CDMA CELLULAR TELEPHONE SCH-811
SERVICE CDMA CELLULAR TELEPHONE
Manual
CONTENTS 1. General Introduction 2. Specification 3. Installation 4. NAM Programming 5. Product Support Tools 6. Troubleshooting 7. Exploded view and its Part List 8. Electrical Parts List 9. PCB diagrams 10. Block & circuit diagrams
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ELECTRONICS
Samsung Electronics Co.,Ltd. GH68-00398A 1999. 3. REV. 1.0
1. General Description The SCH-811 cellular phone functions as both analog cellular phone working in AMPS (Advanced Mobile Phone Service) mode and digital cellular phone working in CDMA (Code Division Multiple Access) mode. CDMA type digital mode applies DSSS (Direct Sequential Spread spectrum) mode which first came to be used in the military. The DSSS reduces channel cross talk and allow to use one frequency channel by multiple users in the same specific area, resulting in increase of channel capacity to about ten times compared to that of analog mode currently used. Soft/Softer Handoff, Hard Handoff, and Dynamic RF Power Control technologies are combined into this phone to reduce the call drop while usage. CDMA digital cellular network consists of MSO (Mobile Switching Office), BSC (Base Station Controller), BTS(Base Station Transmission System), and MS (Mobile Station). MS meets the specifications of the below: E IS-95A : Mobile Station-Base Station Compatibility Standard for Dual-Mode Wideband Spread Spectrum Cellular System E IS-96A : Speech Service Option 1 Standard for Dual-Mode Wideband Spread Spectrum Cellular Systems E IS-98A : Standards for Dual-Mode Wideband Spread Spectrum Cellular Mobile Station E IS-126 : Mobile Station Loopback Service Options Standard SCH-811 is composed of main handset, rapid charger, three batteries (1600 mAh, 1000 mAh, 550mAh), handsfree kit, car adaptor, and travel charger. Hands-Free Kit is designed to be operated in full-duplex mode taking turn-around delay between the phone and the system into account.
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1-1
2. Specification 2-1 General Frequency Range Transmitter Receiver
Digital Mode : 824 ~ 849 MHz : 869 ~ 894 MHz
Analog Mode 824 ~ 849 MHz 869 ~ 894 MHz
Channel Spacing : 1.23 MHz 30kHz Number of Channels : 20 FA 832CHs Duplex Spacing : 45 MHz 45MHz Frequency Stability : ±2.5 ppm (-20ûC ~ +60ûC, -4ûF ~ +140ûF) Operating Temperature : -30ûC~+60ûC (-4ûF ~ +140ûF) Operating Voltage HHP : 3.6V DC (±10%) Hands-free : 13.7V DC (±10%) Size and Weight : 88.0 x 56.5 x 26.7/27.6/31.3 mm including slim battery : 117.3 g including standard battery : 145.2 g including extended battery : 160.5 g Operating Time Digital Mode Standby Time
Talk Time
2-1
: up to 36 hours (with slim battery) : up to 65 hours (with standard battery) : up to 100 hours (with extended battery) : up to 75 min (with slim battery) : up to 150min (with standard battery) : up to 240min (with extended battery)
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2-2 Digital Mode Waveform Quality Time Reference Rx Sensitivity and Dynamic Range Tx Output Power Tx Frequency Deviation Occupied Band Width Tx Conducted Spurious Emission Minimum Tx Power Control Open Loop Power Control Standby Output Power
Colsed Loop Tx Power Control Range
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0.944 or more ±1uS or less -104dBm, FER=0.5% or less -25dBm, FER=0.5% or less 320mW (25dBm) ±300Hz or less 1.32MHz 900KHz : -42dBc / 30KHz below 1.98MHz: -54dBc / 30KHz below below -50dBm -25dBm: -57.0dBm ~ -38.5dBm -65dBm: -17.5dBm ~ + 1.5dBm -104dBm: +18.0dBm ~ +30.0dBm below -61dBm Test1: ±24dB or less Test2: 0mS ~ 2.5mS Test3: ±24dB or more Test4: ±24dB or more Test5: ±24dB or more
2-2
2-3 ANALOG MODE TRANSMITTER RF output power Carrier ON/OFF conditions ÒONÓ Condition ÒOFFÓ Condition Compressor Compression Rate Attack Time Recovery Time Reference Input Preamphasis Maximum Freqency Deviation F3 of G3 Supervisory Audio Tone Signaling Tone Wideband Data Post Deviation Limiter Filter 3.0 ~ 5.9KHz 5.9 ~ 6.1KHz 6.1 ~ 15KHz Over 15KHz
0.6W (+2/-4dB) within ±3dB of specification output (in 2mS) below-60dBm (in 2mS) 2:1 3mS 13.5mS Input level for producing a nominal ±2.9KHz peak freqency deviation of transmitted carrier 6dB/OCT within 0.3 ~ 3KHz ±12KHz ±2KHz (±10%) ±8KHz (±10%) ±8KHz (±10%) above 40 LOG (F/3000) dB above 35 dB above 40 LOG (F/3000) dB above 28 dB
Spectrum Noise Suppression
For all modulation f0+20KHz ~ f0+45KHz
For modulation by voice and SAT f0 +45KHz
For modulation by WBD(without SAT) and ST (with SAT) f0+45KHz ~ f0+60KHz f0+60KHz ~ f0+90KHz f0+90KHz ~ 2f0 Harmonic and conducted Spurious Emissions
2-3
above 26 dB
above 63 +10 LOG (PY) dB
above 45 dB above 65 dB above 63 +10 LOG (PY) dB (where f0=carrier frequency PY=mean output power in watts) below 43 + 10 LOG (PY) dB
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RECEIVER De-Emphasis Expander Expander Rate Attack Time Recovery Time Reference Input Sensitivity
-6dB / OCT within 0.3 ~3KHz 1:2 within 3mS within 13.5mS output level to a 1000Hz tone from a carrier within ±2.9KHz peak frequency deviation 12dB SINAD / -116dBm
Intermodulation Spurious Response Attenuation
avove 65dB
RSSI Range
above 60dB
Protection Against Spurious Response Interference
above 60dB
In Band Conducted Spurious Emission Transmit Band Receive Band Other Band
below -60dBm below -80dBm below -47dBm
Radiated Spurious Emission Frequency Range 25 ~ 70 MHz 70 ~ 130MHz 130 ~ 174 MHz 174 ~ 260 MHz 260 ~ 470 MHz 470 ~ 1GHz
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Maximum Allowable EIRP -45dBm -41dBm -41 ~ -32dBm -32dBm -32 ~ -26dBm -21dBm
2-4
2-4 CDMA Debug Display Information (menu 8) IN IDLE MODE 1
2
3
Sxxxx 4
SIx
T-xx
x Dxxx
Pxxx
-xx
6
CHxxx 8
7 5
IN CONVERSATION MODE
9
10
TEx T-xx Pxxx
REx
11
xx Dxxx
x -xx
3
CHxxxx
1 : Sxxxxx : SID (System ldentification) toggle Nxxxxx : NID (Network Identification) toggle 2 : SIx : Slot cycle index (lowest between the system and the phone will be used) 3 : Handset Status : 0 - Acquisition 1 - Synchronization 2 - Paging (Idle) 3 - Traffic Initialization 4 - Traffic Mode 5 - Exit 4 : T-xx : Tx adjust, Value ranges from +63 ~ -63dB 5 : Dxxx : sector power in dBm 6 : -xx : Ec/Io 7 : Pxxx : PN offset 8 : CHxxxx : channel number 9 : TEx : Tx vocoder rate (8 is full rate, 1 is 1/8th rate) E : EVRC V : 13k or 8k 10 : REx : Rx vocoder rate (8 is full rate, 1 is 1/8th rate) 11 : xx : Walsh code used in traffic channel
2-5
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2-5 FM Debug Display Information (menu 8) 1
4
SIDxxxxx 2
PWRx SATx
3
x RSSIxxx
5
CHxxxx 6
1 : SIDxxxxx : FM Home System ID 2 : PWRx : Power Level 0~7 3 : SATx : Supervisory Audio Tone code (0~3) 4 : x (Using Frequency Band) : A Band or B Band 5 : RSSIxxx : RSSI value 6 : CHxxx : Using Channel
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2-6
3. Installation 3-1 Installing a Battery Pack 1. To attach the battery pack after charging, align it with the phone about 1cm (1/2 inch away from its place so that the two arrows on the phone are seen, the battery charge contacts pointing downward. 2. Slide the battery pack upwards until it clicks firmly into position. The phone is now ready to be turned on. 3. To remove the battery pack, release it by pressing the button on the rear of the phone. 4. Slide the battery pack downward about 1cm (1/2inch and lift it away from the phone.
Press this button to release the battery pack
3-1
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3-2 For Desk Top Use 1. Choose a proper location to install the charger for Desk Top use. 2. Plug the power cord of the charger into an appropriate wall socket. When the power is connected correctly, the lamps turn on briefly. 3. To charge the battery pack, insert the battery pack into the rear slot of the charger. The lamp marked BAT on the front panel of the charger ights up red. 4. If you do not wish to use the phone while charging the battery, insert the phone with the battery pack attached into the front slot of the charger. The lamp marked PHONE on the front panel of the charger lights up red.
SLIM BATTERY PACK
STANDARD BATTERY PACK
EXTENDED BATTERY PACK
Figure 3-1 Charging the Phone and Battery
item
Model Name
Desk Top Rapid Charger
Service Part#
DTC81
Slim Battery Pack
BTI81AB
Standard Battery Pack
BTS81AB
Extended Battery Pack
BTE81AB
GH43-00060A
SPECIFICATIONS USING ÒDTC 81Ó Product
Charging time (hours)
Stand by time (hours) Talking time(min)
Front
Rear
Digital
Digital
2
2
36
75
Standard Battery Pack (Li-ion: 1000mAh)
2.5
4
65
150
Extended Battery Pack (Li-ion: 1600mAh)
3
5
100
240
Slim Battery Pack (Li-ion: 550mAh
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3-2
3-3 For Mobile Mount 3-3-1 Cradle 1. Choose a location where it is easy to reach and does not interfere with the driverÕs safe operation of the car. 2. Separate the two halves of the clamshell by removing the two large slotted screws. See the figure 3-2. 3. Drill holes and mount the lower half of the clamshell by using the screws. 4. Place the cradle onto the remaining half of the clamshell and assemble them by using the screws. 5. Reassemble the two halves of the clamshell together. Adjust the mounting angle and tighten the two slotted screws.
CRADLE
CLAM SHEEL MOUNT UPPER
CELLULAR PHONE
FIXED SCREW HANDS FREE BOX
CLAM SHEEL MOUNT LOWER
CAR
32
32
Figure 3-2 Cradle Installation
3-3-2 Hands-Free Box 1. Drill holes in a proper location for the hands-free box, attach the mounting bracket by using the screws. See the figure 3-3. 2. Install the hands-free box into the bracket.
3-3
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3-3-3 Hands-Free Microphone 1. It is recommended to install the microphone where it is 30-45 cm (12-18inch away from the driver. Choose the location where is least susceptible to interference caused by external noise sources, ie, adjacent windows, radio speakers, etc. Normal place is the sun visor. 2. Once the microphone has been correctly positioned, connect the microphone wire to the MIC jack on the hands-free box.
MOUNTING BRACKET
Figure 3-3 Hands-Free Box 1 Installation
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3-4
3-3-4 Cables 1. Connect the cradle and the hands-free box with the data cable. See the figure 3-4. 2. Connect the antenna cable to the RF jack of the cradle. 3. Connect the power cable as follows: Connect the red wire to the battery (+) terminal, black wire to the vehicle chassis. Then connect the battery (-) terminal to the vehicle chassis. Connect the yellow wire to the switched side of the ignition switch, and then connect the white to the stereo mute wire from your vehicle stereo. 4. Connect the other end of the power cable to the PWR jack of the hands-free box. Notes: It is recommended to connect the power cable directly to the battery to avoid power noise. Make sure the connection, in the vehicle, between the battery (-) terminal and vehicle chassis is made correctly. Make sure the fuse having a proper capacity is used on the power cable. Make sure the cables do not pass over any sharp metal edge that may damage it.
Micro Phone
Yellow(Ignition) White(Stereo Mute) Red(Vehicle Battery) Black(GND)
3-5
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4. NAM Programming NAM features can be programmed as follows: Notes: -If you enter the NAM program mode, each item shows the currently stored data. Go to the next item by pressing OK. -You can modify the data by entering a new data. -If you enter a wrong digit, press CLR to delete the last digit. Press and hold CLR to delete all digits. -To scroll items backwards or forwards, press the VOLUME button on the left side of the phone.
4-1 General Setup LCD Display
Key in
Function
47*869#08#9 1
-selects NAM programming -choose ÔGENERALÕ
ESN E9031F77
Volume ▼
-Electronic Serial Number of the phone is displayed
CAI version 3
Volumet
-Common Air Interface version is displayed
Volume ▼
-Vocoder Rate
Volume ▼
-Station Class Mark displays the power class, transmission, slotted class, dual mode.
NAM program 1:General 2:Setup NAM1 3:Setup NAM2
VOC13K/8K SO_VOICE_08K SCM 01101010 Lock Code 0000
Slot Mode Yes
Slot Index 2 OK -store it. Pref NAM(1~4)... Digital pref
4-digit code OK
Lock code, current ststus is displayed -to change, enter new code. -store it
F or E OK
Slot mode. ÔYesÕ indicates the slot mode. -changes the status. -store it.
0-7
Slot mode index. The higher, the longer sleeping time -to change, enter new one.
F or E OK
Preferred system selection for NAM(1~4). Up to four NAMs are allowed for the phone. This lists one of the four NAMs and allows you to program both the FM and CDMA settings.
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4-1
4-2 Setting Up NAM1 LCD Display
Key in
NAM Program 1:General 2:Setup NAM1 3:Setup NAM2
2
-Choose ÔSetup NAM1.Õ
Setup NAM1 1:Phone # 2:FM 3:CDMA
1
-Choose ÔPhone #Õ
Phone number OK
-directory number -to change, enter new one. -store it.
Phone number OK
-Phone number currently used. -to change, enter new one. -store it.
2
-Choose ÔPhone #Õ
ID number OK
System ID for home, current ststus is displayed. -to change, enter new one. -store it.
Channel number OK
Current 1st paging channel. -to change, enter new one. -store it.
ID number OK
Acquisition system ID 1, current status is displayed. -to change, enter new one. -store it.
ID number OK
Acquisition system ID2, current status is displayed. -to change, enter new one. -store it.
Phone # 1234567890
Mobile ID # 1234567890
Setup NAM1 1:Phone # 2:FM 3:CDMA FM HOME SID 4369
FM 1st Chn 333
FM Acq SID1 4
FM Acq SID2 0
FM LockSID 1 0 Auto Reg
4-2
ID number OK
Function
Lock system ID 1, current status is displayed. -to change, enter new one. -store it. FM Registration, current status is displayed. -changes the status.
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LCD Display Yes
Key in F or E OK
ÔYESÕ to enable, ÔNOÕ to disable. -store it.
F or E OK
Preferred system selection, current status is displayed. -changes the system. ÔYESÕ to enable, ÔNOÕ to disable. -store it.
F or E OK
Current Access Overload Class. -changes the system. -store it.
3
-choose ÔCDMAÕ
number OK
IMSI Moble Country Code, current code is displayed. -to change, enter new one. -store it.
number OK
IMSI Mobile Network Code, current code is displayed. -to change, enter new one. -store it.
F or E OK
Preferred system selection, current system is displayed. -changes the system. -store it.
class number OK
CDMA Access Overload Class, current status is displayed. -to change, enter new one. -store it.
channel number OK
Preferred channel currently used under system A -to change, enter new one. -store it.
channel number OK
Preferred channel currently used under system B -to change, enter new one. -store it.
channel number OK
Second channel currently used under system A -to change, enter new one. -store it.
FM preq... A only
FM ACCOLC 0
Setup NAM1 1:Phone # 2:FM 3:CDMA IMSI_MCC 000
IMSI_MNC 00
CDMA pref.. A only
CDMA ACCOLC 0
Pchn Sys A 779
Pchn Sys B 779
Schn Sys A 738
Function
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4-3
LCD Display Schn Sys B 738
CD Acq SID 1 0
CD lockSID 1 0
CDMA Home SID Yes
CDMA fSID Yes
CDMA fNID Yes
Key in channel number OK
Second channel currently used under system B -to change, enter new one. -store it.
ID number OK
1st Acquisition system ID, current status is displayed. -to change, enter new one. -store it.
ID number OK
1st lock system ID,current status is displayed. -to change, enter new one. -store it.
F or E OK
CDMA Home system ID, current status is displayed -changes the status. -store it.
F or E OK
CDMA foreign SID, current status is displayed. -changes the system. -store it.
F or E OK
CDMA foreign NID, current status is displayed. -changes the system. -store it.
number OK
first SID written in the list, current status is displayed. -to change, enter new one. -store it.
number OK
first NID written in the list, current status is displayed. -to change, enter new one. -store it.
number OK
2nd SID written in the list, current status is displayed. -to change, enter new one. -store it.
number OK
2nd NID written in the list, current status is displayed. -to change, enter new one. -store it.
number OK
3rd SID written in the list, current status is displayed. -to change, enter new one. -store it.
number OK
3rd SID written in the list, current status is displayed. -to change, enter new one. -store it.
SID #1 2222
NID #1 1
SID #2 2222
NID #2 2
SID #3 2222
NID #3 3
4-4
Function
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LCD Display SID #4 2222 NID #4 15
Key in number OK number OK
Setup NAM1 1:Phone # 2:FM 3:CDMA
Function 4th SID written in the list, current status is displayed. -to change, enter new one. -store it. 4th NID written in the list, current status is displayed. -to change, enter new one. -store it. LCD returns to the NAM1 setup mode.
4-3 Setting Up NAM2,3,4 The NAM2,3,4 setup program is the same as Ô4-2 Setting Up NAM1Õ.
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4-5
5. Product Support Tools 5-1 General IMPORTANT INFORMATION Purpose The Product Support Tool (PST) offers you the ability to interface with the SAMSUNG CDMA telephone using a PC. With this tool you can program the phones network system requirements and functionality, swap phone data, and download software upgrades. This document supports UniPST version 1.xx. NOTE: This software must be executed in the Windows95/98 mode.
EQUIPMENT REQUIRED Make sure you have the following equipment setup: 1. Minimum PC configuration: 586 CPU, 16MB RAM, Windows95/98, 5MB of disk space free for software upgrade. 2. PST Software with appropriate cable (DM Cable for SAMSUNG CDMA phone). 3. Serial Port (16550 Serial Interface Card). 4. POWER SUPPLY (3.8V) OR BATTERY
INSTALLATION Software 1.Insert the PST floppy disk into drive (A:\). 2.Create an appropriate directory on the C:\ drive for PST software, Execute Setup.exe file, The installation program creates folder and task bar on the windows95/98 start bar. SAMSUNG CDMA Phone The serial port should be configured to COM1 or COM2. Use the following procedure to connect the phone, cable, and PC . Plug the female end of the DM Cable into the 16550 card. Pull the black rubber connector away from the socket at the base of the phone. Plug the special connector on the cable into the socket at the base of the phone.
5-1
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5-2. PST (Product Support Tool) 5-2-1 Getting Started MAIN MENU SCREEN 1. At the Windows95/98, Double Click ÒUniPst.exeÓ. 2. The Main Menu Screen will be displayed. The Main Menu Screen shows the basic tasks that are available. CAUTION: DO NOT attempt to program phone with a low battery.
PST SETUP UniPst supports SAMSUNG CDMA portable telephone. You can select serial port COM1 or COM2.
5-2-2 Operation Procedure Service Programming The Service Programming screens enable you to set and change the service activation parameters of the phones. These items can be changed individually or as a group via the ÒEdit ItemsÓ Property Sheet of the PST. There are several pages on the Service Programming Property Sheet (See below Figure). Read Data from File Click ÒopenÓ icon to select the name of a file whose extension is ÒmmcÓ. The values will be read from the named file, and will initialize the parameter values seen on the Service programming screen Read Data from Phone Click Read from the Phone icon to upload the current programmable parameters of the phone. The values are read from the phone, so the phone must have the power ON and be properly connected to the PST. NOTE: To actually view the data you need to go to the Edit Items screens. Edit Items Click this icon to edit Number Assignment Module (NAM) items or UI items. There are two types of screens: 1. Parameters associated with a particular Number Assignment Module (NAM) 2. UI items settings Phone Book Click this icon to edit Phone Book. While you edit cell, you can use and < UP , DOWN,LEFT,LIGHT Arrow> and key. If you want to edit phone number or name , you must move rectangle box to cell where you want to edit , Write it down . if key is pressed, the cursor moves to next cell or previous cell.
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5-2
Save Data to File Click this icon to save the current parameters to a file. Once you enter a filename, Click button to write all current parameters to that file. This way the same information can be downloaded into multiple phones. Write to Phone Click this icon to write the selected parameter values to the phone. Writing the selected values to the phone may take up to a minute. If there are dependencies in a field you can make all the changes in the proper fields and download the information all together. If you intend to use this ÒWrite to PhoneÓ feature, it is recommended that you do a ÒRead Data from PhoneÓ first, and then make the changes, so that nothing gets inadvertently overwritten.
NOTE: DO NOT TOUCH THE PHONE WHILE WRITING IS IN PROGRESS. Software Download and Upgrade Screen To begin a software upgrade or download, perform the following steps: 1. From the main menu screen choose DOWNLOAD MODE? Click open icon to choose a BIN file of the new software to be loaded. Choose the appropriate BIN file, then Click (see below figure). 2. Click Download? to begin downloading the file. You will notice various messages and a progress bar that informs the user what percentage of the downloading has already occurred. 3.Click Mode Select box, then Select SERVICE MODE?to return to the Service Mode Screen. NOTE: DO NOT POWER OFF WHILE THE PHONE IS BEING DOWNLOADED!
5-3
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5-3 TEST PROCEDURE 5-3-1 Configuration of Test
Spectrum Analyzer
RF In
HP8924C
RF In/Out
Audio Audio Out In
Directional Coupler
To A-Out Test Jig To A-In
DC Power Supply (+3.93V)
❈ CAUTION : Because there is the loss (0.33V at FM Max Power) of the test jig and Data cable, youÕd better input 3.93V to the DC Power Supply to use 3.6V (Battery normal voltage) at Cellular phone
Items needed to purchase from SAMSUNG ITEMS RF test Cable Test cable DM Cable Test JIG (RF Interface Pack AssÕy)
PARTS # GH39-0002A GH39-30516A GH39-30525A GH80-10502A
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REMARK
Including 1. Power Cable(Black,Red) 2. 9-pin RS232 data Cable
5-4
5-3-2 List of Equipment - DC Power Supply - Test Jig - Test Cable - CDMA Mobile Station Test Set - Spectrum Analyzer(include CDMA Test Mode)
HP8924C, HP83236A, CMD-80, etc HP8596E
TEST JIG
AUDIO SELECT LEFT: AUDIO IN RIGHT: AUDIONOFF
DC POWER INPUT PORT CHANGE VOLTAGE LEVEL BY MODEL (3.8VDC) RED: + BLACK: GND
UP: AUTO POWER ON DOWN: NOT USE AUTO
DB25 CONNECTOR CPMMECT TO DB25 CONNECTOR OF TEST CABLE
A-IN
- DC3.8v +
TO_PC
T E S T
D89 CONNECTOR CONNECT TO IBM PC SERIAL PORT
HHP I/F TEST JIG
P A C K
TO_HP TO A-OUT
TO A-IN
BJ11 CONNECTOR CONNECT TO HP SERIAL PORT
PROBE NOT USED
CONNECT TO AUDIO OUT PORT OF TEST EQUIPMENT (USE BNC CABLE)
CONNECT TO AUDIO IN PORT OF TEST EQUIPMENT (USE BNC CABLE)
TEST CABLE
5-5
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TEST CABLE CONNECTIONS 1
MHC 172
2
RF CABLE (1.4 dB Loss)
3
BNC CONNECTOR (RF)
4
PLUG CONNECT TO SCH-811
5
DATA CABLE
6
Dsub 25PIN CONNECTOR (DATA)
Dsub 25 PIN CONNECTOR PIN DESCRIPTION (TEST CABLE 1, BACK SIDE) DATA DESCRIPTION
Dsub CONN. PIN NO.
DATA DESCRIPTION
Dsub CONN. PIN NO.
V_F
12,21
DP_RX_DATA
8
DGND
2,4,6,13,19
HP_PWR
9
BATT
15,16,22
RI
10
C_F
3,20
CD
11
TX_AUDIO
5
RTS
14
DP_TX_DATA
7
CTS
17
RX_AUDIO
1
DTR
18
15 14
1
17 16
2
3
19 18
4
5
21 20
6
7
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23 22
8
9
25 24
10
11
12
13
5-6
5-4. CONVERSION TABLE OF FREQUENCY vs CHANNEL TYPE
CHANNEL
CONVERSION EQUATION
REMARK
TX
1 ² N² 799
F=0.03 ✕ N + 825.00
FREQUENCY
990 ²N²1023
F=0.03 ✕ (N-1023) + 825.00
N ; CH NUMBER
RX
1 ²N² 799
F=0.03 ✕ N + 870.00
F ; FREQUENCY
FREQUENCY
990 ²N²1023
F=0.03 ✕ (N-1023) + 870.00
Change to Test Mode A. To change the phoneÕs state from Normal Mode to Test Mode, You should enter the following keys. Ò*759#813580Ò B. The command Ò0 1Ó is Suspend. C. To finish the Test Mode, You should enter the command Ò0 2Ó. * Note: Make sure to change to ÒDigital onlyÓ or ÒAnalog onlyÓ mode in NAM1, EST MODE. (Refer to 4. NAM Programming) Channel Selection and Tx Power Output Level Control 1. Digital Mode (CDMA) A. Enter to Test Mode ( * 7 5 9 # 8 1 3 5 8 0 ). B. Ò0 1Ó : Suspend. C. Ò0 9 0 3 6 3 #Ó : Set to Ô0363Õ channel. D. Ò0 7Ó : Carrier On. E. Ò3 4Ó : Spread spectrum to 1.23MHz band width. F. Ò7 1 2 7 5 #Ó : Output RF power level setting. Ò275Ó means AGC level and AGC level range is from 0 to 511. 2. Analog Mode ( FM ) A. Enter to Test Mode ( * 7 5 9 # 8 1 3 5 8 0 ). B. Ò0 1Ó : Suspend. C. Ò4 6Ó : Vocoder initial to Analog mode. D. Ò0 9 0 3 8 3 #Ó : Set to Ô0383Õ channel. E. Ò0 7Ó : Carrier On. F. Ò7 2 2 7 5 #Ó : Output RF power level setting. Ò275Ó means AGC level and AGC level range is from 0 to 511. G. Ò1 0 2Ó : RF Power level control, 2(0~7) means power level . 5-7
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5-5 TEST COMMAND TABLE Command No.
Signal. Name
Description
01(1F,0,0)
T_SUSPEND_I
Terminate the normal mode, enter to the test mode.
02(3F,0,0)
T_RESTART_I
Terminate the test mode, enter to the normal mode.
03(FD,0,0)
T_SAVE_VAL_I
Save value in EEPROM. (Only for Auto test).
04(1D,0,1)
T_GET_MODE_I
Get mode CDMA or FM (Only for Auto test).
05(1C,1,0)
T_SET_MODE_I
Set mode CDMA or FM. (Only for Auto test).
06(1E,0,0)
T_WRITE_NV_I
Write an EEPROM item (one of the NV items)
07(81,0,0)
T_CARRIERON_I
Turn the carrier on.
08(82,0,0)
T_CARRIEROFF_I
Turn the carrier off
09(83,4,0)
T_LOADSYN_I
Set the synthesizer to the channel specified by ch_data.
10(84,1,0)
T_PWRLEVEL_I
Set the RF power level.
11(85,0,0)
T_RXMUTE_I
Mute the receive-audio signal.
12(86,0,0)
T_RXUNMUTE_I
Unmute the receive-audio signal.
13(87,0,0)
T_TXMUTE_I
Mute the transmit-audio signal.
14(88,0,0)
T_TXUNMUTE_I
Unmute the transmit-audio signal.
15(89,1,0)
T_VOC_ESEC_I
Echo canceller ON/OFF
16(8F,0,0)
T_ST_ON_I
Transmit a continuous Signaling Tone(ST).
17(90,0,0)
T_ST_OFF_I
Stop transmit a continuous Signaling Tone.
19(93,0,0)
T_INDEX_DECR_I
Index dn Key.
20(9E,3,0)
T_LNA_GAIN_WR_I
Write LNA gain.
22(91,96,96)
T_SNDNAM_I1)
Display and send NAM information.
23(95,3,4)
T_SNDVERSION_I
Display and return s/w version .
24(9F,7,8)
T_SNDESN_I
Display and return ESN .
25(92,0,0)
T_BACKLIGHT_ON_I
Turn on the backlight
26(93,0,0)
T_BACKLIGHT_OFF_I
Turn off the backlight
27(96,0,0)
T_LAMP_ON_I
Turn on the LAMP
28(97,0,0)
T_LAMP_OFF_I
Turn off the LAMP
29(9A,5,0)
T_REBUILD_I
Rebuild EEPROM
30(9D,16,0)
T_PLINE_I
Display and return production line information.
32(A0,1,0)
T_SAT_ON_I*
Enable the transmission of SAT.
33(A1,0,0)
T_SAT_OFF_I*
Disable the transmission of SAT.
34(A2,0,0)
T_CDATA_I
Transmit continuous 5-word Reverse CTL CH message.
35(A3,3,0)
T_VOLUME_UP_I
Increase value of the last command (Only for autotest)
36(A4,3,0)
T_VOLUME_DOWN_I
Decrease value of the last command (Only for autotest)
38(A6,3,0)
T_VOC_ENC_OFFSET_I
Vocoder ENC offset.
39(A7,3,0)
T_VOC_DEC_OFFSET_I
Vocoder DEC offset.
(OP,AB,RB)
2) 2)
1)
1)
2)
SAMSUNG Proprietary-Contents may change without notice
5-8
Command No.
Signal. Name
Description
40(A8,4,0)
T_VOC_CDMA_UNITY _GAIN_I
Vocoder CDMA unity gain.
41(A9,0,0)
T_VOC_FM_HFRX_UPGAIN_I
Vocoder FM hfrx upgain.
42(AA,1,0)
T_DTMFON_I
Activate dtmf generator with keycode.
43(AB,0,0)
T_DTMFOFF_I
Deactivate DTMF generator.
44(B0,0,0)
T_COMPANDORON_I
Enable the compressor and expandor.
45(B1,0,0)
T_COMPANDOROF_I
Diable the compressor and expandor.
46(B2,0,0)
T_FM_VCLINE_I*
Enter Analog voice channel state.
47(B3,0,0)
T_FM_AUD_GAIN_I
FM audio gain.
48(B4,0,0)
T_VIBRATOR_ON_I
Active A Vibrator.
49(B5,0,0)
T_VIBRATOR_OFF_I
Inactive A Vibrator.
50(B6,0,4)
T_BATT_TYPE_I
Batt type.
51(B7,1,1)
T_BBA_I
BBA supplier.
52(B9,2,2)
T_HW_VERSION_I
HW version.
53(BA,3,0)
T_CARRIER_I
Target Carrier option (Banner).
54(BB,1,0)
T_VOC13K_I
Target Service option (8K/13K).
55(AC,1,0)
T_EXT_AUDIO_I
External Audio Path ON/OFF.
56(AD,0,0)
T_LOOP_BACK_I
Loopback ON.
57(BC,0,0)
T_MIC_ON_I
Mic path on.
58(BD,0,0)
T_MIC_OFF_I
Mic path off.
59(BE,0,0)
T_ALLPATH_I
60(BF,3,0)
T_FM_TX_GAIN_I
(OP,AB,RB)
2)
Set Rx Path, TX Path Unmute to Earpiece. FM Tx Audio Gain Control.
2)3)
61(C0,3,0)
2)3)
T_FM_RX_GAIN_I
FM Rx Audio Gain Control.
62(C1,3,0)
T_DTMF_VOL_TX_I
FM Tx DTMF Gain control.
63(C2,3,0)
T_TX_LIMITER_I
64(C3,3,0)
T_FM_SAT_LEVEL_I
65(C4,3,0)
T_FM_FREQ_SGAIN_I
FM Tx Master Gain Control.
66(C5,3,0)
T_FM_ST_GAIN_I
FM TX ST Gain Control.
67(C6,3,6)
T_READ_BATT_I
Reads low batt. Value in Standby or Talk mode.
68(C8,0,3)
T_VBATT1_I
Set the low battery position in the standby.
69(C9,0,3)
T_VBATT2_I
70(CA,3,0)
T_WRITE_BATT_I
71(D1,3,0)
T_CDMA_TXADJ_I
Change pdm TX AGC in CDMA.
72(D2,3,0)
T_FM_TXADJ_I
Change pdm TX AGC in FM.
73(D3,1,0)
T_SET_PA_R0_I
74(D4,4,0)
T_OFF_PA_R0_I
75(D5,0,3)
T_READ_RSSI_I
Read a RSSI.
77(D7,0,3)
T_READ_TEMP_I
Read Temp.
78(D8,0,3)
T_RXRAS_AUTO_I
Adjust RXRAS from 8924C.
79(D9,1,0)
T_BUZZER_ON_I2)
Buzzer On at DTMF 0 key
80(DA,0,0)
T_BUZZER_OFF_I
Buzzer off
5-9
2)3)
FM Tx Limiter Gain Control.
2)3)
FM Tx SAT level Control.
2)3) 2)3)
2)3)
1)
3)
Set the low battery position in the talking.
3) 3)3) 2)
2) 2)
Write low battery Level Value to NVM.
Set TX power Amp ctrl R0. Off TX power Amp ctrl R0.
3)
SAMSUNG Proprietary-Contents may change without notice
Command No.
Signal. Name
Description
81(E3,0,0)
T_VOC_PCMLPON_I
Play a PCM LOOP BACK.
82(E4,0,0)
T_VOC_PCMLPOFF_I
Play off a PCM LOOP BACK.
85(E7,0,0)
T_SPEAKER_ON_I
Turn on the speaker path.
86(E8,0,0)
T_SPEAKER_OFF_I
Turn off the speaker path.
87(E9,0,0)
T_FM_LOOP_TEST_I
Play a PCM FM loopback.
88(EA,0,0)
T_TRK_ADJ_I3)
FM TRK_LO_ADJ control.
89(EB,0,0)
T_CD_TRK_ADJ_I3)
CDMA TRK_LO_ADJ control.
92(F2,3,0)
T_TXRAS_ADJ_I
TXRAS adj = TX RAS offset array.
93(F3,3,0)
T_RXRAS_ADJ_I
RXRAS adj = RX RAS offset array.
94(F4,4,0)
T_HW_CHANFLAT_T
H/W Channel Flatness.
95(F5,4,0)
T_SW_CHANFLAT_T
S/W Channel Flatness.
96(F6,3,0)
T_CH_FLATNESS_I
Set 22dBm Channel Deviation 10 POINT.
97(F7,3,0)
T_FM_TX_PWR_I
Set FM PWR LEVEL 2~7
(OP,AB,RB)
1) ==> The AB (Input Argument Byte Number) values of these commands are used only in the manual test. In automatic test mode, the AB is regarded as 0. 2) ==> You can assign the value for these commands. If the AB value is assigned without argument, the test is achieved with the value stored in EEPROM. 3) ==> After you get a desired test value by performing these commands, if you want to save the value in EEPROM, use T-SAVE-VAL-I command to store the test value into the corresponding position.
* OP : Operation Command Number AB : Input Argument Byte Number RB : Return Byte Number
SAMSUNG Proprietary-Contents may change without notice
5-10
6. Troubleshooting 6-1 Logic Section 6-1-1 No Power
Press End button
U105 pin 1=VBAT?
No
Check the signal from the battery terminal to U 105 pin 1.
No
Check U105 and its neighboring circuits.
No
Check U106 and its neighboring circuits.
No
Check U107 and its neighboring circuits.
Yes
U106 pin 1 input =3.7V?
Yes
U106 pin 5 output =3.7V?
Yes
U107 pin 5 output =3.7V?
Yes
END
6-1
SAMSUNG Proprietary-Contents may change without notice
6-1-2 Abnormal Initial Operation (Normal +3.3V source)
Press END button
TCXO CLK applied to U401 pin 26?
No
Check TCXO output, R400 and C400. Replace if required.
No
Check U401 and its meighboring circuit. Replace if required.
No
Check U109, MSM and its neighboring circuits.
No
Check ‘H’ level input from J104 pin 17 to U401 pin 79. replace if required.
No
Check Q125 and its neighboring circuit. Replace if required.
No
Check the LCD pins and its neighboring circuit. Replace if required.
Yes
TCXO CLK signal output from U401 pin 29?
Yes
RAM-CS signal output from U109 pin 44?
Yes
CHIPX8 CLK signal output from U401 pin 52?
Yes
Alert LED ON?
Yes
Normal initial display on LCD?
Yes
END
SAMSUNG Proprietary-Contents may change without notice
6-2
6-1-3 Abnormal Backlight Operation
Press and button on the phone
‘H’ level output from U101 L7 to J105 pin 19?
No
Check U101 L7. Replace if required
No
Check FPC. Replace if required
No
Check U139, L201, Q139 and its neighboring circuits. Replace if required
No
Check EL. Replace if required
Yes
‘H’ level input to U139 pin 4,5?
Yes
Normal U139 operation?
Yes
Normal EL?
Yes
EL ON
6-3
SAMSUNG Proprietary-Contents may change without notice
6-1-4 Abnormal Key Data input
Check initial status
Scanning signals output from U101, C5, B4, D5, A5 C6, A5, D6
No
Check U101
No
Replace the key pad assembly
Yes
Check U101 A2, A3, C4, B5, E5
Yes
Check J103
Yes
Normal key data input?
Yes
END
SAMSUNG Proprietary-Contents may change without notice
6-4
6-1-5 Abnormal Key tone
Press and key
Waveform output from U102 pin 14, 15, 16
No
Check U102 pin 14, 15, 16. Replace if required.
No
Check U102, pin 2, 3 and its neighboring circuits. Replace if required.
No
Check U102, R250 and C108, FPC. Replace if required.
No
Check SPK. Replace if required.
Yes
Waveform output from U102 pin 2, 3?
Yes
Waveform applied to SPK(+), (-)?
Yes
normal key tone?
Yes
END
6-5
SAMSUNG Proprietary-Contents may change without notice
6-1-6 Abnormal Alert Tone
Abnormal alert tone
CLK waveform output from U101, N7, P7?
No
Check U101 N7, P7. Replace if required.
No
Check U102 pin 17, and its neighboring circuits. Replace if required
No
Check Q120, Q121, R128. Replace if required.
No
Connect the buzzer correctly.
Yes
CLK waveform output from U102 pin 17?
Yes
CLK waveform applied to Buzz?
Yes
Is the buzzer connection correct?
Yes
Check the buzzer and replace if required
SAMSUNG Proprietary-Contents may change without notice
6-6
6-2 Receiver Section 6-2-1 FM mode
Start FM mode
No
Check FM 12dB SINAD OK?
No
Check LNA in/output OK?
Check Duplexer & LNA power
Gain: +16dB
Yes Yes
Check RF amp in/output OK? Gain: +17dB
Yes Yes
Check mixer in/output OK?
No
Gain(FM): -8dB
Check 1st local & mixer power OK?
No
Check PLL (U306) & VCO output
969.96MHz local: -4~0dBm
VCO_OUTPUT: -10dBm
Yes
No
Check IF filter soldering
Check IF filter in/output OK? Loss: -5dB
Yes Yes No
Check AGC amp in/output OK? Gain: +, -45dB
Check 2nd local & AGC control voltage OK?
No
Check PLL & BBA #80
170.76MHz
Yes
RF Rx FM OK
BBA INPUT: -54dBm
6-7
SAMSUNG Proprietary-Contents may change without notice
6-2-2 CDMA Mode
Start CDMA mode
Normal CDMA SVC & ROAM?
No
Check CDMA RX path
Setup CDMA call OK?
No
Check Transmitter
No
Yes
Measure CDMA FER
Yes
Normal CDMA RF?
SAMSUNG Proprietary-Contents may change without notice
6-8
6-3 Transmitter Section
Check Tx
No
O.K
Check Tx PLL
Check U403 Tx IF level
O.K
CDMA: -20dBm
Check U403 Local Input level
CDMA: -5~3dBm
SPAN 5MHz Tx VCO:260.76MHz IF:130.38MHz
Yes O.K
Check Tx Power level
No
Check U403 Out level
O.K
CDMA: -16~15dBm
6-9
Check U404 RF Out level
O.K
CDMA: 0~1dBm
Check U407 Pout level
CDMA: 24~26dBm
SAMSUNG Proprietary-Contents may change without notice
6-4 Desk-Top Rapid Charger
Plug_in
Check LED state (RED>GRN>YEL)
Check BAT-Contact.
Check Voltage of C3, C2. (about 330V)
Check F1, BD1, U1
Check Battery.
Check component the secondary D30, D20, U22, U23, U24, U25, U26.
Blank of Front.
Check BAT-Contact.
Check Battery.
Check C30
Blank of Rear
Check BAT-Contact.
Check Battery.
Check C40.
Check Voltage of C41.(5V)
Check U25.
LED blink? (Yellow) Check Voltage of C22. (about 4.5V) Check U26. Check Voltage of C22. (about 4.5V)
LED blink? (RED>GRN>YEL)
Check LD1, LD2
Check component the secondary D30, D20, U22, U23, U24, U25, U26.
SAMSUNG Proprietary-Contents may change without notice
6-10
6-5 Hands-Free Kit 1
Start
Ignition Check
Phone Power ON/OFF Check
Charger Circuit
Auto Power ON
Handset Hook ON/OFF Check
Handset Mode
Battery Check
Hands Free Mode
Charging current and voltage check according to battery type
In conversation mode, volume adijustment, mute on/off, calibration check
Full Charging check
Auto power off according to lgnition status
Charging LED Check
Handsfree off with the phone powered off or removed
6-11
SAMSUNG Proprietary-Contents may change without notice
7. Exploded View and its Parts List 7-1 Cellular phone Exploded View
1 2
20
3 21 5 22 4 6
23
24 7
25 26
8 12
9 10
27
29
13 28
11
30
14 15
31 32 16
33
17 49
18 19
34
35
39
36 37 40 38 41 43
42
44 45 46 47 48
SAMSUNG Proprietary-Contents may change without notice
7-1
7-2 Cellular phone Parts List No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 7-2
Description PMO-DECORATION MPR-TAPE DECORATION LABEL(M) LOGO BADGE PCL PMO-FOLDER UPPER SCREW-MACHINE MCT-SHIELD GASKET LCD ASSÕY MPR-SPONGE LCD MPR-TAPE EAR PIECE MPR-TAPE VIBRATIOR NPR-BRACKET FOLDER R PPR-PC SHEET LCD MEC-HINGE ASSY ICT-MAGNET NPR-BRACKET FOLDER L PMO-FOLDER LOWER MPR-TAPE WINDOW LCD PCT-WINDOW LCD PPR-WINDOW BOHO PMO-HINGE DUMMY RMO-REFLECTOR LED PMO-FRONT COVER RMO-KEY PAD LOGIC BOARD RMO-HOLDER MIC RMO-CONNECTOR COVER NPR-SHIELD STRIP(C) NPR-SHIELD STRIP(A) NPR-SHIELD MSM CAN PMO-SHIELD COVER NNPR-SHIELD DUPLEX CA RMO-HOLDER BUZZER PMO-MOBILE CAP NPR-SHIELD TAPE RF NPR-GROUND PLATE PMO-KNOB VOLUME RMO-EAR JACK COVER PMO-REAR COVER NPR-BRACKET ANT ANTENNA SPRING-LOCKER PMO-LOCKER BATT SCREW-MACHINE SCREW-MACHINE LABEL(R) MAIN SLIM BATTERY STANDARD BATTERY EXTENDED BATTERY RF BOARD
SEC code GH72-00264C GH74-10772A GH68-00365C GH72-00285A 601-000876 GH74-00011A GH96-00798A GH74-10774A GH74-00005A GH74-10776A GH71-10726A GH72-10545A GH75-11337A GH70-00009A GH71-10722A GH72-41804A GH74-10775A GH72-00283A GH72-10001A GH72-00067A GH72-41801A GH72-41800A GH73-00080A GH41-00019A GH73-40708A GH73-40704A GH71-00006A GH71-00004A GH71-00008A GH72-41799A GH71-00009A GH73-40735A GH73-40705A GH74-00027A GH71-00010A GH72-41787A GH73-40734A GH72-41806A GH71-10742A GH42-00002A GH61-70054A GH72-00068A 6001-001140 6001-000876 GH68-00368A
GH41-00020A
QÕTY
Remark
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 1 1 1 3 1 1 1 1 1 1 1 1 4 1 1 1 1 1 1
SAMSUNG Proprietary-Contents may change without notice
7-3 Desk-Top Rapid charger Exploded View
1 2
4
6
3 5
7
8 9 10 11
SAMSUNG Proprietary-Contents may change without notice
7-3
7-4 Desk-Top Rapid charger Parts List No
Description
SEC. CODE
QÕTY
1
Case. upper
1
2
Hook-plate
2
3
SCREW
4
4
Battery housing
1
5
SCREW
1
6
Power cord
1
7
PCB
1
8
Case. Lower
1
9
SCREW
4
10
BUM PON
4
11
Label
1
TYPE
A
B
C
D
SEC. CODE
Remark
A
ISRAEL
B
Brazil
C
China
D
Hong Kong
7-4
Remark
SAMSUNG Proprietary-Contents may change without notice
7-5 Hands-free Kit 1 Exploded View
1
2 3
4
5 6 7
SAMSUNG Proprietary-Contents may change without notice
7-5
7-6 Hands-free Kit 1 Parts List No
Description
SEC. CODE
QÕTY
1
Case. upper
1
2
SCREW 3✕5Y
1
3
PCB
1
4
Case. Lower
1
5
SCREW 3✕12Y
4
6
Sponge
2
7
Label
1
7-6
Remark
SAMSUNG Proprietary-Contents may change without notice
7-7 Speaker Exploded View
6
7
4
3
9 8
5 2 1
SAMSUNG Proprietary-Contents may change without notice
7-7
7-8 Speaker Parts List No
Description
SEC. CODE
QÕTY
1
Case. Front
1
2
Speaker
1
3
Case. Rear
1
4
Bolt
2
5
HEX. NUT
2
6
Hamdle
1
7
Speaker wire
1
8
Screw
4
9
Label
1
7-8
Remark
SAMSUNG Proprietary-Contents may change without notice
7-9 Cradle Exploded View
1 2
4
3
6
5
7
9 8
7 10
11 12
16
13 14 15 17
SAMSUNG Proprietary-Contents may change without notice
7-9
7-10 Cradle Parts List No
Description
SEC. CODE
QÕTY
1
Cover Top
1
2
Holder Socket
1
3
Spring rock
2
4
Locker
1
5
Locker
1
6
Eject-A
1
7
Efect Spring
2
8
Frame
1
9
Eject-B
1
10
Screw
6
11
PCB
1
12
SCREW
4
13
Cover Bottom
1
14
Screw
2
15
Label
1
16
I/F coil cord
1
17
Data coil cord
1
7-10
Remark
SAMSUNG Proprietary-Contents may change without notice
7-11 Main packing Exploded View
1
2
8
4
6 5 3
7
SAMSUNG Proprietary-Contents may change without notice
7-11
7-12 Main packing Parts List No
PART NAME
CODE NO
QÕTY
1
CUSHION DUMMY MANUAL
1
2
MAIN SET
1
3
DTC81
1
4
EXT BATT
1
5
HOLSTER
1
6
STD BATT
1
7
MAIN CUSHION
1
8
MAIN GIFT BOX
1
7-12
Remark
SAMSUNG Proprietary-Contents may change without notice
7-13 Hands-Free Kit 1 packing Exploded View
1 3
2
4 7
6
5 8
9
10
SAMSUNG Proprietary-Contents may change without notice
7-13
7-14 Hands-Free Kit 1 packing Parts List No
Description
SEC. CODE
QÕTY
1
User manual
1
2
User manual
1
3
External speaker
1
4
Cradle
1
5
install Bracket for cradle
1
6
External Mic
1
7
Hands-free Box
1
8
install Bracket for hands-free Box
1
9
Power cable
1
10
Unit Box
1
7-14
Remark
SAMSUNG Proprietary-Contents may change without notice
8. Electrical Parts List 8-1 Main Part List Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
1
-
SCREW-MACHINE
“CH,+,M1.7,L2,ZPC(BLK),SWRCH18”
6001-000876
1
-
SCREW-MACHINE
“BH,STAR,M2,L4,CBLACK,SM20C,-”
6001-001140
1
REAR-COVER
ANTENNA-SCH800
“-,824~894MHZ,0DBD,50OHM”
GH42-00002A
1
-
BATTERY-STD ENG(B)
“3.6V,1000MAH,-,1CMA,4.1V”
GH43-00057A
1
-
LABEL(R)-MAIN SCH811
“SCH-811,POLYESTER T0.05,37X28,-,SIL”
GH68-00368A
1
-
LABEL(P)-7PI
“SCH-200F,ART,PI7,100G,BLK”
GH68-10680A
1
-
LABEL(P)-MS BAR CODE
“SCH-1900,ART,100X155,T0.1,WHT”
GH68-11057A
1
-
LABEL(R)-BARCODE BOX
“SCH-1011,POLYESTER,61X71,T0.1,”
GH68-30937A
1
-
LABEL(R)-BAR CODE
“SP-D300,PR,34X6.5,T0.1,WHT”
GH68-30963A
1
-
PCT-WINDOW LCD SCH811P
“SCH-811,-,BLK,-,-”
GH72-00283A
1
WINDOW-LCD
PPR-TAPE WINDOW BOHO
“SCH-100,VINYL TAPE,TRP,-,-”
GH72-10001A
1
-
PMO-KEY VOLUME
“SPH7000,PC+ELASTOMER,BLK,-,-”
GH72-41787A
1
SCREW BOSS
RPR-GROUND GASKET
“SPH-7000,SI RUBBER,®™7*T0.4,GRY,-”
GH73-00005A
1
-
RMO-CONNECTOR COVER
“SPH7000,URETAN,18.2X4.0XT5.8,B”
GH73-40704A
1
-
RMO-MOBILE CAP
“SPH7000,URETHAN,5.2X4.2XT5.0,B”
GH73-40705A
1
-
RMO-EAR JACK COVER
“SCH-800,URETHAN,5.0X11XT5.0,BL”
GH73-40734A
1
SPEAKER
MPR-SPONGE SPEAK
“SCH-800,FOAM,®™8.5XT0.4,BLK,-”
GH74-00012A
1
FPC-CABLE
MPR-SPONGE MIC
“SH-800,SPONGE,7X7.5X3,BLK,-”
GH74-10526A
1
-
MEC-SHIELD COVER
“SCH-800B,SEC,TRP”
GH75-00022A
2
SHIELD-COVER
NPR-SHIELD STRIP(A)
“SCH-800B,C5210-1/2H,T0.1,-”
GH71-00004A
2
SHIELD-COVER
NPR-SHIELD STRIP(C)
“SCH-800B,C5210-1/2H,T0.1,-”
GH71-00006A
2
SHIELD-COVER
NPR-SHIELD MSM CAN
“SCH-800B,C5210-1/2H,T0.1,-”
GH71-00008A
2
SHIELD-COVER
NPR-SHIELD DUPLEX CAN
“SCH-800B,C5210-1/2H,T0.1,-”
GH71-00009A
2
SHIELD-COVER
PMO-SHIELD COVER
“SCH-800,PC,TRP,-,-”
GH72-41799A
2
SHIELD-COVER
MPR-SPONGE MSM
“SPH-7000,PVC FOAM,10X10XT0.5,WHT,-”
GH74-00002A
2
SHIELD-COVER
MPR-SPONGE SAW FILTER
“SCH-800B,PE SPONGE,15X5.8XT0.5,WHT,-”
GH74-00014A
2
SHIELD-COVER
MPR-SPONGE TCXO
“SCH-800B,PE SPONGE,9.0X7.0XT0.5,WHT,-”
GH74-00015A
1
-
MEC-HOLSTER 811B
“SCH-811,PCL,BLK”
GH75-00144A
2
-
SPRING-CLAMP
“SCH-811,PW1(KSD 3556),-,-,-,-”
GH61-00005A
2
-
IPR-E RING
“SCH-811,STS304 W2,0.3,-”
GH70-00023A
2
-
ICT-PIN CLAMP
“SCH-811,STS304 W2,PI1.9X20,-”
GH70-00024A
2
-
PMO-HOLSTER CRADLE 811B
“SCH-811,PC,BLK,-,-”
GH72-00282A
2
-
PMO-HOLSTER CLAMP 811B
“SCH-811,PC,BLK,-,-”
GH72-00284A
1
-
MEC-HANGER
“SCH-811,PCL,BLK”
GH75-00157A
1
-
PBA MAIN-SCH810 LOGIC
“SCH-810,SAMSUNG,BRAZ,LOGIC,-,-,-”
GH92-00758A
2
D107
DIODE-SWITCHING
“MCL4148,100V,200mA,LL-34,TP”
0401-001052
2
D109
DIODE-RECTIFIER
“UPS5819,40V,1.0A,SMT,TP”
0402-001207
2
D101
DIODE-TVS
“SM05,6V/1mA,300,SOT-23”
0406-001005
2
D103
DIODE-TVS
“SM05,6V/1mA,300,SOT-23”
0406-001005
2
D130
DIODE-TVS
“SM05,6V/1mA,300,SOT-23”
0406-001005
SAMSUNG Proprietary-Contents may change without notice
8-1
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
D111
DIODE-TVS
“SMS05C,6V,300W,SOT-23-6”
0406-001051
2
D112
DIODE-TVS
“SMS05C,6V,300W,SOT-23-6”
0406-001051
2
D128
DIODE-TVS
“SMS05C,6V,300W,SOT-23-6”
0406-001051
2
D129
DIODE-TVS
“SMS05C,6V,300W,SOT-23-6”
0406-001051
2
D135
DIODE-TVS
“SMS05C,6V,300W,SOT-23-6”
0406-001051
2
D104
DIODE-ARRAY
“DA204U,20V,100mA,C2-3,SC-70,TP”
0407-000102
2
D102
DIODE-ARRAY
“KDS226,80V,300mA,C2-3,SOT-23,T”
0407-000122
2
Q124
TR-SMALL SIGNAL
“2SA1576,PNP,200MW,SOT-323,TP,180-390”
0501-000162
2
Q107
TR-SMALL SIGNAL
“2SC4081,NPN,200mW,UMT,TP,180-3”
0501-000218
2
Q119
TR-SMALL SIGNAL
“MMBT2222A,NPN,225mW,SOT-23,TP,”
0501-000457
2
Q121
TR-SMALL SIGNAL
“MMBT2222A,NPN,225mW,SOT-23,TP,”
0501-000457
2
Q123
TR-SMALL SIGNAL
“MMBT2222A,NPN,225mW,SOT-23,TP,”
0501-000457
2
Q106
TR-DIGITAL
“RN1104,NPN,100MW,47K/47K,SSM,TP”
0504-000168
2
Q125
TR-DIGITAL
“RN1104,NPN,100MW,47K/47K,SSM,TP”
0504-000168
2
Q126
TR-DIGITAL
“RN1104,NPN,100MW,47K/47K,SSM,TP”
0504-000168
2
Q101
TR-DIGITAL
“RN2104,PNP,100MW,47K/47K,SSM,TP”
0504-000172
2
Q120
TR-DIGITAL
“RN2104,PNP,100MW,47K/47K,SSM,TP”
0504-000172
2
Q103
FET-SILICON
“SI3443DV,P,-20V,+-3.5mA,65mohm”
0505-001165
2
Q104
FET-SILICON
“SI6803DQ,N/P,20/-20V,+-2.5/+-2”
0505-001185
2
D120
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D121
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D122
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D123
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D124
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D125
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D126
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D127
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D110
LED
“CHIP,RED/GRN,3x2.5mm,660/570nm”
0601-001130
2
U114
IC-CMOS LOGIC
“7W04,INVERTER,SSOP,8P,110MIL,T”
0801-000301
2
U116
IC-CMOS LOGIC
“7S32,OR GATE,SOT-25,5P,63MIL,S”
0801-000796
2
U111
IC-CMOS LOGIC
“7S04,INVERTER,SOT-25,5P,63MIL,”
0801-002192
2
U112
IC-TTL
“4W53,MUX/DEMUX,SOP,8P,110MIL,S”
0803-003010
2
U115
IC-DSP
“16272,16BIT,TQFP,64P,400MIL,27”
0904-001280
2
U104
IC-EEPROM
“24C256,32Kx8BIT,SOP,8P,200MIL,”
1103-001131
2
U110
IC-FLASH MEMORY
“29LV800,1Mx8BIT,SON,46P,-,100n”
1107-001062
2
U109
IC-ETC. MEMORY
“1306,524Kx16BIT,SOP,48P,400MIL”
1109-001081
2
U103
IC-VOLTAGE COMP.
“75W56,SSOP,8P,110MIL,DUAL,7V,C”
1202-001022
2
U108
IC-RESET
“809,SOP,3P,-,PLASTIC,-0.3/6V,4”
1203-000392
2
U107
IC-VOLTAGE REGULATOR
“5205,SOT-23,5P,59MIL,PLASTIC,3”
1203-001256
2
U105
IC-PWM CONTROLLER
“9161,SOP,16P,-,PLASTIC,1.455/1”
1203-001434
8-2
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
U106
IC-VOLTAGE REGULATOR
“5219,SOT-23,5P,63MIL,PLASTIC,3”
1203-001518
2
U102
IC-ENCODER/DECODER
“ST5092TQFPTR,QFP,44P,-,PLASTIC”
1204-001375
2
U101
IC-DATA COMM./GEN.
“MSM2300,PBGA,196P,590MIL,PLAST”
1205-001517
2
R113
R-CHIP
“2Kohm,5%,1/16W,DA,TP,1005”
2007-000137
2
R105
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R106
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R129
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R130
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R131
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R137
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R188
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
“R103,R108,R224”
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R104
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R116
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R117
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R125
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R128
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R181
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R183
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R230
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R102
R-CHIP
“2.2Kohm,5%,1/16W,DA,TP,1005”
2007-000141
2
R114
R-CHIP
“2.7Kohm,5%,1/16W,DA,TP,1005”
2007-000142
2
R100
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
2
R149
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
2
R217
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
2
R221
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
2
R222
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
2
R223
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
2
R144
R-CHIP
“6.8Kohm,5%,1/16W,DA,TP,1005”
2007-000146
2
R120
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R136
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R182
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R184
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R185
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R187
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R124
R-CHIP
“15Kohm,5%,1/16W,DA,TP,1005”
2007-000151
2
R139
R-CHIP
“15Kohm,5%,1/16W,DA,TP,1005”
2007-000151
2
R101
R-CHIP
“20Kohm,5%,1/16W,DA,TP,1005”
2007-000152
2
R107
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R132
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
SAMSUNG Proprietary-Contents may change without notice
8-3
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
R150
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R189
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R211
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R215
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R216
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R155
R-CHIP
“24Kohm,5%,1/16W,DA,TP,1005”
2007-000154
2
“R145,C162”
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R210
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R138
R-CHIP
“56Kohm,5%,1/16W,DA,TP,1005”
2007-000159
2
R111
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R134
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R135
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R146
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R147
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R148
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R151
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R172
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R173
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R174
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R175
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R176
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R177
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R178
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R190
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R109
R-CHIP
“120Kohm,5%,1/16W,DA,TP,1005”
2007-000163
2
R152
R-CHIP
“150Kohm,5%,1/16W,DA,TP,1005”
2007-000164
2
R153
R-CHIP
“150Kohm,5%,1/16W,DA,TP,1005”
2007-000164
2
R154
R-CHIP
“200Kohm,5%,1/16W,DA,TP,1005”
2007-000165
2
R186
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R115
R-CHIP
“1.5Kohm,5%,1/16W,DA,TP,1005”
2007-000242
2
R127
R-CHIP
“33Kohm,5%,1/16W,DA,TP,1005”
2007-000775
2
R214
R-CHIP
“39Kohm,5%,1/16W,DA,TP,1005”
2007-000831
2
R133
R-CHIP
“470ohm,5%,1/16W,DA,TP,1005”
2007-000932
2
R250
R-CHIP
“4.7ohm,5%,1/16W,DA,TP,1005”
2007-001284
2
“R212,R225”
R-CHIP
“33ohm,5%,1/16W,DA,TP,1005”
2007-001292
2
R168
R-CHIP
“51ohm,5%,1/16W,DA,TP,1005”
2007-001298
2
R169
R-CHIP
“51ohm,5%,1/16W,DA,TP,1005”
2007-001298
2
R170
R-CHIP
“51ohm,5%,1/16W,DA,TP,1005”
2007-001298
2
R171
R-CHIP
“51ohm,5%,1/16W,DA,TP,1005”
2007-001298
2
R218
R-CHIP
“150ohm,5%,1/16W,DA,TP,1005”
2007-001306
8-4
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
R220
R-CHIP
“150ohm,5%,1/16W,DA,TP,1005”
2007-001306
2
R122
R-CHIP
“1.2Kohm,5%,1/16W,DA,TP,1005”
2007-001319
2
R213
R-CHIP
“13KOHM,5%,1/16W,DA,TP,1005”
2007-007015
2
R110
R-CHIP
“43KOHM,5%,1/16W,DA,TP,1005”
2007-007101
2
R141
R-CHIP
“100Kohm,1%,1/16W,DA,TP,1005”
2007-007107
2
R123
R-CHIP
“10Kohm,1%,1/16W,DA,TP,1005”
2007-007142
2
R142
R-CHIP
“68Kohm,1%,1/16W,DA,TP,1005”
2007-007589
2
C167
“C-CERAMIC,CHIP”
“1.5nF,10%,50V,X7R,TP,1005,-”
2203-000138
2
C103
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C105
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C106
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C121
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C122
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C130
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C152
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C154
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C156
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C100
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C116
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C118
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C119
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C127
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C158
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C159
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C164
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C170
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C182
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C183
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C184
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C185
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C133
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C151
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C153
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C160
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C102
“C-CERAMIC,CHIP”
“220pF,10%,50V,X7R,TP,1005,-”
2203-000585
2
C104
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C120
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C123
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C135
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C187
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
SAMSUNG Proprietary-Contents may change without notice
8-5
Level 2
Design LOC
DESCRIPTIONS
SEC.CODE
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
“C191,C192,C193,C194” “C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
“C195,C196,C198”
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
C199
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
“C201,C202”
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
“C205,C206”
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
“C207,C208,C209,C210” “C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
C101
“C-CERAMIC,CHIP”
“8.2nF,10%,16V,X7R,TP,1005,-”
2203-001210
2
C109
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C111
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C112
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C115
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C126
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C128
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C129
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C132
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C134
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C137
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C155
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
“C161,C163,C211”
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C169
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C171
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C181
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
“C197,C200”
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C220
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C221
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C222
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C139
“C-CERAMIC,CHIP”
“1uF,+80-20%,10V,Y5V,TP,1608,-”
2203-005065
2
C117
“C-TA,CHIP”
“1uF,20%,10V,GP,TP,2012,2,0”
2404-001017
2
C180
“C-TA,CHIP”
“1uF,20%,10V,GP,TP,2012,2,0”
2404-001017
2
C108
“C-TA,CHIP”
“33uF,20%,6.3V,GP,TP,3528,-”
2404-001032
2
C125
“C-TA,CHIP”
“33uF,20%,6.3V,GP,TP,3528,-”
2404-001032
2
C131
“C-TA,CHIP”
“100uF,20,6,LZ,TP,7343,-”
2404-001057
2
C110
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C136
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C138
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
L105
INDUCTOR-SMD
“1uH,10%,0.8x1.6x0.8mm”
2703-000300
2
L101
INDUCTOR-SMD
“10uH,20%,4.45x6.6x2.92mm”
2703-001563
2
X101
RESONATOR-CERAMIC
“27MHz,0.5%,TP,3.2x2.1x1.5”
2802-001090
2
X102
RESONATOR-CERAMIC
“27MHz,0.5%,TP,3.2x2.1x1.5”
2802-001090
8-6
“C186,C188,C190”
ITEMS
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
S1
SWITCH-REED
“100VDC,0.5A,1mS,1mS”
3409-001039
2
J105
CONNECTOR-FPC/FC/PIC
“22P,0.5mm,SMD-A,SN”
3708-001295
2
J110
CONNECTOR-SOCKET
“18P,1R,0.5mm,SMD-A,AUF”
3710-001429
2
J104
CONNECTOR-HEADER
“NOWALL,60P,2R,0.5mm,SMD-S,AUF”
3711-004027
2
J102
JACK-AC POWER
“2P,2.6PI,AU,BLK,NO”
3722-001172
2
-
PCB-SCH811 LOG
“SCH-811,-,8,0.8T,118X138MM”
GH41-00019A
2
VOL_KEY
UNIT-VOLKEY
“SCH-800,KBSCH800B,KEYPAD,FPC,-,-,-”
GH59-00004A
2
MIC ASS’Y
ELA ETC-MIC
“SPH-7000,SAMSUNG,KORA,MICROPHO”
GH96-01156A
1
-
PBA MAIN-SCH810 RF
“SCH-810,SAMSUNG,BRAZ,RF,-,-,-”
GH92-00759A
2
D400
DIODE-VARACTOR
“1SV279,15V,3nA,USC,TP”
0405-001035
2
D401
DIODE-VARACTOR
“1SV279,15V,3nA,USC,TP”
0405-001035
2
D402
DIODE-VARACTOR
“1SV279,15V,3nA,USC,TP”
0405-001035
2
D403
DIODE-VARACTOR
“1SV279,15V,3nA,USC,TP”
0405-001035
2
D310
DIODE-ARRAY
“DAN202U,80V,100mA,CA2-3,SC-70,”
0407-000115
2
D300
DIODE-PIN
“BAR63-02W,50V,100mA,SCD-80,TP”
0409-001016
2
D301
DIODE-PIN
“BAR63-02W,50V,100mA,SCD-80,TP”
0409-001016
2
Q402
TR-SMALL SIGNAL
“2SA1576,PNP,200MW,SOT-323,TP,180-390”
0501-000162
2
Q300
TR-SMALL SIGNAL
“2SC4081,NPN,200mW,UMT,TP,180-3”
0501-000218
2
U309
TR-SMALL SIGNAL
“AT-32011,NPN,200mW,SOT-143,TP,”
0501-002060
2
Q302
TR-SMALL SIGNAL
“BFP420,NPN,160MW,SOT-343,TP,50-150”
0501-002096
2
D302
TR-SMALL SIGNAL
“BCR400W,NPN,-,SOT-343,TP,-”
0501-002205
2
Q301
TR-SMALL SIGNAL
“BFP196W,NPN,700MW,SOT-343,TP,100”
0501-002240
2
Q401
TR-DIGITAL
“RN1102,NPN,100MW,10K/10K,SSM,TP”
0504-000167
2
Q303
TR-DIGITAL
“RN1104,NPN,100MW,47K/47K,SSM,TP”
0504-000168
2
U408
FET-SILICON
“SI3443DV,P,-20V,+-3.5mA,65mohm”
0505-001165
2
U301
IC-ANALOG SWITCH
“SW395TR,SPDP,SOT-26,6P,-,DUAL,”
1001-001048
2
U409
IC-ANALOG MULTIPLEX
“MAX4524EUB-T,TTL/CMOS,SOP,10P,”
1001-001080
2
U404
IC-PREAMP
“01037,SOP,6P,59MIL,SINGLE,-,PL”
1201-001175
2
U310
IC-CASCODE AMP
“0916,SOT-143,4P,-,-,2.7V,-,6Vd”
1201-001248
2
U407
IC-POWER AMP
“23124,LCC,8P,-,SINGLE,-,PLASTI”
1201-001259
2
U402
IC-AGC AMP
“3222,SOP,-,-,SINGLE,-,PLASTIC,”
1201-001261
2
U314
IC-OP AMP
“821,SOT23-5,5P,63MIL,SINGLE,-,”
1201-001348
2
U405
IC-OP AMP
“821,SOT23-5,5P,63MIL,SINGLE,-,”
1201-001348
2
U406
IC-OP AMP
“821,SOT23-5,5P,63MIL,SINGLE,-,”
1201-001348
2
U303
IC-RF AMP
“2617,SSOP,16P,150MIL,DUAL,3V/V”
1201-001366
2
U304
IC-VOLTAGE REGULATOR
“5205,SOT-23,5P,59MIL,PLASTIC,3”
1203-001256
2
U311
IC-VOLTAGE REGULATOR
“5205,SOT-23,5P,59MIL,PLASTIC,3”
1203-001256
2
U312
IC-VOLTAGE REGULATOR
“5205,SOT-23,5P,59MIL,PLASTIC,3”
1203-001256
2
U300
IC-MIXER
“CMY210,SOP,6P,-,PLASTIC,3 TO 6”
1205-001249
2
U401
IC-DATA COMM./GEN.
“Q5312I-3S2,QSOP,80P,138mm,PLAS”
1205-001451
SAMSUNG Proprietary-Contents may change without notice
8-7
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
U403
IC-MIXER
“RF2628,MSOP,8P,190MIL,PLASTIC,”
2
U306
IC-PLL
“LMX2332LSLB,CSP,20P,-,PLASTIC,”
1209-001197
2
U313
THERMISTOR-NTC
“10Kohm,5%,3650K,-,TP”
1404-001040
2
U410
THERMISTOR-NTC
“10Kohm,5%,3650K,-,TP”
1404-001040
2
R325
R-CHIP
“2Kohm,5%,1/16W,DA,TP,1005”
2007-000137
2
R321
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R394
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R305
R-CHIP
“220ohm,5%,1/16W,DA,TP,1005”
2007-000139
2
R307
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R309
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R330
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R426
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R443
R-CHIP
“2.2Kohm,5%,1/16W,DA,TP,1005”
2007-000141
2
R315
R-CHIP
“5.1Kohm,5%,1/16W,DA,TP,1005”
2007-000144
2
R440
R-CHIP
“5.1Kohm,5%,1/16W,DA,TP,1005”
2007-000144
2
R324
R-CHIP
“6.2Kohm,5%,1/16W,DA,TP,1005”
2007-000145
2
R451
R-CHIP
“6.2Kohm,5%,1/16W,DA,TP,1005”
2007-000145
2
R411
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R412
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R417
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R438
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R306
R-CHIP
“12Kohm,5%,1/16W,DA,TP,1005”
2007-000149
2
R441
R-CHIP
“12Kohm,5%,1/16W,DA,TP,1005”
2007-000149
2
R452
R-CHIP
“12Kohm,5%,1/16W,DA,TP,1005”
2007-000149
2
R444
R-CHIP
“20Kohm,5%,1/16W,DA,TP,1005”
2007-000152
2
R310
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R322
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R401
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R402
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R435
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R333
R-CHIP
“56Kohm,5%,1/16W,DA,TP,1005”
2007-000159
2
R395
R-CHIP
“68Kohm,5%,1/16W,DA,TP,1005”
2007-000160
2
R308
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R332
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R331
R-CHIP
“1Mohm,5%,1/16W,DA,TP,1005”
2007-000170
2
R425
R-CHIP
“1Mohm,5%,1/16W,DA,TP,1005”
2007-000170
2
C444
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
C445
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
L353
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R314
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
8-8
1205-001535
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
R316
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R320
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R327
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R329
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R396
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R398
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R406
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R407
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R408
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R416
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R418
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R419
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R437
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R445
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R446
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R450
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R300
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R303
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R311
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R313
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R319
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R400
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R439
R-CHIP
“1.5Kohm,5%,1/16W,DA,TP,1005”
2007-000242
2
R421
R-CHIP
“270Kohm,5%,1/16W,DA,TP,1005”
2007-000636
2
R442
R-CHIP
“39Kohm,5%,1/16W,DA,TP,1005”
2007-000831
2
R424
R-CHIP
“430Kohm,5%,1/16W,DA,TP,1005”
2007-000899
2
R422
R-CHIP
“560Kohm,5%,1/16W,DA,TP,1005”
2007-001025
2
R302
R-CHIP
“24ohm,5%,1/16W,DA,TP,1005”
2007-001290
2
R427
R-CHIP
“51ohm,5%,1/16W,DA,TP,1005”
2007-001298
2
R399
R-CHIP
“150ohm,5%,1/16W,DA,TP,1005”
2007-001306
2
R301
R-CHIP
“200ohm,5%,1/16W,DA,TP,1005”
2007-001308
2
R328
R-CHIP
“910ohm,5%,1/16W,DA,TP,1005”
2007-001317
2
R410
R-CHIP
“1.8Kohm,5%,1/16W,DA,TP,1005”
2007-001320
2
R423
R-CHIP
“1.8Kohm,5%,1/16W,DA,TP,1005”
2007-001320
2
R334
R-CHIP
“36Kohm,5%,1/16W,DA,TP,1005”
2007-001335
2
R317
R-CHIP
“16OHM,5%,1/16W,DA,TP,1005”
2007-003006
2
R318
R-CHIP
“16OHM,5%,1/16W,DA,TP,1005”
2007-003006
2
R420
R-CHIP
“20OHM,5%,1/16W,DA,TP,1005”
2007-003010
2
R428
R-CHIP
“20OHM,5%,1/16W,DA,TP,1005”
2007-003010
2
R335
R-CHIP
“43KOHM,5%,1/16W,DA,TP,1005”
2007-007101
SAMSUNG Proprietary-Contents may change without notice
8-9
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
R405
R-CHIP
“300ohm,1%,1/16W,DA,TP,1005”
2007-007133
2
R409
R-CHIP
“39Kohm,1%,1/16W,DA,TP,1005”
2007-007134
2
R403
R-CHIP
“1.2Kohm,1%,1/16W,DA,TP,1005”
2007-007137
2
R404
R-CHIP
“10Kohm,1%,1/16W,DA,TP,1005”
2007-007142
2
R449
R-CHIP
“10Kohm,1%,1/16W,DA,TP,1005”
2007-007142
2
R448
R-CHIP
“11.3Kohm,1%,1/16W,DA,TP,1005”
2007-007491
2
C303
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C310
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C311
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C315
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C316
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C326
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C337
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C341
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C342
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C344
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C349
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C350
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C362
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C363
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C365
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C367
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C369
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C370
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C373
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C393
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C400
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C410
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C416
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C426
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C428
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C432
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C434
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C448
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C454
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
L304
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C343
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C356
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C359
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C366
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
8-10
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
C371
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C372
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C378
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C381
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C382
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C387
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C404
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C415
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C421
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C427
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C435
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C438
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C439
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C440
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C442
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C443
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C450
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C452
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C456
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C458
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C464
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C468
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C470
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C471
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C472
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C322
“C-CERAMIC,CHIP”
“10pF,0.5pF,50V,NPO,TP,1005,-”
2203-000278
2
C383
“C-CERAMIC,CHIP”
“10pF,0.5pF,50V,NPO,TP,1005,-”
2203-000278
2
C403
“C-CERAMIC,CHIP”
“10pF,0.5pF,50V,NPO,TP,1005,-”
2203-000278
2
C418
“C-CERAMIC,CHIP”
“18pF,5%,50V,NPO,TP,1005,-”
2203-000425
2
C301
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C320
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C323
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C327
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C361
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C407
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C409
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C419
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C422
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C423
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C424
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
SAMSUNG Proprietary-Contents may change without notice
8-11
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
C425
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C430
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C431
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C437
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C449
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C455
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C457
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C459
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C463
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C345
“C-CERAMIC,CHIP”
“1pF,0.25pF,50V,NPO,TP,1005,-”
2203-000466
2
C346
“C-CERAMIC,CHIP”
“1pF,0.25pF,50V,NPO,TP,1005,-”
2203-000466
2
C329
“C-CERAMIC,CHIP”
“220pF,10%,50V,X7R,TP,1005,-”
2203-000585
2
C305
“C-CERAMIC,CHIP”
“22pF,5%,50V,NPO,TP,1005,-”
2203-000628
2
C351
“C-CERAMIC,CHIP”
“3.9nF,10%,50V,X7R,TP,1005,-”
2203-000725
2
C319
“C-CERAMIC,CHIP”
“33pF,5%,50V,NPO,TP,1005,-”
2203-000812
2
C391
“C-CERAMIC,CHIP”
“33pF,5%,50V,NPO,TP,1005,-”
2203-000812
2
C401
“C-CERAMIC,CHIP”
“39pF,5%,50V,NPO,TP,1005,-”
2203-000854
2
C402
“C-CERAMIC,CHIP”
“39pF,5%,50V,NPO,TP,1005,-”
2203-000854
2
C321
“C-CERAMIC,CHIP”
“3pF,0.25pF,50V,NPO,TP,1005,-”
2203-000870
2
C324
“C-CERAMIC,CHIP”
“3pF,0.25pF,50V,NPO,TP,1005,-”
2203-000870
2
C338
“C-CERAMIC,CHIP”
“3pF,0.25pF,50V,NPO,TP,1005,-”
2203-000870
2
C508
“C-CERAMIC,CHIP”
“3pF,0.25pF,50V,NPO,TP,1005,-”
2203-000870
2
C318
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C328
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C332
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C340
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C357
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C360
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C376
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C379
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C384
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C390
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C395
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C398
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C325
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C333
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C334
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C368
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C388
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C405
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
8-12
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
C461
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C446
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
C462
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
C312
“C-CERAMIC,CHIP”
“4pF,0.25pF,50V,NPO,TP,1005,-”
2203-001017
2
C353
“C-CERAMIC,CHIP”
“56pF,5%,50V,NPO,TP,1005,-”
2203-001072
2
C411
“C-CERAMIC,CHIP”
“68pF,5%,50V,NPO,TP,1005,-”
2203-001153
2
C412
“C-CERAMIC,CHIP”
“68pF,5%,50V,NPO,TP,1005,-”
2203-001153
2
C304
“C-CERAMIC,CHIP”
“7pF,0.5pF,50V,NPO,TP,1005,-”
2203-001201
2
C441
“C-CERAMIC,CHIP”
“8.2nF,10%,16V,X7R,TP,1005,-”
2203-001210
2
“C302,L306”
“C-CERAMIC,CHIP”
“8pF,0.5pF,50V,NPO,TP,1005,-”
2203-001259
2
C386
“C-CERAMIC,CHIP”
“33nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001416
2
C300
“C-CERAMIC,CHIP”
“47nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001432
2
C314
“C-CERAMIC,CHIP”
“47nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001432
2
C331
“C-CERAMIC,CHIP”
“47nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001432
2
C336
“C-CERAMIC,CHIP”
“47nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001432
2
C355
“C-CERAMIC,CHIP”
“47nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001432
2
C429
“C-CERAMIC,CHIP”
“47nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001432
2
C307
“C-CERAMIC,CHIP”
“5pF,0.25pF,50V,X7R,TP,1005,1.0”
2203-001437
2
C309
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C313
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C339
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C354
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C364
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C380
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C417
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C420
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C436
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C451
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C413
“C-CERAMIC,CHIP”
“6pF,0.1pF,50V,NPO,TP,1005,-”
2203-005382
2
C408
“C-TA,CHIP”
“1uF,20%,10V,GP,TP,2012,2,0”
2404-001017
2
C467
“C-TA,CHIP”
“33uF,20%,6.3V,GP,TP,3528,-”
2404-001032
2
C317
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C347
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C348
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C358
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C374
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C375
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C396
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C399
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C414
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
SAMSUNG Proprietary-Contents may change without notice
8-13
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
C460
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C465
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C453
“C-TA,CHIP”
“4.7uF,20%,6.3V,GP,TP,2012,-”
2404-001086
2
C385
“C-TA,CHIP”
“3.3uF,20%,6.3V,GP,TP,2012,-”
2404-001087
2
C389
“C-TA,CHIP”
“3.3uF,20%,6.3V,GP,TP,2012,-”
2404-001087
2
C447
“C-TA,CHIP”
“3.3uF,20%,6.3V,GP,TP,2012,-”
2404-001087
2
C498
“C-TA,CHIP”
“3.3uF,20%,6.3V,GP,TP,2012,-”
2404-001087
2
C499
“C-TA,CHIP”
“3.3uF,20%,6.3V,GP,TP,2012,-”
2404-001087
2
C352
“C-TA,CHIP”
“220nF,20%,20V,GP,TP,2012,-”
2404-001092
2
L315
INDUCTOR-SMD
“470nH,10%,0.8x1.6x0.8mm”
2703-000213
2
L316
INDUCTOR-SMD
“470nH,10%,0.8x1.6x0.8mm”
2703-000213
2
L312
INDUCTOR-SMD
“390nH,10%,0.8x1.6x0.8mm”
2703-000297
2
L403
INDUCTOR-SMD
“1uH,10%,0.8x1.6x0.8mm”
2703-000300
2
L310
INDUCTOR-SMD
“100nH,5%,1.6x0.8x0.8mm”
2703-001172
2
L400
INDUCTOR-SMD
“33nH,5%,1.6x0.8x0.8mm”
2703-001174
2
L307
INDUCTOR-SMD
“18nH,5%,1.6x0.8x0.8mm”
2703-001189
2
L313
INDUCTOR-SMD
“120nH,10%,1.6x0.8x0.8mm”
2703-001220
2
L305
INDUCTOR-SMD
“39nH,5%,1.6x0.8x0.8mm”
2703-001285
2
L319
INDUCTOR-SMD
“8.2nH,10%,1x0.5x0.5mm”
2703-001408
2
L320
INDUCTOR-SMD
“8.2nH,10%,1x0.5x0.5mm”
2703-001408
2
L323
INDUCTOR-SMD
“8.2nH,10%,1x0.5x0.5mm”
2703-001408
2
L351
INDUCTOR-SMD
“12nH,10%,1x0.5x0.5mm”
2703-001409
2
L410
INDUCTOR-SMD
“12nH,10%,1x0.5x0.5mm”
2703-001409
2
L402
INDUCTOR-SMD
“68nH,5%,1.8x1.12x1.02mm”
2703-001514
2
L404
INDUCTOR-SMD
“120nH,5%,1.7x1.14x1.02mm”
2703-001546
2
L405
INDUCTOR-SMD
“120nH,5%,1.7x1.14x1.02mm”
2703-001546
2
L301
INDUCTOR-SMD
“47nH,5%,1.0x0.5x0.5mm”
2703-001595
2
L303
INDUCTOR-SMD
“47nH,5%,1.0x0.5x0.5mm”
2703-001595
2
L322
INDUCTOR-SMD
“5.6nH,10%,1.0x0.5x0.5mm”
2703-001708
2
L406
INDUCTOR-SMD
“33nH,5%,1.0x0.5x0.5mm”
2703-001723
2
L407
INDUCTOR-SMD
“22nH,5%,1x0.5x0.5mm”
2703-001727
2
L308
INDUCTOR-SMD
“15nH,5%,1x0.5x0.5mm”
2703-001730
2
L350
INDUCTOR-SMD
“15nH,5%,1x0.5x0.5mm”
2703-001730
2
L302
INDUCTOR-SMD
“6.8nH,5%,1x0.5x0.5mm”
2703-001734
2
L330
INDUCTOR-SMD
“6.8nH,5%,1x0.5x0.5mm”
2703-001734
2
L311
INDUCTOR-SMD
“100nH,2%,2.29x1.73x1.52mm”
2703-001743
2
U307
OSCILLATOR-VCO
“954MHz,-,-,TP,3.3V,6.4mA”
2806-001146
2
U305
OSCILLATOR-VCTCXO
“19.68MHZ,2.5PPM,10KOHM//10PF,TP,3V,2MA”
2809-001225
2
F302
FILTER-SAW
“85.38MHz,0.630MHz,0.3MHz/0.3dB”
2904-001128
2
F304
FILTER-SAW
“967MHz,25MHz,967MHz/0.5dB,TP,9”
2904-001133
8-14
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
F400
FILTER-SAW
“836.5MHz,25MHz,+-25MHz/0.9dB,T”
2
F301
FILTER-SAW
“881.5MHz,25MHz,+-25MHz/0.9dB,T”
2904-001136
2
F401
FILTER-SAW
“836.50MHz,-,849MHz/1dB,TP,849M”
2904-001138
2
F300
FILTER-DUPLEXER
“881.5MHz,836.5MHz,4/2.7dB,TP,8”
2909-001077
2
BUZZ
BUZZER-MAGNETIC
“88dB,3.6V,90mA,2.731KHz,TP”
3002-001062
2
L300
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L309
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L317
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L321
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L325
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L326
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L328
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L409
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
J301
CONNECTOR-COAXIAL
“SMC,JACK,100mohm,50ohm,0.5dB”
3705-001163
2
J300
CONNECTOR-SOCKET
“60P,2R,0.5mm,SMD-S,AUF”
3710-001390
2
U308
RF POWER SPLITTER
“2WAY,955-979MHz,12dB,-,TP”
4709-001080
2
-
PCB-SCH811 RF
“SCH-811,-,6,0.8T,118X90MM”
GH41-00020A
2
PBA MAIN RF
RMO-HOLDER BUZZER
“SCH-800,CR RUBBER,11x9xT3.5,BL”
GH73-40735A
1
-
MEA FRONT-SCH811B
“SCH-800,PCL,ISRL,-,-,-,-”
GH97-00918A
2
FOLDER ASSY
SCREW-MACHINE
“CH,+,M1.7,L2,ZPC(BLK),SWRCH18”
6001-000876
2
FRONT-COVER
PMO-HINGE DUMMY
“SCH-800,PC,BLK,-,-”
GH72-00067A
2
-
PMO-DECORATION B(CHNA)
“SGH-800,ABS,B/PEL,-,-”
GH72-00264C
2
WINDOW-LCD
PPR-TAPE WINDOW BOHO
“SCH-100,VINYL TAPE,TRP,-,-”
GH72-10001A
LABEL(M)-LOGO BADGE PCL
SCH-811 BLK
GH68-00365A
“SCH-811,-,-,BLK,-”
GH73-00080A
2
2904-001135
2
-
RMO-KEY PAD HEBREW
2
FRONT-COVER
RMO-HOLDER MIC
“SPH7000,SI RUBBER,PI8.0,T5.0,B”
GH73-40708A
2
SPEAKER
MPR-SPONGE SPEAK
“SCH-800,FOAM,®™8.5XT0.4,BLK,-”
GH74-00012A
2
FOLDER-UPPER
MPR-DECO BOHO VINYL
“SCH-800,VINYL,27X32.5X0.2,TRP,-”
GH74-00084A
2
-
MEC-FOLDER UPPER 811B
“SCH-811,PCL,BLK”
GH75-00139A
3
-
PMO-FOLDER UPPER 811B
“SCH-811,PC,BLK,-,-”
GH72-00285A
3
-
MCT-SHIELD GASKET
“SCH-800B,GASKET(SHIELD),30X34XT0.7,GRY,-”
GH74-00011A
3
-
MPR-TAPE UPPER
“SCH-800B,TESA 983,8X8XT0.15,TRP,-”
GH74-00031A
3
-
MPR-TAPE DECORATION
“SCH-800,TESA4965,16.9x23xT0.2,”
GH74-10772A
2
-
MEC-FOLDER LOWER 811B
“SCH-811,PCL,BLK”
GH75-00143A
3
-
NPR-BRACKET FOLDER
“SPH7000,C5210S-1/2H,T0.5,NI”
GH71-10722A
3
-
NPR-BRACKET FOLDER R
“SPH7000,C5210S-1/2H,T0.5,NI”
GH71-10726A
3
-
PMO-EARPIECE 811B
“SCH-811,PC,BLK,-,-”
GH72-00281A
3
-
PPR-PC SHEET LCD
“SCH-800,PC SHEET T0.6,BLK,-,-”
GH72-10545A
3
-
PMO-FOLDER LOWER
“SCH-800,PC,BLK,-,LEXAN SP-1210”
GH72-41804A
3
-
MPR-TAPE EAR PIECE
“SCH-800,FOAM TAPE,5X4XT0.4,BLK,-”
GH74-00005A
SAMSUNG Proprietary-Contents may change without notice
8-15
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
3
-
MPR-SPONGE EAR PIECE
“SCH-800B,PE SPONGE,8X11XT0.5,WHT,-”
GH74-00029A
3
-
MPR-SPONGE LCD
“SCH-800,SPONGE,41.5x38xT1.0,BL”
GH74-10774A
3
-
MPR-TAPE WINDOW LCD
“SCH-800,TESA4965,41.5X38XT0.2,”
GH74-10775A
3
-
MPR-TAPE VIBRATOR
“SCH-800,TESA4965,PI13xT0.2,TRP”
GH74-10776A
3
-
MEC-HINGE
“SCH-800,SEC,BLK”
GH75-11337A
4
HINGE
SPRING-HINGE
“SPH7000,PW2,PI5.0,D0.7,L11.2,-”
GH61-70056A
4
HINGE
HINGE-CAM
“SPH7000,ACETAL,BLK”
GH61-80004A
4
HINGE
HINGE-SHAFT
“SPH7000,ACETAL,BLK”
GH61-80005A
4
HINGE
HINGE-HOUSING
“SCH-800,PC(LEXAN SP-1210R),BLK”
GH61-80007A
4
HINGE-ASSY
ICT-MAGNET
“SCH-800B,ALLOY(AL+NI+CO),(3X15)T1.0,NTR”
GH70-00009A
2
-
MEC-FRONT COVER
“SCH-800,SEC,BLK”
GH75-11334A
3
FRONT-COVER
PMO-FRONT COVER
“SCH-800,PC,BLK,-,LEXAN SP-1210”
GH72-41800A
3
FRONT-COVER
PMO-REFLECTOR LED
“SCH-800,ACRYL,M/WHT,-,-”
GH72-41801A
2
-
ELA HOU-LCD ASS’Y
“SCH-811,SAMSUNG,-,LCD+MOTOR+SPKER,-,-,-”
GH96-00798A
1
-
MEA REAR-SCH800
“SCH-800,SEC,KOR,BLK,-,-,-”
GH97-01432A
2
REAR-COVER
LABEL(R)-QUALCOMM
“SCH-100F,VINYL,12X6,0.12,TRP”
GH68-30846A
2
REAR-COVER
MPR-SHIELD TAPE
“SCH-800B,CLOTH(SHIELD),30X8XT0.1,GRY,-”
GH74-00027A
2
-
MEC-REAR COVER
“SCH-800,SEC,BLK”
GH75-11338A
3
REAR-COVER
SPRING-LOCKER
“SPH7000,PW2,PI.8,D0.2,4.4,-”
GH61-70054A
3
REAR COVER
NPR-GROUND PLATE
“SCH-800B,C5210-3/4H,T0.1,-”
GH71-00010A
3
REAR-COVER
NPR-BRACKET ANT
“SCH-800,C2801S-1/4H,T0.5,AU(0.”
GH71-10742A
3
REAR-COVER
PMO-LOCKER BATT
“SCH-800,PC,BLK,-,-”
GH72-00068A
3
REAR-COVER
PMO-REAR COVER
“SCH-800,PC,BLK,-,LEXAN SP-1210”
GH72-41806A
1
-
PAA MAIN-PACKING 811 PCL
“SCH-811,PCL,ISRL,-,-,-,-”
GH99-02153A
2
-
BAG-PE
“PE,T0.06,150X300,-”
GA69-30508A
2
-
PAC-SILICAGEL
“SiO2,50x40,5,SKP-816H”
GA69-90502A
2
-
BAG-LDPE
“PELD,T0.06,100X260,SP-RM928”
GG69-30517A
2
-
LABEL(P)-SHIPPING 811 PCL
“SCH-811,CRAFT-PAPER 100G,250X180,-,BRN”
GH68-00386A
2
-
BOX(P)-MAIN GIFT BOX 811 IS
“-,SCH-811,-,171X220X94,-”
GH69-00169A
2
-
CUSHION-MAIN 811
“SCH-811,-,165X223X90”
GH69-00170A
2
-
CUSHION—DUMMY MANUAL
“SCH-811,SW5,124X208”
GH69-00185A
2
-
BOX(P)-MASTER MAIN
“SPRINT,SCH-2000,DW-3,498X355X2”
GH69-11133A
2
-
CUSHION-PAD MAIN
“SCH-2000,DW-3,483X340XT7”
GH69-20666A
2
-
CUSHION-PAD SIDE
“SCH-2000,DW-3,340X230XT7”
GH69-20667A
2
-
BAG-STD BATT.
“PE,T0.06,70X170,SCH-1011”
GH69-30503A
2
-
BAG-MANUAL
“PP,T0.06,125*280,SCH-1011”
GH69-30518A
8-16
SAMSUNG Proprietary-Contents may change without notice
8-2 Desk-top charger part List No
Design LOC
DESCRIPTIONS
SEC CODE
1
C7, C8
Y-CAP
2, 2nF, 20%, 250V
2201-001004
2
C1
X-CAP
100nF, 20%, 250V
2301-001092
3
C2, C3
CAP-FELECTRONIC
10uF, 400V, 85°C 10x16
2401-00
4
C21, C332
CAP-FELECTRONIC
680uF, 16V, 105°C 10x13
2401-003090
5
C23, C33
CAP-FELECTRONIC
220uF, 16V, 85°C 6x11
2401-000804
6
C36
CAP-FELECTRONIC
47uF, 16V, 85°C 5x7
2401-00
7
C6, C41
CAP-FELECTRONIC
10uF, 50V, 105°C 5x11
2401-00
9
F1
FUSE
250VAC, 2A 5x15 BLACK-TUBING
10
LD1, LD2
LED
RED/GRN-DUAL 3 (ROUND)
11
BD1
DIODE-BRIDGE
600V, 1A
0402-000003
12
D2, D3
DIODE-FR
1000V, 1A
0402-000012
13
D21, D31, D32
DIODE-SCHOTKY
40V, 1A
0402-000358
14
D30
DIODE-FR
200V, 1.5A/2A
0402-000205
15
D20
DIODE-SCHOTKY
60V, 5A
0402-000467
16
TH1
THERMISTER
5Ω, 10Ø
1404-000128
17
D1
TRANSIENT VOLTAGE
160V, 600W
18
U1
SUPPESSOR
TO-220, 700V, 1A
0505-00
19
U26
IC-pemto
35V, 1.5A, DIP-8P
1203-000391
20
U21
IC-SWITCHING
5V, 100mA, TO-92
1203-000542
21
PC1
IC-VOLTAGE REGULATER 120-180%, 200mW
0604-001098
REMARKS
8 3601-001125 0601-00
0402-000124
1404-001083 0403-001028
DIP-4P, ST
0604-000191
22
R21
PHOTO-OOUPLER
51Ω, 2W, 5%
2003-000327
23
R15, R16
R-METAL OXIDE
1/2W, 4.7MΩ, 5%
2009-001039
24
R51
R-SURGE
10KΩ, 25°C
1404-000215 1404-001014
25
VR1, VR2
R-NTC
1KΩ, 1/10W, 30% TOP, TP
2103-000210
26
TNR1
R-SEMIFIX
470V, 2500A, 300V, 3000A
1405-000001 1405-000193
27
J01-15
VARISTOR
0.6*52mm, SDACW
28
R26, R27, R45, R16
WIRE-NO SHEATH
1Ω, 1/4W, 1%, TP
29
R35, R52
R-METAL FILM
47KΩ, 1/8W, 5%, TP
30
R33, R47
R-CARBON FILM
4.7KΩ, 1/8W, 1%, TP
31
CHT009
R-METAL FILM
CHT09, 0.8mA, EE1916
ML26-00274A
32
LF1
S/W TRANS
UU1014-V, 22mH(MIN)
ML29-00023K
33
L22
LINE-FILTER
120uH, 10X5, 0, 40
34
L21
COIL-CHOKE(TROIDAL)
7uH 5X7,5
ML27-00252A
35
C25
COIL-CHOKE (DRUM)
2012, 104K, X7R, 50V
2203-000206
SAMSUNG Proprietary-Contents may change without notice
3811-000545
ML27-00
8-17
No
Design LOC
DESCRIPTIONS
35
SEC CODE
REMARKS
2203-000204
36
C4, C23, C24
CAP-CHIP
2012, 474Z, Y5V, 50V
2203-000922
37
C44
CAP-CHIP
2012, 474K, X7R, 50V
2203-000985 2203-000979
38
C34
CAP-CHIP
2012, 101J, NPO, 50V
2203-002278
39
C5, C7
CAP-CHIP
2012, 103K, X7R, 50V
2203-001458
40
C28, C30, C33, C42,
CAP-CHIP
2012, 104Z, Y52, 50V
2203-000192
2203-001604
C43, C45 41
C26
CAP-CHIP
2012, 224K, X7R, 25V
42
U25
u-com
u-com, 8bit, SOP-32P
0903-001148
43
U22
IC-OP AMP
28V, 150pA, DUAL
1201-000166
SOP-8P
1201-000167
36V, 1mA, DUAL
1202-000188
SOP-8P
1202-000104
2203-000575
44
U23, U24
IC-COMPERATER
1202-000187 45
Q23
46
Q21, Q22, Q24
47
FET-DUAL
12V, 5A, 0.05
P-CHANNEL
SO-8P
TR-PNP
SOT-23, 60V, 600mA
0501-000462
D33
DIODE-ULTRA HIGH SPEED
SOT-23, 80V, 100mW
0407-000114
49
R24, R44
R-CHIP
2012, 620Ω, 1%
2007-000
50
R25
R-CHIP
2012, 680Ω, 1%
2007-000
51
R28, R31, R32, R48, R63
R-CHIP
2012, 10KΩ, 1%
2007-000297
52
R36, R53
R-CHIP
2012, 470KΩ, 1%
2007-000922
53
R34, R51
R-CHIP
2012, 150KΩ, 1%
2007-000
54
R40, R49
R-CHIP
2012, 12KΩ, 1%
2007-000352
55
R61
R-CHIP
2012, 27KΩ, 1%
2007-00
56
R23, R43, R60
R-CHIP
2012, 91Ω, 1%
57
R64, R65, R66, R7
R-CHIP
2012, 470Ω, 1%
2007-00
58
R41
R-CHIP
2012, 4.7KΩ, 1%
2007-000868
59
R37, R54
R-CHIP
2012, 2.4KΩ, 1%
2007-00508
61
R38, R55, R69, R70
R-CHIP
2012, 47KΩ, 5%
2007-000
62
R1, R2
R-CHIP
2012, 10Ω, 5%
2007-000
63
R29, R47
R-CHIP
2012, 2.2KΩ, 5%
64
R30, R42, R68
R-CHIP
2012, 1KΩ, 5%
2007-000
65
R4
R-CHIP
2012, 750Ω, 5%
2007-000
66
R22
R-CHIP
2012, 180Ω, 5%
2007-000
67
R3
R-CHIP
2012, 5.6Ω, 5%
2007-000
0505-001180
48
2007-001677
60
8-18
2007-000493
SAMSUNG Proprietary-Contents may change without notice
No
DESCRIPTIONS
Design LOC
SEC CODE
REMARKS
68 69
B1, B2
CHIP-BEAD
3x4, CHIP-BEAD
3301-000329
70
CN21
BAIT-CONNENTOR-
4P, 3.0mm
ML74-001411
FRONT, REAR
30x9x10
CONNECTOR-C/B
3.9mm, 3(2)P
CASE ASS’Y-COVER
COVER (1)
71
CON1
72
3711-000203 ML72-00
GATE LABEL (1) BATT HOUSING (1) BATT LOCKER (1) TH+M3x8, BLK (1) 73
CASE ASS’Y-BOTTOM
BOTTOM (1), BOMPON (4)
ML72-00
74
LABEL, DTC81
30x50x0.15
ML68-0
SCREW-TAP
PH+, 2.6x12, BLK
76
PCB-MAIN DTC81
FR-1, loz, 125x64x1.2
77
PWR-CORD
75
(BOTTBM)
ML60-00001A ML41-00 ML39-00
78
(U1)
HEAT-SINK(U1)
15x13x5x1.0
ML62-00133A
79
(U1)
SCREW-TAP)U1)
PH+, M3x6
6001-000563
ADHESIVE-SEALANT
DC739, 40RTV
0201-001029
80
0201-000303 81
VINIL SACK
170x350x0.05, WHITE
82
SOLDER-WIRE
KR-19, S60A, D1.0
83
ALCOHL
(CH3)2CHOM
0204-000429
84
FLUX-SOLDER
920-CFX
MF02-00020A
0202-000178 0202-000193
0202-000226 85
SOLDER-WIRE
D3, 0, Sn60%
SAMSUNG Proprietary-Contents may change without notice
ML74-00113A
8-19
8-3 Hands-Free Kit Part List No
Design LOC
DESCRIPTIONS
1
UPPER C/D
FOR CRADLE
2
LOWER C/D
FOR CRADLE
3
FRAME
FOR CRADLE
4
HOLDER SOCKET
FOR CRADLE
5
LOCKER
FOR CRADLE
6
EJECTOR
FOR CRADLE
7
SPRING LOCK
FOR CRADLE
8
SPRING EJECT
FOR CRADLE
9
HOLDER C/D
FOR CRADLE
10
COVER GATE
FOR CRADLE
11
SCREW
#2 BT 2.6x6B
12
SCREW
BM 3x6B
13
SCREW
#2 BT 2x8Y
14
CASE CONN UPPER
FOR CONNECTOR JACK
15
CASE CONN LOWER
FOR CONNECTOR JACK
16
BUTTON PUSH
FOR CONNECTOR JACK
17
CURL CORD ASS'Y
FOR CONNECTOR JACK
18
CONNECTOR
FOR CONNECTOR JACK
19
SPRING PLATE
FOR CONNECTOR JACK
20
CABLE DATA ASS'Y
HIROCE 15P
21
SCREW
#2 FT2x6B
22
CASE UPPER
CONTROL BOX CASE
23
CASE LOWER
CONTROL BOX CASE
24
BRACKET INSTALL
CONTROL BOX CASE
25
RIVET
CONTROL BOX CASE
26
HEAT SINK
CONTROL BOX CASE
27
SCREW
#2 PS 3x6 Y
28
SCREW
#2 PS 3x12 B
29
CASE UPPER
MICROPHONE
30
CASE LOWER
MICROPHONE
31
SPRING FIXING
MICROPHONE
32
SCREW
#1 FT 2x8 B
33
CABLE MIC
1P+1SCHIELD WIRE+PLUG
34
CUSHION MIC.
MICROPHONE
35
MIC CONDENSOR
CMP-68(NP)
36
CABLE POWER
4P, RED-BLK-YLW-WHITE
37
LABEL
FOR CRADLE
38
LABEL
FOR CONTROL BOX
39
LABEL
FOR SPEAKER
40
LABEL BAR CODE
FOR SERIAL NO.
8-20
SEC. CODE
REMARKS
SAMSUNG Proprietary-Contents may change without notice
No
Design LOC
DESCRIPTIONS
41
LABEL BAR CODE
FOR PRODUCT
42
MANUAL
4-COLOR PRINT
43
POLYBAG
15x27, PE
44
POLYBAG
6x9, PE
45
CABLE TIE
80mm
46
POWER LOG
ø6
47
SCREW
#1 BT4x16B
48
SCREW
PM 4x6B
49
BOX ACCESSORY
FOR ACCESSORY ASS'Y
50
UNIT BOX
FOR PACKING
51
PACKING PAD
FOR PACKING
52
OUTER BOX
FOR PACKING
53
CASE FRONT
FOR EXTERNAL SPEAKER
54
CASE REAR
FOR EXTERNAL SPEAKER
55
HANDLE SPEAKER
FOR EXTERNAL SPEAKER
56
BOLT
FOR FIXING HANDLE
57
HEX. NUT
WITH WASHER
58
SPEAKER
LEEWON 9050F
59
SPEAKER WIRE
2P
60
SCREW
#1 PT 3x12B
61
LABEL
62
LABEL 3 SORTS
SAMSUNG Proprietary-Contents may change without notice
SEC. CODE
REMARKS
8-21
No
Design LOC
DESCRIPTION
1
ZD201, ZD202
ZENER DIODE
5.1V 0.5W - DIP
2
ZD1
TVS DIODE
P6KE33 - DIP
3
D5, D7, D101, D102
DIODE
1N4148 - DIP
4
D1, D2, D3
DIODE
1N5818 - DIP
5
D100
DIODE
SDS7000 - CHIP
6
R278
RESISTOR
CH2012 1ohm-J 5%
7
R9
RESISTOR
CH2012 91oohm-F 1%
8
R8
RESISTOR
CH2012 8.2K-F 1%
9
R3, R13, R131
RESISTOR
CH2012 100ohm-J 5%
10
R51, R52, R139, R272
RESISTOR
CH2012 220ohm-J 5%
11
R279
RESISTOR
CH2012 270ohm-J 5%
12
R137, R138
RESISTOR
CH2012 330ohm-J 5%
13
R31, R32, R225, R251, R257,
RESISTOR
CH2012 1K-J 5%
SEC. CODE
REMARKS
R270 14
R132
RESISTOR
CH2012 1.8K-J 5%
15
R213, R217, R228, R229,
RESISTOR
CH2012 2.2K-J 5%
R230, R231 16
R271
RESISTOR
CH2012 2.4K-J 5%
17
R1, R7, R112
RESISTOR
CH2012 2.7K-J 5%
18
R18
RESISTOR
CH2012 3K-J 5%
19
R12
RESISTOR
CH2012 3.9K-J 5%
20
R38, R110, R113, R117,
RESISTOR
CH2012 4.7K-J 5%
R119, R268 R275 21
R57, R233, R248
RESISTER
CH2012 5.1K-J 5%
22
R5, R10, R17, R20, R23,R27
RESISTER
CH 2012 10K-J 5%
R30, R33, R41, R44 R45, R46, R55, R56, R100. R104, R108, R109, R111, R115, R116, R120, R122, R123, R124, R135, R201, R202, R203, R204, R205, R207, R208, R210, R211, R212, R215, R252, R253, R254, R255, R258, R260, R266, R270, R274, R276, R114 23
R269
RESISTER
CH 2012 560 ohm-J 5%
24
R102
RESISTER
CH 3216 10K-J 5%
25
R43
RESISTER
CH 3216 12K-J 5%
26
R54, R267
RESISTER
CH 3216 10K-J 5%
8-22
SAMSUNG Proprietary-Contents may change without notice
No 27
Design LOC
DESCRIPTIONS
R19, R128, R266
RESISTER
CH 2012 12K-J 5%
28
R24
RESISTER
CH 2012 15K-J 5%
29
R106, R107, R121, R127, R277
RESISTER
CH 2012 18K-J 5%
30
R16, R126
RESISTER
CH 2012 22K-J 5%
31
R40, R222, R223, R224
RESISTER
CH 2012 27K-J 5%
32
R4, R21, R37, R101, R105
RESISTER
CH 2012 33K-J 5%
SEC.CODE
REMARKS
R136, R140, R259, R273 33
R133, R134
RESISTER
CH 2012 47K-J 5%
34
R227
RESISTER
CH 2012 56K-J 5%
35
R216, R226
RESISTER
CH 2012 68K-J 5%
36
R36, R42, R53, R103, R125,
RESISTER
CH 2012 82K-J 5%
R129 R141, R214, R261 37
R26
RESISTER
CH 2012 100K-J 5%
38
R39
RESISTOR
CH 2012 220K-J 5%
39
R29
RESISTOR
CH 2012 1M-J 5%
40
R14
RESISTOR
CH 2012 5.6K-J 5%
41
R50
RESISTOR
0.1 ohm/1W-F-DIP
42
L6
RESISTOR
22 ohm/1W-J-DIP
43
VR1
VAR. RESISTOR
0.2 ohm/1W-J-DIP
44
C255, C256
ELEC. CAPACITOR
MVR32 5K
45
C257
ELEC. CAPACITOR
0.47UF/50V (5*11)85˚C
46
C15, C204, C205, C206, C259
ELEC. CAPACITOR
2.2UF/16V (5*11)85˚C
47
C104
ELEC. CAPACITOR
10UF/16V (5*11)85˚C
48
C106
ELEC. CAPACITOR
10UF/25V (5*11)85˚C
49
C258
ELEC. CAPACITOR
22UF/35V (5*11)85˚C
50
C207
ELEC. CAPACITOR
47UF/16V (5*11)85˚C
51
C1
ELEC. CAPACITOR
100UF/35V (6.3*11)85˚C
52
C7, C18, C23, C29, C40,
ELEC. CAPACITOR
470UF/16V (8*11.5)85˚C
C43, C45, C260 53
C4
ELEC. CAPACITOR
470UF/35V (10*18)85˚C
54
C221
TAN. CAPACITOR
4.7UF/16V (5*11)85˚C
55
C32, C101, C105, C107
CERAMIC CAPACITOR
CH 2012 B330P-J (330)
C108, C109, C110, C111, C112, C111133,, C114, C115, C1116, C117, C118, C119, C201, C202, C215. C216, C217 56
C17
CERAMIC CAPACITOR
CH 2012 B470P-K (471)
57
C5, C25, C209, C218, C222,
CERAMIC CAPACITOR
CH2012 B102-K (102)
SAMSUNG Proprietary-Contents may change without notice
8-23
DESIGN LOC
No
DESCRIPTION
SEC. CODE
REMARKS
C223, C261 58
C250
CERAMIC CAPACITOR
CH 2012 B152-K (152)
59
C100
CERAMIC CAPACITOR
CH 2012 B103-K (103)
60
C219, C220
CERAMIC CAPACITOR
CH 2012 B472-K (472)
61
C2, C3, C6, C13, C14, C16, C22,
CERAMIC CAPACITOR
CH 2012 B104-Z (104)
C24, C26, C30, C31, C41, C42, C44,C46, C103, C120, C121, C2224, C226, C228, C237, C238, C239, C241, C242, C243, C244, C245, C246, C247, C248, C249, C251, C252, C253, C254, R209 62
C208, C213
CERAMIC CAPACITOR
CH 2012 B105-Z (105)
63
C263
CERAMIC CAPACITOR
CH 3216 B104-Z (104)
64
C262
CERAMIC CAPACITOR
CH 2012 B224-Z (224)
65
L2
INDUCTOR (COIL)
220UH (18ø )
66
L4
INDUCTOR (COIL)
220UH (13ø )
67
L1
INDUCTOR (COIL)
10UH
68
L3
INDUCTOR (COIL)
20UH
69
J100
CONNECTOR-DATA
20P (RP13A-12RC-20PB)
70
J201
MIC JACK
TC38-001-01
71
J203 FOR SPEAKER
CONNECTOR-SPEAKER
LAD-1140-02 (2 PIN)
72
J1
CONNECTOR-POWERR
LAD-1140-04 (4 PIN)
73
Q20, Q21
TRANSISTOR
B772-DIP
74
Q1, Q2, Q6, Q11, Q12, Q13, Q14,
TRANSISTOR
KST2222A - CHIP
Q15, Q16, Q100, Q101, Q102, Q103, Q104, Q105, Q107, Q108, Q109, Q110, Q208 75
Q3, Q8, Q106, Q202
TRANSISTOR
KST2907A - CHIP
76
Q4, Q5
FET
IRF9540 OR 2SJ176 - DIP
77
BT201
X-TAL
I2.288Mhz - DIP
78
BT100
RESONATOR
3.58Mhz - DIP
79
U201, U207
IC
LM358 - CHIP
80
U202
IC
AD1845 - CHIP
81
U204
IC
ADSP-2176 - CHIP
82
U205
IC
74111C14D - CHIP
83
U206
IC
93C66 - CHIP
84
U208
IC
HEF4051B - CHIP
85
U100
IC
PIC6C73 - CHIP
86
U1
IC
NJM2360 OR KA34063 - CHIP
8-24
SAMSUNG Proprietary-Contents may change without notice
No
DESIGN LOC
DESCRIPTIONS
87
U4
IC
LM2576 - DIP
88
U2
IC
LM7805 - CHIP
89
U3
IC
LP2951CM
90
U5
IC
LM3403 - CHIP
91
U101
IC
LM2904 - CHIP
92
S201
SWITCH
TACT SWITCH
93
U209
IC
TDA1905 - DIP
94
P.C.B
No
REMARKS
SEC. CODE
REMARKS
SEC. CODE
REMARKS
MAIN PCB SCH 811
DESIGN LOC
DESCRIPTIONS
1
MIC ASS'Y
CMP-68
2
SPEAKER ASS'Y
4 ohm 5W
3
POWER CABLE
4 PIN POWER CABLE ASS'Y
No
SEC. CODE
DESIGN LOC
DESCRIPTIONS
1
RESISTOR
CH 2012 330 ohm-J 5%
2
RESISTOR
CH 2012 2.2K-J 5%
3
RESISTOR
CH 2012 1K-J 5%
4
CONNECTOR WAFER
13 PIN 2mm PITCH ANGLE
5
CONNECTOR WAFER
15 PIN 2mm PITCH ANGLE
6
PHOTO INT.
SG215 - DIP
7
THERMOSTOR
C103JF4C (10K 1%)
8
LED (LED TACK)
KARG138 (5 , 3 COLOR)
9
COILD CORD CABLE
13 PIN 2mm PITCH ANGLE
10
DATA CABLE
15 PIN 2mm PITCH ANGLE
11
P.C.B
SUB PCB SCH-811
SAMSUNG Proprietary-Contents may change without notice
8-25
8-4 Travel charger No
DESIGN LOC
DESCRIPTIONS
1
U2
IC OPTP
2
U1
IC PWM P/S
TOP222P
3
U4
IC V.REF TO -92
KA431AZ
SEC. CODE
REMARKS
LTV817V TLP621GRH
TL431ACLP KIA431 4
D1, 2, 3, 4
DIODE REC
1N4007
5
D21
DIODE SCHOTKY
SR560 SR560
6
D7, 20
DIODE SW
RLS4148
7
D5
T.V.S DIODE
P6KE160A P6KE1600A
8
D6
DIODE UF
9
D24
DIODE ZENER
RLZJ4.3
10
LED
LED CONNECTOR
352111-0310
11
LED
12
MOV1
UF40007 UF4007
ALL-153GW VARISTOR
D62Z0V300RA65
M.O.V
TNR12G471K RG06P102
13
VR1
SEMI-FIXEED RES
14
L1, 2
INDUCCTOR
15
PTF1
SGH500 TRANS
16
L20
CHOKE ASS'Y
17
R4, 5
SURGE RESISTOR
PPSR0.5W
18
C1, 2
CAP EL
SHL400V10UF
19
C22
CAP EL
KMF16V330UF
20
C21
CAP EL
AG10V1000UF
21
C4, 20, 24
CAP EL
1SK1C476M05007
22
C8
CE. CAP
440DL472
23
C3
CE. CAP
ECSL3A220K06BS5
24
C6
MY. CAP
S/M2A152J
25
TH
THERMISTOR
FTG-310H37
26
F1
MICRO FUSE
MST
27
SK2
CONN. HEADER
5267-04A
28
Q7
S.S. TR
KTA1273
29
R2
CHIP RESI
MCR18EZHJ6R2
30
R14, 15, 16
CHIP RESI
MCR18EZHF1R0
31
JP1, 2, 3
CHIP RESI
MCR18EZHJ0R0
SCH500
SDE472M
CR180R0JM
8-26
SAMSUNG Proprietary-Contents may change without notice
DESIGN LOC
DESCRIPTIONS
32
R66, 67
CHIP RESI
33
JP4, 5
CHIP RESI
MCR10EZHJORO
34
R57
CHIP RESI
MCR10EZHF1501
SEC. CODE
REMARKS
MCR18EZHJ511 CR18511JM
CR10150FM 35
R58
CHIP RESI
MCR10EZHF2201 CR102201FM
36
R17
CHIP RESI
MCR10EZHJ470 CR10470JM
37
R1
CHIP RESI
MCR18EZHJ103 CR18103JM
38
R59
CHIP RESI
MCR10EZHJ102
39
C23
CHIP CAPACITOR
CM21COG331J50AT
40
C5
CHIP CAPACITOR
CM316Y5V224Z50AT
41
C25, 26, 27, 28, 29, 30
CHIP CAPACITOR
CM21Y5V104Z50AT
42
U3
IC HYBRID
AH1504F
43
MICOM IC
PIC16C711
44
P.C.B
TC30
45
AC PLUG ASS'Y
46
PLUG TERMINAL
47
CONTACT TERMINAL
48
CONTACT TERMINAL
49
CASE BOTTOM
50
CASE TOP
51
SCREW
52
SCREW
53
OUTPUT CABLE ASS'Y
54
LABEL
55
CARTON BOX
56
MAIN BOARD
57
CARD BOARD(A)
58
CARD BOARD(B)
59
PAD
60
VINYL SACK
AXR324100201
SAMSUNG Proprietary-Contents may change without notice
8-27
8-5 CLA Parts List
No
Design LOC
DESCRIPTIONS
SEC CODE
REMARKS
MAIN SMD ASS'Y 1
C6, C9
CERAMIC CAPACITOR
CL21B04JBNCS/0.1U
2
C3
CERAMIC CAPACITOR
CL21B103JBNCS/0.01U
3
C5, C10
CERAMIC CAPACITOR
CL21B224JBNCS/0.22U
4
D7
CHIP DIODE
KDS181
5
D5, D6
CHIP DIODE
KDS184
6
R21
CHIP RESISTOR
RC1608J102CS/1K OHM
7
R111, R12, R22, R34
CHIP RESISTOR
RC1608J104CS/100K OHM
8
R31
CHIP RESISTOR
RC1608J134CS/130K OHM
9
R33
CHIP RESISTOR
RC1608J182CS/1.8K OHM
10
R15
CHIP RESISTOR
RC1608J222CS/2.2K OHM
11
R29
CHIP RESISTOR
RC1608J272CS/2.7K OHM
12
R35
CHIP RESISTOR
RC1608J304CS/300K OHM
13
R13
CHIP RESISTOR
RC1608J333CS/33K OHM
14
R14
CHIP RESISTOR
RC1608J335CS/3.3M OHM
15
R5
CHIP RESISTOR
RC1608J392CS/3.9K OHM
16
R16, R17
CHIP RESISTOR
RC1608J431CS/430 OHM
17
R27
CHIP RESISTOR
RC1608J432CS/4.3K OHM
18
R6, R24
CHIP RESISTOR
RC1608J562CS/5.6K OHM
19
R7, R18, R19, R20,
CHIP RESISTOR
RC1608J912CS/9.1K OHM
R26, R28, R30, R32 20
Q3, Q5, Q7, Q9, Q10, Q11
CHIP TRANSISTOR
KSR1104/NPN
21
Q4, Q8
CHIP TRANSISTOR
KSR2104
22
Q1, Q6
CHIP TRANSISTOR
KTA1504 INSERT ASS'Y
23
J1
7 PIN CONNECTOR
GILS-7P-S2T2-EF
24
L1
CHOKE COIL
RF-300/300UH
25
D2, D4
SCHOTTKY DIODE
1N5819
26
D1
TRANSIENT DIODE
P6KE36A
27
U4
DIODE
KA431
28
C7
ELECT CAPACITOR
CESSL1C100MAAT/10U16V 105˚C
29
C2, C4
ELECT CAPACITOR
CESSL1C331MAAT/330U16V 105˚C
30
C1
ELECT CAPACITOR
CESSX1V101MAAT/100U35V 105˚C
31
F1
FUSE
250V/2A
32
U1
ADJUST REGULATOR I.C.
LM2576T-ADJ
33
U2
O.P AMP
KA358D
34
U3
O.P AMP(14P)
KA324D
35
LED 1, 2
DUALL COLOR LED LAMP
SAM3270
36
R4
CARBON FILM RESISTOR
0.5 OHM 11/2W
37
R2
CARBON FILM RESISTOR
11K OHM 1/4W
8-28
SAMSUNG Proprietary-Contents may change without notice
No
Design LOC
DESCRIPTIONS
38
R1
CARBON FILM RESISTOR
470 OHM 1/4W
39
R3
CARBON FILM RESISTOR
680 OHM 1/4W
40
VR1
V. RESISTOR
1K OHM/VOLUME/GF06P
41
CURL CORD ASS'Y
7 PIN/MQ179
42
CLA PCB
FR-4 (T=1.6)
43
OUTER GND
1.68PIE/25MM
44
WIREJUMPER
PC/BLACK
45
UPPER COVER
PC/BLACK
46
LOWER COVER
PC/BLACK
47
FUSE COVER
CLA OUTER SPRING
48
OUTER SPRING
CLA POWER CONTACT
49
POWER CONTACT
CLA
50
SPRING
FUSE HOLDER/CLA
51
FUSE HOLDER
FUSE PLATE/CLA
52
FUSE PLATE
TAPPING SCREW
+PH (2.6x14-2S) BLACK
53
UPPER+LOWER
NAME LABEL
CLA010A
SEC. CODE
REMARKS
ELECTRIC ASS’Y
PACKING ASS’Y 54
HANISHELLL
55
OUT BOX
CARTON BOX
56
CURRUGATED PAD
CLA CORRUGATED PAD
57
CLA SPONGE
SAMSUNG Proprietary-Contents may change without notice
8-29
9. PCB Diagrams 9-1
Cellular Phone
9-1-1 Main PCB - LOGIC B'D
9-1
Cellular Phone
9-1-2 Main PCB - LOGIC B'D
9-1
Cellular Phone
9-1-3 Main PCB - RF B'D
9-1-4 LCD FPC
9-2 Desk-Top rapid Charger PCB Top View
Bottom View
9-3 Hands-Free kit 1 PCB
Top View
Bottom View
9-4 Cradle 1 PCB Top View
9-5 TC PCB Top View
Bottom View
9-6 CLC PCB Top View
Bottom View
Main Block Diagram
SCH - 811 BLOCK DIAGRAM 3.6V
BATTERY DC/DC 550mAh 1000mAh 1600mAh
Regulator
3.3V
Regulator
3.3AV
Regulator
3.3BBA
Regulator
3.3VT
Regulator
3.3VRC
3.7V CONV.
COMBINATION MEMORY 8M FLASH + 2M SRAM FLASH MEMORY 8M FLASH
EEPROM 256K BITS
1st RF
2nd RF SAW FILTER
Driver Amp
SAW FILTER
130.38 MHz
IF AGC AMP I
PA
D/A CONV.
USER INTERFACE
80186 16BIT CPU
Q
& 824~894 MHz
Filter
PLL & VCO
DUPLEXER
10-1
LCD & KEY
Interleaver
MOD.
& Encoder
Vocoder
A/D CONV.
1ST LO SYNTH
&
(966.87+/12.5 MHz)
MIC PCM CODEC
&
Filter
SPK
VCO RF SAW FILTER
RF AMP
IF BPF
DEMOD
IF AGC AMP
A/D CONV. I
LNA
Q
869~894 MHz 85.38 MHz
Deinterleaver & Decoder
EXT Vocoder I/F
& EVRC Filter
FM DATA PROCESSOR
FM AUDIO PROCESSOR
10-2
Desk-Top rapid Charger Block Diagram
C-C Input
Line
Rectifier
Rectifier
Filter
& Flate
& Flate
Filter
C-V
FET-S/W
Control
Front-out 4.2V/0.8A Snubber u-com
Rectifier & Flate
Reference
Switch |
LED
Over-voltage protection
Display
LED-controller
Controller
charging control
O.C.P O.V.P
| Thermal protection
Feedback
Buck Converter
Filter
C-C C-V Control
FET-S/W Rear-out 4.2V/0.4A
10-3
Hands-Free kit 1 Block Diagram
STABILITY CIRCUIT
POWER (10V~28V)
POWER CONTROL
REGULATOR 5V (RESET CIRCUIT)
DC/DC REGULATOR
CURRENT DETECTOR
VOLTAGE/ CURRENT FEEDBACK
IGNITION
MICOM
CRADLE
DATA COMMUNICATION
EEPROM
DSP
Tx AMP CALIBRATION CODEC Rx AMP MICROPHONE
VOLUME CONTROL
AUDIO AMP
SPEAKER
10-4
Travel Charger Block Diagram
1
2
3
4
5
6
7
8
9
10
11
12
14
13
15
16 A
A R105 CD
FM_CLK FM_STB FM_RX_QD FM_RX_ID
100 MSM
100
+3.3V : E6, F5, J5, K6, E9, F10, J10, K9
R182
R181
DGND : E7, E8, F6, F7, F8, F9, G5, G6, C106 100pF
100pF
10K
C151 1000pF
C152 100pF R183
Q_OFFSET
+3.3V
C104 2.2K
C103
220pF
1K
+3.3V
470pF
1000pF
+3.3V
C183
C184
C185
0.01uF
0.01uF
0.01uF
0.01uF
P10 A12
U102
6 5 17 26
+3.3V
R117 1K
VCC VCCP
VLR+ VLR-
VCCA
BZ
GND GNDP GNDA
LO
B11
19 16 15 14 18 42
C115 + C117
C116
21 8 36
0.01uF
0.1uF
1U/10V(R) TP1
M10
1K R120
+3.3V
2
1
F
MMBT2222A
A0 A1 A2 GND
VCC NC SCL SDA
R124
8 7 6 5
R121
15K
24LC256
B5 C7 A7 A8 C8 B9 C9 D9
MUX_CTL
SCL SDA
D110
3
C208 R218
2
1
4
3
150 C207
SVC_LED
2
R216 22K
C119
1
0.01uF
SML-020MLT
C162
R126
ALT_LED
OPEN
M4
R129
DP_TX_DATA DP_RX_DATA
1
100
P5
R130
V_DC
M3
470
M5
C123
C122
C121
TP2
N5
1U/10V
A6
JACK_S
A3
L101 Q103 6 5 4
BATT
D1 D2 D3 D4 S G
1 2 3
+ C125
33U/6.3V(B) 1 2 3 4 5 6 7 8
C127
0.01uF
100K
R136 10K
Q104
1UF
VDD VS LL_ DR DMAX_SS DS COMP PGND UVLOSET FB NI COSC VREF ROSC GND ENABLE
1 2 3 4
(1608)
16 15 14 13 12 11 10 9
D1 S1 S1-1 G1
D2 S2 S2-2 G2
100K
8 7 6 5
C129
R150 C132
100U/6.3V(B)
0.1uF
0.1uF
3
1
DTC144EE
4
5
+3.3AV
VCC INB INA OUTGND
4
1 2 3
4
ADC_IN0 1
DGND1
DGND2
DGND3
DGND4
R145 47K
6.8K
D104 DA204UT
R146 100K
100K
V_F
R122
R123
1.2K
10K(1%)
LRS1306
C211 0.1uF
D124
3
R230
2
DSP_RESET_
D126
25 26 19 23 31 30 28
X102
SSR27.00B-C15
CKO TDO
M12 P8 L7
52 9 63
21 27
D
+3.3V
TC4W53F PCM_DOUT
R213 13K
C181
H2
R225 33
R212 33
IMD_CTL ADC_SEL1 ADC_SEL0 ADC_IN0 TRK_LO_ADJ
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59
0
MODE_SEL _IDLE _SLEEP
CHIPX8 C166
R222 OPEN
BUZZ_
OPEN
VBAT VBAT R190
C_RX_QD(3) C_RX_QD(2) C_RX_QD(1) C_RX_QD(0) C_RX_ID(3) C_RX_ID(2) C_RX_ID(1) C_RX_ID(0) TX_CLK _TX_CLK CHIPX8 PA_ON
100K
C164
U111 4
C_RX_ID(3) C_RX_ID(2) C_RX_ID(1) C_RX_ID(0)
MUX_CTL
V_DC
ADC_EN ADC_DATA ADC_CLK
TX_IQ_D(7) TX_IQ_D(6) TX_IQ_D(5) TX_IQ_D(4) TX_IQ_D(3) TX_IQ_D(2) TX_IQ_D(1) TX_IQ_D(0)
8 7 6 5
LED_ON
R221 OPEN
L2 H1 H4
E
U112 COMMON VDD CH0 INH CH1 VEE A VSS
Q123
C2 B1 C1
F4 F3 F2 F1
C
J104
+3.3V
G4 G3 G2 G1
14
51 10
1
_PCS6
J2 J1 H3 J4 K1 K2 J3 L1
IBF2_PIBF IBF1 DO1
11
TCK TMS RSTB TRST CKI2 CKI TDI
1 2 3 4
CO_DIN
MMBT2222A
1K
L11
2
TCXO_4
TC7S04F
C_RX_QD(3) C_RX_QD(2) C_RX_QD(1) C_RX_QD(0)
0.01uF
PLL_CLK PLL_DATA PLL_EN SYN_EN RX_AGC_ADJ
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60
F
+3.3V TX_AGC_ADJ LOCK ADC_EN ADC_DATA ADC_CLK Q_OFFSET I_OFFSET
G
FM_RX_ID FM_RX_QD FM_CLK FM_STB TCXO_4 TX_IQ_D(7) TX_IQ_D(6) TX_IQ_D(5) TX_IQ_D(4) TX_IQ_D(3) TX_IQ_D(2) TX_IQ_D(1) TX_IQ_D(0)
_TX_CLK SPK-
TX_CLK
H
HEADER30X2
SPK+
+3.3V
A10 D1 M2
LCD_CS D130 SM05
_SLEEP _IDLE
4.7K
MODE0 MODE1 MODE2
B2 C3 D4
I_OFFSET D3 Q_OFFSET D2
2
1
4
5
6
D129 D111
CD
RI
D135 RTS
KEY_0
V_F
KEY_1
C_F
1 2 3
SMS05C
UP
F4
DOWN
F1
F2
F3
SMS05C
SEND
CLR
J110 100K
100K END/P
1
2
3
4
5
6
RX_AUDIO DGND C_F DGND TX_AUDIO DGND DP_RX_DATA DP_TX_DATA HP_PWR RI CD
1 2 3 4 5 6 7 8 9 10 11
12 13 14 15 16 17 18 19 20 21 22
V_F DGND RTS BATT BATT CTS DTR DGND C_F V_F BATT
3
2
4
5
KEY_2
J103
R173
D125
+3.3V
R211 22K
M14 L12 N14
R175
D123
CO_DOUT
9 NC1 36 NC2
IACK
OBE2_POBE OBE1
18 TRAP 12 INT1 13 INT0 7 DI1
EL_EN
100K
D122
_LWR _RD
N12
3
C133
D121
NC
U115 DSP1627SS
58 OCK2_PCSN 57 DO2_PSTAT 56 SYNC2_PBSEL 55 ILD2_PIDS 53 OLD2_PODS
_PCS6
C156 100pF
V_DC
R174
D120
OLD1 OCK1 ICK1 ILD1 SYNC1 SADD1 DOEN1
C170
C171
0.01uF
0.1uF
J105
0.1uF
1000pF
5
C158 0.01uF
MBM29LV800T
R189 22K
N13
R172
BATT
2 3 4 5 62 61 60
3
C155 0.1uF
22 VSS1 25 VSS2
+3.3V
VOL_KEY
10U/6.3V(R)
7
R210 47K
AD(15) AD(14) AD(13) AD(12) AD(11) AD(10) AD(9) AD(8) AD(7) AD(6) AD(5) AD(4) AD(3) AD(2) AD(1) AD(0)
37 36 35 34
C_RX_QD(0:3)
1 2 3
SCAN_0 KEY_3 SCAN_1
R149
23 18 16 14 35 33 31 29 19 17 15 13 34 32 30 28
VEC3_IOBIT4 VEC2_IOBIT5 VEC1_IOBIT6 VEC0_IOBIT7
7
8
9
*
0
H
D127
NNYG101TS
R177
C167
100K
1500P
J
LCD_CONN_22
C161
0.1U
C222
0.1U
C200
C202
C198 C197
C163
100K
I
47P 0.1U 47P 47P 0.1U 47P 47P 47P 47P 47P 47P 47P 47P 47P 470P 47P
C201
Engineer: CDMA2 Drawn by: JB-KIM R&D CHK:
IFCON
100K
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
LCD_CS _RESET A(1) DGND AD(7) D112 AD(6) AD(5) 1 SMS05C AD(4) AD(3) AD(2) AD(1) AD(0) 6 DGND +3.3V +3.3V SPK+ SPKMOTOR EL_EN
0.1U
C194 C192 C190 C196 C187 C188 C186 C191 C195 C193 C199
K
COMPANY NAME Address City Size: A3
TITLE:
R178 R168 51
V_F_CON
R169 51
R170 51
R171 51
B
R188
2
0.01uF
10K
0
_RD _LWR _RAM_CS
12
37 RY_BY* 21 _BYTE 11 _RESET
+3.3V R186
_RESET
VCC
DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0
24 _OE 26 _CE 10 _WE
R187
TX_IQ_D(0:7)
SCAN_0 SCAN_1 SCAN_2 SCAN_3 SCAN_4 SCAN_5 SCAN_6
V_DC
Q101 DTA144EE
C118
GND
A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
1
TC7W04FU
R176
1
3
31 _SWE 44 _SCE 9 _SOE
_FRP
_RESET
0.1U
R148 100K
AD(15) AD(14) AD(13) AD(12) AD(11) AD(10) AD(9) AD(8) AD(7) AD(6) AD(5) AD(4) AD(3) AD(2) AD(1) AD(0)
100
4.7K
2SC4081BR
27
A(19) A(18) A(17) A(16) A(15) A(14) A(13) A(12) A(11) A(10) A(9) A(8) A(7) A(6) A(5) A(4) A(3) A(2) A(1)
R185 10K
38 39 20 3 2 1 4 5 6 7 8 40 41 42 43 46 45 44 27
+3.3AV 29
C_RX_ID(0:3)
R147
+3.3V
K
11
_KEYSENSE4
+ C138
MIC5205-3.3BM5
C221 R144 Q107
LCD_CS _SLEEP _IDLE
GPIO7
5
VIN VOUT GND CONT BYP
C137
TC7S32FU 3
C_RX_QDATA3 C_RX_QDATA2 C_RX_QDATA1 C_RX_QDATA0
_RFR
+3.3AV
150K
2
_CTS
10U/6.3V(R)
R153
HP_PWR
C_RX_IDATA3 C_RX_IDATA2 C_RX_IDATA1 C_RX_IDATA0
470pF
R142 68K(1%)
1 2 3
_GP_WR GPIO_INT1
C135
0.1U U107
U116
GPIO17
+ C136
MIC5219-3.3BM5
C220
R141 100K(1%)
0.1uF
TX_IQDATA7 TX_IQDATA6 TX_IQDATA5 TX_IQDATA4 TX_IQDATA3 TX_IQDATA2 TX_IQDATA1 TX_IQDATA0
TAMN1
5
VIN VOUT GND CONT BYP
28 _RD _FOE _ROM_CS 26 _FCE _LWR 10 _FWE
M11
R223
1
150K 15K
C128
CHIPX8 TCXO_4 TX_CLK _TX_CLK
2
+3.3V
U106 1 2 3
R152
A(19) A(18) A(17) A(16) A(15) A(14) A(13) A(12) A(11) A(10) A(9) A(8) A(7) A(6) A(5) A(4) A(3) A(2) A(1) A(0)
U114
U110
MSM2300BGA
RESET_ VCC GND
MAX809S
C130 100pF R139
R135 100K
GPIO_28 GPIO22 ADC_ENABLE ADC_DATA ADC_CLK
U108
RN1104
R138
J
_DT_R
GPIO21
ON_SW_SENSE
2
22K
SI9161 56K
_PCS6
GPIO20
Q106 3 UPS5819 + C131
_ROM_CS _RAM_CS _EEPROM_CS
GPIO13
R151
V_DC
D109
SI6803
_LWR
TMS TCK TDO TDI _TRST GPIO14 GPIO15 GPIO16
M6 GPIO19 P9 GPIO_INT0
+3.3V C139
U105
R134
PS_HOLD DC_DC_CON
10uH
MCL4148
0.1uF
SI3443
I
D107
R137 100
C126
_HWR
M9 _RESIN P11 RESOUT
33K SMS05C
VBAT
WDOC_STB
P4 DP_TX_DATA L5 DP_RX_DATA
470pF
100pF
100pF
470pF C120
R127
+3.3V
4
C210 47P
C180
_RD
5
2
FR2S2025-052500
22K
3
2
6
S1 R215
3
22K M8
R133
1
Q124 2SA1576
R132
+3.3V
100
D128
39K
1
R131
DTR CTS
R214
D11 C12 B13 B14 D12 C13 E10 C14 E12 D13 E11 D14 F12 E13 E14 F11 G12 F14 F13 G14
_WP_ROM
RTS
WDOG_EN
100
IMD_CTL
U114 TC7W04FU
+3.3V
2
XTAL_OUT
L9 GPIO_INT2 P2 PDM1 P3 PDM2
REED_SW
2
47P
47K
BATT
4.7K
DTC144EE
C209
P6
R217
Q125
3
47P
+3.3V SVC_LED
47P
150 R220
G
A9 N6
DTC144EE
XTAL_IN
B6 GPIO8 D7 GPIO9 B7 GPIO10 B8 GPIO11 D8 GPIO12
Q126
+3.3V
MOTOR
OPEN
SSR27.00B-C15
1K
PLL_DATA PLL_CLK PLL_EN V_F_CON ADC_SEL0 ADC_SEL1 SYN_EN
PLL_DATA PLL_CLK PLL_EN V_F_CON ADC_SEL0 ADC_SEL1 SYN_EN MODE_SEL
H
N11
R125
DTA144EE
1K
L10
X101
U104
3
R128
2
P12
10K
+3.3V
3 Q121
M13 P13 K10
N7 GPIO24 N10 GPIO_INT4 N4 RINGER L6 GPIO18
SEND_END
RX_AUDIO
BUZZ_
A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
B12 PCM_SCS B10 AUX_PCM_CLK C10 AUX_PCM_SYNC D10 AUX_PCN_DIN A11 AUX_PCM_DOUT
+3.3AV
41
E
1 2 3 4
PCM_CLK
M7 GPIO23 P7 GPIO25 N8 GPIO26 L8 GPIO27
MODE_SEL DSP_RESET_
ST5092TQ
Q120
PCM_SYNC
+3.3V
R116
1
PCM_DOUT
1
C169 0.1uF
SPK+ SPK-
VFR+ VFR-
C11
Q119
MMBT2222A
47 45 42 40 37 35 33 30 46 43 41 39 36 34 32 29
I_O15 I_O14 I_O13 I_O12 I_O11 I_O10 I_O9 I_O8 I_O7 I_O6 I_O5 I_O4 I_O3 I_O2 I_O1 I_O
6
3 2
20 10 24 25
1
2
0.1uF R155 R113 5.6K 1M
CO CI CS CCLK
38 MIC3+ 37 MIC3-
C112
1SS226
R250 4.7
DX DR FX MCLK
31 MIC2+ 30 MIC2-
C168 0.1uF
D102
A13
34 MIC1+ 33 MIC1-
3
12 FVPP 14 _FWP
5
OPEN
0.1uF
13 SVCC 38 FVCC
3
C204
OPEN
C111
FA18 FA17 SA17_FA16 SA16_FA15 SA15_FA14 SA14_FA13 SA13_FA12 SA12_FA11 SA11_FA10 SA10_FA9 SA9_FA8 SA8_FA7 SA7_FA6 SA6_FA5 SA5_FA4 SA4_FA3 SA3_FA2 SA2_FA1 SA1_FA0 SA0
4
+
C203
47P
1UH(X)
10U/6.3V(R) C109 0.1uF
C205
47P
L105
1.5K + C110
6
2.7K
+3.3AV
TX_AUDIO C206
R115
+3.3AV 100K
5
R114
R111 C108
PCM_DIN
4
2 4 5 3 1
GPIO_INT3
1
TC75W56FU
33U/6.3V(B)
D
_WP_ROM CO_DOUT PCM_SYNC PCM_CLK PCM_DOUT CO_DIN
SEND_END JACK_S
2
8 1 7 4
VCC AOUT BOUT GND
15 16 48 1 2 3 4 5 6 7 8 17 18 19 20 21 22 23 25 24
A(19) A(18) A(17) A(16) A(15) A(14) A(13) A(12) A(11) A(10) A(9) A(8) A(7) A(6) A(5) A(4) A(3) A(2) A(1) A(0)
AD(15) AD(14) AD(13) AD(12) AD(11) AD(10) AD(9) AD(8) AD(7) AD(6) AD(5) AD(4) AD(3) AD(2) AD(1) AD(0)
3
AA+ B+ B-
SMS05C
2 3 5 6
G11 G13 H14 H13 H12 H11 J14 J13 J12 J11 K14 K13 K12 K11 L14 L13
GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6
U103 R109 120K R110 43K
J102
R112 OPEN
0.1uF
R224 1K
U109
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
VDDA
IOBIT3_PB7 IOBIT2_PB6 IOBIT1_PB5 IOBIT0_PB4 SADD2_PB3 DOEN2_PB2 DI2_PB1 CK2_PB0
VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSSA
C134
D101 SM05
SYNTH_LOCK PA_ON PA_R0 RA_R1 LNA_RANGE TRK_LO_ADJ TX_AGC_ADJ RX_AGC_ADJ
39 40 41 42 44 45 46 47
C5 B4 D5 A4 C6 A5 D6
200K R108 1K
BATT
K4 L4 L3 N1 N2 N3 K3 M1
+3.3AV
LNA_GAIN ALE NMI
MIC
+3.3V FM_RX_CLK E2 FM_RX_STB E1 FM_RX_QDATA E3 FM_RX_IDATA E4
U101
AD(7) AD(6) AD(5) AD(4) AD(3) AD(2) AD(1) AD(0)
PCM_CLK PCM_SYNC
A(0:19)
1 8 17 22 33 43 49 59 32
C182
WSYMCLK_GPIO29 N9 MASKDATA_GPIO30 K5
22K
4.7K
R154
AD(0:15)
100pF
R107
A2_KEYSENSE0 C4_KEYSENSE1 B3_KEYSENSE2 E5_KEYSENSE3
J111
+3.3V
100pF
20K
8200pF C100 0.01uF
+3.3V
C154
10K
STOP
R103
R102 C102
R101 C101
R100
C153
1K
15
1K
TRK_LO_ADJ TX_AGC_ADJ RX_AGC_ADJ
C
C159 0.01uF
R184
PA_ON
B
C160 1000P
I_OFFSET 1K
G7, G8, G9, G10, H5, H6, H7, H8, H9, H10, J6, J7, J8, J9, K7, K8
R104
VDD1 VDD2 VDD3 VDD4 VDD5 VDD6 VDD7 VDD8 VDD9
C105 LOCK
+3.3V
6 16 20 24 38 48 50 54 64
R106 RI
KEY_0
LED_ON
DOC CTRL CHK:
100K
KEY_1
SCH-811 LOGIC
KEY_2
MFG ENGR CHK:
16 1 12 A
L
L Changed by:
Date Changed: CDMA2
1
2
3
4
5
6
7
8
9
10
11
1999.02.12 12
Time Changed: 9:02:31 am
13
REV:
QA CHK:
14
Drawing Number:
15
Page: 1
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16 A
A +3.3VRC C340 100P R332
3
R334
1
2
4
36K
+
5
R335 43K
C355 0.047U
U314 LMV821
R333 56K
C389 BLM11A102S 3.3U/6.3V(R)
1
C300 0.047U C398 4700P
3
C301 1000P
Q300 2SC4081BR
IMD_CTL
100P
F300 DFA0836G0881A 4 10
TXOUTPUT
C304 7P
D
R323 OPEN
R330 1K
L305 39N(X)
R325 2K L304 100P
C307 5P
4
Q301 BFP196W
C311 100P
L306 8P
C321
R305
1
C316 100P
C312
L350 3
15N(W) Q302 BFP420
2
2 OUT
~OUT
C388 470P
L312 390N(X)
9
4
C327
10
5
1000P
C397 OPEN
6 7 8
_FMIF NC IFCON GND1 GND2 GND3 GND4_IFCON
L315
OPEN
470N(X)
10
RXIF C333 470P
R326 OPEN
9
_RXIF
D
C334 470P C335 OPEN
OPEN(X) F303 SAFC85.380ME35X
100K
+3.3VRC
C C330
RF2617
L314 R308
47N(W)
5 8 3 6 11 12
RX_AGC_ADJ 1K
13 14 15
_CDIF VCC1 VCC2 4 FMIF VCC3
4700P
MODE_SEL R309
16
2
C328
1 2 3 C323 1000P
7
CDIF IN_SEl GC
L313 120N(X)
SW395
1
6
G1G2G3G4G5G6
B
L316 470N(X)
+3.3VRC C339 0.1UF
R301
R300
C337 100P
C342 100P
U310 2
L322 5.6N(W)
U309
R321 100
C345
1
V_DC
CTL
BYP
GND 2
10uF/6.3V(R)
2
F
10uF/6.3V(R)
4
C356 0.01UF
R310 47K
G
_SLEEP
C357 4700P
C346 1P U306 LMX2332L
+3.3VRC C393 100P
VCC
19 20 C349 100P
OUT
GND1 GND2 GND3 GND4 GND5
3
C347 10U/6.3(R)
VT
4
R318 16
1
R316 0 C351
2 5 6 7 8
3900P
C350 100P
R317 16
4 R314 0
C353 56P
R315 5.1K
J300
PLL_CLK PLL_DATA PLL_EN SYN_EN RX_AGC_ADJ
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60
C352 0.22U/6.3(R)
U311
C354
C382
0.1U
0.01UF
+3.3BBA
+3.3V
3
TX_AGC_ADJ LOCK ADC_EN ADCDATA ADCCLK Q_OFFSET I_OFFSET
VOUT
CTL
VIN
BYP
GND 2
1
R327 0
C386 0.033U
C384
4
4700P
R328 910
5 3 6 8 13 16
DO_RF _RX_IN GND1 _IFIN IFIN GND2 GND3 DOIF GND4 GND5
C362 100P
TCO-555 3
OUT
VC GND GND1 GND2
1 2 5 6
TRK_LO_ADJ
H
C381 0.01U
VCC 4
L328 R399 BLM11A102S 150
+3.3BV C365
C366
100P
0.01U
C348 10U/6.3V(R)
I
C383 10P
PLL_CLK PLL_EN PLL_DATA
C387
C367
C369
C370
0.01UF
100P
100P
100P
TCXO
+3.3VRC
U313 NTH5G36B103J01TE
C385 3.3U/6.3V(R)
C378 0.01UF R322 47K
1
+3.3VT
U312 C374
MIC5205-3.3BM5 1
V_DC RXIFMDATA RXQFMDATA FM_CLK RXFMSTB TCXO_4 TXD(7) TXD(6) TXD(5) TXD(4) TXD(3) TXD(2) TXD(1) TXD(0)
U305 C363 100P
R313 10
7
RX_IN TCXO_IN
RX_IF_IN
R329 0
VDC_R RX_IF_DO
2 14 15 17
1 18
11 12 10 9
MIC5205-3.3BM5 5
VIN
VOUT
5 10U/6.3V(R)
2
C372 0.01U
C373 100P
J
TEMPO C371 0.01U
R324 6.2K
C375 10uF/6.3V(R)
C379 4700P
4
BYP
BUZZ_
4
2
BUZZ
GND 2
CTL
3
_IDLE
K Engineer: CDMA2 Drawn by: JB-KIM
3
C376 4700P 1
RXQD(3) RXQD(2) RXQD(1) RXQD(0) RXID(3) RXID(2) RXID(1) RXID(0) TXCLK TXCLK_ CHIPX8 PA_ON
VIN
C317
R320 0
U307 VC-3R3A30-0967
L321 BLM11A102S
H
BUZZ_ V_DC V_DC VBAT VBAT
VOUT
4
6
R319 10
MRFIC0916
MODE_SEL _IDLE _SLEEP
L325 BLM11A102S 5
C396 10U/6.3V(R)
1P
4 1
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59
C359 0.01UF
L309 BLM11A102S
MIC5205-3.3BM5
C399
100P
U308 STH-01R
IMD_CTL ADC_SEL1 ADC_SEL0 ADC_IN0 TRK_LO_ADJ
L317 BLM11A102S C360 4700P
10
C341
AT-32011
3
C361 1000P
3 4 2
L320 8.2N(W)
TX_1ST_LO
VDC_R U304 C358 10U/6.3V(R)
3
100P
G
1
R311
L318 OPEN(W)
C344
C380 0.1U
R395 68K
1
E
+3.3VRC
C395 4700P
3 4 5 6
C343 0.01UF
C336 0.047U
2
R394 100
L319 8.2N(W) F304 FAR-F5CE-967M00-K286 C338 3P 1 2
C313 0.1U
DTC144EE 3
MODE_SEL
R396 0
+3.3VRC
Q303
R393 OPEN
200
10
ANT
K
~IN
C332 4700P
U303
C324 C325 3P 470P
5
1
v2 out2
L303
C305 22P
F
J
6
3
2 4
OUT
2
gnd
in
IN
2 3 4 7 8 9
+3.3VRC
L307 18N(X)
I
5
1000P
3
v1 out1
1
C508 3P
L353 0N(W)
G4 6 G3 5 G2 4 G1 3 IN 1
E
1
U300 CMY210
4 C320
6 L323 8.2N(W) 5
12N
4P
10
L311 100N(CY)
U301
3P
4 L351
J301 MHC-173
C322 10P
15N(W)
1K
220
33P
C368 470P
L308
C315 100P
R307
F302 FB_G953
3 1
C306 OPEN
D301 BAR63-02W
F301 FAR-F5CE-881M50-D233 1 2
6.8N(W)
2 L302 6.8N(W)
C319
L330
C303 100P
1
C308 OPEN
C391 33P
C302 8P
D300 BAR63-02W
C326 100P
C310
0
C
C331 0.047U
L310 R306 12K 100N(X)
R398
L326 BLM11A102S
C314 0.047U
R303 10
C318 4700P
C309 0.1U
R302 27
2 4 D302 BCR400W
C390 4700P
L301 47N(W)
C329 220P
L300
VP VP1
B
-
VCC VCC1
MODE_SEL
100K
+3.3VRC
DATA EN CLK FOLD
RX_AGC_ADJ
R331 1M
C364 0.1U
D310 DAN202U
VDC_R
COMPANY NAME Address City
R&D CHK:
16 1 12 A
SCH-811 RX
MFG ENGR CHK:
HEADER30X2
Size: A3
TITLE:
DOC CTRL CHK:
L
L Changed by:
Date Changed: CDMA2
1
2
3
4
5
6
7
8
9
10
11
1999.02.12 12
Time Changed: 9:02:31 am
13
QA CHK:
REV:
14
Drawing Number:
15
Page: 1
16
1
2
3
6
5
4
7
8
9
10
12
11
13
14
15
16 A
A
U409 4
U401 Q5312I-3S2
64 +3.3BV RXIFMDATA TCXO 63 RXQFMDATA 61 +3.3V TXVCO_T1 RXFMSTB 62 FMCLK 38 5 +3.3BV6 +3.3BV1 10 +3.3BV2 14 51 +3.3BV7 +3.3BV3 48 21 68 TXCLK +3.3BV4 +3.3BV8 49 23 71 TXCLK_+3.3BV5 +3.3BV9TXVCO_T2 75 ADCENA 74 ADCDATA 73 ADCCLK FM_MOD 52 CHIPX8 29 TCXO_4
C
TXCLK TXCLK_ ADC_EN ADCDATA ADCCLK CHIPX8 TCXO_4 R447 OPEN
TXD(0:7)
47 46 45 44 43 42 41 40
TXD(7) TXD(6) TXD(5) TXD(4) TXD(3) TXD(2) TXD(1) TXD(0)
D
E
PD_OUT TXIQ7 TXIQ6 TXIQ5 TXIQ4 TXIQ3 TXIQ2 TXIQ1 TXIQ0
RXID(0:3) RXID(3) RXID(2) RXID(1) RXID(0) RXQD(3) RXQD(2) RXQD(1) RXQD(0)
RXQD(0:3)
56 55 54 53 60 59 58 57
F LOCK _SLEEP MODE_SEL _IDLE I_OFFSET Q_OFFSET
G
C443 0.01U
RXI3 RXI2 RXI1 RXI0 RXQ3 RXQ2 RXQ1 RXQ0
PD_ISET
RXVCO_OUT
C444 0
C445 0
C403 6P(1%)
R404 10K(1%)
0
R409 39K(1%)
R405 300(1%)
R445 0
C470 0.01U
R448 11.3K(1%)
C471 0.01U
C
R408 0
C406 OPEN
R410 1.8K
R400
C400
10
100P
TCXO
C407 1000P
D
C408 1U/10V(R)
C410
80
TEMPO
C405 2200P
R407
19
VBAT
10K(1%)
2
NO3 GND
47K
RX_IF_IN
GND4 GND5 GND6 GND7 GND8 GND9 GND10 GND11
2 RXVCO_T1 1 28 GND12 4 30 GND13 37 9 GND14 13 39 GND15 20 50 GND16 3 22 67 GND17RXVCO_T2 25 72 GND18 27
C411
R411
68P
10K
L402 68N(COI,X)
D402 1SV279
C413 6P(1%)
RX_IF_DO
E
D403 1SV279
+3.3VT R412 10K
C412 68P
R450 0
Q402
C460 10UF
R416 0
2SA1576
L403 1UH(X)
R417 10K
PSV
C417 0.1U
C419 1000P
U402
C442 0.01U
NO2 NO1
VCC
C420 0.1U
C447 3.3U/6.3V(R)
C448 100P
C421 0.01U
7
F
C499
C446 47P
C431 1000P
C429 0.047uF
3.3U/6.3V(R)
C432 L407 100P 22N(TX)
R427 51
L406 33N(TX)
PA_ON LOCK SLEEP_ FM_ IDLE_ I_OFFSET Q_OFFSET
TXIF
C422
12
1
1000P
TXIF_
R423 1.8K
2
C423
11
OUTX
IF_IN
IN_INX
OUT
5 C468 0.01U
R418 0
6
R419 0
U404 C416
1000P
3
GND
GCTL
U403
L404 120N(X)
8
C424
CXA3222N
2
IF-
VCC
1000P
33 NC1 34 NC2 65 NC3 66 NC4
L405 120N(X)
RFOUT C425 1000P
R446 0 C427
C426
0.01U
100P
1 4
R425 1M
7 2
5
C450
1000P
0.01U
C418 18P
R444
1
F401
12N(TX)
FAR-F5CE-836M50-K205
C461 470P
R440 5.1K
C462 47P
R437 0 +
3
-
2
4 8
C498 3.3U/6.3V(R)
C451 0.1U
5
C452 0.01uF
C453 4.7uF
C409 1000P
U408 6 5 4
4
U405 LMV821
R441 12K
-
2
VBAT
U406 LMV821
D1D2 D3D4 S G
1 5 7
1 2 3
L409
38
68
C439 0.01U
C465 10U/6.3V(R)
23
C436 0.1U
VREF
PIN
I
VDD1 VDD2 GND4 GND1
9
GND2 GND3 POUT
6
TXOUTPUT C495 OPEN
J C435 0.01U
C433 OPEN
2
SI3443DV
R435 47K
+3.3BV
C434 100P
U407 RI23124U 3
C497 OPEN
4 3
H
TX_1ST_LO
5
+
C441 8200P
G
R428 20
L410
+3.3VT
1 20K
3
C438 0.01U R443 2.2K R442 39K
C440 0.01U
TX_AGC
TX_AGC_ADJ
1
GN01037B
C430 1000P
R421 270K
LO_BYPASS
6 GND0 3 GND1 LO
560K
1
C428 100P
IF+
R422
TX_AGC
FAR-F5CE-836M50-D232 8
R424 430K
51 C449
R420 20
F400
RF2628
+3.3V
I
6 RF_IN VDD1 4 VAGC 2 GND1 5 GND2VDD2
100P
R426 1K
C454 100P
J
C496 OPEN
Q401 DTC114EE
PA_ON
TX_AGC
+3.3BBA BLM11A102S C467
K
B
ADC_IN0 R449
1
MAX4524
R402
C402 39P R403 10K
5
0
D401 1SV279
16
15
3
47K D400 1SV279 R406
39P L400 33N
ADC_SEL1
8
R401
100P
31 GND0 32 GND1 35 GND2 36 GND3
H
C401
ADC_SEL0
6
NO0
4 24 77 79 78 70 69
COM ADDB
17
+3.3BBA
7
ADDA
26
18
10
INHIBIT V+
2
RXIF _RXIF RXIFMDATA RXQFMDATA RXFMSTB FM_CLK
9
76 ADCIN 8 RSSI
1
B
7 RXIF 6 RXIF_
33UF/6.3V
C455
C456
C459
C404
C463
C464
1000P
0.01U
1000P
0.01U
1000P
0.01U
+3.3VRC C414
14 C457
C458
1000P
0.01U
C437 1000P
U410 NTH5G36B103J01TE
10U/6.3V(R)
1
2
C415 0.01UF
R451 6.2K
R439 1.5K
R452 12K
K Engineer: CDMA2 Drawn by: JB-KIM R&D CHK:
R438 10K
C472 0.01U
COMPANY NAME Address City Size: A3
TITLE:
DOC CTRL CHK:
SCH-811 TX
MFG ENGR CHK:
16 1 12 A
L
L Changed by:
Date Changed: CDMA2
1
2
3
4
5
6
7
8
9
10
11
1999.02.12 12
Time Changed: 9:02:31 am
13
QA CHK:
REV:
14
Drawing Number:
15
Page: 2
16
10-5
Main Circuit Diagram (1/3)
Main Circuit Diagram (2/3)
Main Circuit Diagram (3/3)
LCD FPC Circuit Diagram
10-7 Hands-Free kit 1 Circuit Diagram (data)
Hands-Free kit 1 Circuit Diagram (audio)
Car Adaptor 1 Circuit Diagram
10-8
Cradle 1 Circuit Diagram
10-9
Travel Charger Circuit Diagram
10-10 CLC (Cigarette Lighter Charger) Circuit Diagram
