - Test Cable - CDMA Mobile Station Test Set - Spectrum Analyzer(include CDMA Test Mode)

HP8924C, HP83236A, CMD-80, etc HP8596E

TEST JIG

AUDIO SELECT LEFT: AUDIO IN RIGHT: AUDIONOFF

DC POWER INPUT PORT CHANGE VOLTAGE LEVEL BY MODEL (3.8VDC) RED: + BLACK: GND

UP: AUTO POWER ON DOWN: NOT USE AUTO

DB25 CONNECTOR CPMMECT TO DB25 CONNECTOR OF TEST CABLE

A-IN

- DC3.8v +

TO_PC

T E S T

D89 CONNECTOR CONNECT TO IBM PC SERIAL PORT

HHP I/F TEST JIG

P A C K

TO_HP TO A-OUT

TO A-IN

BJ11 CONNECTOR CONNECT TO HP SERIAL PORT

PROBE NOT USED

CONNECT TO AUDIO OUT PORT OF TEST EQUIPMENT (USE BNC CABLE)

CONNECT TO AUDIO IN PORT OF TEST EQUIPMENT (USE BNC CABLE)

TEST CABLE

5-5

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TEST CABLE CONNECTIONS 1

MHC 172

2

RF CABLE (1.4 dB Loss)

3

BNC CONNECTOR (RF)

4

PLUG CONNECT TO SCH-811

5

DATA CABLE

6

Dsub 25PIN CONNECTOR (DATA)

Dsub 25 PIN CONNECTOR PIN DESCRIPTION (TEST CABLE 1, BACK SIDE) DATA DESCRIPTION

Dsub CONN. PIN NO.

DATA DESCRIPTION

Dsub CONN. PIN NO.

V_F

12,21

DP_RX_DATA

8

DGND

2,4,6,13,19

HP_PWR

9

BATT

15,16,22

RI

10

C_F

3,20

CD

11

TX_AUDIO

5

RTS

14

DP_TX_DATA

7

CTS

17

RX_AUDIO

1

DTR

18

15 14

1

17 16

2

3

19 18

4

5

21 20

6

7

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23 22

8

9

25 24

10

11

12

13

5-6

5-4. CONVERSION TABLE OF FREQUENCY vs CHANNEL TYPE

CHANNEL

CONVERSION EQUATION

REMARK

TX

1 ² N² 799

F=0.03 ✕ N + 825.00

FREQUENCY

990 ²N²1023

F=0.03 ✕ (N-1023) + 825.00

N ; CH NUMBER

RX

1 ²N² 799

F=0.03 ✕ N + 870.00

F ; FREQUENCY

FREQUENCY

990 ²N²1023

F=0.03 ✕ (N-1023) + 870.00

Change to Test Mode A. To change the phoneÕs state from Normal Mode to Test Mode, You should enter the following keys. Ò*759#813580Ò B. The command Ò0 1Ó is Suspend. C. To finish the Test Mode, You should enter the command Ò0 2Ó. * Note: Make sure to change to ÒDigital onlyÓ or ÒAnalog onlyÓ mode in NAM1, EST MODE. (Refer to 4. NAM Programming) Channel Selection and Tx Power Output Level Control 1. Digital Mode (CDMA) A. Enter to Test Mode ( * 7 5 9 # 8 1 3 5 8 0 ). B. Ò0 1Ó : Suspend. C. Ò0 9 0 3 6 3 #Ó : Set to Ô0363Õ channel. D. Ò0 7Ó : Carrier On. E. Ò3 4Ó : Spread spectrum to 1.23MHz band width. F. Ò7 1 2 7 5 #Ó : Output RF power level setting. Ò275Ó means AGC level and AGC level range is from 0 to 511. 2. Analog Mode ( FM ) A. Enter to Test Mode ( * 7 5 9 # 8 1 3 5 8 0 ). B. Ò0 1Ó : Suspend. C. Ò4 6Ó : Vocoder initial to Analog mode. D. Ò0 9 0 3 8 3 #Ó : Set to Ô0383Õ channel. E. Ò0 7Ó : Carrier On. F. Ò7 2 2 7 5 #Ó : Output RF power level setting. Ò275Ó means AGC level and AGC level range is from 0 to 511. G. Ò1 0 2Ó : RF Power level control, 2(0~7) means power level . 5-7

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5-5 TEST COMMAND TABLE Command No.

Signal. Name

Description

01(1F,0,0)

T_SUSPEND_I

Terminate the normal mode, enter to the test mode.

02(3F,0,0)

T_RESTART_I

Terminate the test mode, enter to the normal mode.

03(FD,0,0)

T_SAVE_VAL_I

Save value in EEPROM. (Only for Auto test).

04(1D,0,1)

T_GET_MODE_I

Get mode CDMA or FM (Only for Auto test).

05(1C,1,0)

T_SET_MODE_I

Set mode CDMA or FM. (Only for Auto test).

06(1E,0,0)

T_WRITE_NV_I

Write an EEPROM item (one of the NV items)

07(81,0,0)

T_CARRIERON_I

Turn the carrier on.

08(82,0,0)

T_CARRIEROFF_I

Turn the carrier off

09(83,4,0)

T_LOADSYN_I

Set the synthesizer to the channel specified by ch_data.

10(84,1,0)

T_PWRLEVEL_I

Set the RF power level.

11(85,0,0)

T_RXMUTE_I

Mute the receive-audio signal.

12(86,0,0)

T_RXUNMUTE_I

Unmute the receive-audio signal.

13(87,0,0)

T_TXMUTE_I

Mute the transmit-audio signal.

14(88,0,0)

T_TXUNMUTE_I

Unmute the transmit-audio signal.

15(89,1,0)

T_VOC_ESEC_I

Echo canceller ON/OFF

16(8F,0,0)

T_ST_ON_I

Transmit a continuous Signaling Tone(ST).

17(90,0,0)

T_ST_OFF_I

Stop transmit a continuous Signaling Tone.

19(93,0,0)

T_INDEX_DECR_I

Index dn Key.

20(9E,3,0)

T_LNA_GAIN_WR_I

Write LNA gain.

22(91,96,96)

T_SNDNAM_I1)

Display and send NAM information.

23(95,3,4)

T_SNDVERSION_I

Display and return s/w version .

24(9F,7,8)

T_SNDESN_I

Display and return ESN .

25(92,0,0)

T_BACKLIGHT_ON_I

Turn on the backlight

26(93,0,0)

T_BACKLIGHT_OFF_I

Turn off the backlight

27(96,0,0)

T_LAMP_ON_I

Turn on the LAMP

28(97,0,0)

T_LAMP_OFF_I

Turn off the LAMP

29(9A,5,0)

T_REBUILD_I

Rebuild EEPROM

30(9D,16,0)

T_PLINE_I

Display and return production line information.

32(A0,1,0)

T_SAT_ON_I*

Enable the transmission of SAT.

33(A1,0,0)

T_SAT_OFF_I*

Disable the transmission of SAT.

34(A2,0,0)

T_CDATA_I

Transmit continuous 5-word Reverse CTL CH message.

35(A3,3,0)

T_VOLUME_UP_I

Increase value of the last command (Only for autotest)

36(A4,3,0)

T_VOLUME_DOWN_I

Decrease value of the last command (Only for autotest)

38(A6,3,0)

T_VOC_ENC_OFFSET_I

Vocoder ENC offset.

39(A7,3,0)

T_VOC_DEC_OFFSET_I

Vocoder DEC offset.

(OP,AB,RB)

2) 2)

1)

1)

2)

SAMSUNG Proprietary-Contents may change without notice

5-8

Command No.

Signal. Name

Description

40(A8,4,0)

T_VOC_CDMA_UNITY _GAIN_I

Vocoder CDMA unity gain.

41(A9,0,0)

T_VOC_FM_HFRX_UPGAIN_I

Vocoder FM hfrx upgain.

42(AA,1,0)

T_DTMFON_I

Activate dtmf generator with keycode.

43(AB,0,0)

T_DTMFOFF_I

Deactivate DTMF generator.

44(B0,0,0)

T_COMPANDORON_I

Enable the compressor and expandor.

45(B1,0,0)

T_COMPANDOROF_I

Diable the compressor and expandor.

46(B2,0,0)

T_FM_VCLINE_I*

Enter Analog voice channel state.

47(B3,0,0)

T_FM_AUD_GAIN_I

FM audio gain.

48(B4,0,0)

T_VIBRATOR_ON_I

Active A Vibrator.

49(B5,0,0)

T_VIBRATOR_OFF_I

Inactive A Vibrator.

50(B6,0,4)

T_BATT_TYPE_I

Batt type.

51(B7,1,1)

T_BBA_I

BBA supplier.

52(B9,2,2)

T_HW_VERSION_I

HW version.

53(BA,3,0)

T_CARRIER_I

Target Carrier option (Banner).

54(BB,1,0)

T_VOC13K_I

Target Service option (8K/13K).

55(AC,1,0)

T_EXT_AUDIO_I

External Audio Path ON/OFF.

56(AD,0,0)

T_LOOP_BACK_I

Loopback ON.

57(BC,0,0)

T_MIC_ON_I

Mic path on.

58(BD,0,0)

T_MIC_OFF_I

Mic path off.

59(BE,0,0)

T_ALLPATH_I

60(BF,3,0)

T_FM_TX_GAIN_I

(OP,AB,RB)

2)

Set Rx Path, TX Path Unmute to Earpiece. FM Tx Audio Gain Control.

2)3)

61(C0,3,0)

2)3)

T_FM_RX_GAIN_I

FM Rx Audio Gain Control.

62(C1,3,0)

T_DTMF_VOL_TX_I

FM Tx DTMF Gain control.

63(C2,3,0)

T_TX_LIMITER_I

64(C3,3,0)

T_FM_SAT_LEVEL_I

65(C4,3,0)

T_FM_FREQ_SGAIN_I

FM Tx Master Gain Control.

66(C5,3,0)

T_FM_ST_GAIN_I

FM TX ST Gain Control.

67(C6,3,6)

T_READ_BATT_I

Reads low batt. Value in Standby or Talk mode.

68(C8,0,3)

T_VBATT1_I

Set the low battery position in the standby.

69(C9,0,3)

T_VBATT2_I

70(CA,3,0)

T_WRITE_BATT_I

71(D1,3,0)

T_CDMA_TXADJ_I

Change pdm TX AGC in CDMA.

72(D2,3,0)

T_FM_TXADJ_I

Change pdm TX AGC in FM.

73(D3,1,0)

T_SET_PA_R0_I

74(D4,4,0)

T_OFF_PA_R0_I

75(D5,0,3)

T_READ_RSSI_I

Read a RSSI.

77(D7,0,3)

T_READ_TEMP_I

Read Temp.

78(D8,0,3)

T_RXRAS_AUTO_I

Adjust RXRAS from 8924C.

79(D9,1,0)

T_BUZZER_ON_I2)

Buzzer On at DTMF 0 key

80(DA,0,0)

T_BUZZER_OFF_I

Buzzer off

5-9

2)3)

FM Tx Limiter Gain Control.

2)3)

FM Tx SAT level Control.

2)3) 2)3)

2)3)

1)

3)

Set the low battery position in the talking.

3) 3)3) 2)

2) 2)

Write low battery Level Value to NVM.

Set TX power Amp ctrl R0. Off TX power Amp ctrl R0.

3)

SAMSUNG Proprietary-Contents may change without notice

Command No.

Signal. Name

Description

81(E3,0,0)

T_VOC_PCMLPON_I

Play a PCM LOOP BACK.

82(E4,0,0)

T_VOC_PCMLPOFF_I

Play off a PCM LOOP BACK.

85(E7,0,0)

T_SPEAKER_ON_I

Turn on the speaker path.

86(E8,0,0)

T_SPEAKER_OFF_I

Turn off the speaker path.

87(E9,0,0)

T_FM_LOOP_TEST_I

Play a PCM FM loopback.

88(EA,0,0)

T_TRK_ADJ_I3)

FM TRK_LO_ADJ control.

89(EB,0,0)

T_CD_TRK_ADJ_I3)

CDMA TRK_LO_ADJ control.

92(F2,3,0)

T_TXRAS_ADJ_I

TXRAS adj = TX RAS offset array.

93(F3,3,0)

T_RXRAS_ADJ_I

RXRAS adj = RX RAS offset array.

94(F4,4,0)

T_HW_CHANFLAT_T

H/W Channel Flatness.

95(F5,4,0)

T_SW_CHANFLAT_T

S/W Channel Flatness.

96(F6,3,0)

T_CH_FLATNESS_I

Set 22dBm Channel Deviation 10 POINT.

97(F7,3,0)

T_FM_TX_PWR_I

Set FM PWR LEVEL 2~7

(OP,AB,RB)

1) ==> The AB (Input Argument Byte Number) values of these commands are used only in the manual test. In automatic test mode, the AB is regarded as 0. 2) ==> You can assign the value for these commands. If the AB value is assigned without argument, the test is achieved with the value stored in EEPROM. 3) ==> After you get a desired test value by performing these commands, if you want to save the value in EEPROM, use T-SAVE-VAL-I command to store the test value into the corresponding position.

* OP : Operation Command Number AB : Input Argument Byte Number RB : Return Byte Number

SAMSUNG Proprietary-Contents may change without notice

5-10

6. Troubleshooting 6-1 Logic Section 6-1-1 No Power

Press End button

U105 pin 1=VBAT?

No

Check the signal from the battery terminal to U 105 pin 1.

No

Check U105 and its neighboring circuits.

No

Check U106 and its neighboring circuits.

No

Check U107 and its neighboring circuits.

Yes

U106 pin 1 input =3.7V?

Yes

U106 pin 5 output =3.7V?

Yes

U107 pin 5 output =3.7V?

Yes

END

6-1

SAMSUNG Proprietary-Contents may change without notice

6-1-2 Abnormal Initial Operation (Normal +3.3V source)

Press END button

TCXO CLK applied to U401 pin 26?

No

Check TCXO output, R400 and C400. Replace if required.

No

Check U401 and its meighboring circuit. Replace if required.

No

Check U109, MSM and its neighboring circuits.

No

Check ‘H’ level input from J104 pin 17 to U401 pin 79. replace if required.

No

Check Q125 and its neighboring circuit. Replace if required.

No

Check the LCD pins and its neighboring circuit. Replace if required.

Yes

TCXO CLK signal output from U401 pin 29?

Yes

RAM-CS signal output from U109 pin 44?

Yes

CHIPX8 CLK signal output from U401 pin 52?

Yes

Alert LED ON?

Yes

Normal initial display on LCD?

Yes

END

SAMSUNG Proprietary-Contents may change without notice

6-2

6-1-3 Abnormal Backlight Operation

Press and button on the phone

‘H’ level output from U101 L7 to J105 pin 19?

No

Check U101 L7. Replace if required

No

Check FPC. Replace if required

No

Check U139, L201, Q139 and its neighboring circuits. Replace if required

No

Check EL. Replace if required

Yes

‘H’ level input to U139 pin 4,5?

Yes

Normal U139 operation?

Yes

Normal EL?

Yes

EL ON

6-3

SAMSUNG Proprietary-Contents may change without notice

6-1-4 Abnormal Key Data input

Check initial status

Scanning signals output from U101, C5, B4, D5, A5 C6, A5, D6

No

Check U101

No

Replace the key pad assembly

Yes

Check U101 A2, A3, C4, B5, E5

Yes

Check J103

Yes

Normal key data input?

Yes

END

SAMSUNG Proprietary-Contents may change without notice

6-4

6-1-5 Abnormal Key tone

Press and key

Waveform output from U102 pin 14, 15, 16

No

Check U102 pin 14, 15, 16. Replace if required.

No

Check U102, pin 2, 3 and its neighboring circuits. Replace if required.

No

Check U102, R250 and C108, FPC. Replace if required.

No

Check SPK. Replace if required.

Yes

Waveform output from U102 pin 2, 3?

Yes

Waveform applied to SPK(+), (-)?

Yes

normal key tone?

Yes

END

6-5

SAMSUNG Proprietary-Contents may change without notice

6-1-6 Abnormal Alert Tone

Abnormal alert tone

CLK waveform output from U101, N7, P7?

No

Check U101 N7, P7. Replace if required.

No

Check U102 pin 17, and its neighboring circuits. Replace if required

No

Check Q120, Q121, R128. Replace if required.

No

Connect the buzzer correctly.

Yes

CLK waveform output from U102 pin 17?

Yes

CLK waveform applied to Buzz?

Yes

Is the buzzer connection correct?

Yes

Check the buzzer and replace if required

SAMSUNG Proprietary-Contents may change without notice

6-6

6-2 Receiver Section 6-2-1 FM mode

Start FM mode

No

Check FM 12dB SINAD OK?

No

Check LNA in/output OK?

Check Duplexer & LNA power

Gain: +16dB

Yes Yes

Check RF amp in/output OK? Gain: +17dB

Yes Yes

Check mixer in/output OK?

No

Gain(FM): -8dB

Check 1st local & mixer power OK?

No

Check PLL (U306) & VCO output

969.96MHz local: -4~0dBm

VCO_OUTPUT: -10dBm

Yes

No

Check IF filter soldering

Check IF filter in/output OK? Loss: -5dB

Yes Yes No

Check AGC amp in/output OK? Gain: +, -45dB

Check 2nd local & AGC control voltage OK?

No

Check PLL & BBA #80

170.76MHz

Yes

RF Rx FM OK

BBA INPUT: -54dBm

6-7

SAMSUNG Proprietary-Contents may change without notice

6-2-2 CDMA Mode

Start CDMA mode

Normal CDMA SVC & ROAM?

No

Check CDMA RX path

Setup CDMA call OK?

No

Check Transmitter

No

Yes

Measure CDMA FER

Yes

Normal CDMA RF?

SAMSUNG Proprietary-Contents may change without notice

6-8

6-3 Transmitter Section

Check Tx

No

O.K

Check Tx PLL

Check U403 Tx IF level

O.K

CDMA: -20dBm

Check U403 Local Input level

CDMA: -5~3dBm

SPAN 5MHz Tx VCO:260.76MHz IF:130.38MHz

Yes O.K

Check Tx Power level

No

Check U403 Out level

O.K

CDMA: -16~15dBm

6-9

Check U404 RF Out level

O.K

CDMA: 0~1dBm

Check U407 Pout level

CDMA: 24~26dBm

SAMSUNG Proprietary-Contents may change without notice

6-4 Desk-Top Rapid Charger

Plug_in

Check LED state (RED>GRN>YEL)

Check BAT-Contact.

Check Voltage of C3, C2. (about 330V)

Check F1, BD1, U1

Check Battery.

Check component the secondary D30, D20, U22, U23, U24, U25, U26.

Blank of Front.

Check BAT-Contact.

Check Battery.

Check C30

Blank of Rear

Check BAT-Contact.

Check Battery.

Check C40.

Check Voltage of C41.(5V)

Check U25.

LED blink? (Yellow) Check Voltage of C22. (about 4.5V) Check U26. Check Voltage of C22. (about 4.5V)

LED blink? (RED>GRN>YEL)

Check LD1, LD2

Check component the secondary D30, D20, U22, U23, U24, U25, U26.

SAMSUNG Proprietary-Contents may change without notice

6-10

6-5 Hands-Free Kit 1

Start

Ignition Check

Phone Power ON/OFF Check

Charger Circuit

Auto Power ON

Handset Hook ON/OFF Check

Handset Mode

Battery Check

Hands Free Mode

Charging current and voltage check according to battery type

In conversation mode, volume adijustment, mute on/off, calibration check

Full Charging check

Auto power off according to lgnition status

Charging LED Check

Handsfree off with the phone powered off or removed

6-11

SAMSUNG Proprietary-Contents may change without notice

7. Exploded View and its Parts List 7-1 Cellular phone Exploded View

1 2

20

3 21 5 22 4 6

23

24 7

25 26

8 12

9 10

27

29

13 28

11

30

14 15

31 32 16

33

17 49

18 19

34

35

39

36 37 40 38 41 43

42

44 45 46 47 48

SAMSUNG Proprietary-Contents may change without notice

7-1

7-2 Cellular phone Parts List No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 7-2

Description PMO-DECORATION MPR-TAPE DECORATION LABEL(M) LOGO BADGE PCL PMO-FOLDER UPPER SCREW-MACHINE MCT-SHIELD GASKET LCD ASSÕY MPR-SPONGE LCD MPR-TAPE EAR PIECE MPR-TAPE VIBRATIOR NPR-BRACKET FOLDER R PPR-PC SHEET LCD MEC-HINGE ASSY ICT-MAGNET NPR-BRACKET FOLDER L PMO-FOLDER LOWER MPR-TAPE WINDOW LCD PCT-WINDOW LCD PPR-WINDOW BOHO PMO-HINGE DUMMY RMO-REFLECTOR LED PMO-FRONT COVER RMO-KEY PAD LOGIC BOARD RMO-HOLDER MIC RMO-CONNECTOR COVER NPR-SHIELD STRIP(C) NPR-SHIELD STRIP(A) NPR-SHIELD MSM CAN PMO-SHIELD COVER NNPR-SHIELD DUPLEX CA RMO-HOLDER BUZZER PMO-MOBILE CAP NPR-SHIELD TAPE RF NPR-GROUND PLATE PMO-KNOB VOLUME RMO-EAR JACK COVER PMO-REAR COVER NPR-BRACKET ANT ANTENNA SPRING-LOCKER PMO-LOCKER BATT SCREW-MACHINE SCREW-MACHINE LABEL(R) MAIN SLIM BATTERY STANDARD BATTERY EXTENDED BATTERY RF BOARD

SEC code GH72-00264C GH74-10772A GH68-00365C GH72-00285A 601-000876 GH74-00011A GH96-00798A GH74-10774A GH74-00005A GH74-10776A GH71-10726A GH72-10545A GH75-11337A GH70-00009A GH71-10722A GH72-41804A GH74-10775A GH72-00283A GH72-10001A GH72-00067A GH72-41801A GH72-41800A GH73-00080A GH41-00019A GH73-40708A GH73-40704A GH71-00006A GH71-00004A GH71-00008A GH72-41799A GH71-00009A GH73-40735A GH73-40705A GH74-00027A GH71-00010A GH72-41787A GH73-40734A GH72-41806A GH71-10742A GH42-00002A GH61-70054A GH72-00068A 6001-001140 6001-000876 GH68-00368A

GH41-00020A

QÕTY

Remark

1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 1 1 1 3 1 1 1 1 1 1 1 1 4 1 1 1 1 1 1

SAMSUNG Proprietary-Contents may change without notice

7-3 Desk-Top Rapid charger Exploded View

1 2

4

6

3 5

7

8 9 10 11

SAMSUNG Proprietary-Contents may change without notice

7-3

7-4 Desk-Top Rapid charger Parts List No

Description

SEC. CODE

QÕTY

1

Case. upper

1

2

Hook-plate

2

3

SCREW

4

4

Battery housing

1

5

SCREW

1

6

Power cord

1

7

PCB

1

8

Case. Lower

1

9

SCREW

4

10

BUM PON

4

11

Label

1

TYPE

A

B

C

D

SEC. CODE

Remark

A

ISRAEL

B

Brazil

C

China

D

Hong Kong

7-4

Remark

SAMSUNG Proprietary-Contents may change without notice

7-5 Hands-free Kit 1 Exploded View

1

2 3

4

5 6 7

SAMSUNG Proprietary-Contents may change without notice

7-5

7-6 Hands-free Kit 1 Parts List No

Description

SEC. CODE

QÕTY

1

Case. upper

1

2

SCREW 3✕5Y

1

3

PCB

1

4

Case. Lower

1

5

SCREW 3✕12Y

4

6

Sponge

2

7

Label

1

7-6

Remark

SAMSUNG Proprietary-Contents may change without notice

7-7 Speaker Exploded View

6

7

4

3

9 8

5 2 1

SAMSUNG Proprietary-Contents may change without notice

7-7

7-8 Speaker Parts List No

Description

SEC. CODE

QÕTY

1

Case. Front

1

2

Speaker

1

3

Case. Rear

1

4

Bolt

2

5

HEX. NUT

2

6

Hamdle

1

7

Speaker wire

1

8

Screw

4

9

Label

1

7-8

Remark

SAMSUNG Proprietary-Contents may change without notice

7-9 Cradle Exploded View

1 2

4

3

6

5

7

9 8

7 10

11 12

16

13 14 15 17

SAMSUNG Proprietary-Contents may change without notice

7-9

7-10 Cradle Parts List No

Description

SEC. CODE

QÕTY

1

Cover Top

1

2

Holder Socket

1

3

Spring rock

2

4

Locker

1

5

Locker

1

6

Eject-A

1

7

Efect Spring

2

8

Frame

1

9

Eject-B

1

10

Screw

6

11

PCB

1

12

SCREW

4

13

Cover Bottom

1

14

Screw

2

15

Label

1

16

I/F coil cord

1

17

Data coil cord

1

7-10

Remark

SAMSUNG Proprietary-Contents may change without notice

7-11 Main packing Exploded View

1

2

8

4

6 5 3

7

SAMSUNG Proprietary-Contents may change without notice

7-11

7-12 Main packing Parts List No

PART NAME

CODE NO

QÕTY

1

CUSHION DUMMY MANUAL

1

2

MAIN SET

1

3

DTC81

1

4

EXT BATT

1

5

HOLSTER

1

6

STD BATT

1

7

MAIN CUSHION

1

8

MAIN GIFT BOX

1

7-12

Remark

SAMSUNG Proprietary-Contents may change without notice

7-13 Hands-Free Kit 1 packing Exploded View

1 3

2

4 7

6

5 8

9

10

SAMSUNG Proprietary-Contents may change without notice

7-13

7-14 Hands-Free Kit 1 packing Parts List No

Description

SEC. CODE

QÕTY

1

User manual

1

2

User manual

1

3

External speaker

1

4

Cradle

1

5

install Bracket for cradle

1

6

External Mic

1

7

Hands-free Box

1

8

install Bracket for hands-free Box

1

9

Power cable

1

10

Unit Box

1

7-14

Remark

SAMSUNG Proprietary-Contents may change without notice

8. Electrical Parts List 8-1 Main Part List Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

1

-

SCREW-MACHINE

“CH,+,M1.7,L2,ZPC(BLK),SWRCH18”

6001-000876

1

-

SCREW-MACHINE

“BH,STAR,M2,L4,CBLACK,SM20C,-”

6001-001140

1

REAR-COVER

ANTENNA-SCH800

“-,824~894MHZ,0DBD,50OHM”

GH42-00002A

1

-

BATTERY-STD ENG(B)

“3.6V,1000MAH,-,1CMA,4.1V”

GH43-00057A

1

-

LABEL(R)-MAIN SCH811

“SCH-811,POLYESTER T0.05,37X28,-,SIL”

GH68-00368A

1

-

LABEL(P)-7PI

“SCH-200F,ART,PI7,100G,BLK”

GH68-10680A

1

-

LABEL(P)-MS BAR CODE

“SCH-1900,ART,100X155,T0.1,WHT”

GH68-11057A

1

-

LABEL(R)-BARCODE BOX

“SCH-1011,POLYESTER,61X71,T0.1,”

GH68-30937A

1

-

LABEL(R)-BAR CODE

“SP-D300,PR,34X6.5,T0.1,WHT”

GH68-30963A

1

-

PCT-WINDOW LCD SCH811P

“SCH-811,-,BLK,-,-”

GH72-00283A

1

WINDOW-LCD

PPR-TAPE WINDOW BOHO

“SCH-100,VINYL TAPE,TRP,-,-”

GH72-10001A

1

-

PMO-KEY VOLUME

“SPH7000,PC+ELASTOMER,BLK,-,-”

GH72-41787A

1

SCREW BOSS

RPR-GROUND GASKET

“SPH-7000,SI RUBBER,®™7*T0.4,GRY,-”

GH73-00005A

1

-

RMO-CONNECTOR COVER

“SPH7000,URETAN,18.2X4.0XT5.8,B”

GH73-40704A

1

-

RMO-MOBILE CAP

“SPH7000,URETHAN,5.2X4.2XT5.0,B”

GH73-40705A

1

-

RMO-EAR JACK COVER

“SCH-800,URETHAN,5.0X11XT5.0,BL”

GH73-40734A

1

SPEAKER

MPR-SPONGE SPEAK

“SCH-800,FOAM,®™8.5XT0.4,BLK,-”

GH74-00012A

1

FPC-CABLE

MPR-SPONGE MIC

“SH-800,SPONGE,7X7.5X3,BLK,-”

GH74-10526A

1

-

MEC-SHIELD COVER

“SCH-800B,SEC,TRP”

GH75-00022A

2

SHIELD-COVER

NPR-SHIELD STRIP(A)

“SCH-800B,C5210-1/2H,T0.1,-”

GH71-00004A

2

SHIELD-COVER

NPR-SHIELD STRIP(C)

“SCH-800B,C5210-1/2H,T0.1,-”

GH71-00006A

2

SHIELD-COVER

NPR-SHIELD MSM CAN

“SCH-800B,C5210-1/2H,T0.1,-”

GH71-00008A

2

SHIELD-COVER

NPR-SHIELD DUPLEX CAN

“SCH-800B,C5210-1/2H,T0.1,-”

GH71-00009A

2

SHIELD-COVER

PMO-SHIELD COVER

“SCH-800,PC,TRP,-,-”

GH72-41799A

2

SHIELD-COVER

MPR-SPONGE MSM

“SPH-7000,PVC FOAM,10X10XT0.5,WHT,-”

GH74-00002A

2

SHIELD-COVER

MPR-SPONGE SAW FILTER

“SCH-800B,PE SPONGE,15X5.8XT0.5,WHT,-”

GH74-00014A

2

SHIELD-COVER

MPR-SPONGE TCXO

“SCH-800B,PE SPONGE,9.0X7.0XT0.5,WHT,-”

GH74-00015A

1

-

MEC-HOLSTER 811B

“SCH-811,PCL,BLK”

GH75-00144A

2

-

SPRING-CLAMP

“SCH-811,PW1(KSD 3556),-,-,-,-”

GH61-00005A

2

-

IPR-E RING

“SCH-811,STS304 W2,0.3,-”

GH70-00023A

2

-

ICT-PIN CLAMP

“SCH-811,STS304 W2,PI1.9X20,-”

GH70-00024A

2

-

PMO-HOLSTER CRADLE 811B

“SCH-811,PC,BLK,-,-”

GH72-00282A

2

-

PMO-HOLSTER CLAMP 811B

“SCH-811,PC,BLK,-,-”

GH72-00284A

1

-

MEC-HANGER

“SCH-811,PCL,BLK”

GH75-00157A

1

-

PBA MAIN-SCH810 LOGIC

“SCH-810,SAMSUNG,BRAZ,LOGIC,-,-,-”

GH92-00758A

2

D107

DIODE-SWITCHING

“MCL4148,100V,200mA,LL-34,TP”

0401-001052

2

D109

DIODE-RECTIFIER

“UPS5819,40V,1.0A,SMT,TP”

0402-001207

2

D101

DIODE-TVS

“SM05,6V/1mA,300,SOT-23”

0406-001005

2

D103

DIODE-TVS

“SM05,6V/1mA,300,SOT-23”

0406-001005

2

D130

DIODE-TVS

“SM05,6V/1mA,300,SOT-23”

0406-001005

SAMSUNG Proprietary-Contents may change without notice

8-1

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

2

D111

DIODE-TVS

“SMS05C,6V,300W,SOT-23-6”

0406-001051

2

D112

DIODE-TVS

“SMS05C,6V,300W,SOT-23-6”

0406-001051

2

D128

DIODE-TVS

“SMS05C,6V,300W,SOT-23-6”

0406-001051

2

D129

DIODE-TVS

“SMS05C,6V,300W,SOT-23-6”

0406-001051

2

D135

DIODE-TVS

“SMS05C,6V,300W,SOT-23-6”

0406-001051

2

D104

DIODE-ARRAY

“DA204U,20V,100mA,C2-3,SC-70,TP”

0407-000102

2

D102

DIODE-ARRAY

“KDS226,80V,300mA,C2-3,SOT-23,T”

0407-000122

2

Q124

TR-SMALL SIGNAL

“2SA1576,PNP,200MW,SOT-323,TP,180-390”

0501-000162

2

Q107

TR-SMALL SIGNAL

“2SC4081,NPN,200mW,UMT,TP,180-3”

0501-000218

2

Q119

TR-SMALL SIGNAL

“MMBT2222A,NPN,225mW,SOT-23,TP,”

0501-000457

2

Q121

TR-SMALL SIGNAL

“MMBT2222A,NPN,225mW,SOT-23,TP,”

0501-000457

2

Q123

TR-SMALL SIGNAL

“MMBT2222A,NPN,225mW,SOT-23,TP,”

0501-000457

2

Q106

TR-DIGITAL

“RN1104,NPN,100MW,47K/47K,SSM,TP”

0504-000168

2

Q125

TR-DIGITAL

“RN1104,NPN,100MW,47K/47K,SSM,TP”

0504-000168

2

Q126

TR-DIGITAL

“RN1104,NPN,100MW,47K/47K,SSM,TP”

0504-000168

2

Q101

TR-DIGITAL

“RN2104,PNP,100MW,47K/47K,SSM,TP”

0504-000172

2

Q120

TR-DIGITAL

“RN2104,PNP,100MW,47K/47K,SSM,TP”

0504-000172

2

Q103

FET-SILICON

“SI3443DV,P,-20V,+-3.5mA,65mohm”

0505-001165

2

Q104

FET-SILICON

“SI6803DQ,N/P,20/-20V,+-2.5/+-2”

0505-001185

2

D120

LED

“CHIP,Y-GRN,0.8x1.1mm,570nm”

0601-001094

2

D121

LED

“CHIP,Y-GRN,0.8x1.1mm,570nm”

0601-001094

2

D122

LED

“CHIP,Y-GRN,0.8x1.1mm,570nm”

0601-001094

2

D123

LED

“CHIP,Y-GRN,0.8x1.1mm,570nm”

0601-001094

2

D124

LED

“CHIP,Y-GRN,0.8x1.1mm,570nm”

0601-001094

2

D125

LED

“CHIP,Y-GRN,0.8x1.1mm,570nm”

0601-001094

2

D126

LED

“CHIP,Y-GRN,0.8x1.1mm,570nm”

0601-001094

2

D127

LED

“CHIP,Y-GRN,0.8x1.1mm,570nm”

0601-001094

2

D110

LED

“CHIP,RED/GRN,3x2.5mm,660/570nm”

0601-001130

2

U114

IC-CMOS LOGIC

“7W04,INVERTER,SSOP,8P,110MIL,T”

0801-000301

2

U116

IC-CMOS LOGIC

“7S32,OR GATE,SOT-25,5P,63MIL,S”

0801-000796

2

U111

IC-CMOS LOGIC

“7S04,INVERTER,SOT-25,5P,63MIL,”

0801-002192

2

U112

IC-TTL

“4W53,MUX/DEMUX,SOP,8P,110MIL,S”

0803-003010

2

U115

IC-DSP

“16272,16BIT,TQFP,64P,400MIL,27”

0904-001280

2

U104

IC-EEPROM

“24C256,32Kx8BIT,SOP,8P,200MIL,”

1103-001131

2

U110

IC-FLASH MEMORY

“29LV800,1Mx8BIT,SON,46P,-,100n”

1107-001062

2

U109

IC-ETC. MEMORY

“1306,524Kx16BIT,SOP,48P,400MIL”

1109-001081

2

U103

IC-VOLTAGE COMP.

“75W56,SSOP,8P,110MIL,DUAL,7V,C”

1202-001022

2

U108

IC-RESET

“809,SOP,3P,-,PLASTIC,-0.3/6V,4”

1203-000392

2

U107

IC-VOLTAGE REGULATOR

“5205,SOT-23,5P,59MIL,PLASTIC,3”

1203-001256

2

U105

IC-PWM CONTROLLER

“9161,SOP,16P,-,PLASTIC,1.455/1”

1203-001434

8-2

SAMSUNG Proprietary-Contents may change without notice

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

2

U106

IC-VOLTAGE REGULATOR

“5219,SOT-23,5P,63MIL,PLASTIC,3”

1203-001518

2

U102

IC-ENCODER/DECODER

“ST5092TQFPTR,QFP,44P,-,PLASTIC”

1204-001375

2

U101

IC-DATA COMM./GEN.

“MSM2300,PBGA,196P,590MIL,PLAST”

1205-001517

2

R113

R-CHIP

“2Kohm,5%,1/16W,DA,TP,1005”

2007-000137

2

R105

R-CHIP

“100ohm,5%,1/16W,DA,TP,1005”

2007-000138

2

R106

R-CHIP

“100ohm,5%,1/16W,DA,TP,1005”

2007-000138

2

R129

R-CHIP

“100ohm,5%,1/16W,DA,TP,1005”

2007-000138

2

R130

R-CHIP

“100ohm,5%,1/16W,DA,TP,1005”

2007-000138

2

R131

R-CHIP

“100ohm,5%,1/16W,DA,TP,1005”

2007-000138

2

R137

R-CHIP

“100ohm,5%,1/16W,DA,TP,1005”

2007-000138

2

R188

R-CHIP

“100ohm,5%,1/16W,DA,TP,1005”

2007-000138

2

“R103,R108,R224”

R-CHIP

“1Kohm,5%,1/16W,DA,TP,1005”

2007-000140

2

R104

R-CHIP

“1Kohm,5%,1/16W,DA,TP,1005”

2007-000140

2

R116

R-CHIP

“1Kohm,5%,1/16W,DA,TP,1005”

2007-000140

2

R117

R-CHIP

“1Kohm,5%,1/16W,DA,TP,1005”

2007-000140

2

R125

R-CHIP

“1Kohm,5%,1/16W,DA,TP,1005”

2007-000140

2

R128

R-CHIP

“1Kohm,5%,1/16W,DA,TP,1005”

2007-000140

2

R181

R-CHIP

“1Kohm,5%,1/16W,DA,TP,1005”

2007-000140

2

R183

R-CHIP

“1Kohm,5%,1/16W,DA,TP,1005”

2007-000140

2

R230

R-CHIP

“1Kohm,5%,1/16W,DA,TP,1005”

2007-000140

2

R102

R-CHIP

“2.2Kohm,5%,1/16W,DA,TP,1005”

2007-000141

2

R114

R-CHIP

“2.7Kohm,5%,1/16W,DA,TP,1005”

2007-000142

2

R100

R-CHIP

“4.7Kohm,5%,1/16W,DA,TP,1005”

2007-000143

2

R149

R-CHIP

“4.7Kohm,5%,1/16W,DA,TP,1005”

2007-000143

2

R217

R-CHIP

“4.7Kohm,5%,1/16W,DA,TP,1005”

2007-000143

2

R221

R-CHIP

“4.7Kohm,5%,1/16W,DA,TP,1005”

2007-000143

2

R222

R-CHIP

“4.7Kohm,5%,1/16W,DA,TP,1005”

2007-000143

2

R223

R-CHIP

“4.7Kohm,5%,1/16W,DA,TP,1005”

2007-000143

2

R144

R-CHIP

“6.8Kohm,5%,1/16W,DA,TP,1005”

2007-000146

2

R120

R-CHIP

“10Kohm,5%,1/16W,DA,TP,1005”

2007-000148

2

R136

R-CHIP

“10Kohm,5%,1/16W,DA,TP,1005”

2007-000148

2

R182

R-CHIP

“10Kohm,5%,1/16W,DA,TP,1005”

2007-000148

2

R184

R-CHIP

“10Kohm,5%,1/16W,DA,TP,1005”

2007-000148

2

R185

R-CHIP

“10Kohm,5%,1/16W,DA,TP,1005”

2007-000148

2

R187

R-CHIP

“10Kohm,5%,1/16W,DA,TP,1005”

2007-000148

2

R124

R-CHIP

“15Kohm,5%,1/16W,DA,TP,1005”

2007-000151

2

R139

R-CHIP

“15Kohm,5%,1/16W,DA,TP,1005”

2007-000151

2

R101

R-CHIP

“20Kohm,5%,1/16W,DA,TP,1005”

2007-000152

2

R107

R-CHIP

“22Kohm,5%,1/16W,DA,TP,1005”

2007-000153

2

R132

R-CHIP

“22Kohm,5%,1/16W,DA,TP,1005”

2007-000153

SAMSUNG Proprietary-Contents may change without notice

8-3

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

2

R150

R-CHIP

“22Kohm,5%,1/16W,DA,TP,1005”

2007-000153

2

R189

R-CHIP

“22Kohm,5%,1/16W,DA,TP,1005”

2007-000153

2

R211

R-CHIP

“22Kohm,5%,1/16W,DA,TP,1005”

2007-000153

2

R215

R-CHIP

“22Kohm,5%,1/16W,DA,TP,1005”

2007-000153

2

R216

R-CHIP

“22Kohm,5%,1/16W,DA,TP,1005”

2007-000153

2

R155

R-CHIP

“24Kohm,5%,1/16W,DA,TP,1005”

2007-000154

2

“R145,C162”

R-CHIP

“47Kohm,5%,1/16W,DA,TP,1005”

2007-000157

2

R210

R-CHIP

“47Kohm,5%,1/16W,DA,TP,1005”

2007-000157

2

R138

R-CHIP

“56Kohm,5%,1/16W,DA,TP,1005”

2007-000159

2

R111

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R134

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R135

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R146

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R147

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R148

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R151

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R172

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R173

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R174

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R175

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R176

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R177

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R178

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R190

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R109

R-CHIP

“120Kohm,5%,1/16W,DA,TP,1005”

2007-000163

2

R152

R-CHIP

“150Kohm,5%,1/16W,DA,TP,1005”

2007-000164

2

R153

R-CHIP

“150Kohm,5%,1/16W,DA,TP,1005”

2007-000164

2

R154

R-CHIP

“200Kohm,5%,1/16W,DA,TP,1005”

2007-000165

2

R186

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R115

R-CHIP

“1.5Kohm,5%,1/16W,DA,TP,1005”

2007-000242

2

R127

R-CHIP

“33Kohm,5%,1/16W,DA,TP,1005”

2007-000775

2

R214

R-CHIP

“39Kohm,5%,1/16W,DA,TP,1005”

2007-000831

2

R133

R-CHIP

“470ohm,5%,1/16W,DA,TP,1005”

2007-000932

2

R250

R-CHIP

“4.7ohm,5%,1/16W,DA,TP,1005”

2007-001284

2

“R212,R225”

R-CHIP

“33ohm,5%,1/16W,DA,TP,1005”

2007-001292

2

R168

R-CHIP

“51ohm,5%,1/16W,DA,TP,1005”

2007-001298

2

R169

R-CHIP

“51ohm,5%,1/16W,DA,TP,1005”

2007-001298

2

R170

R-CHIP

“51ohm,5%,1/16W,DA,TP,1005”

2007-001298

2

R171

R-CHIP

“51ohm,5%,1/16W,DA,TP,1005”

2007-001298

2

R218

R-CHIP

“150ohm,5%,1/16W,DA,TP,1005”

2007-001306

8-4

SAMSUNG Proprietary-Contents may change without notice

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

2

R220

R-CHIP

“150ohm,5%,1/16W,DA,TP,1005”

2007-001306

2

R122

R-CHIP

“1.2Kohm,5%,1/16W,DA,TP,1005”

2007-001319

2

R213

R-CHIP

“13KOHM,5%,1/16W,DA,TP,1005”

2007-007015

2

R110

R-CHIP

“43KOHM,5%,1/16W,DA,TP,1005”

2007-007101

2

R141

R-CHIP

“100Kohm,1%,1/16W,DA,TP,1005”

2007-007107

2

R123

R-CHIP

“10Kohm,1%,1/16W,DA,TP,1005”

2007-007142

2

R142

R-CHIP

“68Kohm,1%,1/16W,DA,TP,1005”

2007-007589

2

C167

“C-CERAMIC,CHIP”

“1.5nF,10%,50V,X7R,TP,1005,-”

2203-000138

2

C103

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C105

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C106

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C121

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C122

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C130

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C152

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C154

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C156

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C100

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C116

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C118

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C119

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C127

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C158

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C159

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C164

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C170

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C182

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C183

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C184

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C185

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C133

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C151

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C153

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C160

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C102

“C-CERAMIC,CHIP”

“220pF,10%,50V,X7R,TP,1005,-”

2203-000585

2

C104

“C-CERAMIC,CHIP”

“470pF,10%,50V,X7R,TP,1005,-”

2203-000940

2

C120

“C-CERAMIC,CHIP”

“470pF,10%,50V,X7R,TP,1005,-”

2203-000940

2

C123

“C-CERAMIC,CHIP”

“470pF,10%,50V,X7R,TP,1005,-”

2203-000940

2

C135

“C-CERAMIC,CHIP”

“470pF,10%,50V,X7R,TP,1005,-”

2203-000940

2

C187

“C-CERAMIC,CHIP”

“470pF,10%,50V,X7R,TP,1005,-”

2203-000940

SAMSUNG Proprietary-Contents may change without notice

8-5

Level 2

Design LOC

DESCRIPTIONS

SEC.CODE

“C-CERAMIC,CHIP”

“47pF,5%,50V,NPO,TP,1005,-”

2203-000995

2

“C191,C192,C193,C194” “C-CERAMIC,CHIP”

“47pF,5%,50V,NPO,TP,1005,-”

2203-000995

2

“C195,C196,C198”

“C-CERAMIC,CHIP”

“47pF,5%,50V,NPO,TP,1005,-”

2203-000995

2

C199

“C-CERAMIC,CHIP”

“47pF,5%,50V,NPO,TP,1005,-”

2203-000995

2

“C201,C202”

“C-CERAMIC,CHIP”

“47pF,5%,50V,NPO,TP,1005,-”

2203-000995

2

“C205,C206”

“C-CERAMIC,CHIP”

“47pF,5%,50V,NPO,TP,1005,-”

2203-000995

2

“C207,C208,C209,C210” “C-CERAMIC,CHIP”

“47pF,5%,50V,NPO,TP,1005,-”

2203-000995

2

C101

“C-CERAMIC,CHIP”

“8.2nF,10%,16V,X7R,TP,1005,-”

2203-001210

2

C109

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C111

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C112

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C115

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C126

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C128

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C129

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C132

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C134

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C137

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C155

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

“C161,C163,C211”

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C169

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C171

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C181

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

“C197,C200”

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C220

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C221

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C222

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C139

“C-CERAMIC,CHIP”

“1uF,+80-20%,10V,Y5V,TP,1608,-”

2203-005065

2

C117

“C-TA,CHIP”

“1uF,20%,10V,GP,TP,2012,2,0”

2404-001017

2

C180

“C-TA,CHIP”

“1uF,20%,10V,GP,TP,2012,2,0”

2404-001017

2

C108

“C-TA,CHIP”

“33uF,20%,6.3V,GP,TP,3528,-”

2404-001032

2

C125

“C-TA,CHIP”

“33uF,20%,6.3V,GP,TP,3528,-”

2404-001032

2

C131

“C-TA,CHIP”

“100uF,20,6,LZ,TP,7343,-”

2404-001057

2

C110

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

2

C136

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

2

C138

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

2

L105

INDUCTOR-SMD

“1uH,10%,0.8x1.6x0.8mm”

2703-000300

2

L101

INDUCTOR-SMD

“10uH,20%,4.45x6.6x2.92mm”

2703-001563

2

X101

RESONATOR-CERAMIC

“27MHz,0.5%,TP,3.2x2.1x1.5”

2802-001090

2

X102

RESONATOR-CERAMIC

“27MHz,0.5%,TP,3.2x2.1x1.5”

2802-001090

8-6

“C186,C188,C190”

ITEMS

SAMSUNG Proprietary-Contents may change without notice

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

2

S1

SWITCH-REED

“100VDC,0.5A,1mS,1mS”

3409-001039

2

J105

CONNECTOR-FPC/FC/PIC

“22P,0.5mm,SMD-A,SN”

3708-001295

2

J110

CONNECTOR-SOCKET

“18P,1R,0.5mm,SMD-A,AUF”

3710-001429

2

J104

CONNECTOR-HEADER

“NOWALL,60P,2R,0.5mm,SMD-S,AUF”

3711-004027

2

J102

JACK-AC POWER

“2P,2.6PI,AU,BLK,NO”

3722-001172

2

-

PCB-SCH811 LOG

“SCH-811,-,8,0.8T,118X138MM”

GH41-00019A

2

VOL_KEY

UNIT-VOLKEY

“SCH-800,KBSCH800B,KEYPAD,FPC,-,-,-”

GH59-00004A

2

MIC ASS’Y

ELA ETC-MIC

“SPH-7000,SAMSUNG,KORA,MICROPHO”

GH96-01156A

1

-

PBA MAIN-SCH810 RF

“SCH-810,SAMSUNG,BRAZ,RF,-,-,-”

GH92-00759A

2

D400

DIODE-VARACTOR

“1SV279,15V,3nA,USC,TP”

0405-001035

2

D401

DIODE-VARACTOR

“1SV279,15V,3nA,USC,TP”

0405-001035

2

D402

DIODE-VARACTOR

“1SV279,15V,3nA,USC,TP”

0405-001035

2

D403

DIODE-VARACTOR

“1SV279,15V,3nA,USC,TP”

0405-001035

2

D310

DIODE-ARRAY

“DAN202U,80V,100mA,CA2-3,SC-70,”

0407-000115

2

D300

DIODE-PIN

“BAR63-02W,50V,100mA,SCD-80,TP”

0409-001016

2

D301

DIODE-PIN

“BAR63-02W,50V,100mA,SCD-80,TP”

0409-001016

2

Q402

TR-SMALL SIGNAL

“2SA1576,PNP,200MW,SOT-323,TP,180-390”

0501-000162

2

Q300

TR-SMALL SIGNAL

“2SC4081,NPN,200mW,UMT,TP,180-3”

0501-000218

2

U309

TR-SMALL SIGNAL

“AT-32011,NPN,200mW,SOT-143,TP,”

0501-002060

2

Q302

TR-SMALL SIGNAL

“BFP420,NPN,160MW,SOT-343,TP,50-150”

0501-002096

2

D302

TR-SMALL SIGNAL

“BCR400W,NPN,-,SOT-343,TP,-”

0501-002205

2

Q301

TR-SMALL SIGNAL

“BFP196W,NPN,700MW,SOT-343,TP,100”

0501-002240

2

Q401

TR-DIGITAL

“RN1102,NPN,100MW,10K/10K,SSM,TP”

0504-000167

2

Q303

TR-DIGITAL

“RN1104,NPN,100MW,47K/47K,SSM,TP”

0504-000168

2

U408

FET-SILICON

“SI3443DV,P,-20V,+-3.5mA,65mohm”

0505-001165

2

U301

IC-ANALOG SWITCH

“SW395TR,SPDP,SOT-26,6P,-,DUAL,”

1001-001048

2

U409

IC-ANALOG MULTIPLEX

“MAX4524EUB-T,TTL/CMOS,SOP,10P,”

1001-001080

2

U404

IC-PREAMP

“01037,SOP,6P,59MIL,SINGLE,-,PL”

1201-001175

2

U310

IC-CASCODE AMP

“0916,SOT-143,4P,-,-,2.7V,-,6Vd”

1201-001248

2

U407

IC-POWER AMP

“23124,LCC,8P,-,SINGLE,-,PLASTI”

1201-001259

2

U402

IC-AGC AMP

“3222,SOP,-,-,SINGLE,-,PLASTIC,”

1201-001261

2

U314

IC-OP AMP

“821,SOT23-5,5P,63MIL,SINGLE,-,”

1201-001348

2

U405

IC-OP AMP

“821,SOT23-5,5P,63MIL,SINGLE,-,”

1201-001348

2

U406

IC-OP AMP

“821,SOT23-5,5P,63MIL,SINGLE,-,”

1201-001348

2

U303

IC-RF AMP

“2617,SSOP,16P,150MIL,DUAL,3V/V”

1201-001366

2

U304

IC-VOLTAGE REGULATOR

“5205,SOT-23,5P,59MIL,PLASTIC,3”

1203-001256

2

U311

IC-VOLTAGE REGULATOR

“5205,SOT-23,5P,59MIL,PLASTIC,3”

1203-001256

2

U312

IC-VOLTAGE REGULATOR

“5205,SOT-23,5P,59MIL,PLASTIC,3”

1203-001256

2

U300

IC-MIXER

“CMY210,SOP,6P,-,PLASTIC,3 TO 6”

1205-001249

2

U401

IC-DATA COMM./GEN.

“Q5312I-3S2,QSOP,80P,138mm,PLAS”

1205-001451

SAMSUNG Proprietary-Contents may change without notice

8-7

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

2

U403

IC-MIXER

“RF2628,MSOP,8P,190MIL,PLASTIC,”

2

U306

IC-PLL

“LMX2332LSLB,CSP,20P,-,PLASTIC,”

1209-001197

2

U313

THERMISTOR-NTC

“10Kohm,5%,3650K,-,TP”

1404-001040

2

U410

THERMISTOR-NTC

“10Kohm,5%,3650K,-,TP”

1404-001040

2

R325

R-CHIP

“2Kohm,5%,1/16W,DA,TP,1005”

2007-000137

2

R321

R-CHIP

“100ohm,5%,1/16W,DA,TP,1005”

2007-000138

2

R394

R-CHIP

“100ohm,5%,1/16W,DA,TP,1005”

2007-000138

2

R305

R-CHIP

“220ohm,5%,1/16W,DA,TP,1005”

2007-000139

2

R307

R-CHIP

“1Kohm,5%,1/16W,DA,TP,1005”

2007-000140

2

R309

R-CHIP

“1Kohm,5%,1/16W,DA,TP,1005”

2007-000140

2

R330

R-CHIP

“1Kohm,5%,1/16W,DA,TP,1005”

2007-000140

2

R426

R-CHIP

“1Kohm,5%,1/16W,DA,TP,1005”

2007-000140

2

R443

R-CHIP

“2.2Kohm,5%,1/16W,DA,TP,1005”

2007-000141

2

R315

R-CHIP

“5.1Kohm,5%,1/16W,DA,TP,1005”

2007-000144

2

R440

R-CHIP

“5.1Kohm,5%,1/16W,DA,TP,1005”

2007-000144

2

R324

R-CHIP

“6.2Kohm,5%,1/16W,DA,TP,1005”

2007-000145

2

R451

R-CHIP

“6.2Kohm,5%,1/16W,DA,TP,1005”

2007-000145

2

R411

R-CHIP

“10Kohm,5%,1/16W,DA,TP,1005”

2007-000148

2

R412

R-CHIP

“10Kohm,5%,1/16W,DA,TP,1005”

2007-000148

2

R417

R-CHIP

“10Kohm,5%,1/16W,DA,TP,1005”

2007-000148

2

R438

R-CHIP

“10Kohm,5%,1/16W,DA,TP,1005”

2007-000148

2

R306

R-CHIP

“12Kohm,5%,1/16W,DA,TP,1005”

2007-000149

2

R441

R-CHIP

“12Kohm,5%,1/16W,DA,TP,1005”

2007-000149

2

R452

R-CHIP

“12Kohm,5%,1/16W,DA,TP,1005”

2007-000149

2

R444

R-CHIP

“20Kohm,5%,1/16W,DA,TP,1005”

2007-000152

2

R310

R-CHIP

“47Kohm,5%,1/16W,DA,TP,1005”

2007-000157

2

R322

R-CHIP

“47Kohm,5%,1/16W,DA,TP,1005”

2007-000157

2

R401

R-CHIP

“47Kohm,5%,1/16W,DA,TP,1005”

2007-000157

2

R402

R-CHIP

“47Kohm,5%,1/16W,DA,TP,1005”

2007-000157

2

R435

R-CHIP

“47Kohm,5%,1/16W,DA,TP,1005”

2007-000157

2

R333

R-CHIP

“56Kohm,5%,1/16W,DA,TP,1005”

2007-000159

2

R395

R-CHIP

“68Kohm,5%,1/16W,DA,TP,1005”

2007-000160

2

R308

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R332

R-CHIP

“100Kohm,5%,1/16W,DA,TP,1005”

2007-000162

2

R331

R-CHIP

“1Mohm,5%,1/16W,DA,TP,1005”

2007-000170

2

R425

R-CHIP

“1Mohm,5%,1/16W,DA,TP,1005”

2007-000170

2

C444

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

C445

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

L353

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R314

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

8-8

1205-001535

SAMSUNG Proprietary-Contents may change without notice

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

2

R316

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R320

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R327

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R329

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R396

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R398

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R406

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R407

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R408

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R416

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R418

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R419

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R437

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R445

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R446

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R450

R-CHIP

“0ohm,5%,1/16W,DA,TP,1005”

2007-000171

2

R300

R-CHIP

“10ohm,5%,1/16W,DA,TP,1005”

2007-000172

2

R303

R-CHIP

“10ohm,5%,1/16W,DA,TP,1005”

2007-000172

2

R311

R-CHIP

“10ohm,5%,1/16W,DA,TP,1005”

2007-000172

2

R313

R-CHIP

“10ohm,5%,1/16W,DA,TP,1005”

2007-000172

2

R319

R-CHIP

“10ohm,5%,1/16W,DA,TP,1005”

2007-000172

2

R400

R-CHIP

“10ohm,5%,1/16W,DA,TP,1005”

2007-000172

2

R439

R-CHIP

“1.5Kohm,5%,1/16W,DA,TP,1005”

2007-000242

2

R421

R-CHIP

“270Kohm,5%,1/16W,DA,TP,1005”

2007-000636

2

R442

R-CHIP

“39Kohm,5%,1/16W,DA,TP,1005”

2007-000831

2

R424

R-CHIP

“430Kohm,5%,1/16W,DA,TP,1005”

2007-000899

2

R422

R-CHIP

“560Kohm,5%,1/16W,DA,TP,1005”

2007-001025

2

R302

R-CHIP

“24ohm,5%,1/16W,DA,TP,1005”

2007-001290

2

R427

R-CHIP

“51ohm,5%,1/16W,DA,TP,1005”

2007-001298

2

R399

R-CHIP

“150ohm,5%,1/16W,DA,TP,1005”

2007-001306

2

R301

R-CHIP

“200ohm,5%,1/16W,DA,TP,1005”

2007-001308

2

R328

R-CHIP

“910ohm,5%,1/16W,DA,TP,1005”

2007-001317

2

R410

R-CHIP

“1.8Kohm,5%,1/16W,DA,TP,1005”

2007-001320

2

R423

R-CHIP

“1.8Kohm,5%,1/16W,DA,TP,1005”

2007-001320

2

R334

R-CHIP

“36Kohm,5%,1/16W,DA,TP,1005”

2007-001335

2

R317

R-CHIP

“16OHM,5%,1/16W,DA,TP,1005”

2007-003006

2

R318

R-CHIP

“16OHM,5%,1/16W,DA,TP,1005”

2007-003006

2

R420

R-CHIP

“20OHM,5%,1/16W,DA,TP,1005”

2007-003010

2

R428

R-CHIP

“20OHM,5%,1/16W,DA,TP,1005”

2007-003010

2

R335

R-CHIP

“43KOHM,5%,1/16W,DA,TP,1005”

2007-007101

SAMSUNG Proprietary-Contents may change without notice

8-9

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

2

R405

R-CHIP

“300ohm,1%,1/16W,DA,TP,1005”

2007-007133

2

R409

R-CHIP

“39Kohm,1%,1/16W,DA,TP,1005”

2007-007134

2

R403

R-CHIP

“1.2Kohm,1%,1/16W,DA,TP,1005”

2007-007137

2

R404

R-CHIP

“10Kohm,1%,1/16W,DA,TP,1005”

2007-007142

2

R449

R-CHIP

“10Kohm,1%,1/16W,DA,TP,1005”

2007-007142

2

R448

R-CHIP

“11.3Kohm,1%,1/16W,DA,TP,1005”

2007-007491

2

C303

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C310

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C311

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C315

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C316

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C326

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C337

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C341

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C342

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C344

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C349

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C350

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C362

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C363

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C365

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C367

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C369

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C370

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C373

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C393

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C400

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C410

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C416

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C426

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C428

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C432

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C434

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C448

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C454

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

L304

“C-CERAMIC,CHIP”

“100pF,5%,50V,NPO,TP,1005,-”

2203-000233

2

C343

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C356

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C359

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C366

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

8-10

SAMSUNG Proprietary-Contents may change without notice

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

2

C371

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C372

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C378

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C381

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C382

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C387

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C404

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C415

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C421

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C427

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C435

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C438

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C439

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C440

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C442

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C443

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C450

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C452

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C456

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C458

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C464

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C468

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C470

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C471

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C472

“C-CERAMIC,CHIP”

“10nF,10%,16V,X7R,TP,1005,-”

2203-000254

2

C322

“C-CERAMIC,CHIP”

“10pF,0.5pF,50V,NPO,TP,1005,-”

2203-000278

2

C383

“C-CERAMIC,CHIP”

“10pF,0.5pF,50V,NPO,TP,1005,-”

2203-000278

2

C403

“C-CERAMIC,CHIP”

“10pF,0.5pF,50V,NPO,TP,1005,-”

2203-000278

2

C418

“C-CERAMIC,CHIP”

“18pF,5%,50V,NPO,TP,1005,-”

2203-000425

2

C301

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C320

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C323

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C327

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C361

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C407

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C409

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C419

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C422

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C423

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C424

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

SAMSUNG Proprietary-Contents may change without notice

8-11

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

2

C425

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C430

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C431

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C437

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C449

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C455

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C457

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C459

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C463

“C-CERAMIC,CHIP”

“1nF,10%,50V,X7R,TP,1005,-”

2203-000438

2

C345

“C-CERAMIC,CHIP”

“1pF,0.25pF,50V,NPO,TP,1005,-”

2203-000466

2

C346

“C-CERAMIC,CHIP”

“1pF,0.25pF,50V,NPO,TP,1005,-”

2203-000466

2

C329

“C-CERAMIC,CHIP”

“220pF,10%,50V,X7R,TP,1005,-”

2203-000585

2

C305

“C-CERAMIC,CHIP”

“22pF,5%,50V,NPO,TP,1005,-”

2203-000628

2

C351

“C-CERAMIC,CHIP”

“3.9nF,10%,50V,X7R,TP,1005,-”

2203-000725

2

C319

“C-CERAMIC,CHIP”

“33pF,5%,50V,NPO,TP,1005,-”

2203-000812

2

C391

“C-CERAMIC,CHIP”

“33pF,5%,50V,NPO,TP,1005,-”

2203-000812

2

C401

“C-CERAMIC,CHIP”

“39pF,5%,50V,NPO,TP,1005,-”

2203-000854

2

C402

“C-CERAMIC,CHIP”

“39pF,5%,50V,NPO,TP,1005,-”

2203-000854

2

C321

“C-CERAMIC,CHIP”

“3pF,0.25pF,50V,NPO,TP,1005,-”

2203-000870

2

C324

“C-CERAMIC,CHIP”

“3pF,0.25pF,50V,NPO,TP,1005,-”

2203-000870

2

C338

“C-CERAMIC,CHIP”

“3pF,0.25pF,50V,NPO,TP,1005,-”

2203-000870

2

C508

“C-CERAMIC,CHIP”

“3pF,0.25pF,50V,NPO,TP,1005,-”

2203-000870

2

C318

“C-CERAMIC,CHIP”

“4.7nF,10%,25V,X7R,TP,1005,-”

2203-000885

2

C328

“C-CERAMIC,CHIP”

“4.7nF,10%,25V,X7R,TP,1005,-”

2203-000885

2

C332

“C-CERAMIC,CHIP”

“4.7nF,10%,25V,X7R,TP,1005,-”

2203-000885

2

C340

“C-CERAMIC,CHIP”

“4.7nF,10%,25V,X7R,TP,1005,-”

2203-000885

2

C357

“C-CERAMIC,CHIP”

“4.7nF,10%,25V,X7R,TP,1005,-”

2203-000885

2

C360

“C-CERAMIC,CHIP”

“4.7nF,10%,25V,X7R,TP,1005,-”

2203-000885

2

C376

“C-CERAMIC,CHIP”

“4.7nF,10%,25V,X7R,TP,1005,-”

2203-000885

2

C379

“C-CERAMIC,CHIP”

“4.7nF,10%,25V,X7R,TP,1005,-”

2203-000885

2

C384

“C-CERAMIC,CHIP”

“4.7nF,10%,25V,X7R,TP,1005,-”

2203-000885

2

C390

“C-CERAMIC,CHIP”

“4.7nF,10%,25V,X7R,TP,1005,-”

2203-000885

2

C395

“C-CERAMIC,CHIP”

“4.7nF,10%,25V,X7R,TP,1005,-”

2203-000885

2

C398

“C-CERAMIC,CHIP”

“4.7nF,10%,25V,X7R,TP,1005,-”

2203-000885

2

C325

“C-CERAMIC,CHIP”

“470pF,10%,50V,X7R,TP,1005,-”

2203-000940

2

C333

“C-CERAMIC,CHIP”

“470pF,10%,50V,X7R,TP,1005,-”

2203-000940

2

C334

“C-CERAMIC,CHIP”

“470pF,10%,50V,X7R,TP,1005,-”

2203-000940

2

C368

“C-CERAMIC,CHIP”

“470pF,10%,50V,X7R,TP,1005,-”

2203-000940

2

C388

“C-CERAMIC,CHIP”

“470pF,10%,50V,X7R,TP,1005,-”

2203-000940

2

C405

“C-CERAMIC,CHIP”

“470pF,10%,50V,X7R,TP,1005,-”

2203-000940

8-12

SAMSUNG Proprietary-Contents may change without notice

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

2

C461

“C-CERAMIC,CHIP”

“470pF,10%,50V,X7R,TP,1005,-”

2203-000940

2

C446

“C-CERAMIC,CHIP”

“47pF,5%,50V,NPO,TP,1005,-”

2203-000995

2

C462

“C-CERAMIC,CHIP”

“47pF,5%,50V,NPO,TP,1005,-”

2203-000995

2

C312

“C-CERAMIC,CHIP”

“4pF,0.25pF,50V,NPO,TP,1005,-”

2203-001017

2

C353

“C-CERAMIC,CHIP”

“56pF,5%,50V,NPO,TP,1005,-”

2203-001072

2

C411

“C-CERAMIC,CHIP”

“68pF,5%,50V,NPO,TP,1005,-”

2203-001153

2

C412

“C-CERAMIC,CHIP”

“68pF,5%,50V,NPO,TP,1005,-”

2203-001153

2

C304

“C-CERAMIC,CHIP”

“7pF,0.5pF,50V,NPO,TP,1005,-”

2203-001201

2

C441

“C-CERAMIC,CHIP”

“8.2nF,10%,16V,X7R,TP,1005,-”

2203-001210

2

“C302,L306”

“C-CERAMIC,CHIP”

“8pF,0.5pF,50V,NPO,TP,1005,-”

2203-001259

2

C386

“C-CERAMIC,CHIP”

“33nF,10%,16V,Y5V,TP,1005,1.0mm”

2203-001416

2

C300

“C-CERAMIC,CHIP”

“47nF,10%,16V,Y5V,TP,1005,1.0mm”

2203-001432

2

C314

“C-CERAMIC,CHIP”

“47nF,10%,16V,Y5V,TP,1005,1.0mm”

2203-001432

2

C331

“C-CERAMIC,CHIP”

“47nF,10%,16V,Y5V,TP,1005,1.0mm”

2203-001432

2

C336

“C-CERAMIC,CHIP”

“47nF,10%,16V,Y5V,TP,1005,1.0mm”

2203-001432

2

C355

“C-CERAMIC,CHIP”

“47nF,10%,16V,Y5V,TP,1005,1.0mm”

2203-001432

2

C429

“C-CERAMIC,CHIP”

“47nF,10%,16V,Y5V,TP,1005,1.0mm”

2203-001432

2

C307

“C-CERAMIC,CHIP”

“5pF,0.25pF,50V,X7R,TP,1005,1.0”

2203-001437

2

C309

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C313

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C339

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C354

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C364

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C380

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C417

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C420

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C436

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C451

“C-CERAMIC,CHIP”

“100nF,+80-20%,16V,Y5V,TP,1005,”

2203-005061

2

C413

“C-CERAMIC,CHIP”

“6pF,0.1pF,50V,NPO,TP,1005,-”

2203-005382

2

C408

“C-TA,CHIP”

“1uF,20%,10V,GP,TP,2012,2,0”

2404-001017

2

C467

“C-TA,CHIP”

“33uF,20%,6.3V,GP,TP,3528,-”

2404-001032

2

C317

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

2

C347

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

2

C348

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

2

C358

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

2

C374

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

2

C375

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

2

C396

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

2

C399

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

2

C414

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

SAMSUNG Proprietary-Contents may change without notice

8-13

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

2

C460

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

2

C465

“C-TA,CHIP”

“10uF,20%,6.3V,GP,TP,2012,-”

2404-001064

2

C453

“C-TA,CHIP”

“4.7uF,20%,6.3V,GP,TP,2012,-”

2404-001086

2

C385

“C-TA,CHIP”

“3.3uF,20%,6.3V,GP,TP,2012,-”

2404-001087

2

C389

“C-TA,CHIP”

“3.3uF,20%,6.3V,GP,TP,2012,-”

2404-001087

2

C447

“C-TA,CHIP”

“3.3uF,20%,6.3V,GP,TP,2012,-”

2404-001087

2

C498

“C-TA,CHIP”

“3.3uF,20%,6.3V,GP,TP,2012,-”

2404-001087

2

C499

“C-TA,CHIP”

“3.3uF,20%,6.3V,GP,TP,2012,-”

2404-001087

2

C352

“C-TA,CHIP”

“220nF,20%,20V,GP,TP,2012,-”

2404-001092

2

L315

INDUCTOR-SMD

“470nH,10%,0.8x1.6x0.8mm”

2703-000213

2

L316

INDUCTOR-SMD

“470nH,10%,0.8x1.6x0.8mm”

2703-000213

2

L312

INDUCTOR-SMD

“390nH,10%,0.8x1.6x0.8mm”

2703-000297

2

L403

INDUCTOR-SMD

“1uH,10%,0.8x1.6x0.8mm”

2703-000300

2

L310

INDUCTOR-SMD

“100nH,5%,1.6x0.8x0.8mm”

2703-001172

2

L400

INDUCTOR-SMD

“33nH,5%,1.6x0.8x0.8mm”

2703-001174

2

L307

INDUCTOR-SMD

“18nH,5%,1.6x0.8x0.8mm”

2703-001189

2

L313

INDUCTOR-SMD

“120nH,10%,1.6x0.8x0.8mm”

2703-001220

2

L305

INDUCTOR-SMD

“39nH,5%,1.6x0.8x0.8mm”

2703-001285

2

L319

INDUCTOR-SMD

“8.2nH,10%,1x0.5x0.5mm”

2703-001408

2

L320

INDUCTOR-SMD

“8.2nH,10%,1x0.5x0.5mm”

2703-001408

2

L323

INDUCTOR-SMD

“8.2nH,10%,1x0.5x0.5mm”

2703-001408

2

L351

INDUCTOR-SMD

“12nH,10%,1x0.5x0.5mm”

2703-001409

2

L410

INDUCTOR-SMD

“12nH,10%,1x0.5x0.5mm”

2703-001409

2

L402

INDUCTOR-SMD

“68nH,5%,1.8x1.12x1.02mm”

2703-001514

2

L404

INDUCTOR-SMD

“120nH,5%,1.7x1.14x1.02mm”

2703-001546

2

L405

INDUCTOR-SMD

“120nH,5%,1.7x1.14x1.02mm”

2703-001546

2

L301

INDUCTOR-SMD

“47nH,5%,1.0x0.5x0.5mm”

2703-001595

2

L303

INDUCTOR-SMD

“47nH,5%,1.0x0.5x0.5mm”

2703-001595

2

L322

INDUCTOR-SMD

“5.6nH,10%,1.0x0.5x0.5mm”

2703-001708

2

L406

INDUCTOR-SMD

“33nH,5%,1.0x0.5x0.5mm”

2703-001723

2

L407

INDUCTOR-SMD

“22nH,5%,1x0.5x0.5mm”

2703-001727

2

L308

INDUCTOR-SMD

“15nH,5%,1x0.5x0.5mm”

2703-001730

2

L350

INDUCTOR-SMD

“15nH,5%,1x0.5x0.5mm”

2703-001730

2

L302

INDUCTOR-SMD

“6.8nH,5%,1x0.5x0.5mm”

2703-001734

2

L330

INDUCTOR-SMD

“6.8nH,5%,1x0.5x0.5mm”

2703-001734

2

L311

INDUCTOR-SMD

“100nH,2%,2.29x1.73x1.52mm”

2703-001743

2

U307

OSCILLATOR-VCO

“954MHz,-,-,TP,3.3V,6.4mA”

2806-001146

2

U305

OSCILLATOR-VCTCXO

“19.68MHZ,2.5PPM,10KOHM//10PF,TP,3V,2MA”

2809-001225

2

F302

FILTER-SAW

“85.38MHz,0.630MHz,0.3MHz/0.3dB”

2904-001128

2

F304

FILTER-SAW

“967MHz,25MHz,967MHz/0.5dB,TP,9”

2904-001133

8-14

SAMSUNG Proprietary-Contents may change without notice

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

2

F400

FILTER-SAW

“836.5MHz,25MHz,+-25MHz/0.9dB,T”

2

F301

FILTER-SAW

“881.5MHz,25MHz,+-25MHz/0.9dB,T”

2904-001136

2

F401

FILTER-SAW

“836.50MHz,-,849MHz/1dB,TP,849M”

2904-001138

2

F300

FILTER-DUPLEXER

“881.5MHz,836.5MHz,4/2.7dB,TP,8”

2909-001077

2

BUZZ

BUZZER-MAGNETIC

“88dB,3.6V,90mA,2.731KHz,TP”

3002-001062

2

L300

CORE-FERRITE

“AB,1.6x0.8x0.8mm,-,-”

3301-001105

2

L309

CORE-FERRITE

“AB,1.6x0.8x0.8mm,-,-”

3301-001105

2

L317

CORE-FERRITE

“AB,1.6x0.8x0.8mm,-,-”

3301-001105

2

L321

CORE-FERRITE

“AB,1.6x0.8x0.8mm,-,-”

3301-001105

2

L325

CORE-FERRITE

“AB,1.6x0.8x0.8mm,-,-”

3301-001105

2

L326

CORE-FERRITE

“AB,1.6x0.8x0.8mm,-,-”

3301-001105

2

L328

CORE-FERRITE

“AB,1.6x0.8x0.8mm,-,-”

3301-001105

2

L409

CORE-FERRITE

“AB,1.6x0.8x0.8mm,-,-”

3301-001105

2

J301

CONNECTOR-COAXIAL

“SMC,JACK,100mohm,50ohm,0.5dB”

3705-001163

2

J300

CONNECTOR-SOCKET

“60P,2R,0.5mm,SMD-S,AUF”

3710-001390

2

U308

RF POWER SPLITTER

“2WAY,955-979MHz,12dB,-,TP”

4709-001080

2

-

PCB-SCH811 RF

“SCH-811,-,6,0.8T,118X90MM”

GH41-00020A

2

PBA MAIN RF

RMO-HOLDER BUZZER

“SCH-800,CR RUBBER,11x9xT3.5,BL”

GH73-40735A

1

-

MEA FRONT-SCH811B

“SCH-800,PCL,ISRL,-,-,-,-”

GH97-00918A

2

FOLDER ASSY

SCREW-MACHINE

“CH,+,M1.7,L2,ZPC(BLK),SWRCH18”

6001-000876

2

FRONT-COVER

PMO-HINGE DUMMY

“SCH-800,PC,BLK,-,-”

GH72-00067A

2

-

PMO-DECORATION B(CHNA)

“SGH-800,ABS,B/PEL,-,-”

GH72-00264C

2

WINDOW-LCD

PPR-TAPE WINDOW BOHO

“SCH-100,VINYL TAPE,TRP,-,-”

GH72-10001A

LABEL(M)-LOGO BADGE PCL

SCH-811 BLK

GH68-00365A

“SCH-811,-,-,BLK,-”

GH73-00080A

2

2904-001135

2

-

RMO-KEY PAD HEBREW

2

FRONT-COVER

RMO-HOLDER MIC

“SPH7000,SI RUBBER,PI8.0,T5.0,B”

GH73-40708A

2

SPEAKER

MPR-SPONGE SPEAK

“SCH-800,FOAM,®™8.5XT0.4,BLK,-”

GH74-00012A

2

FOLDER-UPPER

MPR-DECO BOHO VINYL

“SCH-800,VINYL,27X32.5X0.2,TRP,-”

GH74-00084A

2

-

MEC-FOLDER UPPER 811B

“SCH-811,PCL,BLK”

GH75-00139A

3

-

PMO-FOLDER UPPER 811B

“SCH-811,PC,BLK,-,-”

GH72-00285A

3

-

MCT-SHIELD GASKET

“SCH-800B,GASKET(SHIELD),30X34XT0.7,GRY,-”

GH74-00011A

3

-

MPR-TAPE UPPER

“SCH-800B,TESA 983,8X8XT0.15,TRP,-”

GH74-00031A

3

-

MPR-TAPE DECORATION

“SCH-800,TESA4965,16.9x23xT0.2,”

GH74-10772A

2

-

MEC-FOLDER LOWER 811B

“SCH-811,PCL,BLK”

GH75-00143A

3

-

NPR-BRACKET FOLDER

“SPH7000,C5210S-1/2H,T0.5,NI”

GH71-10722A

3

-

NPR-BRACKET FOLDER R

“SPH7000,C5210S-1/2H,T0.5,NI”

GH71-10726A

3

-

PMO-EARPIECE 811B

“SCH-811,PC,BLK,-,-”

GH72-00281A

3

-

PPR-PC SHEET LCD

“SCH-800,PC SHEET T0.6,BLK,-,-”

GH72-10545A

3

-

PMO-FOLDER LOWER

“SCH-800,PC,BLK,-,LEXAN SP-1210”

GH72-41804A

3

-

MPR-TAPE EAR PIECE

“SCH-800,FOAM TAPE,5X4XT0.4,BLK,-”

GH74-00005A

SAMSUNG Proprietary-Contents may change without notice

8-15

Level

Design LOC

ITEMS

DESCRIPTIONS

SEC.CODE

3

-

MPR-SPONGE EAR PIECE

“SCH-800B,PE SPONGE,8X11XT0.5,WHT,-”

GH74-00029A

3

-

MPR-SPONGE LCD

“SCH-800,SPONGE,41.5x38xT1.0,BL”

GH74-10774A

3

-

MPR-TAPE WINDOW LCD

“SCH-800,TESA4965,41.5X38XT0.2,”

GH74-10775A

3

-

MPR-TAPE VIBRATOR

“SCH-800,TESA4965,PI13xT0.2,TRP”

GH74-10776A

3

-

MEC-HINGE

“SCH-800,SEC,BLK”

GH75-11337A

4

HINGE

SPRING-HINGE

“SPH7000,PW2,PI5.0,D0.7,L11.2,-”

GH61-70056A

4

HINGE

HINGE-CAM

“SPH7000,ACETAL,BLK”

GH61-80004A

4

HINGE

HINGE-SHAFT

“SPH7000,ACETAL,BLK”

GH61-80005A

4

HINGE

HINGE-HOUSING

“SCH-800,PC(LEXAN SP-1210R),BLK”

GH61-80007A

4

HINGE-ASSY

ICT-MAGNET

“SCH-800B,ALLOY(AL+NI+CO),(3X15)T1.0,NTR”

GH70-00009A

2

-

MEC-FRONT COVER

“SCH-800,SEC,BLK”

GH75-11334A

3

FRONT-COVER

PMO-FRONT COVER

“SCH-800,PC,BLK,-,LEXAN SP-1210”

GH72-41800A

3

FRONT-COVER

PMO-REFLECTOR LED

“SCH-800,ACRYL,M/WHT,-,-”

GH72-41801A

2

-

ELA HOU-LCD ASS’Y

“SCH-811,SAMSUNG,-,LCD+MOTOR+SPKER,-,-,-”

GH96-00798A

1

-

MEA REAR-SCH800

“SCH-800,SEC,KOR,BLK,-,-,-”

GH97-01432A

2

REAR-COVER

LABEL(R)-QUALCOMM

“SCH-100F,VINYL,12X6,0.12,TRP”

GH68-30846A

2

REAR-COVER

MPR-SHIELD TAPE

“SCH-800B,CLOTH(SHIELD),30X8XT0.1,GRY,-”

GH74-00027A

2

-

MEC-REAR COVER

“SCH-800,SEC,BLK”

GH75-11338A

3

REAR-COVER

SPRING-LOCKER

“SPH7000,PW2,PI.8,D0.2,4.4,-”

GH61-70054A

3

REAR COVER

NPR-GROUND PLATE

“SCH-800B,C5210-3/4H,T0.1,-”

GH71-00010A

3

REAR-COVER

NPR-BRACKET ANT

“SCH-800,C2801S-1/4H,T0.5,AU(0.”

GH71-10742A

3

REAR-COVER

PMO-LOCKER BATT

“SCH-800,PC,BLK,-,-”

GH72-00068A

3

REAR-COVER

PMO-REAR COVER

“SCH-800,PC,BLK,-,LEXAN SP-1210”

GH72-41806A

1

-

PAA MAIN-PACKING 811 PCL

“SCH-811,PCL,ISRL,-,-,-,-”

GH99-02153A

2

-

BAG-PE

“PE,T0.06,150X300,-”

GA69-30508A

2

-

PAC-SILICAGEL

“SiO2,50x40,5,SKP-816H”

GA69-90502A

2

-

BAG-LDPE

“PELD,T0.06,100X260,SP-RM928”

GG69-30517A

2

-

LABEL(P)-SHIPPING 811 PCL

“SCH-811,CRAFT-PAPER 100G,250X180,-,BRN”

GH68-00386A

2

-

BOX(P)-MAIN GIFT BOX 811 IS

“-,SCH-811,-,171X220X94,-”

GH69-00169A

2

-

CUSHION-MAIN 811

“SCH-811,-,165X223X90”

GH69-00170A

2

-

CUSHION—DUMMY MANUAL

“SCH-811,SW5,124X208”

GH69-00185A

2

-

BOX(P)-MASTER MAIN

“SPRINT,SCH-2000,DW-3,498X355X2”

GH69-11133A

2

-

CUSHION-PAD MAIN

“SCH-2000,DW-3,483X340XT7”

GH69-20666A

2

-

CUSHION-PAD SIDE

“SCH-2000,DW-3,340X230XT7”

GH69-20667A

2

-

BAG-STD BATT.

“PE,T0.06,70X170,SCH-1011”

GH69-30503A

2

-

BAG-MANUAL

“PP,T0.06,125*280,SCH-1011”

GH69-30518A

8-16

SAMSUNG Proprietary-Contents may change without notice

8-2 Desk-top charger part List No

Design LOC

DESCRIPTIONS

SEC CODE

1

C7, C8

Y-CAP

2, 2nF, 20%, 250V

2201-001004

2

C1

X-CAP

100nF, 20%, 250V

2301-001092

3

C2, C3

CAP-FELECTRONIC

10uF, 400V, 85°C 10x16

2401-00

4

C21, C332

CAP-FELECTRONIC

680uF, 16V, 105°C 10x13

2401-003090

5

C23, C33

CAP-FELECTRONIC

220uF, 16V, 85°C 6x11

2401-000804

6

C36

CAP-FELECTRONIC

47uF, 16V, 85°C 5x7

2401-00

7

C6, C41

CAP-FELECTRONIC

10uF, 50V, 105°C 5x11

2401-00

9

F1

FUSE

250VAC, 2A 5x15 BLACK-TUBING

10

LD1, LD2

LED

RED/GRN-DUAL 3 (ROUND)

11

BD1

DIODE-BRIDGE

600V, 1A

0402-000003

12

D2, D3

DIODE-FR

1000V, 1A

0402-000012

13

D21, D31, D32

DIODE-SCHOTKY

40V, 1A

0402-000358

14

D30

DIODE-FR

200V, 1.5A/2A

0402-000205

15

D20

DIODE-SCHOTKY

60V, 5A

0402-000467

16

TH1

THERMISTER

5Ω, 10Ø

1404-000128

17

D1

TRANSIENT VOLTAGE

160V, 600W

18

U1

SUPPESSOR

TO-220, 700V, 1A

0505-00

19

U26

IC-pemto

35V, 1.5A, DIP-8P

1203-000391

20

U21

IC-SWITCHING

5V, 100mA, TO-92

1203-000542

21

PC1

IC-VOLTAGE REGULATER 120-180%, 200mW

0604-001098

REMARKS

8 3601-001125 0601-00

0402-000124

1404-001083 0403-001028

DIP-4P, ST

0604-000191

22

R21

PHOTO-OOUPLER

51Ω, 2W, 5%

2003-000327

23

R15, R16

R-METAL OXIDE

1/2W, 4.7MΩ, 5%

2009-001039

24

R51

R-SURGE

10KΩ, 25°C

1404-000215 1404-001014

25

VR1, VR2

R-NTC

1KΩ, 1/10W, 30% TOP, TP

2103-000210

26

TNR1

R-SEMIFIX

470V, 2500A, 300V, 3000A

1405-000001 1405-000193

27

J01-15

VARISTOR

0.6*52mm, SDACW

28

R26, R27, R45, R16

WIRE-NO SHEATH

1Ω, 1/4W, 1%, TP

29

R35, R52

R-METAL FILM

47KΩ, 1/8W, 5%, TP

30

R33, R47

R-CARBON FILM

4.7KΩ, 1/8W, 1%, TP

31

CHT009

R-METAL FILM

CHT09, 0.8mA, EE1916

ML26-00274A

32

LF1

S/W TRANS

UU1014-V, 22mH(MIN)

ML29-00023K

33

L22

LINE-FILTER

120uH, 10X5, 0, 40

34

L21

COIL-CHOKE(TROIDAL)

7uH 5X7,5

ML27-00252A

35

C25

COIL-CHOKE (DRUM)

2012, 104K, X7R, 50V

2203-000206

SAMSUNG Proprietary-Contents may change without notice

3811-000545

ML27-00

8-17

No

Design LOC

DESCRIPTIONS

35

SEC CODE

REMARKS

2203-000204

36

C4, C23, C24

CAP-CHIP

2012, 474Z, Y5V, 50V

2203-000922

37

C44

CAP-CHIP

2012, 474K, X7R, 50V

2203-000985 2203-000979

38

C34

CAP-CHIP

2012, 101J, NPO, 50V

2203-002278

39

C5, C7

CAP-CHIP

2012, 103K, X7R, 50V

2203-001458

40

C28, C30, C33, C42,

CAP-CHIP

2012, 104Z, Y52, 50V

2203-000192

2203-001604

C43, C45 41

C26

CAP-CHIP

2012, 224K, X7R, 25V

42

U25

u-com

u-com, 8bit, SOP-32P

0903-001148

43

U22

IC-OP AMP

28V, 150pA, DUAL

1201-000166

SOP-8P

1201-000167

36V, 1mA, DUAL

1202-000188

SOP-8P

1202-000104

2203-000575

44

U23, U24

IC-COMPERATER

1202-000187 45

Q23

46

Q21, Q22, Q24

47

FET-DUAL

12V, 5A, 0.05

P-CHANNEL

SO-8P

TR-PNP

SOT-23, 60V, 600mA

0501-000462

D33

DIODE-ULTRA HIGH SPEED

SOT-23, 80V, 100mW

0407-000114

49

R24, R44

R-CHIP

2012, 620Ω, 1%

2007-000

50

R25

R-CHIP

2012, 680Ω, 1%

2007-000

51

R28, R31, R32, R48, R63

R-CHIP

2012, 10KΩ, 1%

2007-000297

52

R36, R53

R-CHIP

2012, 470KΩ, 1%

2007-000922

53

R34, R51

R-CHIP

2012, 150KΩ, 1%

2007-000

54

R40, R49

R-CHIP

2012, 12KΩ, 1%

2007-000352

55

R61

R-CHIP

2012, 27KΩ, 1%

2007-00

56

R23, R43, R60

R-CHIP

2012, 91Ω, 1%

57

R64, R65, R66, R7

R-CHIP

2012, 470Ω, 1%

2007-00

58

R41

R-CHIP

2012, 4.7KΩ, 1%

2007-000868

59

R37, R54

R-CHIP

2012, 2.4KΩ, 1%

2007-00508

61

R38, R55, R69, R70

R-CHIP

2012, 47KΩ, 5%

2007-000

62

R1, R2

R-CHIP

2012, 10Ω, 5%

2007-000

63

R29, R47

R-CHIP

2012, 2.2KΩ, 5%

64

R30, R42, R68

R-CHIP

2012, 1KΩ, 5%

2007-000

65

R4

R-CHIP

2012, 750Ω, 5%

2007-000

66

R22

R-CHIP

2012, 180Ω, 5%

2007-000

67

R3

R-CHIP

2012, 5.6Ω, 5%

2007-000

0505-001180

48

2007-001677

60

8-18

2007-000493

SAMSUNG Proprietary-Contents may change without notice

No

DESCRIPTIONS

Design LOC

SEC CODE

REMARKS

68 69

B1, B2

CHIP-BEAD

3x4, CHIP-BEAD

3301-000329

70

CN21

BAIT-CONNENTOR-

4P, 3.0mm

ML74-001411

FRONT, REAR

30x9x10

CONNECTOR-C/B

3.9mm, 3(2)P

CASE ASS’Y-COVER

COVER (1)

71

CON1

72

3711-000203 ML72-00

GATE LABEL (1) BATT HOUSING (1) BATT LOCKER (1) TH+M3x8, BLK (1) 73

CASE ASS’Y-BOTTOM

BOTTOM (1), BOMPON (4)

ML72-00

74

LABEL, DTC81

30x50x0.15

ML68-0

SCREW-TAP

PH+, 2.6x12, BLK

76

PCB-MAIN DTC81

FR-1, loz, 125x64x1.2

77

PWR-CORD

75

(BOTTBM)

ML60-00001A ML41-00 ML39-00

78

(U1)

HEAT-SINK(U1)

15x13x5x1.0

ML62-00133A

79

(U1)

SCREW-TAP)U1)

PH+, M3x6

6001-000563

ADHESIVE-SEALANT

DC739, 40RTV

0201-001029

80

0201-000303 81

VINIL SACK

170x350x0.05, WHITE

82

SOLDER-WIRE

KR-19, S60A, D1.0

83

ALCOHL

(CH3)2CHOM

0204-000429

84

FLUX-SOLDER

920-CFX

MF02-00020A

0202-000178 0202-000193

0202-000226 85

SOLDER-WIRE

D3, 0, Sn60%

SAMSUNG Proprietary-Contents may change without notice

ML74-00113A

8-19

8-3 Hands-Free Kit Part List No

Design LOC

DESCRIPTIONS

1

UPPER C/D

FOR CRADLE

2

LOWER C/D

FOR CRADLE

3

FRAME

FOR CRADLE

4

HOLDER SOCKET

FOR CRADLE

5

LOCKER

FOR CRADLE

6

EJECTOR

FOR CRADLE

7

SPRING LOCK

FOR CRADLE

8

SPRING EJECT

FOR CRADLE

9

HOLDER C/D

FOR CRADLE

10

COVER GATE

FOR CRADLE

11

SCREW

#2 BT 2.6x6B

12

SCREW

BM 3x6B

13

SCREW

#2 BT 2x8Y

14

CASE CONN UPPER

FOR CONNECTOR JACK

15

CASE CONN LOWER

FOR CONNECTOR JACK

16

BUTTON PUSH

FOR CONNECTOR JACK

17

CURL CORD ASS'Y

FOR CONNECTOR JACK

18

CONNECTOR

FOR CONNECTOR JACK

19

SPRING PLATE

FOR CONNECTOR JACK

20

CABLE DATA ASS'Y

HIROCE 15P

21

SCREW

#2 FT2x6B

22

CASE UPPER

CONTROL BOX CASE

23

CASE LOWER

CONTROL BOX CASE

24

BRACKET INSTALL

CONTROL BOX CASE

25

RIVET

CONTROL BOX CASE

26

HEAT SINK

CONTROL BOX CASE

27

SCREW

#2 PS 3x6 Y

28

SCREW

#2 PS 3x12 B

29

CASE UPPER

MICROPHONE

30

CASE LOWER

MICROPHONE

31

SPRING FIXING

MICROPHONE

32

SCREW

#1 FT 2x8 B

33

CABLE MIC

1P+1SCHIELD WIRE+PLUG

34

CUSHION MIC.

MICROPHONE

35

MIC CONDENSOR

CMP-68(NP)

36

CABLE POWER

4P, RED-BLK-YLW-WHITE

37

LABEL

FOR CRADLE

38

LABEL

FOR CONTROL BOX

39

LABEL

FOR SPEAKER

40

LABEL BAR CODE

FOR SERIAL NO.

8-20

SEC. CODE

REMARKS

SAMSUNG Proprietary-Contents may change without notice

No

Design LOC

DESCRIPTIONS

41

LABEL BAR CODE

FOR PRODUCT

42

MANUAL

4-COLOR PRINT

43

POLYBAG

15x27, PE

44

POLYBAG

6x9, PE

45

CABLE TIE

80mm

46

POWER LOG

ø6

47

SCREW

#1 BT4x16B

48

SCREW

PM 4x6B

49

BOX ACCESSORY

FOR ACCESSORY ASS'Y

50

UNIT BOX

FOR PACKING

51

PACKING PAD

FOR PACKING

52

OUTER BOX

FOR PACKING

53

CASE FRONT

FOR EXTERNAL SPEAKER

54

CASE REAR

FOR EXTERNAL SPEAKER

55

HANDLE SPEAKER

FOR EXTERNAL SPEAKER

56

BOLT

FOR FIXING HANDLE

57

HEX. NUT

WITH WASHER

58

SPEAKER

LEEWON 9050F

59

SPEAKER WIRE

2P

60

SCREW

#1 PT 3x12B

61

LABEL

62

LABEL 3 SORTS

SAMSUNG Proprietary-Contents may change without notice

SEC. CODE

REMARKS

8-21

No

Design LOC

DESCRIPTION

1

ZD201, ZD202

ZENER DIODE

5.1V 0.5W - DIP

2

ZD1

TVS DIODE

P6KE33 - DIP

3

D5, D7, D101, D102

DIODE

1N4148 - DIP

4

D1, D2, D3

DIODE

1N5818 - DIP

5

D100

DIODE

SDS7000 - CHIP

6

R278

RESISTOR

CH2012 1ohm-J 5%

7

R9

RESISTOR

CH2012 91oohm-F 1%

8

R8

RESISTOR

CH2012 8.2K-F 1%

9

R3, R13, R131

RESISTOR

CH2012 100ohm-J 5%

10

R51, R52, R139, R272

RESISTOR

CH2012 220ohm-J 5%

11

R279

RESISTOR

CH2012 270ohm-J 5%

12

R137, R138

RESISTOR

CH2012 330ohm-J 5%

13

R31, R32, R225, R251, R257,

RESISTOR

CH2012 1K-J 5%

SEC. CODE

REMARKS

R270 14

R132

RESISTOR

CH2012 1.8K-J 5%

15

R213, R217, R228, R229,

RESISTOR

CH2012 2.2K-J 5%

R230, R231 16

R271

RESISTOR

CH2012 2.4K-J 5%

17

R1, R7, R112

RESISTOR

CH2012 2.7K-J 5%

18

R18

RESISTOR

CH2012 3K-J 5%

19

R12

RESISTOR

CH2012 3.9K-J 5%

20

R38, R110, R113, R117,

RESISTOR

CH2012 4.7K-J 5%

R119, R268 R275 21

R57, R233, R248

RESISTER

CH2012 5.1K-J 5%

22

R5, R10, R17, R20, R23,R27

RESISTER

CH 2012 10K-J 5%

R30, R33, R41, R44 R45, R46, R55, R56, R100. R104, R108, R109, R111, R115, R116, R120, R122, R123, R124, R135, R201, R202, R203, R204, R205, R207, R208, R210, R211, R212, R215, R252, R253, R254, R255, R258, R260, R266, R270, R274, R276, R114 23

R269

RESISTER

CH 2012 560 ohm-J 5%

24

R102

RESISTER

CH 3216 10K-J 5%

25

R43

RESISTER

CH 3216 12K-J 5%

26

R54, R267

RESISTER

CH 3216 10K-J 5%

8-22

SAMSUNG Proprietary-Contents may change without notice

No 27

Design LOC

DESCRIPTIONS

R19, R128, R266

RESISTER

CH 2012 12K-J 5%

28

R24

RESISTER

CH 2012 15K-J 5%

29

R106, R107, R121, R127, R277

RESISTER

CH 2012 18K-J 5%

30

R16, R126

RESISTER

CH 2012 22K-J 5%

31

R40, R222, R223, R224

RESISTER

CH 2012 27K-J 5%

32

R4, R21, R37, R101, R105

RESISTER

CH 2012 33K-J 5%

SEC.CODE

REMARKS

R136, R140, R259, R273 33

R133, R134

RESISTER

CH 2012 47K-J 5%

34

R227

RESISTER

CH 2012 56K-J 5%

35

R216, R226

RESISTER

CH 2012 68K-J 5%

36

R36, R42, R53, R103, R125,

RESISTER

CH 2012 82K-J 5%

R129 R141, R214, R261 37

R26

RESISTER

CH 2012 100K-J 5%

38

R39

RESISTOR

CH 2012 220K-J 5%

39

R29

RESISTOR

CH 2012 1M-J 5%

40

R14

RESISTOR

CH 2012 5.6K-J 5%

41

R50

RESISTOR

0.1 ohm/1W-F-DIP

42

L6

RESISTOR

22 ohm/1W-J-DIP

43

VR1

VAR. RESISTOR

0.2 ohm/1W-J-DIP

44

C255, C256

ELEC. CAPACITOR

MVR32 5K

45

C257

ELEC. CAPACITOR

0.47UF/50V (5*11)85˚C

46

C15, C204, C205, C206, C259

ELEC. CAPACITOR

2.2UF/16V (5*11)85˚C

47

C104

ELEC. CAPACITOR

10UF/16V (5*11)85˚C

48

C106

ELEC. CAPACITOR

10UF/25V (5*11)85˚C

49

C258

ELEC. CAPACITOR

22UF/35V (5*11)85˚C

50

C207

ELEC. CAPACITOR

47UF/16V (5*11)85˚C

51

C1

ELEC. CAPACITOR

100UF/35V (6.3*11)85˚C

52

C7, C18, C23, C29, C40,

ELEC. CAPACITOR

470UF/16V (8*11.5)85˚C

C43, C45, C260 53

C4

ELEC. CAPACITOR

470UF/35V (10*18)85˚C

54

C221

TAN. CAPACITOR

4.7UF/16V (5*11)85˚C

55

C32, C101, C105, C107

CERAMIC CAPACITOR

CH 2012 B330P-J (330)

C108, C109, C110, C111, C112, C111133,, C114, C115, C1116, C117, C118, C119, C201, C202, C215. C216, C217 56

C17

CERAMIC CAPACITOR

CH 2012 B470P-K (471)

57

C5, C25, C209, C218, C222,

CERAMIC CAPACITOR

CH2012 B102-K (102)

SAMSUNG Proprietary-Contents may change without notice

8-23

DESIGN LOC

No

DESCRIPTION

SEC. CODE

REMARKS

C223, C261 58

C250

CERAMIC CAPACITOR

CH 2012 B152-K (152)

59

C100

CERAMIC CAPACITOR

CH 2012 B103-K (103)

60

C219, C220

CERAMIC CAPACITOR

CH 2012 B472-K (472)

61

C2, C3, C6, C13, C14, C16, C22,

CERAMIC CAPACITOR

CH 2012 B104-Z (104)

C24, C26, C30, C31, C41, C42, C44,C46, C103, C120, C121, C2224, C226, C228, C237, C238, C239, C241, C242, C243, C244, C245, C246, C247, C248, C249, C251, C252, C253, C254, R209 62

C208, C213

CERAMIC CAPACITOR

CH 2012 B105-Z (105)

63

C263

CERAMIC CAPACITOR

CH 3216 B104-Z (104)

64

C262

CERAMIC CAPACITOR

CH 2012 B224-Z (224)

65

L2

INDUCTOR (COIL)

220UH (18ø )

66

L4

INDUCTOR (COIL)

220UH (13ø )

67

L1

INDUCTOR (COIL)

10UH

68

L3

INDUCTOR (COIL)

20UH

69

J100

CONNECTOR-DATA

20P (RP13A-12RC-20PB)

70

J201

MIC JACK

TC38-001-01

71

J203 FOR SPEAKER

CONNECTOR-SPEAKER

LAD-1140-02 (2 PIN)

72

J1

CONNECTOR-POWERR

LAD-1140-04 (4 PIN)

73

Q20, Q21

TRANSISTOR

B772-DIP

74

Q1, Q2, Q6, Q11, Q12, Q13, Q14,

TRANSISTOR

KST2222A - CHIP

Q15, Q16, Q100, Q101, Q102, Q103, Q104, Q105, Q107, Q108, Q109, Q110, Q208 75

Q3, Q8, Q106, Q202

TRANSISTOR

KST2907A - CHIP

76

Q4, Q5

FET

IRF9540 OR 2SJ176 - DIP

77

BT201

X-TAL

I2.288Mhz - DIP

78

BT100

RESONATOR

3.58Mhz - DIP

79

U201, U207

IC

LM358 - CHIP

80

U202

IC

AD1845 - CHIP

81

U204

IC

ADSP-2176 - CHIP

82

U205

IC

74111C14D - CHIP

83

U206

IC

93C66 - CHIP

84

U208

IC

HEF4051B - CHIP

85

U100

IC

PIC6C73 - CHIP

86

U1

IC

NJM2360 OR KA34063 - CHIP

8-24

SAMSUNG Proprietary-Contents may change without notice

No

DESIGN LOC

DESCRIPTIONS

87

U4

IC

LM2576 - DIP

88

U2

IC

LM7805 - CHIP

89

U3

IC

LP2951CM

90

U5

IC

LM3403 - CHIP

91

U101

IC

LM2904 - CHIP

92

S201

SWITCH

TACT SWITCH

93

U209

IC

TDA1905 - DIP

94

P.C.B

No

REMARKS

SEC. CODE

REMARKS

SEC. CODE

REMARKS

MAIN PCB SCH 811

DESIGN LOC

DESCRIPTIONS

1

MIC ASS'Y

CMP-68

2

SPEAKER ASS'Y

4 ohm 5W

3

POWER CABLE

4 PIN POWER CABLE ASS'Y

No

SEC. CODE

DESIGN LOC

DESCRIPTIONS

1

RESISTOR

CH 2012 330 ohm-J 5%

2

RESISTOR

CH 2012 2.2K-J 5%

3

RESISTOR

CH 2012 1K-J 5%

4

CONNECTOR WAFER

13 PIN 2mm PITCH ANGLE

5

CONNECTOR WAFER

15 PIN 2mm PITCH ANGLE

6

PHOTO INT.

SG215 - DIP

7

THERMOSTOR

C103JF4C (10K 1%)

8

LED (LED TACK)

KARG138 (5 , 3 COLOR)

9

COILD CORD CABLE

13 PIN 2mm PITCH ANGLE

10

DATA CABLE

15 PIN 2mm PITCH ANGLE

11

P.C.B

SUB PCB SCH-811

SAMSUNG Proprietary-Contents may change without notice

8-25

8-4 Travel charger No

DESIGN LOC

DESCRIPTIONS

1

U2

IC OPTP

2

U1

IC PWM P/S

TOP222P

3

U4

IC V.REF TO -92

KA431AZ

SEC. CODE

REMARKS

LTV817V TLP621GRH

TL431ACLP KIA431 4

D1, 2, 3, 4

DIODE REC

1N4007

5

D21

DIODE SCHOTKY

SR560 SR560

6

D7, 20

DIODE SW

RLS4148

7

D5

T.V.S DIODE

P6KE160A P6KE1600A

8

D6

DIODE UF

9

D24

DIODE ZENER

RLZJ4.3

10

LED

LED CONNECTOR

352111-0310

11

LED

12

MOV1

UF40007 UF4007

ALL-153GW VARISTOR

D62Z0V300RA65

M.O.V

TNR12G471K RG06P102

13

VR1

SEMI-FIXEED RES

14

L1, 2

INDUCCTOR

15

PTF1

SGH500 TRANS

16

L20

CHOKE ASS'Y

17

R4, 5

SURGE RESISTOR

PPSR0.5W

18

C1, 2

CAP EL

SHL400V10UF

19

C22

CAP EL

KMF16V330UF

20

C21

CAP EL

AG10V1000UF

21

C4, 20, 24

CAP EL

1SK1C476M05007

22

C8

CE. CAP

440DL472

23

C3

CE. CAP

ECSL3A220K06BS5

24

C6

MY. CAP

S/M2A152J

25

TH

THERMISTOR

FTG-310H37

26

F1

MICRO FUSE

MST

27

SK2

CONN. HEADER

5267-04A

28

Q7

S.S. TR

KTA1273

29

R2

CHIP RESI

MCR18EZHJ6R2

30

R14, 15, 16

CHIP RESI

MCR18EZHF1R0

31

JP1, 2, 3

CHIP RESI

MCR18EZHJ0R0

SCH500

SDE472M

CR180R0JM

8-26

SAMSUNG Proprietary-Contents may change without notice

DESIGN LOC

DESCRIPTIONS

32

R66, 67

CHIP RESI

33

JP4, 5

CHIP RESI

MCR10EZHJORO

34

R57

CHIP RESI

MCR10EZHF1501

SEC. CODE

REMARKS

MCR18EZHJ511 CR18511JM

CR10150FM 35

R58

CHIP RESI

MCR10EZHF2201 CR102201FM

36

R17

CHIP RESI

MCR10EZHJ470 CR10470JM

37

R1

CHIP RESI

MCR18EZHJ103 CR18103JM

38

R59

CHIP RESI

MCR10EZHJ102

39

C23

CHIP CAPACITOR

CM21COG331J50AT

40

C5

CHIP CAPACITOR

CM316Y5V224Z50AT

41

C25, 26, 27, 28, 29, 30

CHIP CAPACITOR

CM21Y5V104Z50AT

42

U3

IC HYBRID

AH1504F

43

MICOM IC

PIC16C711

44

P.C.B

TC30

45

AC PLUG ASS'Y

46

PLUG TERMINAL

47

CONTACT TERMINAL

48

CONTACT TERMINAL

49

CASE BOTTOM

50

CASE TOP

51

SCREW

52

SCREW

53

OUTPUT CABLE ASS'Y

54

LABEL

55

CARTON BOX

56

MAIN BOARD

57

CARD BOARD(A)

58

CARD BOARD(B)

59

PAD

60

VINYL SACK

AXR324100201

SAMSUNG Proprietary-Contents may change without notice

8-27

8-5 CLA Parts List

No

Design LOC

DESCRIPTIONS

SEC CODE

REMARKS

MAIN SMD ASS'Y 1

C6, C9

CERAMIC CAPACITOR

CL21B04JBNCS/0.1U

2

C3

CERAMIC CAPACITOR

CL21B103JBNCS/0.01U

3

C5, C10

CERAMIC CAPACITOR

CL21B224JBNCS/0.22U

4

D7

CHIP DIODE

KDS181

5

D5, D6

CHIP DIODE

KDS184

6

R21

CHIP RESISTOR

RC1608J102CS/1K OHM

7

R111, R12, R22, R34

CHIP RESISTOR

RC1608J104CS/100K OHM

8

R31

CHIP RESISTOR

RC1608J134CS/130K OHM

9

R33

CHIP RESISTOR

RC1608J182CS/1.8K OHM

10

R15

CHIP RESISTOR

RC1608J222CS/2.2K OHM

11

R29

CHIP RESISTOR

RC1608J272CS/2.7K OHM

12

R35

CHIP RESISTOR

RC1608J304CS/300K OHM

13

R13

CHIP RESISTOR

RC1608J333CS/33K OHM

14

R14

CHIP RESISTOR

RC1608J335CS/3.3M OHM

15

R5

CHIP RESISTOR

RC1608J392CS/3.9K OHM

16

R16, R17

CHIP RESISTOR

RC1608J431CS/430 OHM

17

R27

CHIP RESISTOR

RC1608J432CS/4.3K OHM

18

R6, R24

CHIP RESISTOR

RC1608J562CS/5.6K OHM

19

R7, R18, R19, R20,

CHIP RESISTOR

RC1608J912CS/9.1K OHM

R26, R28, R30, R32 20

Q3, Q5, Q7, Q9, Q10, Q11

CHIP TRANSISTOR

KSR1104/NPN

21

Q4, Q8

CHIP TRANSISTOR

KSR2104

22

Q1, Q6

CHIP TRANSISTOR

KTA1504 INSERT ASS'Y

23

J1

7 PIN CONNECTOR

GILS-7P-S2T2-EF

24

L1

CHOKE COIL

RF-300/300UH

25

D2, D4

SCHOTTKY DIODE

1N5819

26

D1

TRANSIENT DIODE

P6KE36A

27

U4

DIODE

KA431

28

C7

ELECT CAPACITOR

CESSL1C100MAAT/10U16V 105˚C

29

C2, C4

ELECT CAPACITOR

CESSL1C331MAAT/330U16V 105˚C

30

C1

ELECT CAPACITOR

CESSX1V101MAAT/100U35V 105˚C

31

F1

FUSE

250V/2A

32

U1

ADJUST REGULATOR I.C.

LM2576T-ADJ

33

U2

O.P AMP

KA358D

34

U3

O.P AMP(14P)

KA324D

35

LED 1, 2

DUALL COLOR LED LAMP

SAM3270

36

R4

CARBON FILM RESISTOR

0.5 OHM 11/2W

37

R2

CARBON FILM RESISTOR

11K OHM 1/4W

8-28

SAMSUNG Proprietary-Contents may change without notice

No

Design LOC

DESCRIPTIONS

38

R1

CARBON FILM RESISTOR

470 OHM 1/4W

39

R3

CARBON FILM RESISTOR

680 OHM 1/4W

40

VR1

V. RESISTOR

1K OHM/VOLUME/GF06P

41

CURL CORD ASS'Y

7 PIN/MQ179

42

CLA PCB

FR-4 (T=1.6)

43

OUTER GND

1.68PIE/25MM

44

WIREJUMPER

PC/BLACK

45

UPPER COVER

PC/BLACK

46

LOWER COVER

PC/BLACK

47

FUSE COVER

CLA OUTER SPRING

48

OUTER SPRING

CLA POWER CONTACT

49

POWER CONTACT

CLA

50

SPRING

FUSE HOLDER/CLA

51

FUSE HOLDER

FUSE PLATE/CLA

52

FUSE PLATE

TAPPING SCREW

+PH (2.6x14-2S) BLACK

53

UPPER+LOWER

NAME LABEL

CLA010A

SEC. CODE

REMARKS

ELECTRIC ASS’Y

PACKING ASS’Y 54

HANISHELLL

55

OUT BOX

CARTON BOX

56

CURRUGATED PAD

CLA CORRUGATED PAD

57

CLA SPONGE

SAMSUNG Proprietary-Contents may change without notice

8-29

9. PCB Diagrams 9-1

Cellular Phone

9-1-1 Main PCB - LOGIC B'D

9-1

Cellular Phone

9-1-2 Main PCB - LOGIC B'D

9-1

Cellular Phone

9-1-3 Main PCB - RF B'D

9-1-4 LCD FPC

9-2 Desk-Top rapid Charger PCB Top View

Bottom View

9-3 Hands-Free kit 1 PCB

Top View

Bottom View

9-4 Cradle 1 PCB Top View

9-5 TC PCB Top View

Bottom View

9-6 CLC PCB Top View

Bottom View

Main Block Diagram

SCH - 811 BLOCK DIAGRAM 3.6V

BATTERY DC/DC 550mAh 1000mAh 1600mAh

Regulator

3.3V

Regulator

3.3AV

Regulator

3.3BBA

Regulator

3.3VT

Regulator

3.3VRC

3.7V CONV.

COMBINATION MEMORY 8M FLASH + 2M SRAM FLASH MEMORY 8M FLASH

EEPROM 256K BITS

1st RF

2nd RF SAW FILTER

Driver Amp

SAW FILTER

130.38 MHz

IF AGC AMP I

PA

D/A CONV.

USER INTERFACE

80186 16BIT CPU

Q

& 824~894 MHz

Filter

PLL & VCO

DUPLEXER

10-1

LCD & KEY

Interleaver

MOD.

& Encoder

Vocoder

A/D CONV.

1ST LO SYNTH

&

(966.87+/12.5 MHz)

MIC PCM CODEC

&

Filter

SPK

VCO RF SAW FILTER

RF AMP

IF BPF

DEMOD

IF AGC AMP

A/D CONV. I

LNA

Q

869~894 MHz 85.38 MHz

Deinterleaver & Decoder

EXT Vocoder I/F

& EVRC Filter

FM DATA PROCESSOR

FM AUDIO PROCESSOR

10-2

Desk-Top rapid Charger Block Diagram

C-C Input

Line

Rectifier

Rectifier

Filter

& Flate

& Flate

Filter

C-V

FET-S/W

Control

Front-out 4.2V/0.8A Snubber u-com

Rectifier & Flate

Reference

Switch |

LED

Over-voltage protection

Display

LED-controller

Controller

charging control

O.C.P O.V.P

| Thermal protection

Feedback

Buck Converter

Filter

C-C C-V Control

FET-S/W Rear-out 4.2V/0.4A

10-3

Hands-Free kit 1 Block Diagram

STABILITY CIRCUIT

POWER (10V~28V)

POWER CONTROL

REGULATOR 5V (RESET CIRCUIT)

DC/DC REGULATOR

CURRENT DETECTOR

VOLTAGE/ CURRENT FEEDBACK

IGNITION

MICOM

CRADLE

DATA COMMUNICATION

EEPROM

DSP

Tx AMP CALIBRATION CODEC Rx AMP MICROPHONE

VOLUME CONTROL

AUDIO AMP

SPEAKER

10-4

Travel Charger Block Diagram

1

2

3

4

5

6

7

8

9

10

11

12

14

13

15

16 A

A R105 CD

FM_CLK FM_STB FM_RX_QD FM_RX_ID

100 MSM

100

+3.3V : E6, F5, J5, K6, E9, F10, J10, K9

R182

R181

DGND : E7, E8, F6, F7, F8, F9, G5, G6, C106 100pF

100pF

10K

C151 1000pF

C152 100pF R183

Q_OFFSET

+3.3V

C104 2.2K

C103

220pF

1K

+3.3V

470pF

1000pF

+3.3V

C183

C184

C185

0.01uF

0.01uF

0.01uF

0.01uF

P10 A12

U102

6 5 17 26

+3.3V

R117 1K

VCC VCCP

VLR+ VLR-

VCCA

BZ

GND GNDP GNDA

LO

B11

19 16 15 14 18 42

C115 + C117

C116

21 8 36

0.01uF

0.1uF

1U/10V(R) TP1

M10

1K R120

+3.3V

2

1

F

MMBT2222A

A0 A1 A2 GND

VCC NC SCL SDA

R124

8 7 6 5

R121

15K

24LC256

B5 C7 A7 A8 C8 B9 C9 D9

MUX_CTL

SCL SDA

D110

3

C208 R218

2

1

4

3

150 C207

SVC_LED

2

R216 22K

C119

1

0.01uF

SML-020MLT

C162

R126

ALT_LED

OPEN

M4

R129

DP_TX_DATA DP_RX_DATA

1

100

P5

R130

V_DC

M3

470

M5

C123

C122

C121

TP2

N5

1U/10V

A6

JACK_S

A3

L101 Q103 6 5 4

BATT

D1 D2 D3 D4 S G

1 2 3

+ C125

33U/6.3V(B) 1 2 3 4 5 6 7 8

C127

0.01uF

100K

R136 10K

Q104

1UF

VDD VS LL_ DR DMAX_SS DS COMP PGND UVLOSET FB NI COSC VREF ROSC GND ENABLE

1 2 3 4

(1608)

16 15 14 13 12 11 10 9

D1 S1 S1-1 G1

D2 S2 S2-2 G2

100K

8 7 6 5

C129

R150 C132

100U/6.3V(B)

0.1uF

0.1uF

3

1

DTC144EE

4

5

+3.3AV

VCC INB INA OUTGND

4

1 2 3

4

ADC_IN0 1

DGND1

DGND2

DGND3

DGND4

R145 47K

6.8K

D104 DA204UT

R146 100K

100K

V_F

R122

R123

1.2K

10K(1%)

LRS1306

C211 0.1uF

D124

3

R230

2

DSP_RESET_

D126

25 26 19 23 31 30 28

X102

SSR27.00B-C15

CKO TDO

M12 P8 L7

52 9 63

21 27

D

+3.3V

TC4W53F PCM_DOUT

R213 13K

C181

H2

R225 33

R212 33

IMD_CTL ADC_SEL1 ADC_SEL0 ADC_IN0 TRK_LO_ADJ

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59

0

MODE_SEL _IDLE _SLEEP

CHIPX8 C166

R222 OPEN

BUZZ_

OPEN

VBAT VBAT R190

C_RX_QD(3) C_RX_QD(2) C_RX_QD(1) C_RX_QD(0) C_RX_ID(3) C_RX_ID(2) C_RX_ID(1) C_RX_ID(0) TX_CLK _TX_CLK CHIPX8 PA_ON

100K

C164

U111 4

C_RX_ID(3) C_RX_ID(2) C_RX_ID(1) C_RX_ID(0)

MUX_CTL

V_DC

ADC_EN ADC_DATA ADC_CLK

TX_IQ_D(7) TX_IQ_D(6) TX_IQ_D(5) TX_IQ_D(4) TX_IQ_D(3) TX_IQ_D(2) TX_IQ_D(1) TX_IQ_D(0)

8 7 6 5

LED_ON

R221 OPEN

L2 H1 H4

E

U112 COMMON VDD CH0 INH CH1 VEE A VSS

Q123

C2 B1 C1

F4 F3 F2 F1

C

J104

+3.3V

G4 G3 G2 G1

14

51 10

1

_PCS6

J2 J1 H3 J4 K1 K2 J3 L1

IBF2_PIBF IBF1 DO1

11

TCK TMS RSTB TRST CKI2 CKI TDI

1 2 3 4

CO_DIN

MMBT2222A

1K

L11

2

TCXO_4

TC7S04F

C_RX_QD(3) C_RX_QD(2) C_RX_QD(1) C_RX_QD(0)

0.01uF

PLL_CLK PLL_DATA PLL_EN SYN_EN RX_AGC_ADJ

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60

F

+3.3V TX_AGC_ADJ LOCK ADC_EN ADC_DATA ADC_CLK Q_OFFSET I_OFFSET

G

FM_RX_ID FM_RX_QD FM_CLK FM_STB TCXO_4 TX_IQ_D(7) TX_IQ_D(6) TX_IQ_D(5) TX_IQ_D(4) TX_IQ_D(3) TX_IQ_D(2) TX_IQ_D(1) TX_IQ_D(0)

_TX_CLK SPK-

TX_CLK

H

HEADER30X2

SPK+

+3.3V

A10 D1 M2

LCD_CS D130 SM05

_SLEEP _IDLE

4.7K

MODE0 MODE1 MODE2

B2 C3 D4

I_OFFSET D3 Q_OFFSET D2

2

1

4

5

6

D129 D111

CD

RI

D135 RTS

KEY_0

V_F

KEY_1

C_F

1 2 3

SMS05C

UP

F4

DOWN

F1

F2

F3

SMS05C

SEND

CLR

J110 100K

100K END/P

1

2

3

4

5

6

RX_AUDIO DGND C_F DGND TX_AUDIO DGND DP_RX_DATA DP_TX_DATA HP_PWR RI CD

1 2 3 4 5 6 7 8 9 10 11

12 13 14 15 16 17 18 19 20 21 22

V_F DGND RTS BATT BATT CTS DTR DGND C_F V_F BATT

3

2

4

5

KEY_2

J103

R173

D125

+3.3V

R211 22K

M14 L12 N14

R175

D123

CO_DOUT

9 NC1 36 NC2

IACK

OBE2_POBE OBE1

18 TRAP 12 INT1 13 INT0 7 DI1

EL_EN

100K

D122

_LWR _RD

N12

3

C133

D121

NC

U115 DSP1627SS

58 OCK2_PCSN 57 DO2_PSTAT 56 SYNC2_PBSEL 55 ILD2_PIDS 53 OLD2_PODS

_PCS6

C156 100pF

V_DC

R174

D120

OLD1 OCK1 ICK1 ILD1 SYNC1 SADD1 DOEN1

C170

C171

0.01uF

0.1uF

J105

0.1uF

1000pF

5

C158 0.01uF

MBM29LV800T

R189 22K

N13

R172

BATT

2 3 4 5 62 61 60

3

C155 0.1uF

22 VSS1 25 VSS2

+3.3V

VOL_KEY

10U/6.3V(R)

7

R210 47K

AD(15) AD(14) AD(13) AD(12) AD(11) AD(10) AD(9) AD(8) AD(7) AD(6) AD(5) AD(4) AD(3) AD(2) AD(1) AD(0)

37 36 35 34

C_RX_QD(0:3)

1 2 3

SCAN_0 KEY_3 SCAN_1

R149

23 18 16 14 35 33 31 29 19 17 15 13 34 32 30 28

VEC3_IOBIT4 VEC2_IOBIT5 VEC1_IOBIT6 VEC0_IOBIT7

7

8

9

*

0

H

D127

NNYG101TS

R177

C167

100K

1500P

J

LCD_CONN_22

C161

0.1U

C222

0.1U

C200

C202

C198 C197

C163

100K

I

47P 0.1U 47P 47P 0.1U 47P 47P 47P 47P 47P 47P 47P 47P 47P 470P 47P

C201

Engineer: CDMA2 Drawn by: JB-KIM R&D CHK:

IFCON

100K

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

LCD_CS _RESET A(1) DGND AD(7) D112 AD(6) AD(5) 1 SMS05C AD(4) AD(3) AD(2) AD(1) AD(0) 6 DGND +3.3V +3.3V SPK+ SPKMOTOR EL_EN

0.1U

C194 C192 C190 C196 C187 C188 C186 C191 C195 C193 C199

K

COMPANY NAME Address City Size: A3

TITLE:

R178 R168 51

V_F_CON

R169 51

R170 51

R171 51

B

R188

2

0.01uF

10K

0

_RD _LWR _RAM_CS

12

37 RY_BY* 21 _BYTE 11 _RESET

+3.3V R186

_RESET

VCC

DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0

24 _OE 26 _CE 10 _WE

R187

TX_IQ_D(0:7)

SCAN_0 SCAN_1 SCAN_2 SCAN_3 SCAN_4 SCAN_5 SCAN_6

V_DC

Q101 DTA144EE

C118

GND

A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

1

TC7W04FU

R176

1

3

31 _SWE 44 _SCE 9 _SOE

_FRP

_RESET

0.1U

R148 100K

AD(15) AD(14) AD(13) AD(12) AD(11) AD(10) AD(9) AD(8) AD(7) AD(6) AD(5) AD(4) AD(3) AD(2) AD(1) AD(0)

100

4.7K

2SC4081BR

27

A(19) A(18) A(17) A(16) A(15) A(14) A(13) A(12) A(11) A(10) A(9) A(8) A(7) A(6) A(5) A(4) A(3) A(2) A(1)

R185 10K

38 39 20 3 2 1 4 5 6 7 8 40 41 42 43 46 45 44 27

+3.3AV 29

C_RX_ID(0:3)

R147

+3.3V

K

11

_KEYSENSE4

+ C138

MIC5205-3.3BM5

C221 R144 Q107

LCD_CS _SLEEP _IDLE

GPIO7

5

VIN VOUT GND CONT BYP

C137

TC7S32FU 3

C_RX_QDATA3 C_RX_QDATA2 C_RX_QDATA1 C_RX_QDATA0

_RFR

+3.3AV

150K

2

_CTS

10U/6.3V(R)

R153

HP_PWR

C_RX_IDATA3 C_RX_IDATA2 C_RX_IDATA1 C_RX_IDATA0

470pF

R142 68K(1%)

1 2 3

_GP_WR GPIO_INT1

C135

0.1U U107

U116

GPIO17

+ C136

MIC5219-3.3BM5

C220

R141 100K(1%)

0.1uF

TX_IQDATA7 TX_IQDATA6 TX_IQDATA5 TX_IQDATA4 TX_IQDATA3 TX_IQDATA2 TX_IQDATA1 TX_IQDATA0

TAMN1

5

VIN VOUT GND CONT BYP

28 _RD _FOE _ROM_CS 26 _FCE _LWR 10 _FWE

M11

R223

1

150K 15K

C128

CHIPX8 TCXO_4 TX_CLK _TX_CLK

2

+3.3V

U106 1 2 3

R152

A(19) A(18) A(17) A(16) A(15) A(14) A(13) A(12) A(11) A(10) A(9) A(8) A(7) A(6) A(5) A(4) A(3) A(2) A(1) A(0)

U114

U110

MSM2300BGA

RESET_ VCC GND

MAX809S

C130 100pF R139

R135 100K

GPIO_28 GPIO22 ADC_ENABLE ADC_DATA ADC_CLK

U108

RN1104

R138

J

_DT_R

GPIO21

ON_SW_SENSE

2

22K

SI9161 56K

_PCS6

GPIO20

Q106 3 UPS5819 + C131

_ROM_CS _RAM_CS _EEPROM_CS

GPIO13

R151

V_DC

D109

SI6803

_LWR

TMS TCK TDO TDI _TRST GPIO14 GPIO15 GPIO16

M6 GPIO19 P9 GPIO_INT0

+3.3V C139

U105

R134

PS_HOLD DC_DC_CON

10uH

MCL4148

0.1uF

SI3443

I

D107

R137 100

C126

_HWR

M9 _RESIN P11 RESOUT

33K SMS05C

VBAT

WDOC_STB

P4 DP_TX_DATA L5 DP_RX_DATA

470pF

100pF

100pF

470pF C120

R127

+3.3V

4

C210 47P

C180

_RD

5

2

FR2S2025-052500

22K

3

2

6

S1 R215

3

22K M8

R133

1

Q124 2SA1576

R132

+3.3V

100

D128

39K

1

R131

DTR CTS

R214

D11 C12 B13 B14 D12 C13 E10 C14 E12 D13 E11 D14 F12 E13 E14 F11 G12 F14 F13 G14

_WP_ROM

RTS

WDOG_EN

100

IMD_CTL

U114 TC7W04FU

+3.3V

2

XTAL_OUT

L9 GPIO_INT2 P2 PDM1 P3 PDM2

REED_SW

2

47P

47K

BATT

4.7K

DTC144EE

C209

P6

R217

Q125

3

47P

+3.3V SVC_LED

47P

150 R220

G

A9 N6

DTC144EE

XTAL_IN

B6 GPIO8 D7 GPIO9 B7 GPIO10 B8 GPIO11 D8 GPIO12

Q126

+3.3V

MOTOR

OPEN

SSR27.00B-C15

1K

PLL_DATA PLL_CLK PLL_EN V_F_CON ADC_SEL0 ADC_SEL1 SYN_EN

PLL_DATA PLL_CLK PLL_EN V_F_CON ADC_SEL0 ADC_SEL1 SYN_EN MODE_SEL

H

N11

R125

DTA144EE

1K

L10

X101

U104

3

R128

2

P12

10K

+3.3V

3 Q121

M13 P13 K10

N7 GPIO24 N10 GPIO_INT4 N4 RINGER L6 GPIO18

SEND_END

RX_AUDIO

BUZZ_

A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

B12 PCM_SCS B10 AUX_PCM_CLK C10 AUX_PCM_SYNC D10 AUX_PCN_DIN A11 AUX_PCM_DOUT

+3.3AV

41

E

1 2 3 4

PCM_CLK

M7 GPIO23 P7 GPIO25 N8 GPIO26 L8 GPIO27

MODE_SEL DSP_RESET_

ST5092TQ

Q120

PCM_SYNC

+3.3V

R116

1

PCM_DOUT

1

C169 0.1uF

SPK+ SPK-

VFR+ VFR-

C11

Q119

MMBT2222A

47 45 42 40 37 35 33 30 46 43 41 39 36 34 32 29

I_O15 I_O14 I_O13 I_O12 I_O11 I_O10 I_O9 I_O8 I_O7 I_O6 I_O5 I_O4 I_O3 I_O2 I_O1 I_O

6

3 2

20 10 24 25

1

2

0.1uF R155 R113 5.6K 1M

CO CI CS CCLK

38 MIC3+ 37 MIC3-

C112

1SS226

R250 4.7

DX DR FX MCLK

31 MIC2+ 30 MIC2-

C168 0.1uF

D102

A13

34 MIC1+ 33 MIC1-

3

12 FVPP 14 _FWP

5

OPEN

0.1uF

13 SVCC 38 FVCC

3

C204

OPEN

C111

FA18 FA17 SA17_FA16 SA16_FA15 SA15_FA14 SA14_FA13 SA13_FA12 SA12_FA11 SA11_FA10 SA10_FA9 SA9_FA8 SA8_FA7 SA7_FA6 SA6_FA5 SA5_FA4 SA4_FA3 SA3_FA2 SA2_FA1 SA1_FA0 SA0

4

+

C203

47P

1UH(X)

10U/6.3V(R) C109 0.1uF

C205

47P

L105

1.5K + C110

6

2.7K

+3.3AV

TX_AUDIO C206

R115

+3.3AV 100K

5

R114

R111 C108

PCM_DIN

4

2 4 5 3 1

GPIO_INT3

1

TC75W56FU

33U/6.3V(B)

D

_WP_ROM CO_DOUT PCM_SYNC PCM_CLK PCM_DOUT CO_DIN

SEND_END JACK_S

2

8 1 7 4

VCC AOUT BOUT GND

15 16 48 1 2 3 4 5 6 7 8 17 18 19 20 21 22 23 25 24

A(19) A(18) A(17) A(16) A(15) A(14) A(13) A(12) A(11) A(10) A(9) A(8) A(7) A(6) A(5) A(4) A(3) A(2) A(1) A(0)

AD(15) AD(14) AD(13) AD(12) AD(11) AD(10) AD(9) AD(8) AD(7) AD(6) AD(5) AD(4) AD(3) AD(2) AD(1) AD(0)

3

AA+ B+ B-

SMS05C

2 3 5 6

G11 G13 H14 H13 H12 H11 J14 J13 J12 J11 K14 K13 K12 K11 L14 L13

GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6

U103 R109 120K R110 43K

J102

R112 OPEN

0.1uF

R224 1K

U109

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

VDDA

IOBIT3_PB7 IOBIT2_PB6 IOBIT1_PB5 IOBIT0_PB4 SADD2_PB3 DOEN2_PB2 DI2_PB1 CK2_PB0

VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSSA

C134

D101 SM05

SYNTH_LOCK PA_ON PA_R0 RA_R1 LNA_RANGE TRK_LO_ADJ TX_AGC_ADJ RX_AGC_ADJ

39 40 41 42 44 45 46 47

C5 B4 D5 A4 C6 A5 D6

200K R108 1K

BATT

K4 L4 L3 N1 N2 N3 K3 M1

+3.3AV

LNA_GAIN ALE NMI

MIC

+3.3V FM_RX_CLK E2 FM_RX_STB E1 FM_RX_QDATA E3 FM_RX_IDATA E4

U101

AD(7) AD(6) AD(5) AD(4) AD(3) AD(2) AD(1) AD(0)

PCM_CLK PCM_SYNC

A(0:19)

1 8 17 22 33 43 49 59 32

C182

WSYMCLK_GPIO29 N9 MASKDATA_GPIO30 K5

22K

4.7K

R154

AD(0:15)

100pF

R107

A2_KEYSENSE0 C4_KEYSENSE1 B3_KEYSENSE2 E5_KEYSENSE3

J111

+3.3V

100pF

20K

8200pF C100 0.01uF

+3.3V

C154

10K

STOP

R103

R102 C102

R101 C101

R100

C153

1K

15

1K

TRK_LO_ADJ TX_AGC_ADJ RX_AGC_ADJ

C

C159 0.01uF

R184

PA_ON

B

C160 1000P

I_OFFSET 1K

G7, G8, G9, G10, H5, H6, H7, H8, H9, H10, J6, J7, J8, J9, K7, K8

R104

VDD1 VDD2 VDD3 VDD4 VDD5 VDD6 VDD7 VDD8 VDD9

C105 LOCK

+3.3V

6 16 20 24 38 48 50 54 64

R106 RI

KEY_0

LED_ON

DOC CTRL CHK:

100K

KEY_1

SCH-811 LOGIC

KEY_2

MFG ENGR CHK:

16 1 12 A

L

L Changed by:

Date Changed: CDMA2

1

2

3

4

5

6

7

8

9

10

11

1999.02.12 12

Time Changed: 9:02:31 am

13

REV:

QA CHK:

14

Drawing Number:

15

Page: 1

16

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16 A

A +3.3VRC C340 100P R332

3

R334

1

2

4

36K

+

5

R335 43K

C355 0.047U

U314 LMV821

R333 56K

C389 BLM11A102S 3.3U/6.3V(R)

1

C300 0.047U C398 4700P

3

C301 1000P

Q300 2SC4081BR

IMD_CTL

100P

F300 DFA0836G0881A 4 10

TXOUTPUT

C304 7P

D

R323 OPEN

R330 1K

L305 39N(X)

R325 2K L304 100P

C307 5P

4

Q301 BFP196W

C311 100P

L306 8P

C321

R305

1

C316 100P

C312

L350 3

15N(W) Q302 BFP420

2

2 OUT

~OUT

C388 470P

L312 390N(X)

9

4

C327

10

5

1000P

C397 OPEN

6 7 8

_FMIF NC IFCON GND1 GND2 GND3 GND4_IFCON

L315

OPEN

470N(X)

10

RXIF C333 470P

R326 OPEN

9

_RXIF

D

C334 470P C335 OPEN

OPEN(X) F303 SAFC85.380ME35X

100K

+3.3VRC

C C330

RF2617

L314 R308

47N(W)

5 8 3 6 11 12

RX_AGC_ADJ 1K

13 14 15

_CDIF VCC1 VCC2 4 FMIF VCC3

4700P

MODE_SEL R309

16

2

C328

1 2 3 C323 1000P

7

CDIF IN_SEl GC

L313 120N(X)

SW395

1

6

G1G2G3G4G5G6

B

L316 470N(X)

+3.3VRC C339 0.1UF

R301

R300

C337 100P

C342 100P

U310 2

L322 5.6N(W)

U309

R321 100

C345

1

V_DC

CTL

BYP

GND 2

10uF/6.3V(R)

2

F

10uF/6.3V(R)

4

C356 0.01UF

R310 47K

G

_SLEEP

C357 4700P

C346 1P U306 LMX2332L

+3.3VRC C393 100P

VCC

19 20 C349 100P

OUT

GND1 GND2 GND3 GND4 GND5

3

C347 10U/6.3(R)

VT

4

R318 16

1

R316 0 C351

2 5 6 7 8

3900P

C350 100P

R317 16

4 R314 0

C353 56P

R315 5.1K

J300

PLL_CLK PLL_DATA PLL_EN SYN_EN RX_AGC_ADJ

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60

C352 0.22U/6.3(R)

U311

C354

C382

0.1U

0.01UF

+3.3BBA

+3.3V

3

TX_AGC_ADJ LOCK ADC_EN ADCDATA ADCCLK Q_OFFSET I_OFFSET

VOUT

CTL

VIN

BYP

GND 2

1

R327 0

C386 0.033U

C384

4

4700P

R328 910

5 3 6 8 13 16

DO_RF _RX_IN GND1 _IFIN IFIN GND2 GND3 DOIF GND4 GND5

C362 100P

TCO-555 3

OUT

VC GND GND1 GND2

1 2 5 6

TRK_LO_ADJ

H

C381 0.01U

VCC 4

L328 R399 BLM11A102S 150

+3.3BV C365

C366

100P

0.01U

C348 10U/6.3V(R)

I

C383 10P

PLL_CLK PLL_EN PLL_DATA

C387

C367

C369

C370

0.01UF

100P

100P

100P

TCXO

+3.3VRC

U313 NTH5G36B103J01TE

C385 3.3U/6.3V(R)

C378 0.01UF R322 47K

1

+3.3VT

U312 C374

MIC5205-3.3BM5 1

V_DC RXIFMDATA RXQFMDATA FM_CLK RXFMSTB TCXO_4 TXD(7) TXD(6) TXD(5) TXD(4) TXD(3) TXD(2) TXD(1) TXD(0)

U305 C363 100P

R313 10

7

RX_IN TCXO_IN

RX_IF_IN

R329 0

VDC_R RX_IF_DO

2 14 15 17

1 18

11 12 10 9

MIC5205-3.3BM5 5

VIN

VOUT

5 10U/6.3V(R)

2

C372 0.01U

C373 100P

J

TEMPO C371 0.01U

R324 6.2K

C375 10uF/6.3V(R)

C379 4700P

4

BYP

BUZZ_

4

2

BUZZ

GND 2

CTL

3

_IDLE

K Engineer: CDMA2 Drawn by: JB-KIM

3

C376 4700P 1

RXQD(3) RXQD(2) RXQD(1) RXQD(0) RXID(3) RXID(2) RXID(1) RXID(0) TXCLK TXCLK_ CHIPX8 PA_ON

VIN

C317

R320 0

U307 VC-3R3A30-0967

L321 BLM11A102S

H

BUZZ_ V_DC V_DC VBAT VBAT

VOUT

4

6

R319 10

MRFIC0916

MODE_SEL _IDLE _SLEEP

L325 BLM11A102S 5

C396 10U/6.3V(R)

1P

4 1

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59

C359 0.01UF

L309 BLM11A102S

MIC5205-3.3BM5

C399

100P

U308 STH-01R

IMD_CTL ADC_SEL1 ADC_SEL0 ADC_IN0 TRK_LO_ADJ

L317 BLM11A102S C360 4700P

10

C341

AT-32011

3

C361 1000P

3 4 2

L320 8.2N(W)

TX_1ST_LO

VDC_R U304 C358 10U/6.3V(R)

3

100P

G

1

R311

L318 OPEN(W)

C344

C380 0.1U

R395 68K

1

E

+3.3VRC

C395 4700P

3 4 5 6

C343 0.01UF

C336 0.047U

2

R394 100

L319 8.2N(W) F304 FAR-F5CE-967M00-K286 C338 3P 1 2

C313 0.1U

DTC144EE 3

MODE_SEL

R396 0

+3.3VRC

Q303

R393 OPEN

200

10

ANT

K

~IN

C332 4700P

U303

C324 C325 3P 470P

5

1

v2 out2

L303

C305 22P

F

J

6

3

2 4

OUT

2

gnd

in

IN

2 3 4 7 8 9

+3.3VRC

L307 18N(X)

I

5

1000P

3

v1 out1

1

C508 3P

L353 0N(W)

G4 6 G3 5 G2 4 G1 3 IN 1

E

1

U300 CMY210

4 C320

6 L323 8.2N(W) 5

12N

4P

10

L311 100N(CY)

U301

3P

4 L351

J301 MHC-173

C322 10P

15N(W)

1K

220

33P

C368 470P

L308

C315 100P

R307

F302 FB_G953

3 1

C306 OPEN

D301 BAR63-02W

F301 FAR-F5CE-881M50-D233 1 2

6.8N(W)

2 L302 6.8N(W)

C319

L330

C303 100P

1

C308 OPEN

C391 33P

C302 8P

D300 BAR63-02W

C326 100P

C310

0

C

C331 0.047U

L310 R306 12K 100N(X)

R398

L326 BLM11A102S

C314 0.047U

R303 10

C318 4700P

C309 0.1U

R302 27

2 4 D302 BCR400W

C390 4700P

L301 47N(W)

C329 220P

L300

VP VP1

B

-

VCC VCC1

MODE_SEL

100K

+3.3VRC

DATA EN CLK FOLD

RX_AGC_ADJ

R331 1M

C364 0.1U

D310 DAN202U

VDC_R

COMPANY NAME Address City

R&D CHK:

16 1 12 A

SCH-811 RX

MFG ENGR CHK:

HEADER30X2

Size: A3

TITLE:

DOC CTRL CHK:

L

L Changed by:

Date Changed: CDMA2

1

2

3

4

5

6

7

8

9

10

11

1999.02.12 12

Time Changed: 9:02:31 am

13

QA CHK:

REV:

14

Drawing Number:

15

Page: 1

16

1

2

3

6

5

4

7

8

9

10

12

11

13

14

15

16 A

A

U409 4

U401 Q5312I-3S2

64 +3.3BV RXIFMDATA TCXO 63 RXQFMDATA 61 +3.3V TXVCO_T1 RXFMSTB 62 FMCLK 38 5 +3.3BV6 +3.3BV1 10 +3.3BV2 14 51 +3.3BV7 +3.3BV3 48 21 68 TXCLK +3.3BV4 +3.3BV8 49 23 71 TXCLK_+3.3BV5 +3.3BV9TXVCO_T2 75 ADCENA 74 ADCDATA 73 ADCCLK FM_MOD 52 CHIPX8 29 TCXO_4

C

TXCLK TXCLK_ ADC_EN ADCDATA ADCCLK CHIPX8 TCXO_4 R447 OPEN

TXD(0:7)

47 46 45 44 43 42 41 40

TXD(7) TXD(6) TXD(5) TXD(4) TXD(3) TXD(2) TXD(1) TXD(0)

D

E

PD_OUT TXIQ7 TXIQ6 TXIQ5 TXIQ4 TXIQ3 TXIQ2 TXIQ1 TXIQ0

RXID(0:3) RXID(3) RXID(2) RXID(1) RXID(0) RXQD(3) RXQD(2) RXQD(1) RXQD(0)

RXQD(0:3)

56 55 54 53 60 59 58 57

F LOCK _SLEEP MODE_SEL _IDLE I_OFFSET Q_OFFSET

G

C443 0.01U

RXI3 RXI2 RXI1 RXI0 RXQ3 RXQ2 RXQ1 RXQ0

PD_ISET

RXVCO_OUT

C444 0

C445 0

C403 6P(1%)

R404 10K(1%)

0

R409 39K(1%)

R405 300(1%)

R445 0

C470 0.01U

R448 11.3K(1%)

C471 0.01U

C

R408 0

C406 OPEN

R410 1.8K

R400

C400

10

100P

TCXO

C407 1000P

D

C408 1U/10V(R)

C410

80

TEMPO

C405 2200P

R407

19

VBAT

10K(1%)

2

NO3 GND

47K

RX_IF_IN

GND4 GND5 GND6 GND7 GND8 GND9 GND10 GND11

2 RXVCO_T1 1 28 GND12 4 30 GND13 37 9 GND14 13 39 GND15 20 50 GND16 3 22 67 GND17RXVCO_T2 25 72 GND18 27

C411

R411

68P

10K

L402 68N(COI,X)

D402 1SV279

C413 6P(1%)

RX_IF_DO

E

D403 1SV279

+3.3VT R412 10K

C412 68P

R450 0

Q402

C460 10UF

R416 0

2SA1576

L403 1UH(X)

R417 10K

PSV

C417 0.1U

C419 1000P

U402

C442 0.01U

NO2 NO1

VCC

C420 0.1U

C447 3.3U/6.3V(R)

C448 100P

C421 0.01U

7

F

C499

C446 47P

C431 1000P

C429 0.047uF

3.3U/6.3V(R)

C432 L407 100P 22N(TX)

R427 51

L406 33N(TX)

PA_ON LOCK SLEEP_ FM_ IDLE_ I_OFFSET Q_OFFSET

TXIF

C422

12

1

1000P

TXIF_

R423 1.8K

2

C423

11

OUTX

IF_IN

IN_INX

OUT

5 C468 0.01U

R418 0

6

R419 0

U404 C416

1000P

3

GND

GCTL

U403

L404 120N(X)

8

C424

CXA3222N

2

IF-

VCC

1000P

33 NC1 34 NC2 65 NC3 66 NC4

L405 120N(X)

RFOUT C425 1000P

R446 0 C427

C426

0.01U

100P

1 4

R425 1M

7 2

5

C450

1000P

0.01U

C418 18P

R444

1

F401

12N(TX)

FAR-F5CE-836M50-K205

C461 470P

R440 5.1K

C462 47P

R437 0 +

3

-

2

4 8

C498 3.3U/6.3V(R)

C451 0.1U

5

C452 0.01uF

C453 4.7uF

C409 1000P

U408 6 5 4

4

U405 LMV821

R441 12K

-

2

VBAT

U406 LMV821

D1D2 D3D4 S G

1 5 7

1 2 3

L409

38

68

C439 0.01U

C465 10U/6.3V(R)

23

C436 0.1U

VREF

PIN

I

VDD1 VDD2 GND4 GND1

9

GND2 GND3 POUT

6

TXOUTPUT C495 OPEN

J C435 0.01U

C433 OPEN

2

SI3443DV

R435 47K

+3.3BV

C434 100P

U407 RI23124U 3

C497 OPEN

4 3

H

TX_1ST_LO

5

+

C441 8200P

G

R428 20

L410

+3.3VT

1 20K

3

C438 0.01U R443 2.2K R442 39K

C440 0.01U

TX_AGC

TX_AGC_ADJ

1

GN01037B

C430 1000P

R421 270K

LO_BYPASS

6 GND0 3 GND1 LO

560K

1

C428 100P

IF+

R422

TX_AGC

FAR-F5CE-836M50-D232 8

R424 430K

51 C449

R420 20

F400

RF2628

+3.3V

I

6 RF_IN VDD1 4 VAGC 2 GND1 5 GND2VDD2

100P

R426 1K

C454 100P

J

C496 OPEN

Q401 DTC114EE

PA_ON

TX_AGC

+3.3BBA BLM11A102S C467

K

B

ADC_IN0 R449

1

MAX4524

R402

C402 39P R403 10K

5

0

D401 1SV279

16

15

3

47K D400 1SV279 R406

39P L400 33N

ADC_SEL1

8

R401

100P

31 GND0 32 GND1 35 GND2 36 GND3

H

C401

ADC_SEL0

6

NO0

4 24 77 79 78 70 69

COM ADDB

17

+3.3BBA

7

ADDA

26

18

10

INHIBIT V+

2

RXIF _RXIF RXIFMDATA RXQFMDATA RXFMSTB FM_CLK

9

76 ADCIN 8 RSSI

1

B

7 RXIF 6 RXIF_

33UF/6.3V

C455

C456

C459

C404

C463

C464

1000P

0.01U

1000P

0.01U

1000P

0.01U

+3.3VRC C414

14 C457

C458

1000P

0.01U

C437 1000P

U410 NTH5G36B103J01TE

10U/6.3V(R)

1

2

C415 0.01UF

R451 6.2K

R439 1.5K

R452 12K

K Engineer: CDMA2 Drawn by: JB-KIM R&D CHK:

R438 10K

C472 0.01U

COMPANY NAME Address City Size: A3

TITLE:

DOC CTRL CHK:

SCH-811 TX

MFG ENGR CHK:

16 1 12 A

L

L Changed by:

Date Changed: CDMA2

1

2

3

4

5

6

7

8

9

10

11

1999.02.12 12

Time Changed: 9:02:31 am

13

QA CHK:

REV:

14

Drawing Number:

15

Page: 2

16

10-5

Main Circuit Diagram (1/3)

Main Circuit Diagram (2/3)

Main Circuit Diagram (3/3)

LCD FPC Circuit Diagram

10-7 Hands-Free kit 1 Circuit Diagram (data)

Hands-Free kit 1 Circuit Diagram (audio)

Car Adaptor 1 Circuit Diagram

10-8

Cradle 1 Circuit Diagram

10-9

Travel Charger Circuit Diagram

10-10 CLC (Cigarette Lighter Charger) Circuit Diagram