"16 X 5 Asynchronous First-In,First-Out Memory"

mA. IOL. Low-level output current. All other outputs. 8. mA. TA. Operating free-air temperature. 0. 70. °C electrical characteristics over recommended operating ...
145KB taille 1 téléchargements 297 vues
SN74S225 16 × 5 ASYNCHRONOUS FIRST-IN, FIRST-OUT MEMORY WITH 3-STATE OUTPUTS SDLS207B – SEPTEMBER 1976 – REVISED APRIL 1998

D D D D D

Independent Asychronous Inputs and Outputs 16 Words by 5 Bits DC to 10-MHz Data Rate 3-State Outputs Packaged in Standard Plastic 300-mil DIPs

description This 80-bit active-element memory is a monolithic Schottky-clamped transistor-transistor logic (STTL) array organized as 16 words by 5 bits. A memory system using the SN74S225 easily can be expanded in multiples of 48 words or of 10 bits as shown in Figure 3. The 3-state outputs controlled by a single output-enable (OE) input make bus connection and multiplexing easy.

N PACKAGE (TOP VIEW)

CLKA IR UNCK OUT D0 D1 D2 D3 D4 OE GND

1

20

2

19

3

18

4

17

5

16

6

15

7

14

8

13

9

12

10

11

VCC CLKB CLR OR UNCK IN Q0 Q1 Q2 Q3 Q4

A first-in, first-out (FIFO) memory is a storage device that allows data to be written into and read from its array at independent data rates. This FIFO is designed to process data at rates from dc to 10 MHz in a bit-parallel format, word by word. Reading or writing is done independently, utilizing separate asynchronous data clocks. Data can be written into the array on the low-to-high transition of either load-clock (CLKA, CLKB) input. Data can be read out of the array on the low-to-high transition of the unload-clock (UNCK IN) input (normally high). Writing data into the FIFO can be accomplished in one of two ways:

D D

In applications not requiring a gated clock control, best results are achieved by applying the clock input to one of the clocks while tying the other clock input high. In applications needing a gated clock, the load clock (gate control) must be high for the FIFO to load on the next clock pulse.

CLKA and CLKB can be used interchangeably for either clock gate control or clock input. Status of the SN74S225 is provided by three outputs. The input-ready (IR) output monitors the status of the last word location and signifies when the memory is full. This output is high whenever the memory is available to accept any data. The unload-clock (UNCK OUT) output also monitors the last word location. This output generates a low-logic-level pulse (synchronized to the internal clock pulse) when the location is vacant. The third status output, output ready (OR), is high when the first word location contains valid data and UNCK IN is high. When UNCK IN goes low, OR will go low and stay low until new valid data is in the first word position. The first word location is defined as the location from which data is provided to the outputs. The data outputs are noninverted with respect to the data inputs and are 3-state, with a common control input (OE). When OE is low, the data outputs are enabled to function as totem-pole outputs. A high logic level forces each data output to a high-impedance state while all other inputs and outputs remain active.The clear (CLR) input invalidates all data stored in the memory array by clearing the control logic and setting OR to a low logic level on the high-to-low transition of a low-active pulse. The SN74S225 is characterized for operation from 0°C to 70°C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright  1998, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

1

SN74S225 16 × 5 ASYNCHRONOUS FIRST-IN, FIRST-OUT MEMORY WITH 3-STATE OUTPUTS SDLS207B – SEPTEMBER 1976 – REVISED APRIL 1998

logic symbol†

OE UNCK IN

9 16

FIFO 16 × 5 2

EN6

5, 2

Z1 3– CTR

CLR

CLKA CLKB

D0 D1 D2 D3 D4

18

1

CT = 0 &

CT < 16

G2

CT > 0

G3

2 1

5

17

UNCK OUT IR OR

4D

C4 Z5 6

15 14

6

13

7

12

8

11

† This symbol is in accordance with ANSI/IEEE Standard 91-1984 and IEC Publication 617-12.

2

2

2+

19

4

1, 3

3

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

Q0 Q1 Q2 Q3 Q4

functional block diagram Words 3 – 14 Same as 2 or 15 Word 16 (last word) 4

Word 2

Word 1 (first word) 15

14 13 12 11

C1

17

Q1 Q2 Q3 Q4 OE

OR

1D R UNCK 3 OUT

IR CLR

2 18

16 UNCK IN

3

SDLS207B – SEPTEMBER 1976 – REVISED APRIL 1998

• DALLAS, TEXAS 75265

D1 5 6 D2 7 D3 8 D4

SN74S225 16 × 5 ASYNCHRONOUS FIRST-IN, FIRST-OUT MEMORY WITH 3-STATE OUTPUTS

Same as Q0 Same as D10

9 CLKA 1 19 CLKB

Q0

Data Outputs

POST OFFICE BOX 655303

Data Inputs

D0

Word 15

SN74S225 16 × 5 ASYNCHRONOUS FIRST-IN, FIRST-OUT MEMORY WITH 3-STATE OUTPUTS SDLS207B – SEPTEMBER 1976 – REVISED APRIL 1998

schematics of inputs and outputs EQUIVALENT OF ALL INPUTS EXCEPT DATA INPUTS VCC

Input

EQUIVALENT OF DATA INPUTS

TYPICAL OF ALL OUTPUTS VCC

VCC 58 Ω NOM

Input Output

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V Off-state output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V Package thermal impedance, θJA (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values are with respect to GND. 2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero.

4

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

SN74S225 16 × 5 ASYNCHRONOUS FIRST-IN, FIRST-OUT MEMORY WITH 3-STATE OUTPUTS SDLS207B – SEPTEMBER 1976 – REVISED APRIL 1998

recommended operating conditions VCC VIH

Supply voltage

VIL

Low-level input voltage

IOH

High level output current High-level

IOL

Low level output current Low-level

TA

Operating free-air temperature

High-level input voltage

MIN

NOM

MAX

UNIT

4.75

5

5.25

V

2

V 0.8

Q outputs

–6.5

All other outputs

–3.2

Q outputs

16

All other outputs

8 0

70

V mA mA °C

electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH VOL

Q outputs All others Q outputs All others

IOZH IOZL II IIH IIL

Data All others Data All others

IOS‡ ICC§

TEST CONDITIONS

MIN

VCC = 4.75 V, VCC = 4.75 V,

II = –18 mA IOL = –6.5 mA

VCC = 4.75 V, VCC = 4.75 V,

IOL = –3.2 mA IOL = 16 mA

VCC = 4.75 V, VCC = 5.25 V,

IOL = 8 mA VO = 2.4 V

VCC = 5.25 V, VCC = 5.25 V,

VO = 0.5 V VI = 5.5 V

VCC = 5 5.25 25 V V,

VI = 2 2.7 7V

25 V VCC = 5 5.25 V,

5V VI = 0 0.5

VCC = 5.25 V, VCC = 5.25 V

VO = 0

TYP†

2.4

2.9

2.4

2.9

MAX

UNIT

–1.2

V V

0.35

0.5

0.35

0.5 50

µA

1

mA

25 –1 –0.25 80

µA

–50 40

–30

V

µA mA

–100

mA

120

mA

† All typical values are at VCC = 5 V, TA = 25°C. ‡ Duration of the short circuit should not exceed one second. § ICC is measured with all inputs grounded and the outputs open.

timing requirements over recommended operating conditions (unless otherwise noted) (see Figure 1) MIN fclock

Clock frequency

tw

Pulse duration

CLKA or CLKB high UNCK IN low CLR low Data (see Note 3) tsu

Set p time before CLKA↑ or CLKB↑ Setup

CLR inactive

th Hold time after CLKA↑ or CLKB↑ NOTE 3: Data must be set up within 20 ns after the load-clock positive transition.

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

NOM

MAX

UNIT

10

MHz

25 7

ns

40 –20 25 70

ns ns

5

SN74S225 16 × 5 ASYNCHRONOUS FIRST-IN, FIRST-OUT MEMORY WITH 3-STATE OUTPUTS SDLS207B – SEPTEMBER 1976 – REVISED APRIL 1998

switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) PARAMETER

FROM (INPUT)

TO (OUTPUT)

TEST CONDITIONS

CLKA fmax

CL = 30 pF

CLKB UNCK IN

10

20

10

20

10

20

7

14

MAX

UNIT

MHz

UNCK OUT

tdis

OE

Any Q

CL = 5 pF

10

25

ns

ten tPLH

OE

Any Q

CL = 30 pF

25

40

ns

UNCK IN

CL = 30 pF

50

75

Any Q

50

75

CLKA or CLKB

OR

CL = 30 pF

190

300

UNCK IN

OR

CL = 30 pF

40

60

30

45

CLR

OR

35

60

tPLH tPHL

tPHL

CLKA or CLKB UNCK IN CLKA or CLKB

UNCK OUT

CL = 30 pF

IR

UNCK IN tPLH

CLR OR↑

IR

CL = 30 pF

Any Q

† All typical values are at VCC = 5 V, TA = 25°C.

6

TYP†

tw

tPHL tPLH

CL = 30 pF

MIN

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

ns

25

45

270

400

55

75

255

400

16

35

10

20

ns ns ns

ns

ns

SN74S225 16 × 5 ASYNCHRONOUS FIRST-IN, FIRST-OUT MEMORY WITH 3-STATE OUTPUTS SDLS207B – SEPTEMBER 1976 – REVISED APRIL 1998

PARAMETER MEASUREMENT INFORMATION 7V PARAMETER

Open S1

ten R1 = 500 Ω

From Output Under Test

tdis

Test Point

CL (see Note A)

tpd

R2 = 500 Ω

LOAD CIRCUIT FOR 3-STATE OUTPUTS

S1

tPZH tPZL tPHZ tPLZ tPLH tPHL

3.5 V High-Level Pulse

1.3 V

1.3 V 0.3 V

th

tsu

tw

1.3 V

3.5 V

Low-Level Pulse

1.3 V

1.3 V 0.3 V

VOLTAGE WAVEFORMS PULSE DURATION

3.5 V

Data Input

1.3 V 0.3 V

3.5 V

Timing Input

Open Closed Open Closed Open Open

1.3 V 0.3 V

3.5 V

VOLTAGE WAVEFORMS SET UP AND HOLD TIMES

Output Control

1.3 V

1.3 V 0.3 V

3.5 V

Input (see Note C)

1.3 V tPZL

1.3 V

tPLZ

0.3 V tPLH In-Phase Output

1.3 V

tPHL Out-of-Phase Output

tPHL VOH 1.3 V VOL tPLH

1.3 V

VOH 1.3 V VOL

VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES

3.5 V

Waveform 1 S1 Closed (see Note B)

1.3 V

tPHZ

VOL 0.3 V

tPZH Waveform 2 S1 Open (see Note B)

VOH 1.3 V

0.3 V 0V

VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS

NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time with one transition per measurement.

Figure 1. Load Circuit and Voltage Waveforms

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

7

SN74S225 16 × 5 ASYNCHRONOUS FIRST-IN, FIRST-OUT MEMORY WITH 3-STATE OUTPUTS SDLS207B – SEPTEMBER 1976 – REVISED APRIL 1998

APPLICATION INFORMATION CLR

ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ

Inputs

CLKA

CLKB

Word 1

D

Word 2

Word 16

Word 3 is Low

UNCK IN

Outputs

IR

UNCK OUT

OR

Q

Word 1

Word 1

Load Word 1

Load Word 2

Word 3

Unload Word 1

Load Words 3–15

Clear

Word 2

Load Word 16

Unload Words 3–15

Unload Word 2

Figure 2. Typical Waveforms for a 16-Word FIFO

8

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

Word 16

Unload Word 16

SN74S225 16 × 5 ASYNCHRONOUS FIRST-IN, FIRST-OUT MEMORY WITH 3-STATE OUTPUTS SDLS207B – SEPTEMBER 1976 – REVISED APRIL 1998

APPLICATION INFORMATION (high)

(high)

CLKB

(high)

CLKB

CLKB

CLK

CLKA OR

CLKA OR

CLKA OR

NC

UNCK OUTUNCK IN IR D0 Q0 D1 Q1

UNCK OUTUNCK IN IR D0 Q0 D1 Q1

UNCK OUTUNCK IN IR D0 Q0 D1 Q1

5-Bit Data In

NC

NC

D2

Q2

D2

Q2

D2

D3

Q3

D3

Q3

D3

Q3

D4

Q4

D4

Q4

D4

Q4

CLR

OE

CLR

OE

CLR

Q2

OR UNCK IN

5-Bit Data Out

OE

CLR

OE

IR

CLR (high)

NC

5-Bit Data In

OE

CLR (high)

CLKB

OE

CLR (high)

CLKB

OE

CLKB

CLKA OR

CLKA OR

CLKA OR

UNCK OUTUNCK IN IR D0 Q0 D1 Q1

UNCK OUTUNCK IN IR D0 Q0 D1 Q1

UNCK OUTUNCK IN IR D0 Q0 D1 Q1

NC

NC

D2

Q2

D2

Q2

D2

Q2

D3

Q3 Q4

D3

Q3 Q4

D3

Q3 Q4

D4

D4

D4

5-Bit Data Out

Figure 3. Word-Width Expansion: 48 × 10 Bits

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

9

IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.

Copyright  1999, Texas Instruments Incorporated