Manual
MultiPress-II English Version 1.3
LPKF Laser & Electronics AG Osteriede 7 D-30827 Garbsen Telephone : ++ 49 - 51 31 - 70 95 - 0 Fax : ++ 49 - 51 31 - 70 95 - 90 Email :
[email protected] Homepage : http: //www.lpkf.de
Copyright (c) 2001 LPKF AG Distribution or reproduction of this manual and use of its content permitted only with the written approval of LPKF AG. Right to make modifications reserved. No liability is accepted for the content. In particular, we accept no liability for damage caused by information given, information absent, or erroneous information. Trademarks: HP-GL is a registered trademark of the Hewlett-Packard Comp. All other trademarks registered to their relevant owners.
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MultiPress-II
Using this manual
The information contained in this document may be modified without prior notification. No part of this document may be reproduced or transferred for any purpose or in any form by any means without the express written permission of LPKF AG. We have taken great trouble to ensure the accuracy and completeness of the information in this document. However, LPKF AG accepts no liability for the use of the document, including breach of copyright or other infringement against third parties which may arise from this. The LPKF MultiPress-II multilayer press is use for pressing multilayer circuit boards. Thanks to a microprocessor, the pressing cycle can be programmed within wide limits. Custom temperature/pressure/time profiles which are independent of each other can be applied. There is a duty of care on the machine operator to ensure that the following points are observed. It must be ensured that • the machine is only used, in accordance with its intended purpose, for pressing multilayer PCBs or solder masks. • this manual is always kept in a legible and complete condition at the site of use of the machine • the machine is only operated by properly qualified and authorized personnel • such personnel are familiar with this manual and the safety instructions contained in it.
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I. Conventions used in this manual Bold text is used to emphasise important information. Illustrations are numbered. Example: Fig. 5 › Prompts for actions are identified with an arrow. Italic sections are used to indicate the reactions consequent on an action. Words printed in italics mark proper names. Key inscriptions and menu terms are printed in BOLD CAPITALS.
II. Notes on the symbols used Danger! This symbol is used to highlight danger to life or health. Caution! This symbol is used to identify hazards which may result in damage being caused. Note: This symbol is used for notes intended to help you avoid faults during operation or to help you improve your operational procedures.
III. Key Prepreg
: Intermediate layer used for cementing printed boards or foils together
Copper laminate
: An especially thin base material, which is only used for pressing multilayer circuit boards.
Base material
: Substrate of main board coated with copper foil
Solder-stop sheet
: Special foil for milling the connections to be soldered.
IV. Target group This manual is intended for persons who have basic knowledge of the manufacture of printed-circuit boards including multilayer circuit boards for the electronics sector.
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MultiPress-II
Table of contents
1.0 Intended use . . . . . . . . . . . . . . . . . . . .
8
2.0 Scope of delivery . . . . . . . . . . . . . . . .
9
3.0 Necessary installations . . . . . . . . . .
10
4.0 Safety instructions . . . . . . . . . . . . . .
11
5.0 Structure . . . . . . . . . . . . . . . . . . . . . .
12
6.0 Installation / transportation. . . . . . .
13
6.1 Transportation. . . . . . . . . . . . . . . . . . . . . . .
13
7.0 Multilayer (4-layer) . . . . . . . . . . . . . .
14
8.0 Materials and dimensions . . . . . . . .
15
9.0 Creating a multilayer circuit board .
16
9.1 The phases of the pressing cycle . . . . . . . .
10.0 Operation . . . . . . . . . . . . . . . . . . . . . 10.1 Program selection mode . . . . . . . . . . . . . .
17
20 21
10.1.1 Flow chart - program selection software . . . 23
10.2 Modification mode. . . . . . . . . . . . . . . . . . .
24
10.2.1 Flow chart - modification mode . . . . . . . . . . 24
10.3 Error messages . . . . . . . . . . . . . . . . . . .
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5
11.0 Materials. . . . . . . . . . . . . . . . . . . . . .
26
11.1 Recommended materials . . . . . . . . . . . . .
26
11.2 Storage of materials . . . . . . . . . . . . . . . . .
26
12.0 Step by step to the multilayer . . . .
27
12.1 Practical tips. . . . . . . . . . . . . . . . . . . . . . .
29
12.2 EasySolder for MultiPress-II. . . . . . . . . . .
30
12.2.1 Accessories . . . . . . . . . . . . . . . . . . . . . . . . 30 12.2.2 Solder-stop sheet . . . . . . . . . . . . . . . . . . . . 31 12.2.3 Pressing parameters for solder-stop sheet . 31
12.3 Step by step to the solder mask. . . . . . . .
32
12.3.1 Processing data in CircuitCAM . . . . . . . . . . 32
13.0 Consumables. . . . . . . . . . . . . . . . . .
36
14.0 Maintenance. . . . . . . . . . . . . . . . . . .
37
15.0 Procedure for changing oil. . . . . . .
38
15.1 Process of changing the oil . . . . . . . . . . .
38
15.2 Mounting the pump . . . . . . . . . . . . . . . . .
42
16.0 Technical data . . . . . . . . . . . . . . . . .
43
17.0 Original instruction of the pump manufacturer . . . . . . . . . . . . . . . . . . . . . .
44
18.0 Declaration of conformity (German) 53 6
MultiPress-II
19.0 Declaration of conformity (English) 54 20.0 Index. . . . . . . . . . . . . . . . . . . . . . . . .
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7
Intended use
1.0 Intended use The LPKF MultiPress-II multilayer press is used only for multilayer PCBs or solder masks for use in the electronics industry. Any other use is not considered to be in accordance with the "intended use" and shall render any liability claims made against LPKF AG invalid. Caution! When pressing multilayer circuit boards, it must be ensured that the size of the press package is as large as the pressing surface of the machine, if possible. If the surface of the press package is considerably smaller than the machine pressing surface, there is a danger of the press being damaged / destroyed. Caution! Never use material smaller than A4 format.
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MultiPress-II
Scope of delivery
2.0 Scope of delivery • MultiPress-II press (dimensions: W x H x D - 440 mm x 680 mm x 530 mm) • This manual • Gloves • 2 x press sheet • 2 x press plate • 3 x 2.5 mm2 / 2 m mains supply line • Compressed air line (2 mm) • Table (optional) • Compressor for 6 bar (option) • Adaptor pressurized connection • 2 x fuse holder - sockets for fuses by american standard
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Necessary installations
3.0 Necessary installations • Footprint:
approx. 0.25 m², approx. 1 m² with bench
• Compressed air port:
6-8 bar / 30 l/min AC / 50Hz / 10A-Sicherung
• Power supply:
10
230V / 10A
MultiPress-II
Safety instructions
4.0 Safety instructions Danger! The user must have read this manual and the documentation provided with the machine, paying particular attention to the safety instructions printed in bold, to ensure safe working with this system. • Ensure that only trained personnel operate the press. • If you modify the equipment yourself, the equipment's safety can no longer be guaranteed and no guarantee claims can be accepted. • Risk of being burned behind the front cover (hood). Ensure that the press has cooled down to at least 50°C before opening the hood (temperature indicator in the display). • Risk of being burned at the press plates after opening the press. Use the gloves provided when placing the hot multilayers in the press and removing them from it. • Do not place hot multilayers on a flammable surface or surfaces at risk from melting. • Do not bend or chafe the compressed air hoses between the press, control unit and compressor. • Use only suitable materials. Please take note that some materials may produce carcinogenic dust or hazardous gases. Ask your materials supplier. • Keep the workplace tidy. • You should also take account of additional safety instructions in the attached documentation.
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Structure
5.0 Structure fig. 1: MultiPress-II
1
2
1- transport eyelet 2- Squeeze head
fig. 2: Electronic
9 8 7 6 5
1 2
1- Pressure In 2- Transducer 3- Deaerator 4- Ventilator 5- Temp.-Transmitter
12
3
4
6- Lower Heater 7- Upper Heater 8- 2 x 10 A Slow 9- 230V 50-60Hz
MultiPress-II
Installation / transportation
6.0 Installation / transportation • Place the multilayer press on a level, steady bench. • The following connections must be made: • 230V mains cable (3 x 2.5 mm2) to the control unit. • constant pressure connection (min. 6 bar, max. 10 bar) • Set 5.9 - 9 bar at the pressure fig. 3: Electrical and pneumatic connections on back wall of control unit.
2
3
1 1- Compressed air port (6 bar) 2- Pressure reducer display 3- Mains supply
6.1 Transportation Caution! A heavy-duty eyebolt is bolted on to the upper side of the machine for transportation purposes. The bolt must be removed after transportation to the operating location. Leaving the bolt in the machine would result in the top of the machine heating up severely!
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Multilayer (4-layer)
7.0 Multilayer (4-layer) Multilayers or multilayer boards are made of several (more than two) stacked electric layers (copper layers). The copper layers are being connected by means of resin layers (prepreg). The figure below shows a 4-layer multilayer which will be described in the following. fig. 4: Multilayer stack in the press
Press tool The press tool has to be used for pressing the different materials of a multilayer stack. Press pad Press pads are made of paper or cardboard (cellulose) and are used for the optimum pressure distribution and the correct heat transition. They habe a dicisive influence on the resin flow and the distortion-free condition of the multilayer. Press pads made of paper can only be used once. Press form The press form are system-specific components for reproducing the stacking of all parts of a multilayer outside the multilayer press. They can alsobe used to assist the accurate preparation of the stack. Two procedures are possible, the pressing with pinned tools and the pinnless pressing. Press sheet Press sheets (steel or aluminum) are being placed between the single multilayer press stacks (copper foil, laminate, prepreg). They optimize the temperatur and pressure distribution within the press stack as well as the surface quality of the multilayer. Copper laminate The copper laminate is the material combination of which the outer conducting layers of the multilayer are made.
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MultiPress-II
Multilayer (4-layer)
Prepreg Prepregs are glass fabrics impregnated with resin. The resin is only partially matured. Prepregs are the isolation levels as well as the glued joints of the multilayer. They meld due to heat and pressure and are glued joints to the copper laminate and to the copper base material. To guarantee the isolation two layers of prepreg are being used. Copper-clad base material This material guarantees the mechanical and geometrical stability of the multilayer construction. Before pressing, conductor tracks are being milled into the copper-clad material on both sides.
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Materials and dimensions
8.0 Materials and dimensions Base material: FR4 material 1mm thick, with 35µm copper coating on both sides Standard dimension:420 mm x 360 mm max. usable gross pressing surface). Recommendation: 6*7628 (35/35 µm) by Isola / Düren
Copper laminate: 5µm copper laminate with additional adhesive coating layer (0.2 mm in total) and protective copper foil Standard dimension: 420 mm x 360 mm Recommendation: 2*2112 ( 0/5 µm ) by Isola / Düren
Prepreg: 2 x 0.1 mm insulating layer (gel time approx. 2-3 min) Caution! Observe the manufacturer's storage regulations. Standard dimension: 380 mm x 320 mm Recommendation: Type 2125 (15 ST 01) by Isola / Düren
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MultiPress-II
Materials and dimensions
8.1 The phases of the pressing cycle Definitions: P: Pressure
Display in N/cm2
[ N / cm² ]
Caution! Please take the pressure value to be set for board material with a standard size from the table. Should you use a special size, you will have to enter the board measurements as descibed in the chapter „Modification mode“ on page 24. T: Temperature
[ °C ]
Display in °Celsius
T: Time
[ min ]
Display in minutes
fig. 5: Temperature / pressure / time profile
1
2
3
4
Temp. (°C)
Pressure (N/cm2) 0
Time (min.)
Preheating phase ( 1 ) The preheating phase is used for preheating the press. The end of this phase is identified by an acoustic signal. Caution! The door of the press should be closed before the preheating phase is started, to accelerate the preheating cycle.
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Materials and dimensions
The multilayer package is only inserted in the press once the preheating temperature has been reached. The prepreg gel zone is quickly passed by doing so. The temperature of the gel zone depends on the FR4 material and the prepreg. It normally lies between 160 and 180 ºC. Irreversible shrinkage occurs when this softening range has been reached. The severity of the shrinkage depends on the type of fabric, resin, laminate thickness and also the circuit layout. The more copper remaining, the less the shrinkage (favourable: LPKF milling process). Recommendation: Preheating temperature = 180 ºC.
Prepress phase ( 2 ) The multilayer package can only be pushed into the press once the preheating temperature has been reached. The prepress phase is started up by closing the door and pressing the ENTER key. The multilayer pakkage is pressed together here with reduced pressure. Any trapped air bubbles could not escape easily at full pressure. Such prepress phases are mandatory for some materials (long-time prepreg). The prepress time should correspond to the gel time (approximately 10 mins). There would be an excessive resin flux if change-over to the final pressure took place prematurely. In the case of the recommended material, the gel time is approximately 2-3 mins. However the prepress time should be at least approximately 20 minutes, to ensure that the air can escape safely. Recommendation: Prepress pressure = 110 N/cm²; prepress time = 20 min
Main pressing phase ( 3 ) The temperature and pressure are kept constant during the main pressing phase. It generally lasts approximately one hour. The actual pressing of the multilayer circuit boards takes place during this time. Recommendation: Main pressure: 150 N/cm²;main pressing time = 60 min.
Cooling phase ( 4 ) The multilayer circuit board should not be cooled down too quickly. It is important that the pressure does not drop during the cooling phase. The multilayer circuit board could otherwise become distorted. Recommendation: Pressure = 150 N/cm²
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MultiPress-II
Materials and dimensions
Removal After the multilayer circuit board has been removed, it should be left to rest at room temperature for around 8 h (over night) before it is drilled. The prepreg can cure during this time. Caution! If the storing time is reduced, the inner layers in the boreholes may smear during drilling. In the event of a smeared inner layer it is not possible to make a securely plated throughhole. (This smearing can only be subsequently removed by means of a special etching process using very aggressive chemicals, which are not part of LPKF’s scope of delivery).
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Operation
9.0 Operation fig. 6: Buttons and displays on the MultiPress-II control unit
3
1
2 1- Line switch 2- Funktion keys 3- Display
The following display appears in the indicator when the unit is switched on: LPKF AG MultiPress II Version 4.0 Status : idle
The unit is now in the waiting position in the START menu. The following functions can then be carried out with the keys on the press control system: ESC:
Change-over to the modification mode
ENTER:
Change-over to the program selection mode
There are 2 modes in which it is possible to select or change various programs or program parameters.
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MultiPress-II
Operation
9.1 Program selection mode You can enter this mode from Start menu by pressing ENTER. The following 4 different programs can be selected and started: • Multilayer 1 • Multilayer 2 • Multilayer 3 • Solder-stop sheet Preset program sequences have been stored to these programs in the factory for the most frequent applications: Multilayer I (380x320 prepreg size) This program was developed from factory trials. It is used for pressing multilayers with prepreg dimensions of 380 x 320 mm. Multilayer II (240x170 prepreg size) This program was developed from factory trials. It is used for pressing multilayers with prepreg dimensions of 240 x 170 mm. Multilayer III This program was developed from factory trials for pressing circuit boards in the double Euro format (prepreg). Solder-stop sheet This program was developed for pressing solder-stop sheets onto assembled circuit boards. The factory parameters are shown in the following table: fig. 7: Pressing parameters
Program parameters
MultiPress-II
Multilayer 1 Multilayer 2 Multilayer 3
Solder-stop sheet
Dimension X-direction:(cm)
35
24
32
30
Dimension Y-direction:
30
17
20
21
Preheating temperature (ºC)
180
180
180
175
Prepress pressure (N/cm2)
110
135
135
240
Prepress time (min.)
20
20
20
20
Main pressing temperature (°C)
180
180
180
175
Main laminating pressure (N/ cm2)
150
180
180
240
Main pressing time (min.)
50
50
50
40
Hardening pressure(N/cm2)
150
180
180
240
Hardening time (min.)
60
90
90
5
21
Operation
The values given in the table can be changed by the user in modification mode. Details of this will be given later on. The flow chart shown below tells you how to select programs and which steps have to be taken manually whilst the program is running. The flow chart refers to the Multilayer I program. All other programs have the same structure, only the stored temperatures and times are different.
This symbol shows a manual press of the ENTER key.
This symbol shows a manual press of the ESC key.
This symbol shows a possible setting or selection of a parameter using the arrow keys on the MultiPress-II keyboard.
The texts in these oval windows always contain action commands for the operator.
You will hear a beeping when the layer can be taken out. The beeping can be switched off with the button the button
22
and switched on again with
.
MultiPress-II
Operation
9.1.1 Flow chart - program selection software
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Operation
9.2 Modification mode You can manually change all parameters as and when you like. In this way, it is possible to specify special pressing parameters on the basis of materials from different manufacturers, production requirements and empirical values. The basic operation is identical to the program selection mode. The deviating program structure is shown in the following figure. If required, you can use the “Factory settings” function to return the pressing parameters of all programs to the “as delivered” condition.
9.2.1 Flow chart - modification mode
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MultiPress-II
Operation
9.3 Error messages In the event of technical defects or faults in the voltage or compressed air supply, the MultiPress-II reports error messages relevant to the fault. These error messages all lead to the program being halted. In such cases, the error message must be noted, the machine shut down and the fault rectified. Danger! Never repair technical defects yourself. Consult your dealer if the machine has to be dismantled. There is danger of bruises and electric shock when installing yourself. In the event of the following error messages, the fault must be noted, the machine shut down and the relevant dealer consulted: • “Upper temp short.” • “Upper temp open” • “Lower temp short” • “Lower temp open” • “Pressure low” • “Pressure Interlock”
Check the relevant parameters if the following error messages appear: • “Pressure low” › Check the pressure provided by your compressed air supply.
• “Hood opened” The hood is not closed, but the machine is at a point in the program which requires that the cover (hood) be closed in order for it to continue. › Close the cover (hood). Note: The hood must be closed throughout the entire pressing phase.
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Materials
10.0 Materials 10.1 Recommended materials • Base material:
ISOLA, 6*7628 (35 / 35 µm)
• Copper laminate: ISOLA, 2*2112 (0 / 5 µm) • Prepreg:
ISOLA, 2125 (15 ST 01)
These materials can also be obtained as a set from LPKF AG. Order number: Multilayer set for MultiPress-II: 106836 Caution! Observe storage instructions, particularly for the prepreg. Delivery delays may occur if you order large quantities, as LPKF keeps only smaller quantities in store in order to be able to supply new materials every time. Caution! The pressing pad is no ordinary cardboard material. Please only use the material advised by LPKF to avoid fire.
10.2 Storage of materials • The base material, the copper laminate and the prepreg must be stored flat to ensure that the material does not become distorted. • The prepreg can be stored for up to 3 months at a temperature of +20/-2° C, max 50% air humidity and if sufficiently protected against UV radiation. • If kept in the refrigerator, it can be stored for up to 6 months at a temperature of +6/-2° C. • The press padding must be stored in a dry place.
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MultiPress-II
Step by step to the multilayer
11.0 Step by step to the multilayer Caution! This procedure can only succeed if the Multipress-II is properly installed and programmed. Read the preceding text, too, for a better understanding of the MultiPress-II. In order to produce a multilayer, you have to be familar with the handling of the circuit board. fig. 8: Production of a multilayer circuit board (cross-sectional view)
› Before pressing, remove the prepreg from the refrigerator and condition at room temperature for 16 hours. › Make the usual registration holes in the base material (special 1mm base material, as described under “Layer construction of a multilayer stack”) using the LPKF milling-drilling plotter. Mark one corner of the base material with a drill or by cutting it off, so that the correct layer can be found again after pressing and through-hole plating have taken place. Preheat the press in the meantime. To do this, switch the press on, select the desired pressure/temperature/time curve and press START. Caution! Use only standard sizes of Cu laminate and base material. There is a danger that the press plates may become distorted if smaller dimensions are used (see also Practical tips) Material plates smaller than A4 format must not be pressed.
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Step by step to the multilayer
› Mill the isolation in both inner layers using the LPKF milling-drilling plotter. › Clean the base material by hand, rinse with water and wipe down with spirit. Then check the quality and cleanliness of the material. › Cut the prepreg (2 layers) and copper laminate such that the registration holes of the base material and marking for the layer are not covered when the material is subsequently pressed. Make a notch on the prepreg and copper laminate at the points where the alignment pins are located on the base material. Then lay the individual sheets one of top of the other.
fig. 9: Prepreg
Ensure that the holes for the alignment pins remain clear. The prepreg should be somewhat smaller than the base material and the copper laminate, since the resin from the prepreg might otherwise escape at the sides when the material is pressed. › After put into operation the display can possibly misadjust slightly (no pressure in the system yet). Readjust pressure to 5.9 - 6 bar. › Wear the gloves provided and place the press package in the press, as far as the limit stop of the pressing tool. › Then close the press and press the ENTER key. › The pressing cycle is started automatically after the press is closed and the ENTER key pressed. Danger! The pressing cycle is interrupted if the cover is opened. There is a risk of being burned by hot press plates. The sensor emits an acoustic signal at the end of the pressing cycle and the press plates open when the cover is opened. › Put the gloves on again (risk of burning hands) and remove the press package. Caution! The material must now be allowed to cool down to room temperature for at least 2 hours and must then rest for 16 hours so that the prepreg resin can fully harden.
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MultiPress-II
Step by step to the multilayer
› Place the multilayer board on the machine, secure it with the alignment pins and drill it with the LPKF milling-drilling plotter (use new drills if possible) Caution! If the multilayer is not conditioned for a sufficient length of time, there is the danger that the inner layers in the boreholes will become blocked (smearing effect), resulting in the inner layers not being properly joined in through-hole plating. Ensure that the drilling time is kept to a minimum. Furthermore, any projecting, non-pressed corners on the press package must be cut off. There is a risk otherwise that the chemical bath fluid will gather in the gaps which appear and be transferred into another bath. This would lead to reduced efficiency. › Through-plate the multilayer in the same way as double-sided printed boards, except that it is necessary to double the time for the first cleaning bath in this case. › Mill the outer layers using the LPKF milling-drilling plotter. › Clean the multilayer in the usual way.
11.1 Practical tips › Fine boreholes can be made more reliably in materials with a fine glass fabric. › The greater the copper area, the smaller the changes in dimension (shrinkage). › The prepreg should always be stored in the refrigerator, as this increases the shelf life. › The prepreg must be conditioned for 16 hours at room temperature.
Caution! Do not completely remove non-connected soldering pads in the inner layers, choose instead isolation milling, as pressing will not be even if they are removed and the void could result in short-circuits. See figure below. With smaller multilayers there is the danger that the press plates will become distorted as a result of the uneven laminating pressure. For this reason, smaller multilayers must be centred on the pressing surface or several small parts used.
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Step by step to the multilayer
fig. 10: Creation of short-circuits
11.2 EasySolder for MultiPress-II LPKF EasySolder is an application for the manufacture of printed board prototypes. This procedure can be used for permanently fixing a previously milled solder-stop sheet to a printed board using glue, in order to simplify the soldering process, particularly in the case of printed boards with SMD components. The LPKF MultiPress-II can be used for pressing on the foil.
11.2.1 Accessories The accessories for the LPKF EasySolder for MultiPress-II can be ordered separately: Order number: 106244 The following parts are included in the scope of supply: • 2 x A4 press sheet • 10 x A4 press padding • 10 x A4 solder-stop sheet • 2 x A4 pressure compensation film • 10 x A4 drill pad sheet • 10 x micromills • 3 x transparent adhesive tape • 1 x adhesive film • 1 x scalpel • 1 x scalpel blade
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MultiPress-II
Step by step to the multilayer
11.2.2 Solder-stop sheet Material: Glue:
Polyimide Acrylic, flame-retarding
Note: The solder-stop sheet is provided with flame-retarding acrylic glue. The flame protection agent does not contain any polybrominated biphenyl/diphenyl mixtures and therefore no toxic or aggressive gases are generated as it burns. The solder-stop sheet can resist a soldering bath temperature of 288°C for 5 minutes. The electrical properties comply with the IPC requirements.
11.2.3 Pressing parameters for solder-stop sheet This curve for pressing the solder-stop sheet is set in the factory.
fig. 11:
Program parameters
Dimension in X-direction
30 cm
Dimension in Y-direction
21 cm
Prepress pressure Prepress time Preheating temperature Main pressure phase: Main pressing time Main pressing temperature Cooling pressure Cooling time
MultiPress-II
Input value
240 N / cm² 20 min. 175°C 240 N/cm² 40 min. 175°C 240 N/cm² 60 min
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Step by step to the multilayer
11.3 Step by step to the solder mask 11.3.1 Processing data in CircuitCAM CircuitCAM X.X Import the solder mask files (Gerber) with FILE, IMPORT, OPEN or the IMPORT icon in the FRONT-TO-END toolbar, with the SolderMaskTop and SolderMaskBottom layers being assigned. To export, select the LPKF CircuitBoardPlotter entry with FILE, OPEN or click on the icon shown below. The file created is saved to the working directory under the same name as the CircuitCAM file but with the file extension “.LMD”. The relevant button can be found in the FRONT-TOEND toolbar:
Export LPKF CircuitBoardPlotter
Preparing the solder-stop sheet for milling › Cut the solder-stop sheet to size, ensuring that it is at least 10 mm larger on all sides than the circuit board layout. › Use two drill pad sheets, one on top of the other, for milling to avoid damage to the milling tool. › Check whether the solder-stop sheet has a protective film. Remove the film if this is the case. › Lay the solder-stop sheet on the two drill pad sheets with the matt side facing upwards. › Secure the solder-stop sheet using the adhesive film supplied. When securing the sheet, make sure the solder-stop sheet is lying flat and no air is trapped. Notes on milling the circuit board: Ensure that the circuit base material is 10 mm larger on all sides than the layout to be milled so that the solder-stop sheet can be subsequently more easily fixed to the printed board.
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MultiPress-II
Step by step to the multilayer
Milling the solder-stop sheet using BoardMaster Settings: Tool: Tool diameter: Revs: Speed:
0.1-0.15 mm micromill (0.1 mm microcutter) 0.1 mm 40.000 (20.000) rpm 10 (5) mm/s
Values in brackets apply to milling-drilling plotters with direct-current motor. › Set the milling depth using an edge area of the solder-stop sheet which is not used. Use the traverse buttons in BoardMaster to mill a 2 x 2 mm square with the motor switched on and set the mill depth. › Switch on the extraction system. › Start the milling process with the data prepared by CircuitCAM. › At the end of the milling procedure, check that all the pads have been cut out. Start the milling procedure a second time if this is not the case.
Prepare the ready-milled circuit board › Clean and polish the printed board as described in the milling-drilling plotter manual to ensure that the solder mask adheres perfectly to the circuit board. › Clean the circuit board once more with spirit before the pressing cycle.
Preparing the pressure compensation film › The pressure compensation film should be replaced after every 20 pressing cycles. Securing the solder-stop sheet to the circuit board We recommend that you secure it using a glue stick and two small adhesive points on the printed board. fig. 12: Fixing the solder-stop sheet
Spots of adhesive Circuit board Layout area Solder stop film
Ensure that the adhesive dabs are outside the layout area.
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Step by step to the multilayer
Layer make-up of the press package Place in sequence, centred on a press plate: 1. the press padding for the underside 2. the press sheet for the underside 3. the pressure compensation film for the underside of the circuit board 4. the circuit board with solder-stop sheet(s) 5. in the case of double-sided circuit boards: the pressure compensation film for the top face of the circuit board 6. the press sheet for the top face 7. the press padding for the top face 8. and finally place the second press plate with press padding on the stack. fig. 13: Single-sided circuit board
1) 2) 3) 4) 5) 6)
fig. 14: Double-sided circuit board
1) 2) 3) 4) 5) 6) 7)
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MultiPress-II
Step by step to the multilayer
Curing in the multilayer press › Place the stack in the multilayer press. › Select the program for the solder-stop sheet in program selection mode. › Start the pressing cycle by pressing the ENTER key. Danger! Use the gloves provided when removing the pressing stack from the press. There is a danger of burning the hands. Make sure that the press has cooled down before you remove the circuit board. Practical tips It may be the case, following milling of the film with the milling-drilling plotter, that milling chips have adhered to the adhesive underside of the film. We recommend that the milled film be rinsed under running water to remove these chips. Then allow the film to dry for a few minutes. It is recommended that the board be painted with soldering varnish to protect the solder pads permanently against oxidation of the board, once it has been pressed with the EasySolder film. To improve milling capability, you can warm up the adhesive side of the film (hot air blower) and then press it down lightly against the drilling base. This enhances precision, as the film is better fixed. Take care to ensure that the film is pressed down flat and there are no air blisters.
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Consumables
12.0 Consumables You may order the following consumables from us: fig. 15: MultiPress-II
Item
Base plate FR4
Unit
Order number
355 x 260 mm
1
101032
Laminate Multilayer 355 x 260 mm
1
101067
Prepreg
1
101076
Pressing metal sheet
1
103249
Pressing card board cushion
1
101077
240 x 170 mm
fig. 16: EasySolder for MultiPress-II
Item
Order number
Solder-Mask foil
10
105795
Pressure compensating cushion rubber
10
106084
1
104421
10
104420
Drill underlay material
1
106388
microcutter 3 mm shank
1
100889
microcutter 1/8” shank
1
100890
Scalpel blade
1
104441
Pressing metal sheet Pressing coardboard cushion
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Unit
MultiPress-II
Maintenance
13.0 Maintenance The following maintenance work must be carried out after the multilayer press has been used: • Replace the press padding after every 3rd pressing cycle • Replace the press sheet if it is dirty or damaged • Remove any remaining adhesive from the pressing tool • Change the oil in the hydraulic system every 300 operating hours
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Procedure for changing oil
14.0 Procedure for changing oil 14.1 Process of changing the oil fig.17: MultiPress-II rear side
Danger! Make sure the machine is switched off and separated from all power supply lines (voltage, pneumatic system). › First remove the 4 screws (4 mm Allan screws) on the bottom of the rear cover (see arrows in fig. 17 on page 38). › Loosen the cable clamp. › Pull out the tube completely. › Carefully pull down the cover hood and put it down. › Mark the position of the 4 threaded blocks (fig. 18 on page 39) with a lead pencil or a waterproof pencil. Then turn the threaded blocks by 90° and remove them.
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MultiPress-II
Procedure for changing oil
fig. 18:
1
2
1- Pressure reduction valve 2- Hydraulic pump
Loosen the top fixing screw of the pressure reduction valve by hand (following fig.) fig.19:
POWER TEAM
› Remove the 2 screws marked with arrows (5 mm Allen screws) as shown in fig. 20 on page 40.
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Procedure for changing oil
fig.20:
Danger! Before your disconnect any hydraulic connections for maintenance purposes (oil change), please check relief lever is fully applied.
› Remove the pressure reduction valve and then both tubes (press the black ring to unlock the coupling and simultaneously pull off the tube). See also fig. 21 on page 40.
fig.21:
tube coupling
air tube black plastic ring
black plastic ring Removing the tube:
Tube
black plastic ring Fixing the tube:
Tube
Note: Take note of the designation of one of the tubes. During assembly the tubes must not be mixed up (When looking from above on the pressure display: The designated tube is always on the right). If not, this has to be done beforehand. › Lift the hydraulic pump and take it out of the casing (see fig. 22 on page 41) › Remove the two pneumatic tubes, paying attention to the designation. (unlock the tube coupling as described above!) 40
MultiPress-II
Procedure for changing oil
Note: The oil has to be changed after every 100 pressing processes (300 hours).
fig. 22:
at ar
or
Tra ns duc er
De
The following steps for servicing the pump are taken from the original instruction of the pump manufacturer.
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Procedure for changing oil
14.2 Mounting the pump Generally you can take the reverse order of disassembling the pump for the assembling of it. However, the following points must be taken into consideration: • When assembling the tube coupling, make sure that the tube is pushed vigorously into the coupling (see fig. 22 on page 41). • Take care not to mix up the tubes of the compressed-air pump. The right tube in.fig. 22 on page 41 is marked – Transducer -.
Danger! When assembling the pump fixing, take care that the ground conductor is also fixed! • When assembling the pressure reducing valve, take care that the air hose to the removed rear cover is mounted under the big hydraulic tube (see fig. 18 on page 39).
Caution! By all means check the setting of the pressure reducing valve after assembly (5,9 bar) before starting the machine
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MultiPress-II
Technical data
15.0 Technical data Dimensions (HxWxD):.................................................600x530x480mm Weight:......................................................................................210 Kg Compressed air supply:.........................>6 bar - max.10 bar at 30l/min. Power supply:....................................................................230V / 110V Power consumption:....................................................................2 KVA Pressure generation by pressure transformer: 1bar pneumatic = 100 bar hydraulic Press force:...............................................................................150 KN Press area:......................................................420 x 360mm = 1500cm² Total pressure per unit area:...................................................100N/cm² Pressure per unit area on film:................................................120N/cm² Maximum opening of press jaws:.................................................40mm Minimum opening of press jaws:..................................................15mm Maximum multilayer thickness:.....................................................36mm Minimum multilayer thickness:......................................................20mm Traverse speed of the press jaws:...........................................1mm/sec. Temperature of the heated press jaws:........................................180°C
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Original instruction of the pump manufacturer
16.0 Original instruction of the pump manufacturer
44
MultiPress-II
Original instruction of the pump manufacturer
MultiPress-II
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Original instruction of the pump manufacturer
46
MultiPress-II
Original instruction of the pump manufacturer
MultiPress-II
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Original instruction of the pump manufacturer
48
MultiPress-II
Original instruction of the pump manufacturer
MultiPress-II
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Original instruction of the pump manufacturer
50
MultiPress-II
Original instruction of the pump manufacturer
MultiPress-II
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Original instruction of the pump manufacturer
52
MultiPress-II
Declaration of conformity (German)
17.0 Declaration of conformity (German) 1. Hersteller der mit LPKF MultiPress-II bezeichneten Maschine ist die Firma: LPKF Laser & Electronics AG Osteriede 7 D-30827 Garbsen 2. Bei der mit LPKF MultiPress-II bezeichneten Maschine handelt es sich um eine Hydraulikpresse, die zum Verpressen von Mehrlagenmultilayerplatinen und Lötstoppfolien geeignet ist. Die Seriennummer der vorstehenden Maschine ist auf der Maschinenrückseite angebracht. Weitere Angaben zur MultiPress-II sind dem beiliegenden Handbuch zu entnehmen. 3. Die LPKF MultiPress-II entspricht den Bestimmungen der EG-Maschinenrichtlinie 93 /68 vom 22. Juli 93, der EG-Niederspannungsrichtlinie (89/336/EWG). 4. Die LPKF MultiPress-II ist nach dem Stand der Technik und nach den anerkannten sicherheitstechnischen Regeln entwickelt und gebaut worden. Bei der Erstellung fanden auch bestehende DIN-Vorschriften Anwendung. 5. Bevollmächtigter Unterzeichner dieser Erklärung ist Herr Bernd Hackmann Vorstandsmitglied der LPKF AG Osteriede 7 30827 Garbsen
Bernd Hackmann
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Declaration of conformity (English)
18.0 Declaration of conformity (English) 1. The manufacturer of the machine identified as the MultiPress-II is: LPKF Laser & Electronics AG Osteriede 7 D-30827 Garbsen 2. The machine identified as the MultiPress-II is a hydraulic press, suitable for pressing multilayer circuit boards and solder-stop sheets. The serial number of the machine is affixed to the rear side of the machine. Further information regarding the MultiPress-II may be found in the Manual supplied. 3. The LPKF MultiPress-II complies with the requirements of the EU Machinery Directive 93 /68 dated 22 July 93, of the EU Low Voltage Directive (89/336/EEC). 4. The LPKF MultiPress-II has been developed and constructed in accordance with the state of the art and in accordance with the recognized rules of safety. Existing DIN specifications have also been applied. 5. The authorized signatory of this declaration is: Herr Bernd Hackmann Member of the board of management of LPKF AG Osteriede 7 D-30827 Garbsen
Bernd Hackmann
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MultiPress-II
Index
19.0 Index A Accessories ...........................................................................29 Acrylic ....................................................................................30 Air humidity ............................................................................25 B Board material .........................................................................4 BoardMaster ..........................................................................32 C Caution ....................................................................................4 Changes in dimension ...........................................................28 CircuitCam .............................................................................31 Compressed air port ................................................................9 Compressed air supply ..........................................................42 Connections ...........................................................................12 Consumables .........................................................................35 Conventions used in this manual .............................................4 Cooling phase ........................................................................17 Copper area ...........................................................................28 Copper laminate ......................................................................4 Creating a multilayer ..............................................................15 Cu laminate ............................................................................26 Curing ....................................................................................34 D Danger .....................................................................................4 Declaration of conformity ................................................. 42, 53 Defects ...................................................................................24 Destruction ...............................................................................7 Dimensions ............................................................................42 E EasySolder ............................................................................29 Enter key ................................................................................21 Error messages .....................................................................24 ESC. key ................................................................................21 F Factory parameters ................................................................20 Factory settings .....................................................................23 Footprint ...................................................................................9 G Glass fabric ............................................................................28 Gloves ....................................................................................27 H Heavy-duty eyebolt ................................................................12 Holes for the alignment pins ..................................................26 I In the event of technical defects ............................................24 Intended use ............................................................................7
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Index
K Key .......................................................................................... 4 L Layer make-up ...................................................................... 33 Liability claims ......................................................................... 7 LPKF materials ...................................................................... 15 M Main pressing phase ............................................................. 17 Maintenance work ................................................................. 36 Materials ............................................................................... 10 Modification mode ................................................................. 23 Modifications ......................................................................... 10 Multilayer I ............................................................................. 20 Multilayer II ............................................................................ 20 Multilayer III ........................................................................... 20 Multilayer set for MultiPress II ............................................... 25 N Note ........................................................................................ 4 O Oil change ............................................................................. 36 Operating chart ..................................................................... 21 Operation .............................................................................. 19 Order numbers ...................................................................... 25 P Pad .......................................................................................... 4 Phases of the pressing cycle ................................................ 16 Polyimide .............................................................................. 30 Power supply .......................................................................... 9 Practical tips .......................................................................... 28 Preheating phase .................................................................. 16 Prepreg ................................................................................... 4 Prepress phase ..................................................................... 17 Press force ............................................................................ 42 Press plate ............................................................................ 28 Press stack ........................................................................... 27 Pressing parameters ............................................................. 30 Pressure compensation film .................................................. 32 Pressure generation .............................................................. 42 Pressure too low ................................................................... 24 Program selection mode ....................................................... 20 Program selection software ................................................... 22 R Recommended materials ...................................................... 25 Registration holes ................................................................. 26 Removal ................................................................................ 18 Revs ...................................................................................... 32 Risk of being burned ............................................................. 10
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MultiPress-II
Index
S Safety instructions .................................................................10 Scope of delivery .....................................................................8 Short circuits ..........................................................................28 Soldering bath temperature ...................................................30 Soldering pads .......................................................................28 Solder-stop sheet .....................................................................4 Speed ....................................................................................32 START menu .........................................................................19 Storage regulations ................................................................25 Structure of a multilayer .........................................................13 Symbols used ..........................................................................4 T Table of contents ......................................................................5 Target group .............................................................................4 Technical data ........................................................................42 Through-hole plating ..............................................................26 Tool diameter .........................................................................32 Transportation ........................................................................12 U UV radiation ...........................................................................25 W Weight ....................................................................................42
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Index
58
MultiPress-II
