MITSUBISHI RF POWER MOS FET ELECTROSTATIC SENSITIVE DEVICE
RD16HHF1
OBSERVE HANDLING PRECAUTIONS
Silicon MOSFET Power Transistor 30MHz,16W DESCRIPTION
OUTLINE DRAWING
RD16HHF1 is a MOS FET type transistor specifically designed for HF RF power amplifiers applications.
3.2+/-0.4
9.1+/-0.7
12.3MIN
APPLICATION
2 9+/-0.4
•High power gain: Pout>16W, Gp>16dB @Vdd=12.5V,f=30MHz
3.6+/-0.2
4.8MAX
12.3+/-0.6
FEATURES
1.3+/-0.4
1.2+/-0.4 0.8+0.10/-0.15
1 2 3
For output stage of high power amplifiers in HF band mobile radio sets.
0.5+0.10/-0.15
3.1+/-0.6
5deg
4.5+/-0.5
2.5 2.5
9.5MAX
PIN 1.Gate 2.Source 3.Drain UNIT:mm
ABSOLUTE MAXIMUM RATINGS (Tc=25°C UNLESS OTHERWISE NOTED) SYMBOL VDSS VGSS Pch Pin ID Tch Tstg Rth j-c
PARAMETER Drain to source voltage Gate to source voltage Channel dissipation Input power Drain to source current Channel temperature Storage temperature Thermal resistance
CONDITIONS Vgs=0V Vds=0V Tc=25°C Zg=Zl=50Ω junction to case
RATINGS UNIT 50 V +/- 20 V 56.8 W 0.8 W 5 A °C 150 -40 to +150 °C °C/W 2.2
Note 1: Above parameters are guaranteed independently.
ELECTRICAL CHARACTERISTICS SYMBOL IDSS IGSS VTH Pout ηD
PARAMETER Zero gate voltage drain current Gate to source leak current Gate threshold voltage Output power Drain efficiency Load VSWR tolerance
(Tc=25°C , UNLESS OTHERWISE NOTED) CONDITIONS VDS=17V, VGS=0V VGS=10V, VDS=0V VDS=12V, IDS=1mA VDD=12.5V, Pin=0.4W, f=30MHz, Idq=0.5A VDD=15.2V,Po=16W(Pin Control) f=30MHz,Idq=0.5A,Zg=50Ω Load VSWR=20:1(All Phase)
MIN 1.7 16 55
LIMITS TYP MAX. 10 1 4.7 19 65 No destroy
UNIT uA uA V W % -
Note : Above parameters , ratings , limits and conditions are subject to change.
RD16HHF1
MITSUBISHI ELECTRIC 1/7
REV.6 7 APRIL. 2004
MITSUBISHI RF POWER MOS FET ELECTROSTATIC SENSITIVE DEVICE
RD16HHF1
OBSERVE HANDLING PRECAUTIONS
Silicon MOSFET Power Transistor 30MHz,16W TYPICAL CHARACTERISTICS
Vgs-Ids CHARACTERISTICS 10 Vds=10V Ta=+25°C
8
60
6
Ids(A)
CHANNEL DISSIPATION Pch(W)
80
CHANNNEL DISSIPATION VS. AMBIENT TEMPERATURE
40
4
20
2 0
0
0
0 40 80 120 160 200 AMBIENT TEMPERATURE Ta(°C)
2
4 6 Vgs(V)
8
10
Vds VS. Ciss CHARACTERISTICS
Vds-Ids CHARACTERISTICS 8
60 Vgs=10V
Ta=+25°C
50 Vgs=9V
6
Ciss(pF)
Ids(A)
40 Vgs=8V
4 Vgs=7V
2
Vgs=6V
0
2
4 6 Vds(V)
8
0 0
10
10
30
Vds VS. Crss CHARACTERISTICS
100
10
Ta=+25°C Ta=+25°C 80 f=1MHz f=1MHz
Ta=+25°C f=1MHz
Ta=+25°C f=1MHz
8 Crss(pF)
60 40
6 4 2
20
0
0 0
10
20
0
30
Vds(V)
RD16HHF1
20 Vds(V)
Vds VS. Coss CHARACTERISTICS
Coss(pF)
Ta=+25°C f=1MHz
20 10
Vgs=5V
0
30
10
20
30
Vds(V)
MITSUBISHI ELECTRIC 2/7
REV.6 7 APRIL. 2004
MITSUBISHI RF POWER MOS FET ELECTROSTATIC SENSITIVE DEVICE
RD16HHF1
OBSERVE HANDLING PRECAUTIONS
Silicon MOSFET Power Transistor 30MHz,16W TYPICAL CHARACTERISTICS Pin-Po CHARACTERISTICS
80
20
100
ηd
Gp
60
30
40
20 10
Po
15
5
Ta=+25°C f=30MHz Vdd=12.5V Idq=0.5A
-10
0
10 Pin(dBm)
20
0
0
Vdd-Po CHARACTERISTICS
0.6
0.8
+25°C -25°C
4
10
2
5
1
0
0 8 10 Vdd(V)
12
Ids(A)
3
Idd
6
Vds=10V Tc=-25~+75°C
6
Po
15
4
RD16HHF1
5
Idd(A)
Po(W)
20
0.4 Pin(W)
8
6 Ta=25°C f=30MHz Pin=0.4W Idq=0.5A Zg=ZI=50 ohm
0.2
Vgs-Ids CHARACTERISTICS 2
30 25
20 0
0.0
30
40
Idd
Idd
0
60
ηd
10
20
80 ηd(%)
40
25
Po
Pout(W) Idd(A)
Ta=+25°C f=30MHz Vdd=12.5V Idq=0.5A
Pin-Po CHARACTERISTICS 100
ηd(%)
Po(dBm) , Gp(dB),Idd(A)
50
4
+75°C
2
0 2
14
MITSUBISHI ELECTRIC 3/7
4
6 Vgs(V)
8
10
REV.6 7 APRIL. 2004
MITSUBISHI RF POWER MOS FET ELECTROSTATIC SENSITIVE DEVICE
RD16HHF1
OBSERVE HANDLING PRECAUTIONS
Silicon MOSFET Power Transistor 30MHz,16W TEST CIRCUIT(f=30MHz)
V gg
V dd
C1
330uF,50V
L2 8.2K ohm
220pF 68pF
C1 10uF,50V *3pcs C1
100pF 1K ohm
C2
C1
88pF
L1 RD 16HHF1
C2
L3
RF-IN
RF-OUT L4
1 ohm 220pF
20pF
82pF
L5
100pF
100pF
200pF
200pF
1.5
5
15
15 65
34 41 43 45
75 85 90
67
100
91 100
C 1:100pF,0.022uF,0.1uF in parallel C 2:470pF*2 in parallel L1:10Turns,I.D 8mm,D 0.9mm copper wire L2:10Turns,I.D 6mm,D 1.6mm silver plateted copper wire L3:9Turns,I.D 5.6mm,D 0.9mm copper wire L4:4Turns,I.D 5.6mm,D 0.9mm,P =0.5mm copper wire L5:5Turns,I.D 5.6mm,D 0.9mm,P =1mm copper wire
D imensions:mm Note:B oard material-teflon substrate micro strip line width=4.2mm/50 ohm,er:2.7,t=1.6mm
/
RD16HHF1
MITSUBISHI ELECTRIC 4/7
REV.6 7 APRIL. 2004
MITSUBISHI RF POWER MOS FET ELECTROSTATIC SENSITIVE DEVICE
RD16HHF1
OBSERVE HANDLING PRECAUTIONS
Silicon MOSFET Power Transistor 30MHz,16W INPUT/OUTPUT IMPEDANCE VS.FREQUENCY CHARACTERISTICS
Zo=50Ω
f=30MHz Zout
f=30MHz Zin
Zin , Zout
RD16HHF1
f
Zin
Zout
(MHz)
(ohm)
(ohm)
Conditions
30
20.02-j89.42
2.99-j3.66
Po=20W, Vdd=12.5V,Pin=0.4W
MITSUBISHI ELECTRIC 5/7
REV.6 7 APRIL. 2004
MITSUBISHI RF POWER MOS FET ELECTROSTATIC SENSITIVE DEVICE
RD16HHF1
OBSERVE HANDLING PRECAUTIONS
Silicon MOSFET Power Transistor 30MHz,16W
RD16HHF1 S-PARAMETER DATA (@Vdd=12.5V, Id=800mA) Freq. [MHz] 10 30 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000
RD16HHF1
S11 (mag) 0.928 0.761 0.676 0.650 0.679 0.709 0.742 0.775 0.801 0.826 0.844 0.861 0.874 0.884 0.892 0.900 0.903 0.908 0.912 0.912 0.913 0.913
(ang) -43.2 -96.8 -121.9 -145.8 -156.4 -162.7 -168.0 -173.0 -177.7 177.7 173.2 169.0 164.8 160.7 156.9 153.0 149.1 145.5 141.7 137.9 134.3 130.7
S21 (mag) (ang) 50.035 150.2 32.680 117.1 22.018 101.3 11.543 81.0 7.560 66.2 5.380 55.7 4.126 45.9 3.208 36.9 2.592 29.6 2.133 22.6 1.775 16.6 1.509 11.3 1.283 5.9 1.114 2.1 0.974 -1.9 0.855 -5.3 0.759 -8.4 0.678 -11.3 0.614 -13.5 0.559 -15.3 0.509 -17.3 0.467 -17.9
S12 (mag) 0.013 0.025 0.027 0.025 0.023 0.022 0.026 0.034 0.045 0.056 0.069 0.081 0.093 0.104 0.117 0.129 0.140 0.150 0.161 0.172 0.180 0.190
MITSUBISHI ELECTRIC 6/7
S22 (ang) 60.6 34.3 24.3 20.3 27.0 46.4 63.2 74.4 78.3 78.4 78.1 75.3 73.1 69.8 67.2 63.7 60.6 56.8 53.8 50.4 47.1 43.6
(mag) 0.705 0.588 0.540 0.543 0.586 0.633 0.698 0.727 0.769 0.805 0.822 0.851 0.867 0.877 0.894 0.897 0.904 0.914 0.915 0.917 0.922 0.920
(ang) -44.6 -92.6 -116.9 -138.4 -147.1 -153.2 -158.1 -163.2 -168.0 -172.8 -176.8 178.9 174.7 170.9 166.9 163.4 159.6 155.9 152.9 149.0 145.4 142.4
REV.6 7 APRIL. 2004
MITSUBISHI RF POWER MOS FET ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS
RD16HHF1
Silicon MOSFET Power Transistor 30MHz,16W
Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
warning ! Do not use the device at the exceeded the maximum rating condition. In case of plastic molded devices, the exceeded maximum rating condition may cause blowout, smoldering or catch fire of the molding resin due to extreme short current flow between the drain and the source of the device. These results causes in fire or injury.
RD16HHF1
MITSUBISHI ELECTRIC 7/7
REV.6 7 APRIL. 2004