BMK Group I Agilent DDR2/3 DRAM BGA Probe Assembly Process
BMK Group – Your Competent Partner for Engineering, Manufacturing and Service for Electronic Products
Planung
ni c tro s ec on El luti So
Ele Se ctron rvi ce ic s
Service
Test
Entwicklung
Prüfentwicklung
Layout
SerienPrototypenProfessional fertigung fertigung
Electronics
1
Das Kompetenzzentrum für Elektronikdienstleistungen
BMK Group I Agilent DDR2/3 DRAM BGA Probe Assembly Process
DDR2/3 BGA Probe Assembly Process Introduction This presentation provides customers of Agilent an overview of the process for installing the DDR2/3 DRAM BGA Probes onto printed circiuit board assemblies. BMK Electronic Services GmbH is a highly experienced company providing professional rework and repair services to leading manufacturers. Agilent has approved BMK Electronic Services GmbH to provide the DDR2/3 DRAM BGA Probe rework service to their customers.
Das Kompetenzzentrum für Elektronikdienstleistungen
BMK Group I Agilent DDR2/3 DRAM BGA Probe Assembly Process
DDR2/3 BGA Probe Assembly Process Overview Equipment and Skill Requirements Process Review Inspection Criteria Additional Information
Das Kompetenzzentrum für Elektronikdienstleistungen
BMK Group I Agilent DDR2/3 DRAM BGA Probe Assembly Process
DDR2/3 BGA Probe Assembly Process Equipment and Skill Requirements Machine for BGA rework and reballing using hot nitrogen with no-clean procedure BGA reballing tools and special reballing stencil X-Ray inspection system for post placement and ball inspection Engineer or operater with extensive BGA rework expertise and skills
Das Kompetenzzentrum für Elektronikdienstleistungen
BMK Group I Agilent DDR2/3 DRAM BGA Probe Assembly Process
DDR2/3 BGA Probe Assembly Process Process Review 1. Removal of BGA component from PCB 2. Cleaning of PCB and BGA surface and inspection for BGA placement 3. Reballing of BGA Probe and BGA component 4. Placement of BGA Probe on PCB and soldering process 5. Placement of BGA on BGA Probe and soldering process 6. Visual and X-Ray inspection to confirm soldering and placement process
Das Kompetenzzentrum für Elektronikdienstleistungen
BMK Group I Agilent DDR2/3 DRAM BGA Probe Assembly Process
DDR2/3 BGA Probe Assembly Process Process Review – 1. Removal of BGA
The process for safe removal of BGA component is carried out with a special BGA rework station using hot nitrogen. Additional preparations such as baking and masking the area off adjacent to rework site may be applied. Board damage is being prevented by monitoring temperature with thermocouples.
Process Review – 2. Cleaning and Inspection
The PCB and BGA cleaning is completed with desoldering braid that removes all residual solder from the pads and PCB. Visual inspection with microscope finalizes the BGA removal process. Das Kompetenzzentrum für Elektronikdienstleistungen
BMK Group I Agilent DDR2/3 DRAM BGA Probe Assembly Process
DDR2/3 BGA Probe Assembly Process Process Review – 3. Re-Balling of BGA Probe and BGA component
The BGA Probe and the removed BGA component from PCB must be re-balled. It is performed with special re-balling tool and reballing stencil which match the BGA probe and BGA component layout.
Process Review – 4. Placement and soldering process of BGA Probe to PCB
The exact placement of the BGA Probe on PCB is done via prisma specula and later on soldered to the PCB by using BGA rework machine (using repeatable temperature profiles which are unique for each circuit board). Das Kompetenzzentrum für Elektronikdienstleistungen
BMK Group I Agilent DDR2/3 DRAM BGA Probe Assembly Process
DDR2/3 BGA Probe Assembly Process Process Review – 5. Placement and soldering process of BGA component to BGA Probe
This process is similar to Process Review – 4. Placement and Soldering of BGA Probe to PCB
Process Review – 6. Visual and X-Ray inspection
Verifying the BGA placement and soldering process requires X-Ray in order to inspect for solder bridges, voids and misalignment. Visual inspection is completed with a microscope and/or inspection camera.
Das Kompetenzzentrum für Elektronikdienstleistungen
BMK Group I Agilent DDR2/3 DRAM BGA Probe Assembly Process
DDR2/3 BGA Probe Assembly Process Additional Information Possible moisture entrapment in boards or components needs to be considered. This can be eliminated by baking out the boards and components i.e. for 24 hours at 125°C. BGA component and BGA Probe rework profile is similar to profile for the assembly process of the board. The soldering profile is unique to the board layout/construction (PCB thickness, number of layers, PCB board size and weight). Before proceeding the rework, BMK might request to evaluate the board. A quote will be given after evaluation to each specific board type. A purchase order may then be generated by the customer directly to BMK to perform the rework. Contact Information
Michael Knöferle BMK electronic services GmbH +49 (0) 821 – 20 788 839
[email protected]
Das Kompetenzzentrum für Elektronikdienstleistungen
